CN216873678U - Electronic device - Google Patents
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- CN216873678U CN216873678U CN202123300753.9U CN202123300753U CN216873678U CN 216873678 U CN216873678 U CN 216873678U CN 202123300753 U CN202123300753 U CN 202123300753U CN 216873678 U CN216873678 U CN 216873678U
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- fixing
- heat dissipation
- hole
- electronic device
- screw
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 61
- 238000003780 insertion Methods 0.000 claims abstract description 11
- 230000037431 insertion Effects 0.000 claims abstract description 11
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 230000005855 radiation Effects 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The embodiment of the utility model relates to the technical field of heat dissipation, and particularly discloses electronic equipment, which comprises: the circuit board comprises a board body and an electronic element, wherein the electronic element is arranged on the surface of the board body, and the board body is provided with a plug hole; the fixing assembly comprises a fixing piece and a bolt, the fixing piece comprises a fixing cap and a fixing rod, the fixing cap is connected with the fixing rod, the fixing piece is inserted into the insertion hole, the fixing cap abuts against the first surface of the plate body, the fixing rod is further provided with a screw hole, the bolt comprises a nut and a screw rod, and one end of the screw rod is fixed with the nut; and the heat radiation assembly is provided with a mounting hole, and the other end of the screw rod penetrates through the mounting hole and then is in threaded connection with the screw hole. Through the mode, the heat dissipation of the electronic equipment can be accelerated.
Description
Technical Field
The embodiment of the utility model relates to the technical field of heat dissipation, in particular to electronic equipment.
Background
With the rapid development of high-tech industries, the operation speed of computers is continuously and greatly increased, and the heat productivity of computers is also greatly increased.
In the process of implementing the embodiment of the present invention, the inventors found that: at present, the heat dissipation design is often rarely carried out on a circuit board and all components on the circuit board in a computer, and if the heat dissipated by the circuit board and all the components on the circuit board is too high, the use of the computer is possibly influenced, and the service life of all parts of the computer is possibly shortened.
SUMMERY OF THE UTILITY MODEL
The technical problem mainly solved by the embodiments of the present invention is to provide an electronic device, which can improve heat dissipation performance.
In order to solve the technical problems, the utility model adopts a technical scheme that: there is provided an electronic device including: circuit board, fixed subassembly and radiator unit. The circuit board comprises a board body and an electronic element, wherein the electronic element is arranged on the surface of the board body, and the board body is provided with a plug hole. The fixing assembly comprises a fixing piece and a bolt, the fixing piece comprises a fixing cap and a fixing rod, the fixing cap is connected with the fixing rod, the fixing piece is inserted into the insertion hole, the fixing cap abuts against the first surface of the plate body, the fixing rod is further provided with a screw hole, the bolt comprises a nut and a screw rod, and one end of the screw rod is fixed with the nut. And the heat radiation assembly is provided with a mounting hole, and the other end of the screw rod penetrates through the mounting hole and then is in threaded connection with the screw hole.
Optionally, the fixing assembly further includes an adhesive disposed between the fixing cap and the first surface of the plate body, and the adhesive is used for bonding the fixing cap and the first surface of the plate body.
Optionally, an annular step is provided on a side wall of one end of the mounting hole away from the circuit board. The fixing assembly further comprises an elastic piece, the elastic piece is sleeved on the screw rod, and the elastic piece abuts against the annular step and the screw cap respectively.
Optionally, the number of the fixing pieces, the number of the inserting holes, the number of the mounting holes and the number of the bolts are multiple, the mounting holes are respectively formed in the periphery of the heat dissipation assembly, one fixing piece is used for being inserted into one inserting hole, and one bolt penetrates through one mounting hole and then is screwed into a screw hole of one fixing rod.
Optionally, the heat dissipation assembly includes a heat dissipation plate, a fixing sleeve, and a plurality of heat dissipation teeth extending from a first surface of the heat dissipation plate, the second surface of the heat dissipation plate is attached to the electronic component, the fixing sleeve is fixed to the heat dissipation plate, and the fixing sleeve is provided with the mounting hole.
Optionally, the heat dissipation assembly includes a fan, the fan is attached to the plurality of heat dissipation teeth, and the fan is fixedly disposed on the heat dissipation plate.
Optionally, the fan is provided with a fixing hole. The heat dissipation assembly comprises a screw and a threaded sleeve, the threaded sleeve is fixed on the heat dissipation fin, and the screw penetrates through the fixing hole and then is in threaded connection with the threaded sleeve.
Optionally, the fan includes a fan body and an outer frame, the outer frame is provided with an accommodating through hole, the fan body is disposed in the accommodating through hole, and the fixing hole is disposed in the outer frame.
