TWI755269B - Heat dissipation module and storage device - Google Patents

Abstract

A heat dissipation module and a storage device are provided. The heat dissipation module is used to fix a hard drive body on a circuit board and includes a first fixing element and a heat dissipating element. The first fixing element includes a top and a bottom. The bottom is used to fix the hard drive body on the circuit board. The heat dissipating element includes at least one connection portion. The connection portion is pivoted on the top of the first fixing element. The storage device is used to be fixed on the circuit board and includes a main body, a first fixing element and a heat dissipating element. The main body includes an end portion and an electronic element. The first fixing element includes a top and a bottom. The bottom is used to be fixed on the circuit board. The heat dissipating element is connected to the electronic element of the main body and includes a connection portion. The connection portion is pivoted on the top of the first fixing element.

Description

Cooling module and storage device

This case relates to a heat dissipation module and a storage device, especially a heat dissipation module and a storage device that can be locked by a heat dissipation member.

With the development of science and technology, the size of electronic products is getting smaller and smaller, which is accompanied by the assembly of components. Solid-state hard disks have the characteristics of high processing performance and are one of the commonly used electronic components. In the prior art, the solid-state hard disk is mostly fixed on the circuit board of the electronic product through screws, and the screw is still locked with a screwdriver. However, in an electronic product system with tiny and complex components, it is more difficult to lock the solid-state hard disk, and the screws are also likely to fall off during the locking process. Therefore, how to simplify the installation of components in the electronic product has become a problem to be solved in the art.

Therefore, it is necessary to develop a heat dissipation module and a storage device that can solve the above problems, so as to solve the problems faced by the prior art.

The main purpose of the present application is to provide a heat dissipation module and a storage device to solve and improve the problems and shortcomings of the aforementioned prior art.

Another purpose of this case is to use the connection between the main body, the first fixing member and the heat sink, so that the heat sink can be used as a screwdriver to improve the heat dissipation effect of the electronic components on the solid state hard disk, and at the same time achieve modular components and simplify the assembly process. Efficacy of the procedure for installing the solid state drive into the electronic device.

In order to achieve the aforementioned purpose, the present application provides a heat dissipation module, which is used for fixing a hard disk body on a circuit board and indirectly or directly connected with the hard disk body, and includes a first fixing member and a heat dissipation member. The first fixing member includes a top portion and a bottom portion, and the bottom portion is used for fixing the hard disk body on the circuit board. The heat sink includes at least one connecting portion. The connecting portion is pivotally connected with the top of the first fixing member.

In order to achieve the aforementioned purpose, the present application further provides a storage device, which is arranged on a circuit board and includes a main body, a first fixing member and a heat dissipation member. The body includes ends and electronic components. The first fixing member includes a top and a bottom. The bottom part is used for fixing to the circuit board. The heat sink is indirectly or directly connected with the electronic components of the body, and includes a connecting portion. The connecting portion is pivotally connected with the top of the first fixing member.

Some typical embodiments embodying the features and advantages of the present case will be described in detail in the description of the latter paragraph. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and drawings therein are essentially for illustration purposes, rather than for limiting this case.

Please refer to Figure 1, Figure 2 and Figure 3. FIG. 1 is a schematic diagram showing the structure of a storage device according to an embodiment of the present application. FIG. 2 is an exploded view of the structure of the storage device of FIG. 1 from a viewing angle. FIG. 3 is an exploded view of the structure of the storage device of FIG. 1 from another viewing angle. As shown in the figure, the storage device is arranged on a circuit board (not shown), and includes a main body 1 , a first fixing member 2 and a heat dissipation member 3 . The body 1 includes an end portion 11 and an electronic component 10 . The first fixing member 2 includes a top portion 21 and a bottom portion 23 . Wherein, the bottom 23 is used for fixing to the circuit board. The heat sink 3 is indirectly or directly connected to the electronic component 10 of the main body 1 , and includes at least one connecting portion 31 . The connecting portion 31 is pivotally connected to the top portion 21 of the first fixing member 2 . Thereby, a modular structure in which the main body 1 , the first fixing member 2 and the heat dissipation member 3 are connected to each other can be formed.

