TWI794039B - Server - Google Patents

Abstract

A server includes a casing, a first hard disk module, a fan module, a host module, a first expansion card module, a second expansion card module, a power module and a second hard drive module. The casing has a first accommodating space, a second accommodating space and a third accommodating space. The second accommodating space is located between the first accommodating space and the third accommodating space. The first hard disk module is located in the first accommodating space. The fan module is located in the second accommodating space. The host module is located in the third accommodating space. The first expansion card module and the second expansion card module are located in the third accommodating space and above the host module. The power module is located in the third accommodating space. The second expansion card module is interposed between the first expansion card module and the power module. The second hard disk module is located in the third accommodating space, and the second hard disk module is interposed between the power module and the second expansion card module.

Description

server

The invention relates to a server, in particular to a server with an optimized internal space configuration.

With the development of electronic technology, servers have become widely used information processing systems in the industry. A server usually includes a motherboard, a power supply, various disk drives, . . . and so on.

In order to provide consumers with better service quality, various manufacturers are eager to improve the performance of servers. Wherein, the performance improvement of the server is directly proportional to the number of electronic components inside the server. If the number of electronic components inside the server increases, the performance of the server will be improved. However, since the internal space of the server is limited, how to further increase the number of electronic components inside the server to improve the performance of the server will be one of the major issues that manufacturers are facing.

The present invention provides a server to further increase the number of electronic components inside the server to improve the performance of the server.

The server disclosed in one embodiment of the present invention includes a casing, a first hard disk module, a fan module, a host module, a first expansion card module, a second expansion card module, A power supply module and a second hard disk module. The casing has a first accommodating space, a second accommodating space and a third accommodating space. The second accommodation space is located between the first accommodation space and the third accommodation space. The first hard disk module is located in the first accommodating space. The fan module is located in the second accommodation space. The host module is located in the third accommodation space. The first expansion card module and a second expansion card module are located in the third accommodating space and above the host module. The power module is located in the third accommodation space. The second expansion card module is located between the first expansion card module and the power supply module. The second hard disk module is located in the third accommodating space, and the second hard disk module is between the power supply module and the second expansion card module.

According to the server of the above embodiment, the casing is divided into three accommodating spaces, and the first hard disk module, fan module, host module, expansion card module, and power supply are respectively accommodated in the three accommodating spaces. module and a second hard disk module to enhance the performance of the server.

The above description of the content of the present invention and the following description of the implementation are used to demonstrate and explain the principle of the present invention, and provide further explanation of the patent application scope of the present invention.

Please refer to Figure 1 to Figure 2. FIG. 1 is a perspective view of a server 10 according to a first embodiment of the present invention. FIG. 2 is a schematic side view of FIG. 1 . FIG. 3 is a partial perspective view of the server 10 shown in FIG. 1 . FIG. 4 is a partial perspective view of another part of the server 10 in FIG. 1 .

The server 10 of this embodiment includes a casing 100, a first hard disk module 200, a fan module 300, a host module 400, a first expansion card module 500, and a second expansion card module 600 , a power supply module 700 and a second hard disk module 800 . In addition, the server 10 can also include two trays 150 .

The casing 100 has a height H of 2U and has a first accommodating space S1 , a second accommodating space S2 and a third accommodating space S3 . The second accommodating space S2 is located between the first accommodating space S1 and the third accommodating space S3. The two trays 150 are disposed in the first accommodating space S1 of the casing 100 through slide rails, so that the two trays 150 are respectively slidably located in the first accommodating space S1 of the casing 100 .

The first hard disk module 200 is located in the first accommodating space S1. Specifically, the first hard disk module 200 includes 24 3.5-inch hard disks 210, and the 24 3.5-inch hard disks 210 are arranged in two layers. The number of 3.5-inch hard disks 210 in each layer is 12, and the second layer of 3.5-inch hard disks 210 are respectively arranged on the two trays 150 , so that each layer of 3.5-inch hard disks 210 can be pulled out of the casing 100 through the trays 150 .

The fan module 300 is located in the second accommodating space S2 and includes, for example, five fans 310 , and these fans 310 are used to generate heat dissipation airflow to dissipate heat from the electronic components in the casing 100 .

In the present embodiment, the fan module 300 takes five fans 310 as an example, but it is not limited thereto. In other embodiments, the number of fans can also be changed to three or other numbers.

The host module 400 is located in the third accommodating space S3 and includes a circuit board 410 , a plurality of host circuit components 420 and a plurality of fan electrical connectors 430 . These host circuit components 420 are disposed on the circuit board 410 . The fan electrical connectors 430 are disposed on the circuit board 410 . In this embodiment, the host circuit components 420 and the fan electrical connector 430 are integrated on the same circuit board 410. In addition to the single-board configuration is more convenient for maintenance, and because the size of the circuit board 410 becomes larger, it can be adjusted more flexibly. Various configuration requirements.

The first expansion card module 500 and the second expansion card module 600 are located in the third accommodating space S3 and above the host module 400 . The first expansion card module 500 is, for example, a full-height expansion card, and the second expansion card module 600 is, for example, a half-height expansion card to meet most demands in the current market. In addition, the first expansion card module 500 and the second expansion card module 600 can be mounted on the casing 100 through the same type of assembly frame, for example, so as to save the mold cost for manufacturing the assembly frame.

The power module 700 is located in the third accommodating space S3. The second expansion card module 600 is located between the first expansion card module 500 and the power supply module 700 . The power module 700 includes two redundant power supplies 710, and the two redundant power supplies 710 are stacked. If one of the backup power supplies 710 is damaged, the other backup power supply 710 can also provide the required power in an emergency, so as to be suitable for important occasions such as banks and national defense units.

The second hard disk module 800 is located in the third accommodating space S3 and includes four U.2 hard disks 810 . The second hard disk module 800 is located between the power module 700 and the second expansion card module 600 .

In this embodiment, the server 10 may further include a transfer backplane 850 and a plurality of transfer connectors 860 . The transfer backplane 850 is installed on the second hard disk module 800 and has a plurality of through holes 851 . The through hole 851 is, for example, irregular in shape, for example, the widths of opposite sides of the through hole 851 are different. These through holes 851 are used, for example, to let the heat dissipation air flow pass through, so as to improve the heat dissipation efficiency of the heat dissipation air flow to the second hard disk module 800 . The transfer connector 860 is disposed on a side of the transfer backplane 850 away from the second hard disk module 800 to be electrically connected to the circuit board 410 of the host module 400 through a cable.

In this embodiment, the server 10 may further include a network card module 900 . The network card module 900 is, for example, an OCP3.0 network card, and is located in the third accommodating space S3. In this embodiment, the network card module 900 is located below the second hard disk module 800, so that in the case of a limited height H of the casing 100, in addition to installing four U.2 hard disks 810, one more U.2 hard disk 810 is installed OCP3.0 network card.

In this embodiment, the network card module 900 is, for example, an OCP3.0 network card, but it is not limited thereto. In other embodiments, the network card module can also be changed to an OCP2.0 network card.

In this embodiment, the server 10 may further include a wind deflector 950 . The wind deflector 950 is located in the third accommodating space S3 , and one side of the wind deflector 950 has a plurality of buckle structures 951 , and the other side of the wind deflector 950 has a support structure 952 . These buckle structures 951 are hooked to the fan module 300 , and the supporting structure 952 is against the circuit board 410 of the host module 400 to fix the air guide cover 950 above the circuit board 410 of the host module 400 . Since the space under the air guide 950 is basically occupied by the circuit board 410 of the host module 400 , it is difficult to arrange a structure for fixing the air guide 950 in the space under the air guide 950 . Therefore, the air guide cover 950 of the present embodiment is hooked to the fan module 300 through the buckle structure 951, and the circuit board 410 of the host module 400 is abutted against through the support structure 952. In addition to being easy to disassemble and assemble, it can also Let the circuit board 410 reserve a larger amount of wiring space.

In this embodiment, the first hard disk module 200, the fan module 300, the host module 400, the first expansion card module 500, the second expansion card module 600, the power supply module 700, the second hard disk module The group 800 and the wind deflector 950 can be disassembled without tools, for example, by turning screws by hand, so as to facilitate disassembly and maintenance.

According to the server of the above embodiment, the casing is divided into three accommodating spaces, and the first hard disk module, fan module, host module, expansion card module, and power supply are respectively accommodated in the three accommodating spaces. module and a second hard disk module to enhance the performance of the server.

In addition, the air guide cover is hooked to the fan module through the buckle structure, which not only facilitates the user to disassemble the air guide cover, but also allows the circuit board to reserve more space for wiring.

Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

10:Server 100: Chassis 150: tray 200: The first hard disk module 210: 3.5-inch hard disk 300: fan module 310: fan 400: host module 410: circuit board 420: host circuit components 430: Fan electrical connector 500: The first expansion card module 600: Second expansion card module 700: Power module 710: Redundant power supply 800: Second hard disk module 810: U.2 hard drive 850: transfer backplane 851: through hole 860: transfer connector 900: network card module 950: Windshield 951: Buckle structure 952:Support structure S1: The first storage space S2: Second storage space S3: The third storage space H: height

FIG. 1 is a perspective view of a server according to a first embodiment of the present invention. FIG. 2 is a schematic side view of FIG. 1 . FIG. 3 is a partial perspective view of the server of FIG. 1 . FIG. 4 is a partial perspective view of another part of the server in FIG. 1 .

10:Server

100: Chassis

150: tray

200: The first hard disk module

210: 3.5-inch hard disk

300: fan module

310: fan

400: host module

410: circuit board

420: host circuit components

430: Fan electrical connector

500: The first expansion card module

600: Second expansion card module

700: Power module

800: Second hard disk module

S1: The first storage space

S2: Second storage space

S3: The third storage space

H: height

Claims (8)

A server, comprising: a casing with a first accommodation space, a second accommodation space and a third accommodation space, the second accommodation space is located between the first accommodation space and the third accommodation space a first hard disk module located in the first accommodating space; a fan module located in the second accommodating space; a host module located in the third accommodating space; a first An expansion card module and a second expansion card module are located in the third accommodating space and above the host module; a power supply module is located in the third accommodating space, and the second expansion card module is interposed between the first expansion card module and the power supply module; and a second hard disk module located in the third accommodating space, and the second hard disk module is between the power supply module and the first Between two expansion card modules; wherein the first expansion card module is a full-height expansion card, and the second expansion card module is a half-height expansion card; wherein the host module includes a circuit board, a plurality of host circuit components and a plurality of fan electrical connectors, the host circuit components are arranged on the circuit board, and the fan electrical connectors are arranged on the circuit board. The server as described in claim 1 further includes a network card module, and the network card module is located in the third accommodating space and under the second hard disk module. The server as described in claim 2, wherein the second hard disk module includes four U.2 hard disks, and the network card module is an OCP3.0 network card. The server as described in claim 1 further includes an air guide cover, the air guide cover is located in the third accommodating space, and one side of the air guide cover is hooked to the fan module, and the air guide cover The other side leans against the host module. The server as described in claim 1, wherein the first hard disk module includes 24 3.5-inch hard disks, the 24 3.5-inch hard disks are arranged in two layers, and the number of these 3.5-inch hard disks on each layer is 12 indivual. The server as described in claim 1 further includes two trays, the two trays are slidably located in the first accommodating space of the casing, and the 3.5-inch hard disks on the second layer are respectively arranged on the two trays. The server according to claim 1, wherein the power module includes two redundant power supplies, and the two redundant power supplies are stacked. The server as described in Claim 1, wherein the height of the casing is 2U.

Images