CN217742105U - Heat dissipation device and electronic device - Google Patents
Heat dissipation device and electronic device Download PDFInfo
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- CN217742105U CN217742105U CN202221073804.0U CN202221073804U CN217742105U CN 217742105 U CN217742105 U CN 217742105U CN 202221073804 U CN202221073804 U CN 202221073804U CN 217742105 U CN217742105 U CN 217742105U
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- heat
- heat dissipating
- hole
- fixed
- wave absorbing
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 29
- 239000003292 glue Substances 0.000 claims description 8
- 230000005428 wave function Effects 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
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Abstract
The embodiment of the utility model provides a relate to electron product technology field, especially disclose a heat abstractor and electron device, include radiator unit and inhale the wave piece, radiator unit has the heat conduction surface, inhale the wave piece and be fixed in the heat conduction surface, radiator unit is used for and treats radiating element fixed, and works as when radiator unit with treat that radiating element is fixed, inhale the wave piece and be located the heat conduction surface with treat between the radiating element. In this way, the embodiment of the utility model provides a realize that heat abstractor has the heat dissipation simultaneously and inhale the wave function, need not to increase and inhale the wave device and absorb the electromagnetic wave.
Description
Technical Field
The embodiment of the utility model provides a relate to electronic product technical field, especially relate to a heat abstractor and electron device.
Background
With the development of electronic products, the operating frequency of electronic components in the electronic products is higher and higher, and the electronic components generate a large amount of heat and electromagnetic waves when working at high speed, so that the heat generated by the electronic components needs to be dissipated and absorbed in time to ensure that the electronic products meet the requirements of regulations.
However, in implementing the embodiments of the present invention, the inventors found that: at present, a heat dissipation device only has a heat dissipation function, and when electromagnetic waves need to be absorbed, a wave absorbing device needs to be added to absorb the waves through the wave absorbing device.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a main technical problem who solves provides a heat abstractor and electron device, realizes that heat abstractor has the heat dissipation simultaneously and inhale the ripples function.
In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a heat abstractor, includes radiator unit and ripples piece, radiator unit has the heat conduction surface, it is fixed in to inhale the ripples piece the heat conduction surface, radiator unit is used for and treats radiating element fixed, and works as radiator unit with when treating radiating element fixed, inhale the ripples piece and be located heat conduction surface and treat between the radiating element, realize that radiator has the heat dissipation simultaneously and inhale the ripples function, need not to increase and inhale the electromagnetic wave that the wave device absorbs and treats the radiating element and produce.
Optionally, the wave absorbing member is provided with a first through hole, the first through hole penetrates through the wave absorbing member along the direction from the heat dissipation assembly to the wave absorbing member, and the first through hole is used for allowing a part of the element to be cooled to penetrate and abut against the heat conducting surface.
Optionally, the heat dissipation device further includes a heat conduction glue, the heat conduction glue is disposed in the first through hole, the heat conduction glue covers a portion of the heat conduction surface exposed to the first through hole, and the heat conduction glue is used for abutting against a portion of the to-be-dissipated element inserted into the through hole.
Optionally, the heat dissipation assembly includes a heat sink having a mounting surface and the heat conducting surface, and the mounting surface and the heat conducting surface are disposed opposite to each other.
Optionally, the heat dissipation assembly further comprises a heat dissipation pipe, and one end of the heat dissipation pipe is connected to the heat dissipation seat.
Optionally, the heat dissipation assembly further comprises a fan, the fan is provided with an air outlet, the fan is connected with the other end of the heat dissipation pipe, and the air outlet blows air towards the heat dissipation pipe.
Optionally, the fan is provided with the screw, the cooling tube is provided with the second through-hole, radiating assembly still includes the bolt, the bolt passes second through-hole after-fixing in the screw.
Optionally, the number of the screw holes, the number of the bolts and the number of the second through holes are multiple, the second through holes are distributed in the radiating pipe, and the bolt penetrates through one of the second through holes and then is fixed in one of the screw holes.
For solving the technical problem, the utility model discloses a another technical scheme is: the utility model provides an electronic device, includes the circuit board, treats radiating element and above-mentioned heat abstractor, treat radiating element set up in the circuit board, heat abstractor installs on treating radiating element, inhale the ripples piece and be located between heat abstractor's the heat conduction surface and the radiating element of treating, and inhale the ripples piece cover treat radiating element towards heat abstractor's surface.
