CN114863957B

CN114863957B - Heat radiation module and storage device

Info

Publication number: CN114863957B
Application number: CN202110151248.8A
Authority: CN
Inventors: 丁百亨; 陈建邦; 邵明伟
Original assignee: Apacer Technology Inc
Current assignee: Apacer Technology Inc
Priority date: 2021-02-03
Filing date: 2021-02-03
Publication date: 2023-07-25
Anticipated expiration: 2041-02-03
Also published as: CN114863957A

Abstract

The invention provides a heat dissipation module and a storage device. The heat dissipation module is used for fixing the hard disk body on the circuit board and is connected with the hard disk body, and comprises a first fixing piece and a heat dissipation piece. The first fixing piece comprises a top and a bottom, and the bottom is used for fixing the hard disk body on the circuit board. The heat sink comprises at least one connecting portion. The connecting part is pivoted with the top of the first fixing piece. The storage device is arranged on the circuit board and comprises a body, a first fixing piece and a heat dissipation piece. The body includes an end portion and an electronic component. The first fixing piece comprises a top and a bottom, wherein the bottom is used for being fixed on the circuit board. The heat dissipation piece is connected with the electronic element of the body and comprises a connecting part. The connecting part is pivoted with the top of the first fixing piece.

Description

Heat radiation module and storage device

Technical Field

The present invention relates to a heat dissipating module and a storage device, and more particularly to a heat dissipating module and a storage device capable of locking by a heat dissipating member.

Background

With the development of technology, electronic products have been increasingly smaller in size, and the assembly of components has been accompanied. The solid state disk has the characteristic of high processing efficiency, and is one of the commonly used electronic components at present. In the prior art, most solid state disks are fixed on a circuit board in an electronic product through screws, and locking of the screws is still performed through screwdrivers. However, in electronic product systems with tiny and complex components, the difficulty of locking the solid state disk is higher, and the screw is easy to fall off in the locking process. Therefore, how to simplify the mounting manner of the components therein under the condition that the size of the electronic product is gradually reduced has become a problem to be solved in the art.

Therefore, there is a need to develop a heat dissipating module and a storage device that can solve the above problems, so as to solve the problems of the prior art.

Disclosure of Invention

The present invention is directed to a heat dissipating module and a storage device, which solve and improve the above-mentioned problems and disadvantages of the prior art.

The invention further aims to realize the effects of modularization of components and simplifying the procedure of installing the solid state disk into the electronic device while improving the heat dissipation effect of the electronic element on the solid state disk by connecting the body, the first fixing piece and the heat dissipation piece.

In order to achieve the above objective, the present invention provides a heat dissipating module for fixing a hard disk body to a circuit board and indirectly or directly connecting the hard disk body, and comprising a first fixing member and a heat dissipating member. The first fixing piece comprises a top and a bottom, and the bottom is used for fixing the hard disk body on the circuit board. The heat sink comprises at least one connecting portion. The connecting part is pivoted with the top of the first fixing piece.

In order to achieve the above objective, the present invention further provides a storage device configured on a circuit board and including a main body, a first fixing member and a heat dissipation member. The body includes an end portion and an electronic component. The first fixing piece comprises a top and a bottom. Wherein the bottom is used for being fixed on the circuit board. The heat sink is connected with the electronic component of the body indirectly or directly and comprises a connecting part. The connecting part is pivoted with the top of the first fixing piece.

Drawings

Fig. 1 is a schematic diagram of a storage device according to an embodiment of the invention.

Fig. 2 is an exploded view of a structure of the storage device of fig. 1 at a viewing angle.

Fig. 3 is an exploded view illustrating a structure of the storage device of fig. 1 in another view.

FIG. 4 is a flowchart of a storage device mounting method according to an embodiment of the invention.

Fig. 5 is a schematic view illustrating a structure of the storage device of fig. 1 during installation.

