CN110313225B - Heat dissipation assembly, circuit board assembly with same and unmanned aerial vehicle - Google Patents

Heat dissipation assembly, circuit board assembly with same and unmanned aerial vehicle Download PDF

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Publication number
CN110313225B
CN110313225B CN201880012031.5A CN201880012031A CN110313225B CN 110313225 B CN110313225 B CN 110313225B CN 201880012031 A CN201880012031 A CN 201880012031A CN 110313225 B CN110313225 B CN 110313225B
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China
Prior art keywords
area
air outlet
sub
fan
circuit board
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CN201880012031.5A
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Chinese (zh)
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CN110313225A (en
Inventor
熊荣明
唐尹
王登
熊贤武
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SZ DJI Technology Co Ltd
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SZ DJI Technology Co Ltd
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Priority to CN202110145895.8A priority Critical patent/CN112996348A/en
Publication of CN110313225A publication Critical patent/CN110313225A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
    • B64U20/00—Constructional aspects of UAVs
    • B64U20/90—Cooling
    • B64U20/94—Cooling of rotors or rotor motors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D33/00—Arrangements in aircraft of power plant parts or auxiliaries not otherwise provided for
    • B64D33/08—Arrangements in aircraft of power plant parts or auxiliaries not otherwise provided for of power plant cooling systems
    • B64D33/10—Radiator arrangement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Abstract

The invention provides a heat dissipation assembly, a circuit board assembly with the heat dissipation assembly and an unmanned aerial vehicle, wherein the heat dissipation assembly comprises a fan and a heat dissipation piece connected with the fan, the heat dissipation piece comprises a main body part, a fin area arranged on the main body part and an air outlet area arranged on the main body part, and the main body part is connected with the fan; the fin area is arranged close to the air outlet of the fan and matched with the air outlet of the fan, the air outlet area is communicated with the fin area, and airflow flowing out of the air outlet of the fan flows into the air outlet area through the fin area and then is guided out of the air outlet area. Through the cooperation of fan, fin region and air-out region, the air current that the fan air outlet flowed out can dispel the heat to the regional absorptive heat of fin on the one hand, and on the other hand fin region has the function of guide air current, and the air current that flows out the fan is leading-in air-out region for the air current is derived by air-out region, and the air current that air-out region was derived can directly dispel the heat or directly derive electronic equipment's outside to each heating element, and the radiating efficiency is high.

Description

Heat dissipation assembly, circuit board assembly with same and unmanned aerial vehicle
Technical Field
The invention relates to the field of heat dissipation, in particular to a heat dissipation assembly, a circuit board assembly with the heat dissipation assembly and an unmanned aerial vehicle with the heat dissipation assembly.
Background
A large number of heating elements are arranged in the electronic equipment, and the heat emitted by the heating elements needs to be timely led out, so that the normal work of the electronic equipment can be ensured. At present, a fan is arranged in the electronic equipment or a heat conducting member is arranged in the electronic equipment, and heat accumulated in the electronic equipment is conducted to the outside through the fan or the heat conducting member, but the heat conducting efficiency of the fan or the heat conducting member alone cannot meet the requirement.
Disclosure of Invention
The invention provides a heat dissipation assembly, a circuit board assembly with the heat dissipation assembly and an unmanned aerial vehicle with the circuit board assembly.
Specifically, the invention is realized by the following technical scheme:
according to a first aspect of the present invention, a heat dissipation assembly is provided, the heat dissipation assembly includes a fan and a heat dissipation member connected to the fan, the heat dissipation member includes a main body portion, a fin region disposed on the main body portion, and an air outlet region disposed on the main body portion, wherein the main body portion is connected to the fan; the fin area is arranged close to the air outlet of the fan and matched with the air outlet of the fan, the air outlet area is communicated with the fin area, and airflow flowing out of the air outlet of the fan flows into the air outlet area through the fin area and then is guided out of the air outlet area.
According to a second aspect of the present invention, there is provided a circuit board assembly, comprising a circuit board and a heat dissipation assembly connected to the circuit board, wherein the heat dissipation assembly comprises a fan and a heat dissipation member connected to the fan, the heat dissipation member comprises a main body portion, a fin region disposed on the main body portion, and an air outlet region disposed on the main body portion, wherein the main body portion is connected to the fan; the fin area is arranged close to the air outlet of the fan and matched with the air outlet of the fan, the air outlet area is communicated with the fin area, and airflow flowing out of the air outlet of the fan flows into the air outlet area through the fin area and then is guided out of the air outlet area.
According to a third aspect of the present invention, an unmanned aerial vehicle is provided, where the unmanned aerial vehicle includes a fuselage having an accommodating space, a circuit board accommodated in the accommodating space, and a heat dissipation assembly accommodated in the accommodating space, the heat dissipation assembly includes a fan and a heat dissipation member connected to the fan, the heat dissipation member includes a main body portion, a fin region provided on the main body portion, and an air outlet region provided on the main body portion, where the main body portion is connected to the fan; the fin area is arranged close to the air outlet of the fan and matched with the air outlet of the fan, the air outlet area is communicated with the fin area, and airflow flowing out of the air outlet of the fan flows into the air outlet area through the fin area and then is guided out of the air outlet area.
According to the technical scheme provided by the embodiment of the invention, through the matching of the fan, the fin area and the air outlet area, on one hand, the airflow flowing out of the air outlet of the fan can dissipate the heat absorbed by the fin area, on the other hand, the fin area has the function of guiding the airflow, and the airflow flowing out of the fan is guided into the air outlet area, so that the airflow is guided out from the air outlet area, and the airflow guided out from the air outlet area can directly dissipate the heat of each heating element or directly guide the airflow out of the electronic equipment, so that the heat dissipation efficiency is high, and the heat dissipation assembly has a simple structure.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
FIG. 1 is a perspective view of a heat sink assembly in accordance with an embodiment of the present invention;
fig. 2 is a schematic structural exploded view of a heat dissipation assembly according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating a disassembled structure of a circuit board assembly according to an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating a disassembled structure of a portion of a circuit board assembly according to an embodiment of the present invention;
FIG. 5 is a perspective view of a circuit board assembly in an embodiment of the present invention;
FIG. 6 is an enlarged partial view of FIG. 5;
fig. 7 is a perspective view of a portion of an unmanned aerial vehicle in accordance with an embodiment of the present invention;
fig. 8 is a schematic diagram of the structure of fig. 7, disassembled.
Reference numerals:
100: a body; 110: an accommodating space; 120: an air outlet part; 121: a first air outlet part; 122: a second air outlet part; 123: a third air outlet part; 130: a first side wall; 140: a second side wall; 150: a third side wall;
200: a circuit board; 210: a first region; 220: a second region; 230: a third region; 240: a functional element; 250: a positioning part;
300: a heat dissipating component; 1: a fan; 11: a housing; 111: a fixed part; 12: a fan blade; 2: a heat sink; 21: a main body portion; 211: a first mounting portion; 22: a fin region; 23: an air outlet area; 231: a first sub-region; 232: a second sub-region; 233: a third sub-region; 24: a cover body; 241: a second mounting portion; 3: a shock absorbing element; 4: a fastener.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The heat dissipation assembly, the circuit board assembly with the heat dissipation assembly and the unmanned aerial vehicle with the heat dissipation assembly are described in detail below with reference to the accompanying drawings. The features of the following examples and embodiments may be combined with each other without conflict.
Example one
With reference to fig. 1 and 2, according to an embodiment of the present invention, a heat dissipation assembly 300 is provided, where the heat dissipation assembly 300 may include a fan 1 and a heat dissipation member 2, where the fan 1 is connected to the heat dissipation member 2. The heat sink 2 includes a main body 21, a fin region 22, and an air outlet region 23, where the fin region 22 and the air outlet region 23 are both disposed on the main body 21. In this embodiment, the main body 21 is connected to the fan 1, the fin region 22 is disposed near the air outlet of the fan 1 and is matched with the air outlet of the fan 1, and the air outlet region 23 is communicated with the fin region 22. The airflow flowing out of the air outlet of the fan 1 of this embodiment flows into the air outlet region 23 through the fin region 22, and is then guided out from the air outlet region 23.
In the embodiment of the invention, through the cooperation of the fan 1, the fin region 22 and the air outlet region 23, on one hand, the airflow flowing out of the air outlet of the fan 1 can dissipate the heat absorbed by the fin region 22, on the other hand, the fin region 22 has the function of guiding the airflow, and the airflow flowing out of the fan 1 is guided into the air outlet region 23, so that the airflow is guided out from the air outlet region 23, and the airflow guided out from the air outlet region 23 can directly dissipate the heat of each heating element or directly guide the airflow out of the electronic equipment, so that the heat dissipation efficiency is high, and the structure of the heat dissipation assembly 300 is simple.
Referring to fig. 1 and 2, the fin region 22 of the present embodiment includes a plurality of fins, the plurality of fins are disposed at intervals, the heat dissipation surfaces of the plurality of fins are parallel to each other, and the heat dissipation surface of each fin extends in a direction away from the air outlet of the fan 1. The two adjacent fins form an airflow guiding area for guiding the airflow flowing out from the air outlet of the fan 1 to the air outlet area 23. Each fin can absorb heat accumulated in the electronic device, for example, each fin absorbs heat on a heating element located below the fin through heat conduction, and airflow flowing out of the air outlet of the fan 1 can rapidly dissipate the heat of the fin. Optionally, the end portions of the plurality of fins are close to the air outlet of the fan 1, so that the heat dissipation speed of the fins is increased.
Further, the air outlet region 23 includes a plurality of sub-regions, and the end portions of the sub-regions are communicated with the fin region 22. In the embodiment, the airflow from the fan 1 is guided into the plurality of sub-areas through the fin area 22, so that the airflow is guided out from the plurality of sub-areas, a part of the airflow guided out from the plurality of sub-areas can be directly guided out of the electronic device, and another part of the airflow guided out from the plurality of sub-areas can directly dissipate heat of each heat generating element.
Specifically, the air outlet region 23 includes a first sub-region 231, a second sub-region 232, and a third sub-region 233, and the second sub-region 232 and the third sub-region 233 are respectively disposed on two sides of the first sub-region 231. In this embodiment, the airflow guided out from the first sub-region 231 can directly dissipate heat of the heat generating element, for example, an end of the first sub-region 231 away from the fin region 22 is directly aligned with the heat generating element. The airflow flowing out of the second subregion 232 and the third subregion 233 can be directly guided out of the electronic device. It is understood that the wind outlet region 23 may also include a plurality of fins, and the fins are consistent with the direction of the partitions dividing the wind outlet region 23 into a plurality of sub-regions. The plurality of fins of the wind outlet region 23 may be connected to the fins of the fin region 22.
Further, referring to fig. 1 and fig. 2, the air outlet directions of the first sub-area 231, the second sub-area 232 and the third sub-area 233 are different from each other, so that the air flow flowing out of the fin area 22 is guided to different directions to meet different requirements.
In addition, in this embodiment, the air outlets of the first sub-regions 231 are gradually increased in a direction away from the fin regions 22, so that the air flows flowing out of the first sub-regions 231 can flow out from multiple directions, thereby dissipating heat of the heat generating elements in different directions.
Referring to fig. 2, the fan 1 includes a housing 11 and fan blades 12 disposed on the housing 11, and the housing 11 is connected to the main body 21. In this embodiment, the air outlet of the fan 1 is disposed on the housing 11, and when the fan 1 works, the airflow generated by the rotation of the fan blade 12 is guided out from the air outlet and enters the fin region 22.
In this embodiment, the housing 11 is a heat conducting member, that is, the housing 11 is made of a heat conducting material (e.g., a heat conducting metal). In this embodiment, the fan 1 not only functions as wind source power, but also has a heat conduction function, and directly participates in heat conduction. Specifically, when the fan 1 is used, the housing 11 may be directly or indirectly contacted with a heat generating element in the electronic device to conduct heat, so as to absorb heat on the heat generating element, thereby further improving heat dissipation efficiency. The housing 11 of the present embodiment may be made of a heat conductive material with high heat conductivity, which may be specifically selected according to the requirement, and this embodiment is not particularly limited thereto.
Further, in order to reduce the influence of the vibration generated during the operation of the fan 1 on the heat sink 2, the heat sink assembly 300 further includes a damping element 3, and the damping element 3 is disposed at the connection position of the housing 11 and the main body 21. The present embodiment connects the housing 11 and the main body 21 through the shock absorbing element 3, and the main body 21 is less affected by the vibration of the fan 1, so as to reduce the influence of the main body 21 on some heat generating elements of the electronic device which are sensitive to the vibration.
Referring to fig. 2, the housing 11 is provided with a fixing portion 111, and the main body portion 21 is provided with a first mounting portion 211. In this embodiment, the first mounting portion 211 is connected to the fixing portion 111, and the damping member 3 is disposed between the first mounting portion 211 and the fixing portion 111. Specifically, the first mounting portion 211 is an insertion portion, the fixing portion 111 is an insertion groove, the insertion portion is in insertion fit with the insertion groove, and the damping element 3 is sleeved on the insertion portion.
In order to improve the stability of the connection between the housing 11 and the main body 21, the fixing portion 111 may include a plurality of fixing portions, for example, in one embodiment, the fixing portion 111 includes two fixing portions 111, and the two fixing portions 111 are respectively disposed at two sides of the housing 11. Correspondingly, the first mounting portions 211 also include two, two the first mounting portions 211 are respectively arranged on two sides of the main body portion 21, two the first mounting portions 211 are correspondingly connected with the two fixing portions 111.