Optionally, the fan body includes a connecting rod, a rotating assembly, a turntable and a plurality of blades, the connecting rod is connected to the outer frame, the rotating assembly is respectively connected to the connecting rod and the turntable, the blades are disposed on a side wall of the turntable, and the rotating assembly is used for driving the turntable to rotate relative to the connecting rod.
Optionally, the electronic device is a computer.
The embodiment of the utility model has the beneficial effects that: in contrast to the prior art, an embodiment of the present invention provides an electronic device including: circuit board, fixed subassembly and radiator unit. The circuit board comprises a board body and an electronic element, wherein the electronic element is arranged on the surface of the board body. The heat dissipation assembly is used for dissipating heat of the circuit board. The fixing component is used for fixing the heat dissipation component on the circuit board. Wherein, fixed subassembly includes mounting and bolt, the mounting includes locking cap and dead lever, the locking cap with the dead lever is connected, the bolt includes nut and screw rod, the one end of screw rod with the nut is fixed. The plate body is provided with an inserting hole, the fixing piece is inserted in the inserting hole, the fixing cap abuts against the first surface of the plate body, the fixing rod is further provided with a screw hole, and the other end of the screw rod penetrates through the mounting hole and then is in threaded connection with the screw hole, so that the heat dissipation assembly is fixed on the circuit board. Through the mode, the embodiment of the utility model accelerates the heat dissipation of the electronic equipment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
Fig. 1 is a perspective view of an electronic device provided in an embodiment of the utility model;
FIG. 2 is an exploded view of an electronic device provided by an embodiment of the present invention;
fig. 3 is an exploded view of a heat dissipation assembly in an electronic device according to an embodiment of the utility model.
The reference numbers in the detailed description are as follows:
| 100 | |
23 | |
| 10 | |
24 | |
| 11 | |
30 | |
| 111 | |
31 | |
| 112 | |
311 | |
| 12 | Chip and method for manufacturing the same | 312 | |
| 20 | |
32 | |
| 21 | |
33 | |
| 211 | Fixing |
34 | Fan with |
| 212 | |
341 | |
| 2121 | |
3411 | |
| 22 | |
342 | |
| 221 | |
35 | |
| 222 | |
36 | Screw sleeve |
Detailed Description
In order to facilitate an understanding of the utility model, the utility model is described in more detail below with reference to the accompanying drawings and specific examples. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, an electronic device 100 according to an embodiment of the present invention includes: the circuit board 10, the fixing component 20 and the heat dissipation component 30. The heat dissipation assembly 30 is fixed to the circuit board 10 by the fixing assembly 20, thereby achieving heat dissipation of the circuit board 10.
Referring to fig. 2, the circuit board 10 includes a board body 11, electronic components (not shown) disposed on a first surface (not shown) and a second surface 111 of the board body 11, and a chip 12 disposed on the second surface 111 of the board body 11. Wherein the first surface is opposite to the second surface 111. Wherein the board body 11 is used for realizing electrical connection between the electronic components. The plate body 11 is provided with an insertion hole 112, and the insertion hole 112 is used for the fixing component 20 to fix the heat dissipation component 30 on the plate body 11.
Referring to fig. 2, the fixing assembly 20 includes a fixing member 21 and a bolt 22, the fixing member 21 is inserted into the insertion hole 112, and the bolt 22 is inserted into the heat dissipating assembly 30 and then connected to the fixing member 21, so as to fix the heat dissipating assembly 30 to the board 11.
For the fixing member 21, the fixing member 21 includes a fixing cap 211 and a fixing rod 212, the fixing cap 211 is connected to the fixing rod 212, the fixing cap 211 abuts against the first surface of the board 11, the fixing rod 212 is inserted into the insertion hole 112, and the fixing rod 212 further has a screw hole 2121.
For the bolt 22, the bolt 22 includes a nut 221 and a screw 222, one end of the screw 222 is fixed to the nut 221, and the other end of the screw 222 is inserted into the heat dissipation assembly 30 and then screwed into the screw hole 2121, so as to fix the heat dissipation assembly 30 to the plate 11.
In some embodiments, the fixing assembly 20 further includes an adhesive 23, and the adhesive 23 is disposed between the fixing cap 211 and the first surface of the board body 11, so as to fix the fixing member 21 to the board body 11. It should be understood that the fixing manner of the fixing member 21 and the plate body 11 is not limited to this, and the fixing member 21 may be fixed to the plate body 11, for example, by welding the fixing member 21 to the plate body 11.
Referring to fig. 3, the heat dissipating assembly 30 is provided with a mounting hole 311, and the other end of the screw 222 passes through the mounting hole 311 and is inserted into the heat dissipating assembly 30.