An embodiment of the utility model provides a heat abstractor, include radiator unit and inhale ripples piece, radiator unit has the heat conduction surface, it is fixed in to inhale ripples piece the heat conduction surface, radiator unit is used for and treats that radiating element is fixed, and works as radiator unit with when treating radiating element is fixed, inhale ripples piece and be located heat conduction surface and treat between the radiating element, realize that radiator unit has the heat dissipation simultaneously and inhale the ripples function, need not to increase and inhale the electromagnetic wave that the radiating element produced of ripples unit absorption.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for a person skilled in the art to obtain other drawings based on the drawings without any creative effort.
Fig. 1 is a perspective view of an electronic device according to an embodiment of the present invention;
fig. 2 is an exploded view of an electronic device according to an embodiment of the present invention;
fig. 3 is a perspective view of a fan in a heat dissipation device according to an embodiment of the present invention.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and fig. 2, the heat dissipating apparatus 10 includes a heat dissipating assembly 101, a heat conductive adhesive 102 and a wave absorbing member 103, the wave absorbing member 103 is fixed to the heat dissipating assembly 101, the heat conductive adhesive 102 is disposed on the heat dissipating assembly 101, the heat dissipating assembly 101 is configured to be fixed to an element 30 to be heat dissipated, when the heat dissipating assembly 101 is fixed to the element 30 to be heat dissipated, the wave absorbing member 103 is located between the heat dissipating assembly 101 and the element 30 to be heat dissipated, the heat conductive adhesive 30 is configured to transfer heat generated by the heat dissipating assembly 101 to the heat dissipating assembly 101, the heat dissipating assembly 101 is configured to dissipate heat generated by the element 30 to be heat dissipated, and the wave absorbing member 103 is configured to absorb electromagnetic waves generated by the element 30 to be heat dissipated.
Referring to fig. 2 and 3, the heat dissipating module 101 includes a plurality of bolts 1011, a heat dissipating pipe 1012, a heat dissipating base 1013, and a fan 1014, wherein the heat dissipating base 1013 has a mounting surface and a heat conducting surface, the mounting surface and the heat conducting surface are oppositely disposed, the fan 1014 is fixed to the heat dissipating pipe 1012, the fan 1014 is provided with a plurality of screw holes 10141 and air outlets 10142, one end of the heat dissipating pipe 1012 is connected to the mounting surface of the heat dissipating base 1013, and the other end of the heat dissipating pipe is connected to the fan 1014 by bending and extending, the heat dissipating pipe 1012 is provided with a plurality of second through holes 10121, one second through hole 10121 is used for a bolt 1011 to pass through and be fixed to one screw hole 10141, so as to fix the fan 1014 to the heat dissipating pipe 1014, and the air outlets 10142 face the surface of the heat dissipating pipe 1012. The heat of the heat dissipating seat 1013 is dissipated through the heat dissipating pipe 1012, and the fan 1014 rotates to drive the air flow from the outside to blow toward the surface of the heat dissipating pipe 1012 through the air outlet 10142, so as to dissipate the heat to the outside.
Referring to fig. 2, the wave absorbing member 103 is provided with a first through hole 1031, the first through hole 1031 penetrates through the wave absorbing member 103 along a direction from the heat dissipation assembly 101 to the wave absorbing member 103, and the first through hole 1031 is used for allowing a part of the element 30 to be dissipated to penetrate through so as to abut against a heat conducting surface.
Referring to fig. 2, the thermal conductive adhesive 102 is disposed in the first through hole 1031, the thermal conductive adhesive 102 covers a portion of the thermal conductive surface exposed to the first through hole 1031, and the thermal conductive adhesive 102 is configured to abut against a portion of the to-be-heat-dissipated element 30 inserted into the first through hole 1031, so as to transfer heat generated by the to-be-heat-dissipated element 30 to the thermal conductive surface.
The embodiment of the utility model provides an in, heat abstractor 10 includes radiator unit 101 and ripples piece 103, radiator unit 101 has the heat conduction surface, it is fixed in the heat conduction surface to inhale ripples piece 103, radiator unit 101 is used for and treats radiating element 30 fixed, and when radiator unit 101 with treat radiating element 30 fixed, inhale ripples piece 103 and be located the heat conduction surface and treat between the radiating element 30, realize that radiator unit 10 has the heat dissipation simultaneously and inhale the ripples function, need not to increase and inhale the electromagnetic wave that the absorbing of ripples unit produced by radiating element 30.