Wherein, the type of the shock-absorbing element 3 can be selected according to the requirement, and optionally, the shock-absorbing element 3 is an elastic element. In some embodiments, the shock absorbing element 3 is made of an elastic material. In other embodiments, the damping element 3 comprises a resilient structure such as a spring.
In addition, referring to fig. 2, the heat dissipation assembly 300 further includes a cover 24, and the cover 24 is matched with the main body 21 to seal the fin region 22 and the air outlet region 23. The cover 24 and the body 21 may be integrally formed or may be provided separately. In this embodiment, the cover 24 is provided separately from the main body 21, and the cover 24 is provided to cover the main body 21. In this embodiment, the fin region 22 and the air outlet region 23 are sealed in a space formed by the main body 21 and the cover 24, so as to ensure a heat dissipation effect, and the fin region 22 and the air outlet region 23 do not need to be separately sealed by an external structure, which is simple in structure.
Further, a second mounting portion 241 is disposed on the cover 24, and the first mounting portion 211 is fixedly connected to the second mounting portion 241 after penetrating through the fixing portion 111, so that the firmness of connection between the housing 11 and the main body portion 21 is improved. Furthermore, the heat dissipation assembly 300 further includes a fastening member 4, and the fastening member 4 fixes the second mounting portion 241 on the first mounting portion 211, so as to further improve the connection firmness between the housing 11 and the main body portion 21. The fastening member 4 may be a nut or other fastening structure.
It should be noted that the heat dissipation assembly 300 according to the embodiment of the present invention can be applied to various electronic devices or structures that need to dissipate heat, for example, in some embodiments, in combination with fig. 3 to 5, the heat dissipation assembly 300 is applied to the circuit board 200 to dissipate heat generated by various electronic components on the circuit board 200. In other embodiments, the heat sink assembly 300 is applied to an electronic device such as an unmanned aerial vehicle or a remote control vehicle, so as to dissipate heat of the electronic device and ensure the normal operation of the electronic device.
The second embodiment and the third embodiment are described in detail by taking the heat dissipation assembly 300 as an example of the circuit board 200 and the unmanned aerial vehicle, respectively.
Example two
With reference to fig. 3 to 5, a second embodiment of the present invention provides a circuit board assembly, which includes a circuit board 200 and a heat dissipation assembly 300 connected to the circuit board 200. The structure, function, working principle and effect of the heat dissipation assembly 300 can be referred to the description of the heat dissipation assembly 300 in the first embodiment, and are not described herein again. The circuit board 200 and the heat dissipation assembly 300 of the embodiment are combined to form a circuit board assembly, and when the circuit board 200 is subjected to a single test, the heat dissipation assembly 300 can dissipate heat of the circuit board 200 without additionally adding other wind sources or components to assist in heat dissipation.
In the present embodiment, the circuit board 200 is provided with a plurality of heat generating functional elements 240. The functional elements 240 include chips, sensors, etc. In the present embodiment, the functional element 240 is a chip, for example, a control chip, a driving chip, and the like.
The fan 1, the fin region 22 and the air outlet region 23 of the heat dissipation assembly 300 can dissipate heat at different positions of the circuit board 200. Specifically, the circuit board 200 includes a first region 210, a second region 220, and a third region 230, the fan 1 of the heat dissipation assembly 300 is matched with the first region 210, the fin region 22 is matched with the second region 220, and the air outlet region 23 is matched with the third region 230. In the present embodiment, the fan 1 is a heat conductive material, and the fan 1 is in contact with the first region 210 to conduct heat generated by the first region 210 and conduct the heat to the heat sink 2, specifically, the housing 11 of the fan 1 is in direct or indirect contact with the functional element 240 in the first region 210 to conduct heat generated by the first region 210 and conduct the heat to the heat sink 2. In addition, in this embodiment, the fin region 22 is in contact with the second region 22 to conduct heat generated by the second region 22 and conduct the heat to the air outlet region 23, specifically, the fin region 22 is in direct or indirect contact with the functional element 240 in the second region 220 to conduct heat generated by the second region 220 and conduct the heat to the air outlet region 23. The air flow guided out from the air outlet region 23 directly or intermittently flows to the third region 230, and dissipates heat of the functional element 240 in the third region 230.