In some embodiments, the number of the fixing member 21, the inserting hole 112, the mounting holes 311 and the bolts 22 is multiple, the mounting holes 311 are respectively disposed around the heat sink 31, and when one fixing member 21 is inserted into one inserting hole 112, and one bolt 22 passes through one mounting hole 311 and then is screwed into a screw hole 2121 of one fixing rod 212, the fixing of the heat sink assembly 30 can be more stable.
The heat dissipation assembly 30 includes a heat dissipation plate 31, a fixing sleeve 32, and a plurality of heat dissipation teeth 33 extending from a first surface of the heat dissipation plate 31, a second surface (not shown) of the heat dissipation plate 31 is attached to the electronic component, the fixing sleeve 32 is fixed to the heat dissipation plate 31, and the fixing sleeve 32 is provided with the mounting hole 311. The heat sink 31 and the plurality of heat dissipation teeth 33 are used for dissipating heat of the circuit board 10, and the fixing sleeve 32 is used for being sleeved on the bolt 22, so as to fix the heat dissipation assembly 30.
In some embodiments, the side wall of the heat sink 31 at the end of the mounting hole 311 away from the circuit board 10 is provided with an annular step 312, and the fixing assembly 20 further includes an elastic member 24 (as shown in fig. 2), the elastic member 24 is sleeved on the screw 222, and the elastic member 24 abuts against the annular step 312 and the nut 221 respectively. The elastic member 24 provides a force to the heat dissipating module 30 in the direction of the board body 11 of the circuit board 10, so that the heat dissipating module 30 can be tightly attached to the chip 12, thereby accelerating the heat dissipation of the chip 12, and the heat dissipating module 30 can be fixed (when the bolt 22 is screwed to the screw hole 2121, the nut 221 and the elastic member 24 are respectively abutted against the board body 11 and the heat dissipating module 30, and the fixing module 20 and the heat dissipating module 30 can be fixed to the board body 11 by using the thicknesses of the board body 11 and the heat dissipating module 30 and the elastic force of the elastic member 24).
It is understood that, in some embodiments, the heat dissipation assembly 30 further includes a fan 34, the fan 34 is attached to the plurality of heat dissipation teeth 33, and the fan 34 is fixed to the heat dissipation plate 31, and the fan 34 is used for increasing the heat dissipation.
For the fan 34, the fan 34 includes an outer frame 341 and a fan body 342, the outer frame 341 has a receiving through hole (not shown), and the fan body 342 is disposed in the receiving through hole.
The outer frame 341 is provided with fixing holes 3411 for the outer frame 341. The heat dissipating assembly 30 includes a screw 35 and a threaded sleeve 36, the threaded sleeve 36 is fixed to the heat dissipating fin 31, and the screw 35 is screwed to the threaded sleeve 36 after passing through the fixing hole 3411.
For the fan body 342, the fan body 342 includes a connecting rod (not shown), a rotating member (not shown), a rotating disk (not shown) and a plurality of blades (not shown), the connecting rod is connected to the outer frame 341, the rotating member is respectively connected to the connecting rod and the rotating disk, the plurality of blades are disposed on a side wall of the rotating disk, and the rotating member is configured to drive the rotating disk to rotate relative to the connecting rod.
In the above-described rotating unit, the rotating unit includes a motor (not shown), a driving gear (not shown), a transmission chain (not shown), and a driven gear (not shown), the driving gear is provided on an output shaft of the motor, the transmission chain is fitted over the driving gear and the driven gear, the transmission chain is engaged with the driving gear and the driven gear, respectively, and the driven gear is provided on the turntable. When the motor starts, the motor drives the driving gear to rotate, and the driven gear also rotates along with the driving gear through the transmission of the transmission chain, so that the rotating disc is driven to rotate, the rotation of the plurality of blades is finally realized, the flow rate of air is accelerated, and the heat dissipation is accelerated.
It will be appreciated that in some embodiments, the electronic device 100 is a computer, thereby enabling heat dissipation from the computer.
It should be noted that, although the electronic device 100 is a computer in some embodiments, the present invention is not limited thereto, and the electronic device 100 may also be other electric devices as long as the above-mentioned structure can be applied to other electric devices.
An embodiment of the present invention provides an electronic device 100 including: the circuit board 10, the fixing component 20 and the heat dissipation component 30. The circuit board 10 includes a board body 11 and an electronic component disposed on a first surface of the board body 11. The heat dissipation assembly 30 is used to dissipate heat from the circuit board 10. The fixing member 20 is used to fix the heat dissipating member 30 to the circuit board 10. The fixing assembly 20 includes a fixing member 21 and a bolt 22, the fixing member 21 includes a fixing cap 211 and a fixing rod 212, the fixing cap 211 is connected to the fixing rod 212, the bolt 22 includes a nut 221 and a screw 222, and one end of the screw 222 is fixed to the nut 221. The board body 11 is provided with an insertion hole 112, the fixing member 21 is inserted into the insertion hole 112, the fixing cap 211 abuts against the first surface of the board body 11, the fixing rod 212 is further provided with a screw hole 2121, and the other end of the screw rod 222 penetrates through the mounting hole 311 and then is screwed into the screw hole 2121, so that the heat dissipation assembly 30 is fixed to the circuit board 10. In this way, the embodiment of the utility model accelerates the heat dissipation of the electronic device 100.
It should be noted that the preferred embodiments of the present invention are shown in the description and the drawings, but the present invention may be embodied in many different forms and is not limited to the embodiments described in the description, which are not intended as additional limitations to the present disclosure, which is provided for the purpose of providing a more thorough understanding of the present disclosure. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention described in the specification; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the utility model as defined by the appended claims.
Claims (10)
1. An electronic device, comprising:
the circuit board comprises a board body and an electronic element, wherein the electronic element is arranged on the surface of the board body, and the board body is provided with a plug hole;
the fixing assembly comprises a fixing piece and a bolt, the fixing piece comprises a fixing cap and a fixing rod, the fixing cap is connected with the fixing rod, the fixing piece is inserted into the insertion hole, the fixing cap abuts against the first surface of the plate body, the fixing rod is further provided with a screw hole, the bolt comprises a nut and a screw rod, and one end of the screw rod is fixed with the nut;
and the heat dissipation assembly is provided with a mounting hole, and the other end of the screw penetrates through the mounting hole and then is in threaded connection with the screw hole.
2. The electronic device of claim 1, wherein the fixing assembly further comprises an adhesive disposed between the fixing cap and the first surface of the board body, and the adhesive is used for bonding the fixing cap and the first surface of the board body.
3. The electronic device of claim 1,
the side wall of one end of the mounting hole, which is far away from the circuit board, is provided with an annular step;
the fixing assembly further comprises an elastic piece, the elastic piece is sleeved on the screw rod, and the elastic piece abuts against the annular step and the screw cap respectively.
4. The electronic device of claim 1, wherein the number of the fixing member, the number of the insertion holes, the number of the mounting holes, and the number of the bolts are plural, the plural mounting holes are respectively disposed around the heat dissipation assembly, one fixing member is adapted to be inserted into one insertion hole, and one bolt is screwed into a bolt hole of one fixing rod after passing through one mounting hole.
5. The electronic device of any one of claims 1-4, wherein the heat dissipation assembly comprises a heat dissipation plate, a fixing sleeve, and a plurality of heat dissipation teeth extending from a first surface of the heat dissipation plate, wherein a second surface of the heat dissipation plate is attached to the electronic component, the fixing sleeve is fixed to the heat dissipation plate, and the fixing sleeve is provided with the mounting hole.
6. The electronic device of claim 5, wherein the heat dissipation assembly comprises a fan, the fan is attached to the plurality of heat dissipation teeth, and the fan is fixedly disposed on the heat dissipation plate.
7. The electronic device of claim 6,
the fan is provided with a fixing hole;
the heat dissipation assembly comprises a screw and a threaded sleeve, the threaded sleeve is fixed on the heat dissipation fin, and the screw penetrates through the fixing hole and then is in threaded connection with the threaded sleeve.
8. The electronic device of claim 7,
the fan comprises a fan body and an outer frame, wherein the outer frame is provided with a containing through hole, the fan body is arranged in the containing through hole, and the fixing hole is formed in the outer frame.
9. The electronic device of claim 8, wherein the fan body comprises a connecting rod, a rotating component, a turntable, and a plurality of blades, the connecting rod is connected to the outer frame, the rotating component is respectively connected to the connecting rod and the turntable, the plurality of blades are disposed on a side wall of the turntable, and the rotating component is configured to drive the turntable to rotate relative to the connecting rod.
10. The electronic device of claim 1, wherein the electronic device is a computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123300753.9U CN216873678U (en) | 2021-12-24 | 2021-12-24 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123300753.9U CN216873678U (en) | 2021-12-24 | 2021-12-24 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216873678U true CN216873678U (en) | 2022-07-01 |
Family
ID=82149823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123300753.9U Active CN216873678U (en) | 2021-12-24 | 2021-12-24 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216873678U (en) |
-
2021
- 2021-12-24 CN CN202123300753.9U patent/CN216873678U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231027 Address after: 518000, 4th Floor, No. 31, Xiacun Community, Gongming Street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Baoxinchuang Information Technology Co.,Ltd. Address before: 518000 2nd floor, no.6, huidebao Industrial Park, No.11, second industrial zone, Baihua community, Guangming Street, Guangming District, Shenzhen City, Guangdong Province Patentee before: Shenzhen baoxinchuang Technology Co.,Ltd. |