The utility model provides an electron device embodiment, refer to again and draw fig. 1 and fig. 2, electron device 1 includes above-mentioned heat abstractor 10, circuit board 20 and treats radiating element 30, can refer to above-mentioned embodiment to heat abstractor 10's structure and function, and the repeated description is no longer given here.
For the above circuit board, please refer to fig. 1 and fig. 2, which are used for mounting the component 30 to be cooled, for example: a central processing unit.
Referring to fig. 2, the component 30 to be radiated is disposed on the circuit board 20, the heat dissipation device 10 is partially mounted on the component 30 to be radiated, the wave absorbing member 103 is located between the heat conducting surface of the heat dissipation device 10 and the component 30 to be radiated, and the wave absorbing member 103 covers the surface of the component 30 to be radiated, which faces the heat dissipation device 10.
It should be noted that the preferred embodiments of the present invention are described in the specification and the drawings, but the present invention can be realized in many different forms, and is not limited to the embodiments described in the specification, and these embodiments are not provided as additional limitations to the present invention, and are provided for the purpose of making the understanding of the disclosure of the present invention more thorough and complete. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A heat dissipating device, comprising:
a heat dissipating assembly having a thermally conductive surface;
the wave absorbing piece is fixed on the heat conducting surface, the radiating assembly is used for being fixed with the element to be radiated, and when the radiating assembly is fixed with the element to be radiated, the wave absorbing piece is located between the heat conducting surface and the element to be radiated.
2. The heat dissipating device of claim 1,
the wave absorbing piece is provided with a first through hole, the first through hole penetrates through the wave absorbing piece along the direction from the heat dissipation assembly to the wave absorbing piece, and the first through hole is used for allowing a part of the element to be cooled to penetrate and abut against the heat conducting surface.
3. The heat dissipating device of claim 2,
the heat conducting glue is arranged in the first through hole, the heat conducting glue covers the part, exposed out of the first through hole, of the heat conducting surface, and the heat conducting glue is used for being abutted to the part, inserted into the through hole, of the element to be cooled.
4. The heat dissipating device of claim 3,
the heat dissipation assembly comprises a heat dissipation seat, the heat dissipation seat is provided with a mounting surface and a heat conduction surface, and the mounting surface and the heat conduction surface are oppositely arranged.
5. The heat dissipating device of claim 4, wherein the heat dissipating module further comprises a heat dissipating tube having one end connected to the heat dissipating base.
6. The heat dissipating device of claim 5, wherein the heat dissipating assembly further comprises a fan, the fan is provided with an air outlet, the fan is connected to the other end of the heat dissipating tube, and the air outlet blows air toward the heat dissipating tube.
7. The heat dissipating device of claim 6,
the fan is provided with a screw hole;
the radiating pipe is provided with a second through hole;
the heat dissipation assembly further comprises a bolt, and the bolt penetrates through the second through hole and then is fixed to the screw hole.
8. The heat dissipating device of claim 7,
the number of the screw holes, the number of the bolts and the number of the second through holes are multiple, the second through holes are distributed in the radiating tube, and one bolt penetrates through one second through hole and then is fixed in one screw hole.
9. An electronic device comprising a circuit board, a component to be heat-dissipated, and the heat dissipating device according to any one of claims 3 to 8;
the wave absorbing piece is positioned between the heat conducting surface of the heat radiating device and the element to be radiated, and the heat conducting glue covers the surface of the element to be radiated, which faces the heat radiating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221073804.0U CN217742105U (en) | 2022-05-06 | 2022-05-06 | Heat dissipation device and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221073804.0U CN217742105U (en) | 2022-05-06 | 2022-05-06 | Heat dissipation device and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217742105U true CN217742105U (en) | 2022-11-04 |
Family
ID=83818249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221073804.0U Active CN217742105U (en) | 2022-05-06 | 2022-05-06 | Heat dissipation device and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217742105U (en) |
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2022
- 2022-05-06 CN CN202221073804.0U patent/CN217742105U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231024 Address after: 518000, 4th Floor, No. 31, Xiacun Community, Gongming Street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Baoxinchuang Information Technology Co.,Ltd. Address before: 518000 2nd floor, no.6, huidebao Industrial Park, No.11, second industrial zone, Baihua community, Guangming Street, Guangming District, Shenzhen City, Guangdong Province Patentee before: Shenzhen baoxinchuang Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |