CN114863957A

CN114863957A - Heat dissipation module and storage device

Info

Publication number: CN114863957A
Application number: CN202110151248.8A
Authority: CN
Inventors: 丁百亨; 陈建邦; 邵明伟
Original assignee: Apacer Technology Inc
Current assignee: Apacer Technology Inc
Priority date: 2021-02-03
Filing date: 2021-02-03
Publication date: 2022-08-05
Anticipated expiration: 2041-02-03
Also published as: CN114863957B

Abstract

The invention provides a heat dissipation module and a storage device. The heat dissipation module is used for fixing the hard disk body on the circuit board and connecting the hard disk body, and comprises a first fixing piece and a heat dissipation piece. The first fixing part comprises a top part and a bottom part, and the bottom part is used for fixing the hard disk body on the circuit board. The heat sink includes at least one connection portion. The connecting part is pivoted with the top part of the first fixing part. The storage device is arranged on the circuit board and comprises a body, a first fixing piece and a heat dissipation piece. The body comprises an end part and an electronic element. The first fixing piece comprises a top part and a bottom part, wherein the bottom part is used for being fixed on the circuit board. The heat dissipation member is connected with the electronic element of the body and comprises a connecting part. The connecting part is pivoted with the top part of the first fixing part.

Description

Heat dissipation module and storage device

Technical Field

The present invention relates to a heat dissipation module and a storage device, and more particularly, to a heat dissipation module and a storage device that can be locked by a heat dissipation member.

Background

With the development of technology, the size of electronic products is becoming smaller and smaller, and the problem of assembling components therein is accompanied. The solid state disk has a feature of high processing performance, and is one of the commonly used electronic components. In the prior art, the solid state disk is mostly fixed on a circuit board in an electronic product by screws, and the screws are still locked by a screwdriver. However, in an electronic product system with tiny and complicated components, the difficulty of locking the solid state disk is higher, and the screws are easy to fall off during the locking process. Therefore, how to simplify the mounting manner of the components in the electronic products with the size thereof gradually decreasing has become a problem to be solved in the field.

Therefore, there is a need to develop a heat dissipation module and a storage device that can solve the above problems, so as to solve the problems in the prior art.

Disclosure of Invention

The present invention is directed to a heat dissipation module and a storage device to solve and overcome the above-mentioned problems and disadvantages of the prior art.

Another objective of the present invention is to connect the body, the first fixing element and the heat dissipating element, so that the heat dissipating element can be used as a screwdriver, thereby improving the heat dissipating effect of the electronic components on the solid state disk, and achieving the effects of modularizing the components and simplifying the procedure of installing the solid state disk in the electronic device.

To achieve the foregoing objective, the present invention provides a heat dissipation module for fixing a hard disk body on a circuit board and indirectly or directly connecting the hard disk body, and the heat dissipation module includes a first fixing element and a heat dissipation element. The first fixing part comprises a top part and a bottom part, and the bottom part is used for fixing the hard disk body on the circuit board. The heat sink includes at least one connection portion. The connecting part is pivoted with the top part of the first fixing part.

To achieve the foregoing objective, the present invention further provides a storage device disposed on a circuit board, and the storage device includes a body, a first fixing element and a heat sink. The body comprises an end part and an electronic element. The first fixing member includes a top portion and a bottom portion. Wherein the bottom portion is adapted to be secured to a circuit board. The heat dissipation member is indirectly or directly connected with the electronic element of the body and comprises a connecting part. The connecting part is pivoted with the top part of the first fixing part.

Drawings

Fig. 1 is a schematic structural diagram of a storage device according to an embodiment of the present invention.

Fig. 2 is an exploded view of the storage device of fig. 1 from a perspective.

Fig. 3 is an exploded view of the storage device of fig. 1 from another perspective.

Fig. 4 is a flowchart illustrating a storage device installation method according to an embodiment of the invention.

Fig. 5 is a schematic view disclosing a structure of the storage device of fig. 1 during an installation process.