In this embodiment, the main body 1 of the storage device is a solid-state hard disk, and the storage device preferably includes a thermally conductive film 12, but it is not limited thereto. The thermally conductive film 12 is disposed between the electronic component 10 and the heat sink 3 , and is closely attached to the surface of the electronic component 10 , and has a larger size than the electronic component 10 , so as to enhance the heat dissipation effect of the electronic component 10 . The heat sink 3 is made of aluminum, copper or its alloy, and its size and shape can be arbitrarily changed according to actual needs. But not limited to this.

In this embodiment, the heat sink 3 includes two connecting portions 31 and further includes a rotating shaft 32 . The two connecting portions 31 respectively include holes 33 . The first fixing member 2 further includes a through hole 24 disposed on the top portion 21 . The top 21 of the first fixing member 2 is disposed between the two connecting portions 31 , and the rotating shaft 32 passes through the hole 33 of the connecting portion 31 and the through hole 24 of the first fixing member 2 , so that the heat dissipation member 3 and the first fixing member 2 are pivotally connected to each other, but not limited to this. In some embodiments, the rotating shaft 32 of the heat dissipation member 3 extends toward each other from the opposite surfaces of the two connecting portions 31 , and is clamped in the through hole 24 of the first fixing member 2 . In this embodiment, the hole diameter of the through hole 24 of the first fixing member 2 is larger than the diameter of the rotating shaft 32 .

In this embodiment, the first fixing member 2 may further include an intermediate portion 22 . The middle portion 22 is disposed between the top portion 21 and the bottom portion 23 , and the diameter of the middle portion 22 is smaller than the diameters of the top portion 21 and the bottom portion 23 . The end portion 11 of the main body 1 is sleeved or partially surrounded by the middle portion 22 . In this embodiment, the storage device further includes a second fixing member 4 . The second fixing member 4 is fixed on the end portion 11 of the body 1 , and the first fixing member 2 passes through the end portion 11 and the second fixing member 4 , thereby achieving the connection between the body 1 and the first fixing member 2 . In this embodiment, the main body 1 further includes a plurality of concave portions 13 disposed at the end portion 11 . The second fixing member 4 includes a plurality of convex portions 41 embedded in a plurality of concave portions 13 of the main body 1 . In this embodiment, the end portion 11 of the main body 1 includes an arc-shaped notch 14 , and the concave portion 13 is arranged around the periphery of the arc-shaped notch 14 . The second fixing member 4 has an annular contour. The convex portion 41 is disposed on the second fixing member 4 and partially corresponds to the concave portion 13 on the end portion 11 . In this embodiment, the first fixing member 2 is an anti-dropout screw, and the bottom portion 23 has threads. The second fixing member 4 is a nut, which has a thread matching with the thread of the first fixing member 2, but is not limited thereto.

In this embodiment, the storage device further includes a gasket 5 . The gasket 5 can be made of rubber, for example but not limited to, and is disposed between the second fixing member 4 and the top 21 of the first fixing member 2 , that is, sleeved on the middle portion 22 of the first fixing member 2 .

According to the structure of the aforementioned storage device, in this case, the heat sink 3 can be used to complete the locking of the storage device. Please refer to Figure 4 and Figure 5. FIG. 4 is a flow chart illustrating a method for installing a storage device according to an embodiment of the present application. FIG. 5 is a schematic diagram showing the structure of the storage device of FIG. 1 during the installation process. As shown in FIG. 4, first, in step S1, the main body 1 of the storage device is disposed on the circuit board (not shown) of the electronic device to be installed. Next, in step S2, the heat sink 3 is in an upright state, as shown in FIG. 5 . The upright state means that the extending direction of the heat sink 3 and the vertical line Z are parallel to each other, but it is not limited thereto. Then, in step S3, by rotating the heat sink 3 in the upright state, the first fixing member 2 is fastened to the circuit board of the electronic device. Finally, in step S4, the heat sink 3 is indirectly or directly attached to the surface of the electronic device 10 of the main body 1, so as to dissipate the heat of the electronic device 10 when it operates. In this way, in this case, the storage device can be assembled to the electronic device directly through the heat sink 3 of the storage device, which can avoid the problems caused by the conventional technology that requires additional use of screwdrivers and screw-locking components, thereby reducing the cost of assembling the storage device. effect.