The reference numerals are as follows:

1: body

10: electronic component

11: end portion

12: heat conducting film

13: concave part

14: notch

2: first fixing piece

21: top part

22: intermediate portion

23: bottom part

24: perforation

3: heat dissipation piece

31: connecting part

32: rotating shaft

33: holes and holes

4: second fixing piece

41: convex part

5: gasket

S1-S4: step (a)

Z: vertical line

Detailed Description

Some exemplary embodiments embodying features and advantages of the present invention will be described in detail in the following description. It will be understood that the invention is capable of modification in various other forms without departing from the scope of the invention, and that the description and drawings are intended to be illustrative in nature and not as a limitation.

Please refer to fig. 1, 2 and 3. Fig. 1 is a schematic diagram of a storage device according to an embodiment of the invention. Fig. 2 is an exploded view of a structure of the storage device of fig. 1 at a viewing angle. Fig. 3 is an exploded view illustrating a structure of the storage device of fig. 1 in another view. As shown in the figure, the storage device is configured to be disposed on a circuit board (not shown), and includes a main body 1, a first fixing member 2, and a heat dissipation member 3. The body 1 includes an end 11 and an electronic component 10. The first fixture 2 includes a top 21 and a bottom 23. Wherein the bottom 23 is adapted to be secured to a circuit board. The heat sink 3 is connected with the electronic component 10 of the body 1 indirectly or directly, and includes at least one connecting portion 31. The connecting portion 31 is pivotally connected to the top 21 of the first fixing member 2. Thus, a modular structure in which the body 1, the first fixing member 2 and the heat sink 3 are connected to each other can be formed.

In the present embodiment, the body 1 of the storage device is preferably a solid state disk, and the storage device preferably includes a heat conductive film 12, but is not limited thereto. The heat conducting film 12 is disposed between the electronic component 10 and the heat sink 3, and is closely adhered to the surface of the electronic component 10, and has a larger size than the electronic component 10, so as to enhance the heat dissipation effect of the electronic component 10. The heat dissipation element 3 is made of aluminum, copper or alloy thereof, and its size and shape can be changed according to practical requirements, for example, the length in the extending direction is determined according to the number and the size of the electronic components 10 and the heat conductive films 12 on the body 1, but not limited thereto.

In the present embodiment, the heat dissipation element 3 includes two connection portions 31 and further includes a rotating shaft 32. The two connecting portions 31 each include a hole 33. The first fixing element 2 further comprises a through hole 24 arranged on the top 21. The top 21 of the first fixing member 2 is disposed between the two connecting portions 31, and the rotating shaft 32 is disposed through the hole 33 of the connecting portion 31 and the through hole 24 of the first fixing member 2, so that the heat dissipation member 3 and the first fixing member 2 are pivoted to each other, but not limited thereto. In some embodiments, the rotating shaft 32 of the heat dissipation element 3 extends from opposite surfaces of the two connecting portions 31 toward each other, and is clamped in the through hole 24 of the first fixing element 2. In the present embodiment, the aperture of the through hole 24 of the first fixing element 2 is larger than the diameter of the rotating shaft 32.

In this embodiment, the first fixing member 2 may further include an intermediate portion 22. The middle portion 22 is disposed between the top portion 21 and the bottom portion 23, and the diameter of the middle portion 22 is smaller than the diameters of the top portion 21 and the bottom portion 23. The end 11 of the body 1 is sleeved or partially encircling the intermediate portion 22. In this embodiment, the storage device further includes a second fixing member 4. The second fixing member 4 is fixed to the end 11 of the body 1, and the first fixing member 2 is inserted through the end 11 and the second fixing member 4, so as to connect the body 1 and the first fixing member 2. In this embodiment, the body 1 further includes a plurality of recesses 13 disposed at the end 11. The second fixing member 4 includes a plurality of protruding portions 41, and is fitted into the plurality of recessed portions 13 of the body 1. In the present embodiment, the end 11 of the body 1 includes an arc-shaped notch 14, and the recess 13 is disposed around the periphery of the arc-shaped notch 14. The second fixing element 4 has an annular profile, the projections 41 being arranged on the second fixing element 4 and partially corresponding to the recesses 13 on the end 11. In this embodiment, the first fixing member 2 is an anti-falling screw, and the bottom 23 has threads. The second fixing member 4 is a nut, and has a line matching with the thread of the first fixing member 2, but not limited thereto.

