TWI593345B - Server - Google Patents

Description

server

The present invention relates to a server, and more particularly to a server having a shroud.

At present, cloud information and applications can be seen everywhere in daily life. The vigorous development of various services and networking devices has made the amount of data larger and larger, and the server plays a very important role behind the entire cloud industry. Among them, in order to expand the performance in the future, a plurality of processor mounts are usually arranged in the server, so that the user can process the amplification of the wafer according to requirements.

In practice, however, typically the processing mounts in a single server are not equipped with processing wafers. Therefore, an open area is left above the processor mount without the handle wafer. Under this circumstance, when the cooling airflow blown by the servo fan flows into the open area, it will escape and become disordered, and not only part of the heat dissipation airflow will be shunted to other unscheduled heat dissipation areas, so that the heat dissipation airflow is required. The heat dissipation area that has passed through cannot be properly deheated, which in turn affects the performance of the server.

In this regard, some operators have replaced the fan with a high-power fan, and it is expected to increase the wind speed to compensate for the insufficient heat dissipation in the heat-dissipating area. However, this method not only increases the overall manufacturing cost, but also increases the power consumption of the server, which is not in line with reality. Economic benefits.

In view of this, the present invention provides a server for effectively utilizing the heat dissipation airflow of the fan.

A server according to the present invention includes a main chassis, a fan module, at least two processor mounts, and at least one shroud. The main chassis has an accommodating space and two side plates on opposite sides of the accommodating space. The fan module is accommodated in the housing space of the main chassis. At least two processor mounting seats are disposed in the accommodating space and adjacent to an air outlet side of the fan module. The at least one shroud has a body portion and a flow guiding portion connected to each other. Each at least two processor mounts can be used to selectively mount a processor module or at least one shroud. The at least one shroud can be detachably mounted on one of the at least two processor mounts of the unequipped processor module via the main body. The flow guiding portion has a near wind side and a far wind side opposite to each other, and the distance between the near wind side and the far wind side to the one side plate is different, so that the heat dissipating air flow from the air outlet side can be guided by the flow guiding portion. concentrated.

In the server disclosed in the present invention, the distance from the near wind side of the flow guiding portion to the adjacent one side plate is smaller than the distance from the far wind side to the side plate of the flow guiding portion.

In the server of the present invention, the server further includes at least one electronic component disposed in the accommodating space of the mainframe, and the at least one electronic component is located at an end of the at least two processor mountings away from the fan module, and adjacent to at least one An airflow outlet of the shroud allows the heat dissipation airflow to be concentrated by the flow guiding portion to concentrate on at least one electronic component.

In the server disclosed in the present invention, the at least one electronic component and one of the side plates have an area to be expanded, and at least one of the flow guides corresponds to the area to be expanded to prevent the heat dissipation airflow from flowing into the area to be expanded.

In the server disclosed in the present invention, the at least one electronic component includes at least one rear hard disk module or one power module.

In the server disclosed in the present invention, the body portion of the at least one air hood has a flow guiding slope connected to the flow guiding portion and raised in a direction away from the fan module.

In the server disclosed in the present invention, the body portion of the at least one air hood has a plurality of mounting portions that can be fastened or screwed to one of the at least two processor mounts.

In the server disclosed in the present invention, the system further includes a system air hood that is detachably received in the accommodating space of the main chassis, and the system air hood is adjacent to the air outlet side of the fan module and covers at least The two processor mounts and the at least one shroud are used to guide the heat flow.

In the server disclosed in the present invention, the foregoing further includes at least one front hard disk module detachably received in the accommodating space of the main chassis, and located on an air inlet side of the fan module.

In the server of the present invention, the processor module includes a processor chip and a heat dissipation unit, the processor chip is mounted on the processor mount, and the heat dissipation unit is detachably mounted on the processor mount. Thermally contact the processor chip.

In the server disclosed in the present invention, the shroud can be mounted on one of the processor mounts without the processor module, and the windward side and the far wind side of the flow guide of the shroud are one of the The spacing of the side plates is different, so that the heat dissipation airflow from the fan module can be guided and concentrated, so as to prevent the heat dissipation airflow from being blown to the unscheduled heat dissipation area and the heat dissipation performance on the heat release target setting is reduced. In this way, in addition to the improved server performance, the power of the fan module can be adjusted to achieve energy saving.

