TWI826195B - Electronic device and one-piece dummy device thereof - Google Patents
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Abstract
Description
本案與虛設裝置有關,特別是關於一種適用於電子裝置的虛設裝置。This case relates to dummy devices, specifically a dummy device suitable for electronic devices.
電子裝置中,為了提高效能並滿足使用者多樣化的需求,電子裝置中的電子組件之配置數量越來越多,提供電子組件裝配的組設部配置也隨之增多。然而,並非所有使用者都需要電子裝置所能提供的所有功能,因此,在不同的使用需求下,電子裝置中的組設部可能就不會都配置有電子組件。在電子裝置中預設的組設部未安裝有電子組件的狀況下,電子裝置內的預設風流路徑也就因此隨之改變,如此就可能導致電子裝置內部的散熱效果不佳之狀況發生,因而有待改善。In electronic devices, in order to improve performance and meet the diverse needs of users, the number of electronic components in the electronic devices is increasing, and the number of assembly units that provide electronic component assembly is also increasing. However, not all users need all the functions provided by the electronic device. Therefore, under different usage requirements, not all components in the electronic device may be equipped with electronic components. When no electronic components are installed in the preset assembly part of the electronic device, the preset air flow path in the electronic device will also change accordingly, which may lead to poor heat dissipation inside the electronic device. Therefore, needs to be improved.
本案提供一種單件式虛設裝置,適用於電子裝置,電子裝置包含彼此電性連接的第一電子組件及第二電子組件,第一電子組件包含組設部及複數擴充單元,各擴充單元分別包含插槽及卡扣件,組設部供第二電子組件組設以與第一電子組件電性連接,擴充單元相鄰於組設部且間隔並列,單件式虛設裝置包括主體、多個結合部及導流翼。主體用以覆蓋於電子裝置內的組設部。各結合部分別連接於主體,且各結合部用以與卡扣件扣合。導流翼與結合部具有夾角地連接於結合部。This application provides a single-piece dummy device suitable for electronic devices. The electronic device includes a first electronic component and a second electronic component that are electrically connected to each other. The first electronic component includes an assembly part and a plurality of expansion units. Each expansion unit includes The slot and the buckle are used. The assembly part is for the second electronic component to be assembled and electrically connected to the first electronic component. The expansion unit is adjacent to the assembly part and is spaced side by side. The single-piece virtual device includes a main body and a plurality of combinations. parts and deflector wings. The main body is used to cover the assembly part in the electronic device. Each combination part is connected to the main body respectively, and each combination part is used to fasten with the buckle. The deflector blades are connected to the coupling part at an included angle.
本案另提供一種電子裝置,包含第一電子組件、第二電子組件、第三電子組件及前述單件式虛設裝置。第一電子組件包含複數組設部及複數擴充單元,各擴充單元分別包含插槽及卡扣件。第二電子組件設置於其中一組設部並與第一電子組件電性連接。第三電子組件插設於相鄰於第二電子組件的其中一插槽並定位於卡扣件,且第三電子組件電性連接第一電子組件及第二電子組件。單件式虛設裝置覆蓋於另一組設部並定位於另一擴充單元的卡扣件。This case also provides an electronic device, which includes a first electronic component, a second electronic component, a third electronic component and the aforementioned single-piece dummy device. The first electronic component includes a plurality of assembly parts and a plurality of expansion units, and each expansion unit includes a slot and a fastener respectively. The second electronic component is disposed in one of the assembly parts and is electrically connected to the first electronic component. The third electronic component is inserted into one of the slots adjacent to the second electronic component and positioned on the buckle, and the third electronic component is electrically connected to the first electronic component and the second electronic component. The one-piece dummy device covers another assembly part and is positioned on the buckle of another expansion unit.
藉此,單件式虛設裝置能在電子裝置的組設部不組設電子組件時覆蓋於組設部上並維持系統內部的預設風流,且單件式虛設裝置整體為單體結構,拆組方式方便,提高使用的便利性。Thereby, the single-piece dummy device can cover the assembly part of the electronic device when no electronic components are assembled and maintain the preset air flow inside the system, and the single-piece dummy device has a single structure as a whole and cannot be disassembled. The assembly method is convenient and improves the convenience of use.
一些實施例中,前述主體包含相對的上表面及下表面,結合部凸出於下表面。In some embodiments, the main body includes an upper surface and a lower surface that are opposite to each other, and the connecting portion protrudes from the lower surface.
一些實施例中,前述主體包含相對的第一側邊及第二側邊,結合部銜接於第一側邊及第二側邊其中一者。In some embodiments, the main body includes a first side and a second side opposite to each other, and the connecting portion is connected to one of the first side and the second side.
一些實施例中,前述導流翼垂直於結合部。In some embodiments, the aforementioned deflector fins are perpendicular to the joint portion.
一些實施例中,前述導流翼位於結合部兩端之間的中央位置。In some embodiments, the aforementioned flow deflector is located at a central position between two ends of the joint.
一些實施例中,前述結合部的數量為二,分別銜接於第一側邊及第二側邊。In some embodiments, the number of the aforementioned connecting parts is two, which are respectively connected to the first side and the second side.
一些實施例中,前述導流翼的數量為二,分別連接於各結合部,且二導流翼以主體為基準對稱配置。In some embodiments, the number of the aforementioned flow guide vanes is two, which are respectively connected to each joint part, and the two flow guide vanes are arranged symmetrically with respect to the main body.
一些實施例中,單件式虛設裝置更包含延伸部一體銜接於主體的下表面。In some embodiments, the one-piece dummy device further includes an extension portion integrally connected to the lower surface of the main body.
一些實施例中,前述垂直上表面及下表面的方向定義第一方向,延伸部遠離下表面的一端具有下凹部,延伸部由下表面至下凹部於第一方向上的延伸長度小於各導流翼於第一方向上的延伸長度。In some embodiments, the direction perpendicular to the upper surface and the lower surface defines the first direction, the end of the extension portion away from the lower surface has a concave portion, and the extension length of the extension portion in the first direction from the lower surface to the concave portion is smaller than each flow guide. The extension length of the wing in the first direction.
本案另提供一種電子裝置,包含第一電子組件、第二電子組件、第三電子組件及前述單件式虛設裝置。第一電子組件包含複數組設部及複數擴充單元,各擴充單元分別包含插槽及卡扣件。第二電子組件設置於其中一組設部並與第一電子組件電性連接。第三電子組件插設於相鄰於第二電子組件的其中一插槽並定位於卡扣件,且第三電子組件電性連接第一電子組件及第二電子組件。單件式虛設裝置覆蓋於另一組設部並定位於另一擴充單元的卡扣件。This case also provides an electronic device, which includes a first electronic component, a second electronic component, a third electronic component and the aforementioned single-piece dummy device. The first electronic component includes a plurality of assembly parts and a plurality of expansion units, and each expansion unit includes a slot and a fastener respectively. The second electronic component is disposed in one of the assembly parts and is electrically connected to the first electronic component. The third electronic component is inserted into one of the slots adjacent to the second electronic component and positioned on the buckle, and the third electronic component is electrically connected to the first electronic component and the second electronic component. The one-piece dummy device covers another assembly part and is positioned on the buckle of another expansion unit.
參閱圖1至圖3,圖1為本案單件式虛設裝置之一實施例裝配於電子裝置之立體外觀示意圖;圖2為本案單件式虛設裝置之一實施例裝配於電子裝置之分解示意圖;圖3為本案單件式虛設裝置之一實施例的立體外觀示意圖。Referring to Figures 1 to 3, Figure 1 is a schematic three-dimensional view of an embodiment of the single-piece dummy device in this case assembled on an electronic device; Figure 2 is an exploded schematic view of an embodiment of the single-piece dummy device in this case assembled on an electronic device; Figure 3 is a schematic three-dimensional view of one embodiment of the single-piece dummy device in this case.
參閱圖1至圖3,本案單件式虛設裝置M適用於電子裝置E,電子裝置E包含彼此電性連接的第一電子組件E1及第二電子組件E2,第一電子組件E1包含組設部E11及複數擴充單元E12,各擴充單元E12分別包含插槽E121及卡扣件E122,組設部E11供第二電子組件E2組設以與第一電子組件E1電性連接,擴充單元E12相鄰於組設部E11且間隔並列,單件式虛設裝置M包括主體10、多個結合部20(以下以二結合部20為例)及多個導流翼30(以下以二導流翼30為例)。主體10用以覆蓋於電子裝置E內的組設部E11。各結合部20分別連接於主體10,且各結合部20用以與卡扣件E122扣合。導流翼30與結合部20具有夾角地連接於結合部20;其中,各結合部20與主體10為一體成形的方式連接,各結合部20與主體10也可以是卡扣連接,但不以此為限;其中,各結合部20與導流翼30為一體成形的方式連接,各結合部20與導流翼30也可以是卡扣連接,但不以此為限,其中,導流翼30與結合部20間的夾角為90度,也可以是其他不使導流翼30與結合部20平行的其他角度。Referring to Figures 1 to 3, the single-piece dummy device M in this case is suitable for an electronic device E. The electronic device E includes a first electronic component E1 and a second electronic component E2 that are electrically connected to each other. The first electronic component E1 includes an assembly part. E11 and a plurality of expansion units E12. Each expansion unit E12 includes a slot E121 and a fastener E122 respectively. The assembly part E11 is for the second electronic component E2 to be assembled to be electrically connected to the first electronic component E1. The expansion unit E12 is adjacent to In the assembly part E11 and juxtaposed at intervals, the single-piece dummy device M includes a main body 10, a plurality of coupling parts 20 (hereinafter, the two coupling parts 20 are taken as an example) and a plurality of guide vanes 30 (hereinafter, the two guide vanes 30 are taken as an example). example). The main body 10 is used to cover the assembly part E11 in the electronic device E. Each coupling part 20 is connected to the main body 10 respectively, and each coupling part 20 is used to engage with the buckle E122. The deflector 30 and the connecting part 20 are connected to the connecting part 20 at an included angle; wherein, each connecting part 20 is connected to the main body 10 in an integrally formed manner. Each connecting part 20 and the main body 10 may also be snap-connected, but not in a snap-fit manner. This is limited to this; wherein, each coupling portion 20 and the flow guide vane 30 are connected in an integrally formed manner. Each coupling portion 20 and the flow guide vane 30 may also be snap-connected, but are not limited to this. Wherein, the flow guide vane 30 The angle between 30 and the connecting part 20 is 90 degrees, and may also be other angles that do not make the deflector 30 and the connecting part 20 parallel.
藉此,單件式虛設裝置M能覆蓋於電子裝置E中未組設第二電子組件E2的組設部E11上以於第二電子組件E2未安裝於組設部E11時,仍能維持系統內部的預設風流的流動方向及流動路徑,且單件式虛設裝置M整體為單體結構,拆組方式方便,提高使用的便利性。Thereby, the single-piece dummy device M can be covered on the assembly portion E11 of the electronic device E where the second electronic component E2 is not installed, so that the system can still be maintained when the second electronic component E2 is not installed on the assembly portion E11 The internal flow direction and flow path of the air flow are preset, and the single-piece dummy device M has a single structure as a whole, which is easy to disassemble and assemble, improving the convenience of use.
本案單件式虛設裝置M所適用之電子裝置E可以例如但不限於是電腦主機或是伺服器系統。The electronic device E to which the single-piece virtual device M in this case is applicable may be, for example, but not limited to, a computer host or a server system.
參閱圖1及圖2,一些實施例中,電子裝置E內的第一電子組件E1為主機板、輸入輸出模組電路板或是其他用於安裝第二電子組件E2之電路板,但不以此為限,第二電子組件E2為中央處理器(Central Processing Unit,CPU)、系統單晶片(System On a Chip,SoC)或圖形處理器(Graphic Processing Unit,GPU),但不以此為限,而第一電子組件E1上的組設部E11為CPU安裝座。擴充單元E12則供第三電子組件E3插設以與第一電子組件E1及第二電子組件E2電性連接,其中,第三電子組件E3例如為記憶體、豎卡(Riser Card)、顯示卡、PCIe擴充卡或其他擴充卡(Expander Card)等用於擴充第二電子組件E2的效能或是功能的電子組件,但不以此為限。Referring to Figures 1 and 2, in some embodiments, the first electronic component E1 in the electronic device E is a motherboard, an input-output module circuit board, or other circuit boards used to install the second electronic component E2, but it is not This is limited to the case where the second electronic component E2 is a central processing unit (Central Processing Unit, CPU), a system on a chip (System On a Chip, SoC) or a graphics processor (Graphic Processing Unit, GPU), but is not limited to this. , and the assembly portion E11 on the first electronic component E1 is a CPU mounting base. The expansion unit E12 is for the third electronic component E3 to be plugged in to electrically connect with the first electronic component E1 and the second electronic component E2. The third electronic component E3 is, for example, a memory, a riser card, or a display card. , PCIe expansion card or other expansion card (Expander Card) and other electronic components used to expand the performance or function of the second electronic component E2, but it is not limited to this.
參閱圖1及圖2,此些實施例中,電子裝置E的第一電子組件E1包含複數組設部E11及複數擴充單元E12供以配置/安裝複數第二電子組件E2及複數第三電子組件E3以提供高效能的使用需求。第二電子組件E2設置於組設部E11以與第一電子組件E1電性連接,第三電子組件E3插設於擴充單元E12的插槽E121並定位於卡扣件E122以與第一電子組件E1及第二電子組件E2電性連接。於此,每一組設部E11分別對應配置複數擴充單元E12,各擴充單元E12相鄰於組設部E11且間隔並列。Referring to FIGS. 1 and 2 , in these embodiments, the first electronic component E1 of the electronic device E includes a plurality of assembly parts E11 and a plurality of expansion units E12 for configuring/installing a plurality of second electronic components E2 and a plurality of third electronic components. E3 to provide high performance usage requirements. The second electronic component E2 is provided in the assembly part E11 to be electrically connected to the first electronic component E1. The third electronic component E3 is inserted into the slot E121 of the expansion unit E12 and positioned on the buckle E122 to be connected to the first electronic component. E1 and the second electronic component E2 are electrically connected. Here, each assembly part E11 is configured with a plurality of expansion units E12, and each expansion unit E12 is adjacent to the assembly part E11 and spaced in parallel.
參閱圖1及圖2,一些實施例中,每一組設部E11的相對兩側分別配置複數間隔並列的擴充單元E12,但本案並不以此為限。在其他實施例中,組設部E11也可以僅於其一側配置間隔並列的複數擴充單元E12。Referring to FIGS. 1 and 2 , in some embodiments, a plurality of expansion units E12 are arranged in parallel and spaced apart on opposite sides of each assembly part E11 , but the present case is not limited to this. In other embodiments, the assembly part E11 may also be configured with a plurality of expansion units E12 arranged in parallel at intervals only on one side thereof.
參閱圖1,圖1所繪示之電子裝置E的第一電子組件E1具有二組設部E11,其中一組設部E11組設第二電子組件E2,本案單件式虛設裝置M則覆蓋於另一組設部E11並結合於擴充單元E12。Referring to Figure 1, the first electronic component E1 of the electronic device E shown in Figure 1 has two assembly parts E11, one of which is assembled with the second electronic component E2. In this case, the single-piece dummy device M is covered Another assembly part E11 is combined with the expansion unit E12.
參閱圖3,一些實施例中,單件式虛設裝置M為單體結構,單件式虛設裝置M由塑料一體射出成形,藉以達到便於製造以及輕量化之目的。其他實施例中,單件式虛設裝置M並不限於以單一材料一體成形,本案中所謂單件式係指單件式虛設裝置M整體相連接以便於拆組工作進行時只需一次工序即可完成之結構組態。Referring to FIG. 3 , in some embodiments, the single-piece dummy device M is a single-piece structure, and the single-piece dummy device M is integrally injection-molded by plastic, so as to facilitate manufacturing and reduce weight. In other embodiments, the single-piece dummy device M is not limited to being integrally formed from a single material. The so-called single-piece in this case means that the single-piece dummy device M is connected as a whole so that only one process is required for disassembly and assembly. Completed structural configuration.
參閱圖2及圖3,一些實施例中,單件式虛設裝置M的主體10為薄片結構,且主體10的形狀、尺寸概略對應電子裝置E的第一電子組件E1之組設部E11之形狀、尺寸,藉以在組設部E11未組設有第二電子組件E2時覆蓋於組設部E11上。Referring to FIGS. 2 and 3 , in some embodiments, the main body 10 of the single-piece dummy device M is a sheet structure, and the shape and size of the main body 10 roughly correspond to the shape of the assembly portion E11 of the first electronic component E1 of the electronic device E. , size, so as to cover the assembly part E11 when the second electronic component E2 is not assembled on the assembly part E11.
參閱圖3,一些實施例中,主體10為矩形片體並具有相對的上表面11、下表面12以及相對的第一側邊13、第二側邊14,第一側邊13及第二側邊14分別銜接於上表面11與下表面12之間。此些實施例中,垂直上表面11與下表面12的方向定義為第一方向D1,垂直連接第一側邊13與第二側邊14的方向定義為第二方向D2,第二方向D2垂直於第一方向D1,垂直第一方向D1與第二方向D2定義為第三方向D3。Referring to Figure 3, in some embodiments, the main body 10 is a rectangular piece and has an upper surface 11, a lower surface 12, and first and second sides 13 and 14. The edges 14 are connected between the upper surface 11 and the lower surface 12 respectively. In these embodiments, the direction perpendicular to the upper surface 11 and the lower surface 12 is defined as the first direction D1, the direction perpendicularly connecting the first side 13 and the second side 14 is defined as the second direction D2, and the second direction D2 is vertical In the first direction D1, the perpendicular first direction D1 and the second direction D2 are defined as the third direction D3.