The reference numbers are as follows:

1: body

10: electronic component

11: end part

12: heat-conducting film

13: concave part

14: gap

2: first fixed part

21: top part

22: intermediate section

23: bottom part

24: perforation

3: heat sink

31: connecting part

32: rotating shaft

33: hole(s)

4: second fixing part

41: convex part

5: gasket

S1-S4: step (ii) of

Z: vertical line

Detailed Description

Some exemplary embodiments that embody features and advantages of the invention will be described in detail in the description that follows. As will be realized, the invention is capable of other and different modifications and its several details are capable of modifications in various obvious respects, all without departing from the invention, and the description and drawings are to be regarded as illustrative in nature, and not as restrictive.

Please refer to fig. 1, fig. 2 and fig. 3. Fig. 1 is a schematic structural diagram of a storage device according to an embodiment of the present invention. Fig. 2 is an exploded view of the storage device of fig. 1 from a perspective. Fig. 3 is an exploded view of the storage device of fig. 1 from another perspective. As shown in the figure, the storage device is configured to be disposed on a circuit board (not shown), and includes a body 1, a first fixing member 2, and a heat sink 3. The body 1 includes an end portion 11 and an electronic component 10. The first fixing member 2 includes a top portion 21 and a bottom portion 23. Wherein the bottom portion 23 is used for fixing to a circuit board. The heat sink 3 is connected to the electronic component 10 of the body 1 indirectly or directly, and includes at least one connection portion 31. The connecting portion 31 is pivotally connected to the top portion 21 of the first fixing member 2. Thus, a modular structure in which the body 1, the first fixing member 2 and the heat sink 3 are connected to each other can be formed.

In the present embodiment, the main body 1 of the storage device is a solid state disk, and the storage device preferably includes a thermal conductive film 12, but not limited thereto. The thermal film 12 is disposed between the electronic component 10 and the heat sink 3, and is closely attached to the surface of the electronic component 10, and has a size larger than that of the electronic component 10, so as to improve the heat dissipation effect of the electronic component 10. The heat spreader 3 is made of aluminum, copper or alloy thereof, and the size and shape thereof can be changed according to the actual requirement, for example, but not limited to, the length in the extending direction is determined according to the number and size of the electronic components 10 and the thermal conductive film 12 on the body 1.

In the present embodiment, the heat sink 3 includes two connecting portions 31 and further includes a rotating shaft 32. The two connecting portions 31 each include a hole 33. The first fixing member 2 further includes a through hole 24 disposed at the top portion 21. The top 21 of the first fixing element 2 is disposed between the two connecting portions 31, and the rotating shaft 32 is disposed through the hole 33 of the connecting portion 31 and the through hole 24 of the first fixing element 2, so that the heat dissipating element 3 and the first fixing element 2 are pivotally connected to each other, but not limited thereto. In some embodiments, the rotating shaft 32 of the heat dissipating member 3 extends from the opposite surfaces of the two connecting portions 31 to each other and is clamped in the through hole 24 of the first fixing member 2. In this embodiment, the aperture of the through hole 24 of the first fixing member 2 is larger than the diameter of the rotating shaft 32.

In this embodiment, the first fixing member 2 may further include an intermediate portion 22. The middle portion 22 is disposed between the top portion 21 and the bottom portion 23, and the diameter of the middle portion 22 is smaller than the diameters of the top portion 21 and the bottom portion 23. The end portion 11 of the body 1 is sleeved or partially surrounded by the middle portion 22. In this embodiment, the storage device further includes a second fixing member 4. The second fixing member 4 is fixed to the end portion 11 of the body 1, and the first fixing member 2 penetrates through the end portion 11 and the second fixing member 4, so that the body 1 and the first fixing member 2 are connected. In the present embodiment, the body 1 further includes a plurality of recesses 13 disposed at the end portion 11. The second fixing member 4 includes a plurality of protrusions 41 fitted into the plurality of recesses 13 of the body 1. In this embodiment, the end portion 11 of the body 1 includes an arc-shaped notch 14, and the concave portion 13 is disposed around the periphery of the arc-shaped notch 14. The second fixing element 4 has a ring-shaped contour, with a projection 41 being provided on the second fixing element 4 and partly corresponding to the recess 13 on the end 11. In the present embodiment, the first fixing element 2 is an anti-drop screw, and the bottom 23 has a thread. The second fixing member 4 is a nut having a thread matching with the thread of the first fixing member 2, but not limited thereto.