In this embodiment, the elasticity of the gasket 5 can increase the stroke of the first fixing member 2 to be locked on the circuit board. Therefore, after step S3 is completed, the heat sink 3 can still have a certain rotation space. In addition, since the diameter of the through hole 24 of the first fixing member 2 is larger than the diameter of the rotating shaft 32 , when the bottom portion 23 of the first fixing member 2 is locked to the circuit board, the heat sink 3 can further have a rotation of about 5-10 degrees. space. In this way, the extending direction of the heat sink 3 can be adjusted to be parallel to the extending direction of the main body 1 , so that the heat sink 3 can be attached to the electronic components 10 and the thermal conductive film 12 of the main body 1 , so as to improve the heat dissipation effect of the electronic components 10 effect.

In this embodiment, the heat sink 3 can be tightly covered on the thermal conductive film 12 through the locking of the first fixing member 2, or can be attached to the electronic components 10 and the thermal conductive film 12 of the main body 1 by means of adhesive. But not limited to this. In some embodiments, the heat sink 3 can be attached to the electronic components 10 and the thermally conductive film 12 by magnetic attraction, so as to separate the heat sink 3 from the main body 1 when necessary, so as to adjust the tightness of the lock of the storage device or Remove the storage device.

Please refer to Figure 2 again. In another embodiment, the present application further provides a heat dissipation module. In this embodiment, the heat dissipation module is used to fix the hard disk body (not shown) on the circuit board (not shown) and is indirectly or directly connected with the hard disk body, and includes a first fixing member 2 and a heat dissipation member. 3. The first fixing member 2 includes a top portion 21 and a bottom portion 23 . The bottom 23 is used for fixing on the circuit board, so that the hard disk body is fixed on the circuit board. The heat sink 3 includes at least one connecting portion 31 . The connecting portion 31 is pivotally connected to the top portion 21 of the first fixing member 2 . In this embodiment, by tightly locking the first fixing member 2 to the circuit board, the hard disk body can be sandwiched between the top 21 of the first fixing member 2 or the heat sink 3 and the circuit board, but not This is the limit.

In this embodiment, the hard disk body is a solid-state hard disk, preferably a solid-state hard disk with an M.2 form factor, but it is not limited thereto. The structures of the first fixing member 2 and the heat dissipation member 3 of the heat dissipation module can be, for example, but not limited to, the same as those described above. The first fixing member 2 includes a through hole 24 , and the heat dissipation member 3 includes a connecting portion 31 , a rotating shaft 32 and a hole 33 . In this embodiment, the first fixing member 2 may further include an intermediate portion 22 . The middle portion 22 is disposed between the top portion 21 and the bottom portion 23 , and the diameter of the middle portion 22 is smaller than the diameter of the top portion 21 and the bottom portion 23 . The heat dissipation module further includes a gasket 5 . The gasket 5 can be, for example, but not limited to, made of rubber, and is sleeved on the middle portion 22 of the first fixing member 2 . Therefore, the heat dissipation module formed by the first fixing member 2, the heat dissipation member 3 and the spacer 5 can also be used to fix a conventional solid-state hard disk on the circuit board of the electronic device and connect with the solid-state hard disk. To simplify the installation process of the solid state drive, and at the same time improve the cooling effect of the solid state drive.

To sum up, the present application provides a heat dissipation module and a storage device. Through the connection between the main body, the first fixing member and the heat dissipation member, or the connection between the first fixing member and the heat dissipation member, a module that is easy to carry and install can be formed. The structure is simple, and the solid-state hard disk can be directly locked by the heat sink, so as to achieve the effect of simplifying the process of installing the solid-state hard disk into the electronic device. In addition, through the arrangement of the gasket and the design of the aperture and the shaft, the heat sink can be accurately attached to the surface of the electronic components, so as to improve the heat dissipation effect of the electronic components.

This case can be modified by Shi Jiangsi, a person familiar with this technology, but all of them do not deviate from the protection of the scope of the patent application attached.

1: Ontology

10: Electronic Components

11: End

12: Thermally conductive film

13: Recess

14: Notch

2: The first fixing piece

21: Top

22: Middle part

23: Bottom

24: Perforation

3: heat sink

31: Connection part

32: Spindle

33: Holes

4: Second fixing piece

41: convex part

5: Gasket

S1~S4: Steps

Z: vertical line

FIG. 1 is a schematic diagram showing the structure of a storage device according to an embodiment of the present application.

FIG. 2 is an exploded view of the structure of the storage device of FIG. 1 from a viewing angle.

FIG. 3 is an exploded view of the structure of the storage device of FIG. 1 from another viewing angle.

FIG. 4 is a flow chart illustrating a method for installing a storage device according to an embodiment of the present application.

FIG. 5 is a schematic diagram showing the structure of the storage device of FIG. 1 during the installation process.

1: Ontology

10: Electronic Components

11: End

12: Thermally conductive film

13: Recess

14: Notch

21: Top

23: Bottom

24: Perforation

3: heat sink

31: Connection part

32: Spindle

33: Holes

4: Second fixing piece

5: Gasket

Claims (10)

A heat dissipation module is used for fixing a hard disk body on a circuit board and indirectly or directly connected with the hard disk body, and comprises: a first fixing part, including a top part, a middle part and a bottom part, the bottom part is It is used to fix the hard disk body on the circuit board, the middle part is arranged between the top and the bottom, and the diameter of the middle part is smaller than the diameter of the top and the bottom; and a heat sink, including at least one A connecting portion, the at least one connecting portion is pivotally connected with the top of the first fixing member. The heat dissipation module according to claim 1, wherein the heat dissipation member further comprises a rotating shaft disposed at the at least one connecting portion, the first fixing member further includes a through hole disposed at the top, and the rotating shaft passes through the through hole , so that the heat dissipation member and the first fixing member are pivotally connected to each other. The heat dissipation module according to claim 2, wherein the heat dissipation member includes two connecting portions, and the two connecting portions respectively include a hole, the top is disposed between the two connecting portions, and the rotating shaft passes through the two connecting portions. The holes of the two connecting parts and the through holes of the first fixing member. The heat dissipation module of claim 1 further comprises a gasket, the gasket is made of rubber, and is sleeved on the middle portion of the first fixing member. A storage device is used to be arranged on a circuit board, and includes: a body, including one end and an electronic component; A first fixing member includes a top, a middle portion and a bottom, wherein the bottom is used for fixing on the circuit board, the middle portion is arranged between the top and the bottom, and the diameter of the middle portion is smaller than the diameter of the middle portion diameters of the top and the bottom; and a heat sink, which is indirectly or directly connected to the electronic component of the body, and includes at least one connecting portion pivotally connected to the top of the first fixing member. The storage device according to claim 5, wherein the heat dissipation member further comprises a rotating shaft disposed on the at least one connecting portion, the first fixing member further includes a through hole disposed on the top portion, and the rotating shaft passes through the through hole, The heat dissipation member and the first fixing member are pivotally connected to each other. The storage device of claim 6, wherein the heat sink includes two connecting portions, and the two connecting portions respectively include a hole, the top is disposed between the two connecting portions, and the rotating shaft passes through the two connecting portions. The hole of the two connecting parts and the through hole of the first fixing piece. The storage device according to claim 5, further comprising a thermally conductive film disposed between the electronic component and the heat sink. The storage device according to claim 5, further comprising a second fixing piece, the second fixing piece is fixed on the end of the main body, and the first fixing piece passes through the second fixing piece. The storage device according to claim 5, further comprising a gasket, the gasket is made of rubber, and is disposed between the end of the main body and the top of the first fixing member.

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