In this embodiment, the storage device further comprises a spacer 5. The gasket 5 may be made of rubber, for example, but not limited to, and is disposed between the second fixing member 4 and the top portion 21 of the first fixing member 2, that is, is sleeved on the middle portion 22 of the first fixing member 2.

According to the structure of the storage device, the locking of the storage device can be completed through the heat dissipation piece 3. Please refer to fig. 4 and fig. 5. FIG. 4 is a flowchart of a storage device mounting method according to an embodiment of the invention. Fig. 5 is a schematic view illustrating a structure of the storage device of fig. 1 during installation. As shown in fig. 4, first, in step S1, a main body 1 of a storage device is disposed on a circuit board (not shown) of an electronic device to be mounted. Next, in step S2, the heat sink 3 is in an upright state, as shown in fig. 5. The standing state refers to the extending direction of the heat dissipation element 3 being parallel to the vertical line Z, but is not limited thereto. Thereafter, in step S3, the first fixing member 2 is locked to the circuit board of the electronic device by rotating the heat dissipation member 3 in the upright state. Finally, in step S4, the heat sink 3 is indirectly or directly attached to the surface of the electronic component 10 of the body 1, so as to dissipate heat of the electronic component 10 during operation. Therefore, the invention can assemble the storage device to the electronic device directly through the heat dissipation part 3 of the storage device, can avoid the problem caused by the prior art that the screwdriver and the screw locking element are needed to be additionally used, and achieves the effect of reducing the cost of assembling the storage device.

In this embodiment, the elasticity of the spacer 5 can increase the stroke of locking the first fixing member 2 to the circuit board. Thus, after step S3 is completed, the heat sink 3 may still have a certain rotational space. In addition, since the aperture of the through hole 24 of the first fixing member 2 is larger than the diameter of the rotating shaft 32, the heat dissipation member 3 can further have a rotation space of about 5-10 degrees when the bottom 23 of the first fixing member 2 is locked to the circuit board. Therefore, the extending direction of the heat dissipation element 3 can be adjusted to be parallel to the extending direction of the body 1, so as to attach the heat dissipation element 3 to the electronic component 10 and the heat conducting film 12 of the body 1, thereby achieving the effect of improving the heat dissipation effect of the electronic component 10.

In the present embodiment, the heat dissipation element 3 can be tightly covered on the heat conductive film 12 by the locking of the first fixing element 2, or can be attached to the electronic component 10 of the body 1 and the heat conductive film 12 by gluing, but not limited thereto. In some embodiments, the heat sink 3 may be attached to the electronic component 10 and the heat conductive film 12 by magnetic attraction, so as to separate the heat sink 3 from the body 1 when necessary, thereby adjusting the tightness of the locking of the storage device or disassembling the storage device.

Please refer to fig. 2 again. In another embodiment, the invention further provides a heat dissipation module. In this embodiment, the heat dissipation module is used for fixing a hard disk body (not shown) to a circuit board (not shown) and is indirectly or directly connected to the hard disk body, and includes a first fixing member 2 and a heat dissipation member 3. The first fixture 2 includes a top 21 and a bottom 23. The bottom 23 is used for being fixed on a circuit board, so that the hard disk body is fixed on the circuit board. The heat sink 3 comprises at least one connection portion 31. The connecting portion 31 is pivotally connected to the top 21 of the first fixing member 2. In the present embodiment, by tightly locking the first fixing member 2 to the circuit board, the hard disk body can be clamped between the top 21 of the first fixing member 2 or the heat dissipation member 3 and the circuit board, but not limited thereto.

In the embodiment, the hard disk body is a solid state disk, preferably a solid state disk with an m.2 external specification, but not limited thereto. The structures of the first fixing member 2 and the heat dissipating member 3 of the heat dissipating module may be, for example, but not limited to, the same as described above. The first fixing member 2 includes a through hole 24, and the heat sink 3 includes a connecting portion 31, a rotating shaft 32, and a hole 33. In this embodiment, the first fixing member 2 may further include an intermediate portion 22. The middle part 22 is arranged between the top part 21 and the bottom part 23, and the diameter of the middle part 22 is smaller than that of the top part 21 and the bottom part 23. The heat dissipation module further comprises a spacer 5. The spacer 5 may be made of, for example, but not limited to, rubber and is fitted over the intermediate portion 22 of the first fixing member 2. Therefore, the heat dissipation module formed by the first fixing piece 2, the heat dissipation piece 3 and the gasket 5 can also be used for fixing a known solid state disk on a circuit board of the electronic device and connecting the solid state disk, so that the effects of simplifying the installation procedure of the solid state disk and improving the heat dissipation effect of the solid state disk are achieved.

In summary, the present invention provides a heat dissipation module and a storage device, wherein a modular structure is formed by connecting a main body, a first fixing member and a heat dissipation member, or connecting the first fixing member and the heat dissipation member, and the solid state disk can be directly locked by the heat dissipation member, so as to simplify the procedure of installing the solid state disk in an electronic device. In addition, through the arrangement of the gaskets and the design of the aperture and the rotating shaft, the heat dissipation piece can be ensured to be accurately attached to the surface of the electronic element, and the effect of improving the heat dissipation effect of the electronic element is achieved.

The present invention is modified as desired by those skilled in the art, but without departing from the scope of the appended claims.

Claims

1. A heat dissipation module for fixing a hard disk body on a circuit board and indirectly or directly connecting with the hard disk body comprises:

the first fixing piece comprises a top and a bottom, and the bottom is used for fixing the hard disk body on the circuit board; and

a heat sink comprising at least one connecting portion pivotally connected to the top of the first fixing member,

wherein the fixing between the bottom of the first fixing piece and the circuit board is achieved by rotating the heat dissipation piece to drive the first fixing piece;

the first fixing piece also comprises a through hole arranged at the top, and the rotating shaft penetrates through the through hole to enable the heat dissipation piece and the first fixing piece to be pivoted with each other;

the heat dissipation part comprises two connecting parts, wherein the two connecting parts respectively comprise a hole, the top part is arranged between the two connecting parts, and the rotating shaft penetrates through the holes of the two connecting parts and the through hole of the first fixing part.

2. The heat dissipating module of claim 1, wherein the heat sink is in an upright state when rotated.

3. The heat dissipating module of claim 1, further comprising an intermediate portion disposed between the top portion and the bottom portion, and having a diameter smaller than the diameters of the top portion and the bottom portion.

4. The heat dissipating module of claim 3, further comprising a gasket made of rubber and sleeved on the middle portion of the first fixing member.

5. A storage device for being disposed on a circuit board, comprising:

a body including an end and an electronic device;

the first fixing piece comprises a top and a bottom, wherein the bottom is used for being fixed on the circuit board; and

a heat sink, which is connected with the electronic component of the body indirectly or directly and comprises at least one connecting part pivoted with the top of the first fixing part,

6. The storage device of claim 5, wherein the heat sink is in an upright state when rotated.

7. The storage device of claim 5, further comprising a thermal conductive film disposed between the electronic component and the heat sink.

8. The storage device of claim 5, further comprising a second fixing member, wherein the first fixing member further comprises an intermediate portion disposed between the top portion and the bottom portion, the intermediate portion has a smaller diameter than the top portion and the bottom portion, the second fixing member is fixed to the end portion of the body, and the first fixing member is disposed through the second fixing member.

9. The storage device of claim 5, further comprising a spacer formed of rubber and disposed between the end of the body and the top of the first securing member.