The above description of the disclosure and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention, and to provide further explanation of the scope of the invention.

The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

In addition, the embodiments of the present invention are disclosed in the following drawings, and for the sake of clarity, the details of the invention are described in the following description. However, it should be understood that these practical details are not intended to limit the invention. In addition, for the sake of simplicity of the drawings, some conventional structures and components will be illustrated in a simplified schematic manner, and even some of the drawings omits the structure of cables (cables, or cables). In order to keep the picture clean and tidy, declare it first.

Furthermore, unless otherwise defined, all terms used herein, including technical and scientific terms, have their ordinary meaning, and their meaning is understood by those skilled in the art. Furthermore, the definition of the above vocabulary should be interpreted in the present specification as having the same meaning as the technical field related to the present invention. Unless specifically defined, these terms are not to be construed as too idealistic or formal.

1 to 5, FIG. 1 is a perspective view of a server according to an embodiment of the present invention, FIG. 2 is a top view of the server of FIG. 1, and FIG. 3 is a server of FIG. Exploded view, FIG. 4 is a partial enlarged view of FIG. 2, and FIG. 5 is a perspective view of the flow guide of the server of FIG. 1. As shown in FIG. 1 , this embodiment provides a server 1 suitable for a server cabinet (not shown).

Specifically, as shown in FIG. 2~3, the server 1 includes a main chassis 10, a fan module 20, a plurality of processor mounts 30, at least one shroud 40, a system air duct 50, and at least one processing. The module 91, the plurality of front hard disk modules 93, a rear hard disk module 95 and a power module 97.

The main chassis 10 includes two side plates 110 and a bottom plate 111. The two side panels 110 are respectively erected on opposite sides of the bottom plate 111 to surround the bottom plate 111 to surround the accommodating space S1 for accommodating the fan module 20, the processor mount 30, the shroud 40, and the processor. Other electronic components such as the module 91, the front hard disk module 93, the rear hard disk module 95, and the power module 97.

In the present embodiment, the number of the front hard disk modules 93 is two, and is arranged in the front end 10a of the main chassis 10 in a manner of being arranged in the front and rear. Each of the front hard disk modules 93 can store a plurality of hard disks (not shown).

The fan module 20 is disposed on the bottom plate 111 and arranged behind the front hard disk module 93, and can be used to dissipate heat from the electronic components in the server 1. Further, the air inlet side 20a of the fan module 20 is adjacent to the front hard disk module 93. In addition, in the present embodiment, the fan module 20 includes a plurality of sub-fans (not labeled), and from the perspective of FIG. 2, the leftmost sub-fan of FIG. 2 is temporarily not operated due to practical considerations, but the present invention is not This is limited to this.

The number of the processor mounts 30 is two, and is disposed on the bottom plate 111 and arranged behind the air outlet side 20b of the fan module 20. Each of the processor mounts 30 has a plurality of mounting holes (not labeled) for the processor module 91 to be mounted. The mounting holes may be a screw hole or a snap hole. It should be noted that the present invention is not limited to the number and location of the processor mounts 30. For example, in other embodiments, the number of processor mounts 30 can be three or more.

Further, each processor module 91 includes a central processing unit (CPU) 911 and a heat dissipation unit 912. The heat dissipation unit 912 described herein is a heat dissipation fin. The processor chip 911 is optionally first mounted on one of the processor mounts 30, and the heat sink unit 912 is mounted on the processor mount 30 such that the heat sink unit 912 can be in close contact with the processor chip 911. The heat contact is used to eliminate the heat generated by the processor chip 911, and the heat is directly blown to the rear end 10b of the main chassis 10 by the heat dissipation airflow (as shown in FIG. 6) blown out from the air outlet side 20b of the fan module 20. . It should be noted that, in this embodiment, the server 1 only needs to configure a set of processor modules 91 in operation. That is to say, under normal operation requirements, only one of the processor mounts 30 may be provided with the processor module 91, and the other, or another plurality of other processor mounts 30, may not be configured. There is a processor module 91. It can be inferred that the present invention is not limited to the number of the processor modules 91. As long as the number of the processor mounts 30 is sufficient, the user can increase or decrease the processing configured in the server 1 according to actual needs. The number of the module modules 91, for example, in other embodiments, the number of the processor modules 91 may be two or more. However, it should be noted that, in conjunction with the actual operation of the server 1, even if a plurality of processor modules 91 are installed, one or more processor modules can be selected to be operated by a control module (not shown). 91. The invention is not limited thereto.

The rear hard disk module 95 and the power module 97 are disposed at the rear end 10b of the main chassis 10 and adjacent to the processor mount 30. The rear hard disk module 95 is similar to the front hard disk module 93 and can be used to accommodate a plurality of hard disks (not shown). The power module 97 can be connected to the power supply of the server cabinet via a cable (not shown) to receive the power required for the servo 1 to operate.

In addition, as can be seen from FIG. 2, in the accommodating space S1, particularly in the area on the left and right sides of the rear hard disk module 95, and the area outside the two processor mounts 30, the area to be expanded S2 is defined. The so-called area to be expanded S2 refers to an area in which a plurality of expansion slots (not labeled) are disposed in the server 1, although the expansion slots are available for a random access memory (RAM) or a PCI card. The plug-in is inserted, but before the expansion card is inserted, the areas are relatively empty, and thus the areas are not the main anti-heating targets set for the fan module 20. It can also be said that the area to be expanded S2 is not the main anti-heating area set for the fan module 20.

The shroud 40 is adapted to be disposed on a processor mount 30 that is not configured with a processor module 91. Specifically, the flow guide cover 40 includes a main body portion 410, a flow guiding portion 420, and a plurality of mounting portions 430 that are connected to each other. The main body portion 410 can be detachably mounted on the processor mount 30 on which the processor module 91 is not disposed via the mounting portion 430. Each mounting portion 430 can be a screw-hole design with a screw, a snap structure or a cylindrical structure, and can be used to fix the mounting hole on the processor mount 30, but the invention is not limited thereto. In fact, as long as the mounting portion 430 is a design that is adaptively mounted to the processor mount 30, it is within the scope of the present invention. The flow guiding portion 420 has a plate-like structure and extends from the main body portion 410 toward the air outlet side 20b of the fan module 20. Further, the flow guiding portion 420 has a near wind side 420a and a far wind side 420b opposite to each other. The so-called near-wind side 420a and the far-wind side 420b refer to opposite sides of the flow guiding portion 420 that are close to and away from the air outlet side 20b of the fan module 20, respectively. In addition, as can be seen from FIG. 4, in the setting, the distance D1 between the near wind side 420a of the flow guiding portion 420 to the adjacent one side plate 110 is smaller than the distance D2 from the far wind side 420b of the flow guiding portion 420 to the side plate 110. The flow guiding portion 420 is disposed obliquely with respect to the main body portion 410.

The system air hood 50 is adjacent to the air outlet side 20b of the fan module 20, and is covered above the electronic components including the airflow damper 40, the processor module 91, and the processor mount 30 for guiding The heat dissipation airflow blown out from the air outlet side 20 can prevent the heat dissipation airflow from escaping from the air outlet side 20b and then dissipating to the external environment.

Next, the case where the flow guide 40 is disposed or not will be compared and explained. Please refer to FIG. 6 , which is a usage context diagram of the server shift of FIG. 1 . It must be stated first that the system air hood 50 is omitted in FIG. 6 for convenience of explanation.

As shown, the flow of airflow when the processor mount 30 is configured and when the shroud 40 is not configured can be seen at the same time. In detail, first, from the heat dissipation airflow F1 (dashed arrow), the heat dissipation airflow F1 means that when one of the processor mounts 30 (the processor mount 30 on the left side of the figure) is not configured with a processor module The group 91 also has no air flow from the fan module 20 when the shroud 40 is not disposed. Since the processor module 91 or the airflow shield 40 is not disposed on the processor mount 30, an open area is formed above the processor mount 30, and the heat dissipation airflow F1 is easy to escape and become disordered when flowing to the area. And most of the heat dissipation airflow F1 flows to the area to be expanded S2 on the left side of the rear hard disk module 95 (that is, the main heat-dissipating area not set by the fan module 20), that is, the fan module 20 is relatively reduced. The heat dissipation effect of the rear hard disk module 95. According to the experimental data, if the ambient temperature is 35 degrees Celsius, if the processor mount 30 without the processor module 91 is not provided with the shroud 40, the temperature of the rear hard disk module 95 will rise. At 68 degrees Celsius, it exceeds a safe value of 64 degrees Celsius. The overheated rear hard disk module 95 causes a problem of a decrease in operating speed, which in turn affects the overall performance of the server 1.

In contrast, please refer to the heat dissipation airflow F2 (solid arrow). The heat dissipation airflow F2 refers to one of the processor mounts 30 when the processor module 91 is not configured (the processor mount 30 on the left side of the figure) When the shroud 40 is disposed, the air flow from the fan module 20 flows. In detail, from the perspective of the drawing, the heat dissipation airflow F2 can be guided by the inclined flow guiding portion 420 on the air guiding cover 40 after being blown out from the air outlet side 20b of the fan module 20, and due to the flow guiding portion 420 The distance D1 between the near wind side 420a and the adjacent one side plate 110 is smaller than the distance D2 of the windward side 420b of the flow guiding portion 420 to the side plate 110 (as shown in FIG. 4), so that the heat dissipation airflow F2 can be along the flow guiding portion 420. The rear hard disk module 95 is concentratedly blown to the air outlet 40b adjacent to the shroud 40. In other words, the flow guiding portion 420 has a guiding and concentrating effect on the heat dissipating airflow F2, so as to prevent the heat dissipating airflow F1 from flowing to the area to be expanded S2 and relatively reducing the antiheating of the rear hard disk module 95 of the fan module 20. The problem of the effect. According to the experimental data, if the ambient temperature is the same as 35 degrees Celsius, if the processor mount 30 without the processor module 91 is provided with the shroud 40, the heat dissipation airflow F2 can be surely guided. The hard disk module 95 is then lowered to lower the temperature of the rear hard disk module 95 to 57.5 degrees Celsius, which is much lower than the security value of 64 degrees Celsius. Thereby, the rear hard disk module 95 can smoothly operate, thereby maintaining the operating efficiency of the server 1.

Further, the present invention is not limited to the position of the shroud 40 in the first embodiment. For example, please refer to FIG. 7. FIG. 7 is a use context diagram of a server according to another embodiment of the present invention. Similar to FIG. 6, FIG. 7 also omits the system air duct 50. It can be seen that the present embodiment proposes a shroud 40' which is mirror symmetrical to the shroud 40 of the previous embodiment. Unlike the shroud 40 of the first embodiment, the shroud 40' of the present embodiment is disposed on the processor mount 30 on the right side of the viewing angle of the drawing. However, similar to the foregoing embodiment, the cooling airflow blown by the fan module 20 can be concentrated by the air guiding cover 40' to the rear hard disk module 95, thereby maintaining the predetermined heat dissipation effect on the rear hard disk module 95. . It can be seen that the present invention is not limited to the position where the shroud is disposed, that is, the present invention is not limited to the position of the processor mount provided by the shroud.

In addition, referring to FIG. 5 and FIG. 6, the main body portion 410 of the air guiding cover 40 has a guiding slope 410s, and the airflow inlet 40a of the self-flowing cover 40 is inclined upward in the direction of the airflow outlet 40b to form an airflow outlet. The relatively high slope at 40b helps to match the air principle that the cold air flowing through the shroud 40 will naturally drop. Specifically, when the cold air climbs to a higher level via the guiding slope 410s, it can be naturally lowered during the blowing to the rear hard disk module 95 and evenly distributed to the rear hard disk module 95 to provide The rear hard disk module 95 has a uniform heat dissipation effect. Of course, the present invention is not limited to the slope of the diversion ramp 410s, or even the diversion ramp 410s.

As described above, in the server disclosed in the present invention, since the shroud can be mounted on one of the processor mounts in which the processor module is not mounted, and the windward side of the flow guide of the shroud is The distance from the far wind side to the one side plate is different, so that the heat dissipation airflow from the fan module can be guided and concentrated, so as to prevent the heat dissipation airflow from being blown to an unintended heat dissipation area and reducing the heat dissipation performance on the heat release target setting. . In this way, in addition to the improved server performance, the power of the fan module can be adjusted to achieve energy saving.

In addition, the deflector of the air duct can be adaptively adjusted to accommodate the processor mounts in different positions in which the shroud is placed. Therefore, regardless of the position where the shroud is installed, the airflow can be effectively guided and concentrated to dissipate the electronic components at the rear end of the server.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

1‧‧‧Server

10‧‧‧Hosting box

10a‧‧‧ front end

10b‧‧‧ backend

20‧‧‧Fan module

20a‧‧‧air inlet side

20b‧‧‧air outlet side

30‧‧‧Processor Mount

40, 40’‧‧‧ hood

40a‧‧‧air inlet

40b‧‧‧Air outlet

50‧‧‧System air duct

91‧‧‧Processor Module

93‧‧‧Pre-hard disk module

95‧‧‧After hard disk module

97‧‧‧Power Module

110‧‧‧ side panels

111‧‧‧floor

410‧‧‧ Main body

410s‧‧‧ Diversion ramp

420‧‧‧Drainage Department

420a‧‧‧ near wind side

420b‧‧‧Great wind

430‧‧‧Installation column

911‧‧‧ processor chip

912‧‧‧Heat unit

F1, F2‧‧‧ cooling airflow

D1, D2‧‧‧ spacing

S1‧‧‧ accommodating space

S2‧‧‧ area to be expanded

1 is a perspective view of a server according to an embodiment of the present invention. 2 is a top view of the server of FIG. 1. Figure 3 is an exploded view of the server of Figure 1. Fig. 4 is a partial enlarged view of Fig. 2. Figure 5 is a perspective view of the shroud of the server of Figure 1. Figure 6 is a usage context diagram of the server of Figure 1. FIG. 7 is a use context diagram of a server according to another embodiment of the present invention.

1‧‧‧Server

Claims (9)

A server includes: a main box having an accommodating space and two side plates on opposite sides of the accommodating space; a fan module accommodating the accommodating space of the main box; at least two processor mounting a housing that is disposed in the accommodating space of the main chassis and adjacent to an air outlet side of the fan module; and at least one airflow hood having a main body portion and a flow guiding portion connected to each other, the main body The portion has a flow guiding slope connected to the flow guiding portion and raised in a direction away from the fan module; wherein each of the at least two processor mounts can be used to selectively install a processor module or the At least one shroud, the at least one shroud can be detachably mounted on the one of the at least two processor mounts on which the processor module is not mounted via the main body portion, the flow guiding portions having opposite to each other a near wind side and a far wind side, the near wind side and the distance from the far wind side to one of the side plates are different, so that the heat dissipation airflow from the air outlet side can be concentrated by the guiding portion . The server of claim 1, wherein a distance between the near wind side of the flow guiding portion and one of the adjacent side plates is smaller than a distance between the windward side of the flow guiding portion and the side plate. The server of claim 1, further comprising at least one electronic component disposed in the accommodating space of the mainframe, the at least one electronic component being located at an end of the at least two processor mountings away from the fan module, And adjacent to an airflow outlet of the at least one shroud, such that the heat dissipation airflow can be concentrated to the at least one electronic component by being guided by the flow guiding portion. The server of claim 3, wherein the at least one electronic component and one of the side panels have an area to be expanded, and the at least one shroud corresponds to the area to be expanded to prevent the heat dissipation airflow from flowing into the server. Area to be expanded. The server of claim 3, wherein the at least one electronic component comprises at least one rear hard disk module or a power module. The server of claim 1, wherein the body portion of the at least one air hood has a plurality of mounting portions for snapping or screwing to one of the at least two processor mounts. The server of claim 1 further includes a system air hood that is detachably received in the accommodating space of the main chassis, and the air hood of the system is adjacent to the air outlet side of the fan module. And covering the at least two processor mounts and the at least one shroud for guiding the heat dissipation airflow. The server of claim 1 further includes at least one front hard disk module detachably received in the accommodating space of the main chassis and located on an air inlet side of the fan module. The server of claim 1, wherein the processor module comprises a processor chip and a heat dissipating unit, the processor chip is mounted on one of the processor mounts, and the heat dissipating unit is detachably mounted on the server The processor mount is in thermal contact with the processor die.