TW201818797A - Server - Google Patents

Abstract

A server including a case, a fan module, two CPU seats and an air guide member. The fan module is accommodated in an accommodating space of the case. The CPU seats are adjacent to an air outlet side of the fan module. The air guide member has a mounting seat and an air guiding assembly connected to each other, the air guiding assembly is detachably pivoted on the mounting seat so that the air guiding assembly is pivotable among a plurality of air guiding positions. The CPU seats each is configured for a CPU module or the air guide member to dispose, the air guide member is detachably disposed on one of the CPU seat which is not disposed with the CPU module, so the airflow generated from the air outlet side can be guided and gathered by the air guiding assembly.

Description

server

The present invention relates to a server, and more particularly to a server having a shroud.

At present, the technology and applications of the cloud are everywhere in daily life. The proliferation of various services and networking devices has made everyone's information usage more and more, and the server plays a very important role behind the entire cloud industry. . In order to expand the performance in the future, there are usually multiple processor mounts in the server to allow the user to expand the processor as needed.

But in reality, usually the processor mounts in a single server are not equipped with a processor. Therefore, an open area will be vacant above the processor mount without the processor. In this case, when the heat-dissipating airflow blown by the servo fan flows to the open area, it will escape and become disordered, and not only part of the heat-dissipating airflow will be shunted to other unscheduled heat-dissipating areas, so that the heat-dissipating airflow is required. The heat dissipation area that has passed through cannot be properly deheated, which in turn causes the temperature of the entire servo system to rise and affects the operation efficiency.

In response to this problem, some operators replace the fan with a high-power fan, or increase the fan speed to compensate for the cooling airflow required in the heat-dissipating area, but this method not only increases the overall manufacturing cost, but also increases the energy consumption of the server. Does not meet the actual economic benefits.

In view of this, the present invention provides a server for effectively utilizing the heat dissipation airflow of the fan.

A server according to the present invention includes a main chassis, a fan module, at least two processor mounts, and at least one shroud. The main chassis has an accommodation space. The fan module is accommodated in the housing space of the main chassis. The processor mounting space is disposed in the accommodating space of the mainframe and adjacent to an air outlet side of the fan module. The air guiding cover has a mounting base and at least one flow guiding component connected to each other, and at least one guiding component is detachably pivoted to the mounting seat, so that the guiding component can swing relative to the mounting seat to selectively select a plurality of air guiding Switch between locations. Each processor mount can be optionally configured with a processor module or a shroud, and the shroud can be detachably mounted on one of the processors without the processor module via the mount. In the seat, the flow guiding assembly is located at a wind guiding position thereof, so that the heat dissipating air flow from the air outlet side can be concentrated by the guiding of the guiding component.

In the above-mentioned server of the present invention, since the shroud can be mounted on the processor mount without the processor module, and the flow guiding component of the shroud can swing relative to the mount of the shroud The selective switching to the proper air guiding position enables the heat dissipating airflow from the fan module to be guided and concentrated to prevent the cooling airflow from being blown to the unintended heat dissipating area and reducing the predetermined heat dissipating effect on the antipyretic target. In this way, in addition to the performance of the server is improved, the power of the fan module can also be adjusted to achieve an energy-saving effect.

The above description of the disclosure and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention, and to provide further explanation of the scope of the invention.

The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

In addition, the embodiments of the present invention are disclosed in the following drawings, and for the sake of clarity, the details of the invention are described in the following description. However, it should be understood that these practical details are not intended to limit the invention. In addition, for the sake of simplicity of the drawings, some conventional structures and components will be illustrated in a simplified schematic manner, and even some of the drawings omits the structure of cables (cables, or cables). In order to keep the picture clean and tidy, declare it first.

Furthermore, unless otherwise defined, all terms used herein, including technical and scientific terms, have their ordinary meaning, and their meaning is understood by those skilled in the art. Furthermore, the definition of the above vocabulary should be interpreted in the present specification as having the same meaning as the technical field related to the present invention. Unless specifically defined, these terms are not to be construed as too idealistic or formal.

1 to 6, FIG. 1 is a perspective view of a server according to an embodiment of the present invention, FIG. 2 is a top view of the server of FIG. 1, and FIG. 3 is a server of FIG. Explosion diagrams, Figures 4 to 5 are exploded views of the flow guide of the servo of Figure 1 at different viewing angles, and Figure 6 is a schematic diagram of the air guiding position of the servo of Figure 1 to switch the air guiding position. As shown in FIG. 1 , this embodiment provides a server 1 suitable for a server cabinet (not shown).

Specifically, as shown in FIG. 2 to FIG. 3, in the embodiment, the server 1 includes a main chassis 10, a fan module 20, a plurality of processor mounts 30, at least one shroud 40, and an electronic component 95. And an electronic component 97.

The main chassis 10 includes two side plates 110 and a bottom plate 111. The two side panels 110 are respectively erected on opposite sides of the bottom plate 111 to surround the bottom plate 111 to surround an accommodating space S1 for accommodating the fan module 20, the processor mount 30, the shroud 40, and the electronic components. 95 and other components required for electronic components 97.

The fan module 20 is disposed on the bottom plate 111 and can be used to deheat the components in the server 1 that generate thermal energy when operating, such as the electronic component 95 and the electronic component 97. In the configuration, the fan module 20 has an air outlet side 20a and an air inlet side 20b, which are respectively located on opposite sides of the fan module 20, and the air outlet side 20a is located on a side of the fan module 20 facing the processor mounting seat 30. In addition, in the embodiment, the fan module 20 includes a plurality of sub-fans (not labeled), but the present invention is not limited to the number of sub-fans. In addition, in the present embodiment or other embodiments, the left side of the fan module 20 is not equipped with a sub-fan due to practical considerations, but the invention is not limited thereto.

The number of the processor mounts 30 is two, and is disposed on the bottom plate 111 and arranged behind the air outlet side 20a of the fan module 20. However, the present invention is not limited to the number, location, and specifications of the processor mounts 30. For example, in other embodiments, the number of processor mounts 30 may be three or more, and the positions and specifications thereof may be adjusted and replaced according to actual needs.

In addition, each processor mount 30 has a plurality of mounting holes (not labeled) for use in a processor module (not shown). The mounting hole on the processor mount 30 can be, but is not limited to, a screw hole or a snap hole, and the invention is not limited thereto. The aforementioned processor module refers to a module including a central processing unit (CPU) and a heat sink. In addition, it should be noted that usually the number of processor mounts in the server will be more than the number of processors that should be configured to actually meet the operational requirements, so that users can add more processors in the future. Expand performance. For example, in this embodiment, the number of processor mounts 30 of the server 1 is two, but only one set of processor modules required to achieve the minimum operation requirement, that is, only one of the processor mounts The processor module is mounted on the 30, and the processor module is not mounted on the other or a plurality of other processor mounts 30. However, the user can still add the processor module according to the actual performance requirement, and the processor module is installed on the two processor mounts 30, and the present invention is not limited thereto.

The electronic component 95 can be, but is not limited to, a hard disk module, and the electronic component 97 can be, but is not limited to, a power module, and the invention is not limited thereto. In the relative position, the electronic component 95 and the electronic component 97 are disposed at the rear end of the main chassis 10 and adjacent to the processor mount 30, that is, the electronic component 95 and the electronic component 97 are located at the processor mount 30 opposite to the fan die. One side of the group 20 can be deheated by the heat dissipation airflow of the fan module 20.

Of course, the vicinity of the electronic component 95 and the electronic component 97 can add other electronic components according to the circuit board specifications and actual needs. For example, as shown in FIG. 2, in the accommodating space S1, particularly in the area on the left and right sides of the electronic component 95, and the area outside the two processor mounts 30, the area to be expanded S2 is defined. The so-called area to be expanded S2 refers to an area in which a plurality of expansion slots (not labeled) are disposed in the server 1, although the expansion slots are available for a random access memory (RAM) or a PCI card. Inserted, but before the aforementioned expansion card is inserted, the areas are relatively empty, and the areas are not set as the main anti-heat target for the fan module 20. It can also be said that the area to be expanded S2 is not the main anti-heating area set for the fan module 20, but the present invention is not limited to the number and position of the area S2 to be expanded.

Next, the flow hood 40 will be explained. The shroud 40 is adapted to be disposed on a processor mount 30 that is not configured with a processor module. Specifically, the shroud 40 includes a mount 410 and two flow directing assemblies 420a, 420b that are coupled to each other. The flow guiding assembly 420a and the flow guiding assembly 420a are respectively located on opposite sides of the mounting base 410. However, it should be stated first that although both the flow guiding assembly 420a and the flow guiding assembly 420b are slightly different in appearance, the structural relationship and the connection relationship with the mounting base 410 are similar. For convenience of explanation, the following This is first introduced only with the flow guiding assembly 420a.