In this embodiment, the storage device further comprises a gasket 5. The gasket 5 may be made of, for example but not limited to, rubber, and is disposed between the second fixing member 4 and the top portion 21 of the first fixing member 2, i.e., sleeved on the middle portion 22 of the first fixing member 2.

According to the structure of the storage device, the locking of the storage device can be completed through the heat dissipation member 3. Please refer to fig. 4 and 5. Fig. 4 is a flowchart illustrating a storage device installation method according to an embodiment of the invention. Fig. 5 is a schematic structural diagram disclosing the storage device of fig. 1 in an installation process. As shown in fig. 4, first, in step S1, the main body 1 of the storage device is disposed on a circuit board (not shown) of an electronic device to be mounted. Next, in step S2, the heat sink 3 is in an upright state, as shown in fig. 5. The upright state is that the extending direction of the heat sink 3 is parallel to the vertical line Z, but not limited thereto. Thereafter, in step S3, the first fixing element 2 is locked on the circuit board of the electronic device by rotating the heat sink 3 in the upright state. Finally, in step S4, the heat sink 3 is indirectly or directly attached to the surface of the electronic component 10 of the body 1 to dissipate heat generated by the electronic component 10 during operation. Therefore, the storage device can be assembled on the electronic device directly through the heat dissipation member 3 of the storage device, thereby avoiding the problem caused by the prior art that a screwdriver and a screw locking element are additionally needed, and achieving the effect of reducing the cost of assembling the storage device.

In the embodiment, the elasticity of the spacer 5 can increase the stroke of the first fixing element 2 locked on the circuit board. Thus, after step S3 is completed, the heat sink 3 may still have a certain rotation space. In addition, since the aperture of the through hole 24 of the first fixing element 2 is larger than the diameter of the rotating shaft 32, when the bottom 23 of the first fixing element 2 is locked to the circuit board, the heat sink 3 can further have a rotation space of about 5-10 degrees. Therefore, the extending direction of the heat sink 3 can be adjusted to be parallel to the extending direction of the body 1, so as to reliably attach the heat sink 3 to the electronic element 10 and the heat conductive film 12 of the body 1, thereby achieving the effect of improving the heat dissipation effect of the electronic element 10.

In the embodiment, the heat sink 3 can be tightly covered on the thermal film 12 by locking the first fixing element 2, or attached to the electronic element 10 and the thermal film 12 of the body 1 by gluing, but not limited thereto. In some embodiments, the heat sink 3 can be magnetically attached to the electronic component 10 and the thermal conductive film 12 to separate the heat sink 3 from the body 1 if necessary, so as to adjust the locking tightness of the storage device or to detach the storage device.

Please refer to fig. 2 again. In another embodiment, the invention further provides a heat dissipation module. In this embodiment, the heat dissipation module is used for fixing a hard disk body (not shown) on a circuit board (not shown) and is indirectly or directly connected with the hard disk body, and includes a first fixing element 2 and a heat dissipation element 3. The first fixing member 2 includes a top portion 21 and a bottom portion 23. The bottom 23 is used to fix the circuit board, so that the hard disk body is fixed on the circuit board. The heat sink 3 includes at least one connection portion 31. The connecting portion 31 is pivotally connected to the top portion 21 of the first fixing member 2. In the embodiment, the hard disk body can be clamped between the top 21 of the first fixing element 2 or between the heat sink 3 and the circuit board by tightly locking the first fixing element 2 to the circuit board, but not limited thereto.

In this embodiment, the hard disk body is a solid state disk, preferably a solid state disk with an m.2 form factor, but not limited thereto. The first fixing member 2 and the heat dissipating member 3 of the heat dissipating module may have, for example, but not limited to, the same structure as described above. The first fixing element 2 includes a through hole 24, and the heat dissipating element 3 includes a connecting portion 31, a rotating shaft 32 and a hole 33. In this embodiment, the first fixing member 2 may further include an intermediate portion 22. The intermediate portion 22 is disposed between the top portion 21 and the bottom portion 23, and has a diameter smaller than the intermediate portion 22 of the top portion 21 and the bottom portion 23. The heat dissipation module further comprises a spacer 5. The gasket 5 may be made of, for example, but not limited to, rubber, and is fitted over the intermediate portion 22 of the first fixing member 2. Therefore, the heat dissipation module composed of the first fixing member 2, the heat dissipation member 3 and the gasket 5 can also be used for fixing a known solid state disk on a circuit board of an electronic device and connecting the known solid state disk with the known solid state disk, so that the mounting procedure of the solid state disk is simplified, and the heat dissipation effect of the solid state disk is improved.

In summary, the present invention provides a heat dissipation module and a storage device, wherein the body, the first fixing element and the heat dissipation element are connected, or the first fixing element and the heat dissipation element are connected, so as to form a modular structure convenient for carrying and installation, and the solid state disk can be directly locked and attached by the heat dissipation element, thereby achieving the effect of simplifying the procedure of installing the solid state disk in the electronic device. In addition, through the arrangement of the gasket and the design of the aperture and the rotating shaft, the heat dissipation piece can be accurately attached to the surface of the electronic element, and the effect of improving the heat dissipation effect of the electronic element is achieved.

The present invention may be modified in various ways by those skilled in the art without departing from the scope of the appended claims.

Claims

1. A heat dissipation module is used for fixing a hard disk body on a circuit board and indirectly or directly connecting with the hard disk body, and comprises:

the first fixing piece comprises a top part and a bottom part, and the bottom part is used for fixing the hard disk body on the circuit board; and

the heat dissipation piece comprises at least one connecting part which is pivoted with the top part of the first fixing piece.

2. The heat dissipating module according to claim 1, wherein the heat dissipating member further comprises a shaft disposed at the at least one connecting portion, the first fixing member further comprises a through hole disposed at the top portion, and the shaft is disposed through the through hole to pivotally connect the heat dissipating member and the first fixing member to each other.

3. The heat dissipating module of claim 2, wherein the heat dissipating member comprises two connecting portions, each of the two connecting portions comprises a hole, the top portion is disposed between the two connecting portions, and the shaft penetrates the holes of the two connecting portions and the through hole of the first fixing member.

4. The heat dissipating module of claim 1, further comprising a middle portion disposed between the top portion and the bottom portion, the middle portion having a diameter smaller than the diameters of the top portion and the bottom portion.

5. The heat dissipating module of claim 4, further comprising a gasket made of rubber and disposed around the middle portion of the first fixing member.

6. A storage device is arranged on a circuit board and comprises:

a body including an end portion and an electronic component;

a first fixing member including a top portion and a bottom portion, wherein the bottom portion is used for fixing the circuit board; and

the heat dissipation part is indirectly or directly connected with the electronic element of the body and comprises at least one connecting part which is pivoted with the top part of the first fixing part.

7. The storage device as claimed in claim 6, wherein the heat sink further comprises a shaft disposed at the at least one connecting portion, the first fixing member further comprises a through hole disposed at the top portion, and the shaft is disposed through the through hole to pivotally connect the heat sink and the first fixing member to each other.

8. The storage device as claimed in claim 7, wherein the heat sink comprises two connecting portions, the two connecting portions each comprise a hole, the top portion is disposed between the two connecting portions, and the shaft is disposed through the holes of the two connecting portions and the through hole of the first fixing member.

9. The storage device of claim 6, further comprising a thermally conductive film disposed between the electronic component and the heat sink.

10. The storage device of claim 6, further comprising a second fastener, the first fastener further comprising a middle portion disposed between the top portion and the bottom portion, the middle portion having a diameter smaller than the top portion and the bottom portion, the second fastener being secured to the end portion of the body, and the first fastener passing through the second fastener.

11. The storage device of claim 6, further comprising a gasket formed of rubber and disposed between the end of the body and the top of the first retaining member.