In order to increase the heat dissipation speed of the third area 230, in an embodiment, the air outlet of the air outlet area 23 is aligned with the third area 230, and the third area 230 of this embodiment is directly aligned with the air outlet of the air outlet area 23, so that the heat dissipation efficiency is high. In another embodiment, the air outlet of the air outlet region 23 is disposed close to the third region 230, so as to increase the heat dissipation speed of the third region 230.
Referring to fig. 5 and 6, the housing 11 of the heat sink assembly 300 is connected to the circuit board 200 to form an integral structure. In the present embodiment, the shock absorbing member 3 of the heat dissipating module 300 is disposed between the housing 11 and the circuit board 200. The vibration component of this embodiment reduces the vibration strength transmitted from the fan 1 to the circuit board 200, thereby reducing the influence of some vibration-sensitive functional components 240 on the circuit board 200.
Specifically, a part of the main body portion 21 of the heat dissipating module 300 is located between the housing 11 and the circuit board 200, and the damping member 3 is disposed between the main body portion 21 and the housing 11.
With reference to fig. 5 and 6, the circuit board 200 is provided with a positioning portion 250, the positioning portion 250 is connected to the first mounting portion 211 of the main body portion 21 in a plugging manner, the first mounting portion 211 is connected to the outer upper fixing portion 111, and the damping element 3 of the heat dissipation assembly 300 is disposed between the first mounting portion 211 and the fixing portion 111. In this embodiment, the positioning portion 250 is a positioning protrusion, the first mounting portion 211 is provided with a mounting hole, and the positioning protrusion is inserted into the mounting hole.
Further, the fixing portions 111 include two, which are disposed on two sides of the housing 11.
Further, the damping element 3 is sleeved on the first mounting portion 211.
Further, a second mounting portion 241 is disposed on the cover 24 of the heat dissipation assembly 300, and the first mounting portion 211 penetrates through the fixing portion 111 and is fixedly connected to the second mounting portion 241.
Further, the heat dissipation assembly 300 further includes a fastening member 4, and the fastening member 4 fixes the second mounting portion 241 to the first mounting portion 211.
For other connection structures of the fan 1 and the heat dissipation member 2, reference may be made to the description of the first embodiment, and further description is not repeated here
EXAMPLE III
With reference to fig. 7 and 8, a third embodiment of the present invention provides an unmanned aerial vehicle, which may include a fuselage 100, a circuit board 200, and a heat dissipation assembly 300. The main body 100 has an accommodating space 110, and the circuit board 200 and the heat sink assembly 300 are accommodated in the accommodating space 110. The structure, function, operation principle and effect of the heat dissipation assembly 300 can be referred to the description of the heat dissipation assembly 300 in the first embodiment, and the structure, function, operation principle and effect of the circuit board 200 can be referred to the description of the circuit board 200 in the second embodiment, which is not repeated herein.
In this embodiment, the fuselage 100 is equipped with a plurality of air-out portions 120, for example, two, three or more than three, and is a plurality of air-out portion 120 with the cooperation of air-out region 23, by the air current that the air-out region 23 flows out, the warp air-out portion 120 leads out to outside the fuselage 100. Specifically, the air outlet portion 120 includes a first air outlet portion 121, a second air outlet portion 122 and a third air outlet portion 123, which are respectively correspondingly matched with the first sub-area 231, the second sub-area 232 and the third sub-area 233 of the heat dissipation assembly 300.
In this embodiment, the first air outlet portion 121 is communicated with the accommodating space 110, the air outlet of the first sub-region 231 is spaced from the first air outlet portion 121, the third region 230 of the circuit board 200 is disposed between the first air outlet portion 121 and the air outlet of the first sub-region 231, and the airflow flowing out of the first sub-region 231 is guided out by the first air outlet portion 121 after passing through the third region 230. In order to better dissipate heat of the third area 230 of the circuit board 200, the size of the air outlet of the first sub-area 231 of the embodiment needs to be matched with that of the third area 230.
Further, the second air outlet portion 122 is communicated with the second sub-area 232, an air outlet of the second sub-area 232 is connected with the second air outlet portion 122, and the airflow flowing out of the second sub-area 232 is directly guided out by the second air outlet portion 122. The third air outlet portion 123 is communicated with the third sub-area 233, an air outlet of the third sub-area 233 is connected with the third air outlet portion 123, and air flow flowing out of the third sub-area 233 is directly guided out by the third air outlet portion 123. Optionally, the air outlet of the second sub-area 232 is hermetically connected to the second air outlet portion 122, and the air outlet of the third sub-area 233 is hermetically connected to the third air outlet portion 123, so that the airflows of the second sub-area 232 and the third sub-area 233 are guided out of the main body 100 as much as possible.
Referring to fig. 8, in the present embodiment, the body 100 includes a first sidewall 130, a second sidewall 140, and a third sidewall 150, the first sidewall 130 is located at the front of the body, and the second sidewall 140 and the third sidewall 150 are located at both sides of the first sidewall 130. The first air outlet portion 121 is disposed on the first side wall 130, the second air outlet portion 122 is disposed on the second side wall 140, and the third air outlet portion 123 is disposed on the third side wall 150. Of course, the first air-out portion 121, the second air-out portion 122 and the third air-out portion 123 are not limited to the position on the machine body 100, and specifically, the first air-out portion 121, the second air-out portion 122 and the third air-out portion 123 can be set as required at the position on the machine body 100.
The first air outlet portion 121 and/or the second air outlet portion 122 and/or the third air outlet portion 123 respectively include a plurality of air outlet portions. For example, in an embodiment, the first air outlet portion 121 includes two air outlet portions, and the two first air outlet portions 121 are opened at two sides of the first sidewall 130. The second air-out portion 122 includes three, three the second air-out portion 122 interval is seted up in the second lateral wall 140, and, three second air-out portion 122 all with the air outlet cooperation of the sub-region 232 of second, in order to with the air current that the sub-region 232 of second flows is derived the fuselage 100 is outside. The third air outlet portions 123 include three, three the third air outlet portions 123 are spaced apart from the third side wall 150, and the three third air outlet portions 123 are all matched with the air outlet of the third sub-area 233, so as to guide the airflow flowing out of the third sub-area 233 out of the machine body 100.
The type of the air outlet part 120 may include various types, for example, in the present embodiment, each air outlet part 120 includes a plurality of air outlet holes. In other embodiments, the air outlet portion 120 may also be an air outlet or a grid structure.
In addition, in the present embodiment, referring to fig. 8, the heat dissipation assembly 300 is connected to the circuit board 200, the circuit board 200 and the heat dissipation assembly 300 of the present embodiment are combined to form a circuit board assembly, and when the circuit board 200 is subjected to a single test, the heat dissipation assembly 300 can dissipate heat of the circuit board 200 without additionally adding other wind sources or components to assist in heat dissipation.
The connection structure between the heat dissipation assembly 300 and the circuit board 200 can be referred to the description of the second embodiment, and is not repeated herein.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The heat dissipation assembly, the circuit board assembly having the heat dissipation assembly, and the unmanned aerial vehicle provided by the embodiment of the invention are described in detail above, and a specific example is applied in the description to explain the principle and the embodiment of the invention, and the description of the above embodiment is only used to help understanding the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (52)

1. A heat dissipation assembly, comprising:
a fan; and
the heat dissipation part is connected with the fan and comprises a main body part, a fin area arranged on the main body part and an air outlet area arranged on the main body part, wherein the main body part is connected with the fan; the fin area is arranged close to the air outlet of the fan and matched with the air outlet of the fan, the air outlet area is communicated with the fin area, and airflow flowing out of the air outlet of the fan flows into the air outlet area through the fin area and then is led out from the air outlet area;
the fin area comprises a plurality of fins arranged at intervals, an airflow guiding area is formed by two adjacent fins, the air outlet area comprises a plurality of sub-areas, the end parts of the sub-areas are communicated with the fin area, and the end part of each sub-area is communicated with at least two airflow guiding areas;
the air outlet area comprises a first sub-area, a second sub-area and a third sub-area, wherein the second sub-area and the third sub-area are respectively arranged on two sides of the first sub-area;
the air outlet directions of the first sub-area, the second sub-area and the third sub-area are different.
2. The heat dissipation assembly of claim 1, wherein the air outlets of the first sub-area gradually increase in a direction away from the fin area.
3. The heat dissipation assembly of claim 1, wherein the fan comprises a housing and fan blades disposed on the housing;
the housing is connected with the main body portion.
4. The heat sink assembly of claim 3, further comprising a shock absorbing element disposed at a junction of the housing and the body portion.
5. The heat sink assembly of claim 4, wherein the housing has a fixed portion and the main body portion has a first mounting portion;
the first mounting part is connected with the fixing part;
the damping element is disposed between the first mounting portion and the fixing portion.
6. The heat dissipating assembly of claim 5, wherein the shock absorbing member is sleeved on the first mounting portion.
7. The heat dissipating assembly of any one of claims 5 to 6, further comprising a cover cooperating with the main body for sealing the fin region and the outlet region.
8. The heat dissipating assembly of claim 7, wherein the cover has a second mounting portion;
the first installation part is fixedly connected with the second installation part after penetrating through the fixing part.
9. The heat sink assembly of claim 8, further comprising a fastener securing the second mounting portion to the first mounting portion.
10. The heat dissipating assembly of claim 5, wherein the fixing portion comprises two fixing portions disposed on two sides of the housing.
11. The heat dissipating assembly of claim 4, wherein the shock absorbing element is an elastomeric member.
12. The heat dissipation assembly of claim 3, wherein the housing is a thermally conductive member.
13. A circuit board assembly, comprising:
a circuit board; and
with the radiator unit that circuit board is connected, wherein, radiator unit includes:
a fan; and
the heat dissipation part is connected with the fan and comprises a main body part, a fin area arranged on the main body part and an air outlet area arranged on the main body part, wherein the main body part is connected with the fan; the fin area is arranged close to the air outlet of the fan and matched with the air outlet of the fan, the air outlet area is communicated with the fin area, and airflow flowing out of the air outlet of the fan flows into the air outlet area through the fin area and then is led out from the air outlet area;
the fin area comprises a plurality of fins arranged at intervals, an airflow guiding area is formed by two adjacent fins, the air outlet area comprises a plurality of sub-areas, the end parts of the sub-areas are communicated with the fin area, and the end part of each sub-area is communicated with at least two airflow guiding areas;
the air outlet area comprises a first sub-area, a second sub-area and a third sub-area, wherein the second sub-area and the third sub-area are respectively arranged on two sides of the first sub-area;
the air outlet directions of the first sub-area, the second sub-area and the third sub-area are different.
14. The circuit board assembly of claim 13, wherein the air outlets of the first sub-area gradually increase in a direction away from the fin area.
15. The circuit board assembly of claim 13, wherein the fan comprises a housing and fan blades disposed on the housing;
the shell is connected with the main body part and the circuit board.
16. The circuit board assembly of claim 15, wherein the heat dissipation assembly further comprises a shock absorbing member disposed between the housing and the circuit board.
17. The circuit board assembly of claim 16, wherein a portion of the body portion is positioned between the housing and the circuit board, the dampening member being disposed between the body portion and the housing.
18. The circuit board assembly according to claim 17, wherein the circuit board is provided with a positioning portion, the housing is provided with a fixing portion, and the main body portion is provided with a first mounting portion;
the positioning part is connected with the first installation part in an inserting mode, and the first installation part is connected with the fixing part;
the damping element is disposed between the first mounting portion and the fixing portion.
19. The circuit board assembly according to claim 18, wherein the shock absorbing member is sleeved on the first mounting portion.
20. The circuit board assembly of any one of claims 18-19, wherein the heat sink assembly further comprises a cover cooperating with the body portion for sealing the fin region and the air outlet region.
21. The circuit board assembly of claim 20, wherein the cover has a second mounting portion;
the first installation part is fixedly connected with the second installation part after penetrating through the fixing part.
22. The circuit board assembly of claim 21, wherein the heat sink assembly further comprises a fastener that secures the second mounting portion to the first mounting portion.
23. The circuit board assembly of claim 18, wherein the fixing portion comprises two fixing portions disposed on both sides of the housing.
24. The circuit board assembly of claim 16, wherein the dampening member is an elastomeric member.
25. The circuit board assembly of claim 15, wherein the housing of the fan is a thermally conductive member.
26. The circuit board assembly of claim 13, wherein the circuit board is configured with a plurality of heat generating functional components, the circuit board comprises a first region, a second region and a third region, the fan of the heat dissipation assembly is engaged with the first region, the fin region is engaged with the second region, and the air outlet region is engaged with the third region.
27. The circuit board assembly of claim 26, wherein the air outlet of the air outlet region is aligned with or close to the third region.
28. The circuit board assembly of claim 26, wherein the fan is thermally conductive and is in contact with the first region of the circuit board to conduct heat generated by the first region and to a heat sink; and/or
The fin area of the heat dissipation member is in contact with the second area of the circuit board so as to conduct heat generated by the second area and conduct the heat to the air outlet area.
29. The circuit board assembly of claim 26, wherein the functional element is a chip.
30. An unmanned aerial vehicle, comprising:
the body is provided with an accommodating space;
a circuit board accommodated in the accommodating space; and
a heat sink housed in the housing space, the heat sink comprising:
a fan; and
the heat dissipation part is connected with the fan and comprises a main body part, a fin area arranged on the main body part and an air outlet area arranged on the main body part, wherein the main body part is connected with the fan; the fin area is arranged close to the air outlet of the fan and matched with the air outlet of the fan, the air outlet area is communicated with the fin area, and airflow flowing out of the air outlet of the fan flows into the air outlet area through the fin area and then is led out from the air outlet area;
the fin area comprises a plurality of fins arranged at intervals, an airflow guiding area is formed by two adjacent fins, the air outlet area comprises a plurality of sub-areas, the end parts of the sub-areas are communicated with the fin area, and the end part of each sub-area is communicated with at least two airflow guiding areas;
the air outlet area comprises a first sub-area, a second sub-area and a third sub-area, wherein the second sub-area and the third sub-area are respectively arranged on two sides of the first sub-area;
the air outlet directions of the first sub-area, the second sub-area and the third sub-area are different.
31. The UAV of claim 30 wherein the outlet openings of the first sub-area increase in size away from the fin area.
32. The UAV of claim 30 wherein the fuselage defines a plurality of air outlets that cooperate with the air outlet region, wherein airflow from the air outlet region is directed out of the fuselage through the air outlets.
33. The UAV of claim 32 wherein the air outlets comprise a first air outlet, a second air outlet, and a third air outlet respectively corresponding to and cooperating with the first sub-area, the second sub-area, and the third sub-area of the heat sink assembly.
34. The UAV of claim 33 wherein the fuselage comprises a first sidewall, a second sidewall, and a third sidewall, the first sidewall being forward of the fuselage, the second sidewall and the third sidewall being on opposite sides of the first sidewall;
the first air outlet part is arranged on the first side wall, the second air outlet part is arranged on the second side wall, and the third air outlet part is arranged on the third side wall.
35. The unmanned aerial vehicle of claim 33 or 34, wherein the first air outlet and/or the second air outlet and/or the third air outlet each comprise a plurality of air outlets.
36. The UAV of claim 32 wherein each vent comprises a plurality of vents.
37. The UAV of claim 30 wherein the heat sink assembly is coupled to the circuit board.
38. The UAV of claim 37 wherein the fan comprises an outer shell and fan blades disposed on the outer shell;
the shell is connected with the main body part and the circuit board.
39. The UAV of claim 38 wherein the heat dissipation assembly further comprises a shock absorbing element disposed between the housing and the circuit board.
40. The UAV of claim 39 wherein a portion of the body portion is located between a housing of the fan and the circuit board, the dampening member being disposed between the body portion and the housing of the fan.
41. The unmanned aerial vehicle of claim 40, wherein the circuit board is provided with a positioning portion, the housing is provided with a fixing portion, and the main body portion is provided with a first mounting portion;
the positioning part is connected with the first installation part in an inserting mode, and the first installation part is connected with the fixing part;
the damping element is disposed between the first mounting portion and the fixing portion.
42. The UAV of claim 41 wherein the shock absorbing element is sleeved on the first mounting portion.
43. The UAV of claim 41 or 42 wherein the heat dissipation assembly further comprises a cover cooperating with the body portion to seal the fin region and the outlet region.
44. The UAV of claim 43 wherein the cover has a second mounting portion;
the first installation part is fixedly connected with the second installation part after penetrating through the fixing part.
45. The UAV of claim 44 wherein the heat sink assembly further comprises a fastener that secures the second mount portion to the first mount portion.
46. The UAV of claim 41 wherein the fixed portion comprises two, disposed on either side of the housing.
47. The UAV of claim 39 wherein the shock absorbing element is an elastomeric element.
48. The UAV of claim 38 wherein the housing is a thermally conductive member.
49. The UAV of claim 30 wherein the circuit board is configured with a plurality of heat generating functional elements, the circuit board including a first region, a second region, and a third region, the fan of the heat dissipation assembly being engaged with the first region, the fin region being engaged with the second region, and the outlet region being engaged with the third region.
50. The UAV of claim 49 wherein the outlet of the outlet region is aligned with or adjacent to the third region.
51. The UAV of claim 49 wherein the fan is made of a thermally conductive material and is in contact with the first region of the circuit board to conduct heat generated by the first region and to a heat sink; and/or
The fin area of the heat dissipation member is in contact with the second area of the circuit board so as to conduct heat generated by the second area and conduct the heat to the air outlet area.
52. The UAV of claim 49 wherein the functional element is a chip.
CN201880012031.5A 2018-06-26 2018-06-26 Heat dissipation assembly, circuit board assembly with same and unmanned aerial vehicle Active CN110313225B (en)

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CN110313225A (en) 2019-10-08
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