The mount 410 includes a protrusion 411 and a mounting portion 412 that are connected to each other. The protruding portion 411 is slightly in a block shape, the mounting portion 412 is slightly in the shape of a plate, and the protruding portion 411 protrudes from one surface of the mounting portion 412. The mount 410 can be detachably mounted via the mounting portion 412 on the processor mount 30 that is not configured with the processor module. Specifically, the mounting portion 412 has two through holes 412a and four mounting holes 412b. The perforations 412a are used to mount the flow guiding assembly 420a, and the mounting holes 412b are respectively located at the four corners of the mounting portion 412 and correspond to mounting holes (not labeled) on the processor mount 30, respectively. When the mounting base 410 is to be assembled to one of the processor mounts 30, the mounting holes 412b of the mounting portion 412 can be respectively screwed into the mounting holes of the processor mount 30 by screws (not shown), but The present invention is not limited to the manner in which the mounting portion 412 is fixed to the processor mount 30. Any design that can adaptively mount the mounting portion 412 to the processor mount 30 is within the scope of the present invention. For example, in other embodiments, the mounting hole 412b of the mounting portion 412 can also be replaced with a screw hole with a screw, a protruding post or a latch.

The flow guiding assembly 420a includes a pivoting seat 421, a body 422, and a skirt 423 that are connected to each other. The pivoting seat 421 is disposed on the through hole 412a of the mounting portion 412 and depends on one side edge of the protruding portion 411. A fixing member 81 (not labeled) is inserted through the through hole 412a of the mounting portion 412 to be locked to the pivoting seat 421. The pivoting seat 421 is pivotable on the mounting portion 412. Therefore, the flow guiding assembly 420a can be pivotally connected to the mounting base 410 via its pivoting seat 421 to pivot relative to the mounting base 410. The fan body 422 is disposed on the pivoting seat 421 and has a slightly-shaped outer shape. The fan body 422 extends outward from the pivoting seat 421 and can swing as the pivoting seat 421 pivots. The skirt portion 423 protrudes from the pivoting seat 421 and is located on the pivoting seat 421 adjacent to a side edge of the mounting portion 412 of the mounting seat 410. The foregoing fixing member 81 can be, but is not limited to, a screw, and the invention is not limited thereto.

Further, as shown in FIG. 5, the skirt portion 423 has a through hole 423a, and the mounting portion 412 has a plurality of fixing holes 412c. When the flow guiding assembly 420a pivots relative to the mounting base 410, the through hole 423a of the skirt portion 423 can be selectively aligned with one of the fixing holes 412c of the mounting seat 410, and then fixed to the aligned through hole 423a by a fixing member 82. The fixing hole 412c is fixed such that the flow guiding assembly 420a is fixed to one of the air guiding positions with respect to the mounting seat 410. The foregoing fixing member 82 can be, but is not limited to, a screw, and the invention is not limited thereto. In addition, it can be understood that, in this embodiment, the mounting portion 412 has three fixing holes 412c, so the flow guiding assembly 420a can be pivotally adjusted relative to the mounting base 410 to have at least three air guiding positions. However, the present invention is not limited to the number of the fixing holes 412c of the mounting base 410 and the position of the air guiding position. For example, in other embodiments, the number of the fixing holes 412c may be only two or more, and the number of the air guiding positions is It increases or decreases corresponding to the number of fixing holes 412c.

Further, as shown in FIG. 5-6, in the embodiment, the server 1 further includes two elastic members 60 and two spacers 70. The mounting portion 412 of the mounting base 410 further has a plurality of positioning slots 412d.

The elastic member 60 is, for example, a compression spring, but the invention is not limited thereto. For example, in other embodiments, the resilient member 60 can also be an object having a deforming restoring force, such as rubber.

The pivoting seat 421 has a cavity 421s and two slides 4211. The cavity 421s is for receiving one of the elastic members 60 and one of the spacers 70. The two slides 4211 are located on opposite sides of the cavity 421s.

The positioning groove 412d surrounds the periphery of the through hole 412a. In the present embodiment, the number of the positioning grooves 412d is ten, which are respectively located on both sides of the through hole 412a in two groups, but the present invention is not limited to the number of the positioning grooves 412d. In addition, in the embodiment, the positioning groove 412d is a through groove and penetrates the mounting portion 412, but the invention is not limited thereto. For example, in other embodiments, the positioning groove 412d can also be a groove without penetrating the mounting portion 412.

The shape of the gasket 70 is slightly in the shape of a piece, and the material thereof can be, but is not limited to, rubber, and has the property of being deformable and recoverable, but the invention is not limited thereto. The spacer 70 is located directly above the positioning groove 412d of the mount 410. Each spacer 70 includes a body 71, two lugs 72 and a plurality of positioning points 73. The lugs 72 are respectively located on opposite side edges of the body 71 and respectively correspond to the slides 4211 of the pivoting seat 421. The positioning points 73 are located on one side of the body 71 facing the mounting portion 412, and are arranged around the center of the body 71, and the The positioning point 73 can selectively correspond to the positioning groove 412d of the mounting portion 412. In the present embodiment, the number of the positioning points 73 is six, which are respectively located on both sides of the body 71 in a manner of being divided into two groups, but the present invention is not limited to the number of the positioning points 73.

In the assembly, the elastic member 60 and the spacer 70 are accommodated in the cavity 421s of the pivoting seat 421. The spacer 70 is located on the elastic member 60 away from one end of the pivoting seat 421. It can also be said that the elastic member 60 is clamped to The pivoting seat 421 is spaced between the spacer 70. The two lugs 72 of the spacer 70 are slidably located on the two slides 4211 of the pivoting seat 421. The elastic element 60 normally releases the elastic force to push the spacer 70 away from the pivoting seat 421. Therefore, when the flow guiding assembly 420a pivots relative to the mounting base 410, the pivoting seat 421 can drive the spacer 70 to pivot together, so that the positioning point 73 can be selectively engaged with the positioning groove 412d of the upper portion of the mounting portion 412. Thereby, the flow guiding assembly 420a is quickly fixed to one of the air guiding positions, and has the effect of preventing fooling and quickly aligning.

However, it should be noted that the present invention is not limited to the design of the aforementioned elastic member 60, the spacer 70, and the positioning groove 412d of the mounting portion 412. For example, in other embodiments, the elastic member 60 may be omitted while the spacer 70 and the positioning groove 412d are retained. In this case, since the material of the spacer 70 itself has deformable characteristics, the spacer 70 can be left unchanged and installed. When the portion 412 is spaced apart, it pivots relative to the mounting portion 412. Still alternatively, in other embodiments, the elastic member 60, the spacer 70, and the positioning groove 412d may be omitted. In addition, the present invention is not limited to the aforementioned fixing portion 412c of the skirt portion 423 and the mounting portion 412. For example, in other embodiments, the fixing hole 412c of the skirt portion 423 and the mounting portion 412 can be omitted. In this case, The pivoting seat 421 and the mounting portion 412 can be adjusted to have a sufficient degree of tightness to maintain the pivoting seat 421 in a specific position (ie, a wind guiding position) after pivoting relative to the mounting portion 412.

As for the flow guiding assembly 420b, since it is similar in structure and assembly to the flow guiding assembly 420a, it will not be described again. However, it should be noted that the shape and size of the sectors of the flow guiding assembly 420a and the flow guiding assembly 420b may be slightly different depending on the internal environment constraints of the different servers, that is, the present invention is not in the shape of a sector. This is limited.

Further, although in the foregoing embodiment, the shroud 40 has two flow guiding assemblies (ie, the flow guiding assembly 420a and the flow guiding assembly 420b), the present invention is not limited to the number of the flow guiding assemblies. For example, in other embodiments, either the flow guiding assembly 420b and the flow guiding assembly 420a may be omitted and only the other flow guiding assembly may be retained. In this case, only one set of the guiding assembly may be reserved on the mounting. Related structures and components. Still alternatively, in other embodiments, the number of flow guiding assemblies may be three or more, respectively disposed on different sides of the mount.

In addition, in this embodiment or other embodiments, a system air hood (not shown) may be optionally disposed on the server 1, and the cover is covered by the airflow cover 40, the processor module, and the processor mount 30. The upper part of the electronic component is used to guide the heat-dissipating airflow blown from the air outlet side 20a, so that the heat-dissipating airflow can be prevented from escaping from the external environment after being blown out from the air outlet side 20a. However, the invention is not limited to the system air hood.

Next, the case where the flow guide 40 is disposed or not will be compared and explained. Please refer to FIG. 7. FIG. 7 is a use context diagram of the server of FIG. 1.

As shown, the flow of airflow when the processor mount 30 is configured and when the shroud 40 is not configured can be seen at the same time. In detail, first, from the heat dissipation airflow F1 (dashed arrow), the heat dissipation airflow F1 means that when one of the processor mounts 30 (the processor mount 30 on the left side of the figure) is not configured with a processor module The air flow from the fan module 20 when the shroud 40 is not disposed in the group. Since no processor module or shroud 40 is disposed on the processor mount 30, an open area is formed above the processor mount 30. When the heat-dissipating airflow F1 flows to this area, it is easy to escape and become disordered, and most of the heat-dissipating airflow F1 will flow to the area to be expanded S2 on the left side of the electronic component 95 (ie, not the main heat-dissipating area in the setting), that is, The electronic component 95 is overheated by relatively reducing the heat dissipation effect of the fan module 20 on the electronic component 95. The overheated electronic component 95 affects the use of the electronic component and causes the operation speed to decrease, thereby affecting the overall performance of the server 1.

In contrast, please refer to the cooling airflow F2 (solid arrow). The cooling airflow F2 refers to one of the processor mounts 30 when the processor module is not configured (the processor mount 30 on the left side of the figure) When the shroud 40 is disposed, air flows from the fan module 20. In detail, since the inclination angles of the flow guiding assemblies 420a and 420b with respect to the mounting seat 410 can be separately adjusted (ie, the flow guiding assemblies 420a or 420b are respectively pivoted relative to the mounting base 410 to selectively switch between the plurality of air guiding positions, As shown in FIG. 6), from the perspective of the drawing, the heat dissipation airflow F2 is blown out from the air outlet side 20a of the fan module 20, and then guided by the inclined flow guiding assemblies 420a and 420b on the air guiding cover 40, so that the heat dissipation airflow F2 The electronic components 95 can be concentratedly blown toward the rear end along the flow guiding assemblies 420a and 420b. That is to say, the flow guiding members 420a and 420b have the effect of guiding and concentrating the heat radiating airflow F2, and the problem caused by the insufficient heat-dissipating effect of the electronic component 95 can be avoided. Thereby, the electronic component 95 can operate smoothly, thereby maintaining the operational efficiency of the server 1.

In addition, please refer to FIG. 8. FIG. 8 is another usage context diagram of a server according to an embodiment of the present invention. It can be seen that in the present embodiment, the shroud 40 is disposed on the processor mount 30 on the right side of the viewing angle of the drawing, due to the tilt angle of the adjustable flow guiding assemblies 420a and 420b relative to the mounting base 410 (coming soon) The flow assembly 420a or 420b is pivoted relative to the mount 410 to selectively switch between a plurality of air guiding positions, as shown in Figure 6). Therefore, similar to the foregoing embodiment, the heat dissipation airflow blown by the fan module 20 can still be guided by the airflow guide 40 to concentrate to the electronic components that need to be deheated at the rear end, thereby maintaining the overall servo 1 predetermined for the internal electronic components. heat radiation.

As described above, in the server disclosed in the present invention, since the airflow cover can be mounted on one of the processor mounts in which the processor module is not installed, and the flow guiding component of the air guiding cover can be adaptively adjusted Angle to match the processor mount in different positions where the shroud is placed. Therefore, regardless of the position of the shroud, the heat dissipation airflow from the fan module can be guided and used centrally to dissipate the electronic components at the rear end of the servo to prevent the cooling airflow from being blown to an unintended heat dissipation region. The heat dissipation effect on the heat-dissipating target setting. In this way, in addition to the improved server performance, the power of the fan module can be adjusted to achieve energy saving.

It can be understood that the user can adjust the light oblique angle of the flow guiding component for the environment inside the server, so as to maximize the utilization of the cooling airflow of the fan.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

1‧‧‧Server

10‧‧‧Hosting box

20‧‧‧Fan module

20a‧‧‧air inlet side

20b‧‧‧air outlet side

30‧‧‧Processor Mount

40‧‧‧Shroud

60‧‧‧Flexible components

70‧‧‧shims

71‧‧‧Ontology

72‧‧‧ 耳耳

73‧‧‧Location points

81‧‧‧Fixed parts

82‧‧‧Fixed parts

95‧‧‧Electronic components

97‧‧‧Electronic components

110‧‧‧ side panels

111‧‧‧floor

410‧‧‧ Mounting

411‧‧‧ protruding parts

412‧‧‧Installation Department

412a‧‧‧Perforation

412b‧‧‧ mounting hole

412c‧‧‧Fixed holes

412d‧‧‧ positioning slot

420a, 420b‧‧‧ diversion components

421‧‧‧ pivoting seat

421s‧‧‧ Cavity

422‧‧‧ sector

423‧‧‧ skirt

423a‧‧‧Perforation

4211‧‧‧ slide

F1, F2‧‧‧ cooling airflow

S1‧‧‧ accommodating space

S2‧‧‧ area to be expanded

1 is a perspective view of a server according to an embodiment of the present invention. 2 is a top view of the server of FIG. 1. Figure 3 is an exploded view of the server of Figure 1. 4 to 5 are exploded views of the flow guide of the servo of Fig. 1 at different viewing angles. 6 is a schematic diagram of the guide vane switching air guiding position of the servo of FIG. 1. FIG. 7 is a usage context diagram of the server of FIG. 1. FIG. 8 is another usage context diagram of a server according to an embodiment of the invention.

Claims (9)

A server includes: a main box having an accommodating space; a fan module accommodating the accommodating space of the main box; at least two processor mounts accommodating the accommodating unit a space adjacent to an air outlet side of the fan module; and at least one airflow cover having a mounting seat and at least one flow guiding component connected to each other, the at least one guiding component being detachably pivoted to the The mounting seat is configured such that the at least one flow guiding component is swingable relative to the mounting seat to selectively switch between the plurality of air guiding positions; wherein each of the at least two processor mounting seats is configured to selectively install a processor The module or the at least one airflow cover, the at least one airflow cover can be detachably mounted on one of the at least two processor mounts on which the processor module is not mounted, the at least one The flow guiding assembly is located at an air guiding position thereof such that the heat dissipating airflow from the air outlet side can be concentrated by the guiding of the at least one flow guiding component. The server of claim 1, further comprising at least one fixing component, wherein the at least one guiding component comprises a pivoting seat, a fan body and a skirt portion, wherein the pivoting seat is pivoted on the mounting seat, a fan body is disposed on the pivoting seat, the skirt protrudes from the pivoting seat, and adjacent to the mounting seat, the skirt has a through hole, and the mounting seat has a plurality of fixing holes adjacent to the pivoting seat, The through hole of the skirt is selectively aligned with one of the fixing holes of the mounting seat, and the fixing member is fixed to the fixing hole of the mounting seat through the aligned through hole to face the at least one flow guiding component relative to the fixing hole The mount is fixed to one of the air guiding positions. The server of claim 1, further comprising at least one spacer, wherein the at least one flow guiding component comprises a pivoting seat and a fan, the pivoting seat is pivoted on the mounting, and the at least one pad The blade is disposed on a side of the pivoting seat facing the mounting seat, the fan body is disposed on the pivoting seat, the mounting seat has a plurality of positioning slots adjacent to the at least one spacer, the at least one spacer comprises a a body and a plurality of positioning points, the positioning points are located on a side of the body facing the positioning slots, and the positioning points are selectively respectively engaged with the positioning slots of the portion to face the at least one flow guiding component The mount is fixed to one of the air guiding positions. The server of claim 3, further comprising at least one fixing component, the at least one flow guiding component further comprising a skirt disposed on the pivoting seat and adjacent to the mounting seat, the skirt The mounting base further has a plurality of fixing holes, the fixing holes are adjacent to the pivoting seat, the through hole of the skirt is selectively aligned with one of the fixing holes of the mounting seat, and the fixing member runs through the pair The perforation is inserted into the fixing hole. The server of claim 4, further comprising at least one elastic component interposed between the at least one spacer and the pivoting socket. The server of claim 1, wherein the number of the at least one flow guiding component is two, respectively detachably pivotally connected to opposite sides of the mounting seat. The server of claim 1, further comprising at least one electronic component disposed in the accommodating space of the mainframe, the at least one electronic component being located at a side of the at least two processor mountings away from the fan module And adjacent to the at least one shroud, such that the heat dissipation airflow can be concentrated to the at least one electronic component by being guided by the flow guiding component. The server of claim 1, wherein the mounting seat of the at least one air hood has a plurality of mounting holes for snapping or screwing to one of the at least two processor mounts. The server of claim 1 further includes a system air hood that is detachably received in the accommodating space of the main chassis, and the air hood of the system is adjacent to the air outlet side of the fan module. And covering the at least two processor mounts and the at least one shroud for guiding the heat dissipation airflow.