參閱圖3,一些實施例中,各結合部20由主體10的下表面12凸出並分別銜接於第一側邊13及第二側邊14,且結合部20為沿第一方向D1與第三方向D3延伸而共同建構出的片體結構。於此,結合部20沿第二方向D2延伸其片體厚度。藉此,二結合部20銜接於主體10的下表面12而能支撐主體10,使單件式虛設裝置M組設於電子裝置E時,主體10得以遠離組設部E11避免損傷組設部E11。Referring to Figure 3, in some embodiments, each connecting portion 20 protrudes from the lower surface 12 of the main body 10 and is connected to the first side 13 and the second side 14 respectively, and the connecting portion 20 is connected to the first side along the first direction D1. The three directions D3 extend together to construct a sheet structure. Here, the connecting portion 20 extends its sheet thickness along the second direction D2. Thereby, the two coupling parts 20 are connected to the lower surface 12 of the main body 10 to support the main body 10 , so that when the single-piece dummy device M is assembled on the electronic device E, the main body 10 can be kept away from the assembly part E11 to avoid damage to the assembly part E11 .
參閱圖1至圖3一些實施例中,各結合部20在第三方向D3上延伸的長度大於主體10的第一側邊13或第二側邊14在第三方向D3上的延伸長度。此些實施例中,各結合部20在第三方向D3上的延伸長度為在第三方向D3上相對的兩兩卡扣件E122之間的距離,藉以使單件式虛設裝置M能透過各結合部20結合於第一電子組件E1上的卡扣件E122。Referring to FIGS. 1 to 3 , in some embodiments, the extending length of each connecting portion 20 in the third direction D3 is greater than the extending length of the first side 13 or the second side 14 of the main body 10 in the third direction D3 . In these embodiments, the extension length of each coupling part 20 in the third direction D3 is the distance between two opposite fasteners E122 in the third direction D3, so that the single-piece dummy device M can pass through each The coupling part 20 is coupled to the buckle E122 on the first electronic component E1.
一些實施例中,各結合部20在第三方向D3上的兩端外型對應第三電子組件E3的外輪廓設置相同形狀、位置的卡槽21以便於配合卡扣件E122結合。在第三電子組件E3為記憶體的一些實施例中,卡扣件E122的長度、外觀型態概略同於記憶體的外觀輪廓。In some embodiments, the two ends of each coupling portion 20 in the third direction D3 are provided with slots 21 of the same shape and position corresponding to the outer contour of the third electronic component E3 to facilitate coupling with the buckle E122. In some embodiments where the third electronic component E3 is a memory, the length and appearance of the buckle E122 are roughly the same as the outline of the memory.
參閱圖2至圖5,一些實施例中,各結合部20在第一方向D1上的延伸長度小於第三電子組件E3在第一方向D1上的延伸長度。藉此,由於第一電子組件E1之插槽E121是可供第三電子組件E3組設並與第三電子組件E3形成電性連接,因此,插槽E121內面通常會設置有與第三電子組件E3電性連接的導電接點,此些實施例中,各結合部20僅透過卡槽21與卡扣件E122結合而不插入插槽E121,降低單件式虛設裝置M插入插槽E121內磨損插槽E121內的可能。Referring to FIGS. 2 to 5 , in some embodiments, the extension length of each coupling portion 20 in the first direction D1 is less than the extension length of the third electronic component E3 in the first direction D1 . Therefore, since the slot E121 of the first electronic component E1 is for the third electronic component E3 to be assembled and electrically connected to the third electronic component E3, the slot E121 is usually provided with a third electronic component E3. The conductive contacts of the component E3 are electrically connected. In these embodiments, each coupling part 20 is only coupled with the buckle E122 through the card slot 21 without being inserted into the slot E121. This reduces the risk of inserting the single-piece dummy device M into the slot E121. Wear inside slot E121 possible.
參閱圖4,一些實施例中,各結合部20在第二方向D2上的延伸長度大於插槽E121供第三電子組件E3插入的一開口於第二方向D2上的開口間距。藉此,可以更為確保各結合部20因無法通過開口而不插入插槽E121而僅抵靠於插槽E121的上方表面,避免使用者將各結合部20插入插槽E121。Referring to FIG. 4 , in some embodiments, the extension length of each coupling portion 20 in the second direction D2 is greater than the opening spacing in the second direction D2 of an opening of the slot E121 for inserting the third electronic component E3 . Thereby, it can be more ensured that each coupling portion 20 cannot pass through the opening without being inserted into the slot E121 and only abuts the upper surface of the slot E121 , thereby preventing the user from inserting each coupling portion 20 into the slot E121 .
參閱圖3,導流翼30為片體結構並用以橫跨於插槽E121上以維持與插槽E121設置/安裝第三電子組件E3後之風流的流動方向及流動路徑。一些實施例中,導流翼30為沿第一方向D1與第二方向D2延伸而共同建構出的片體結構,此些實施例中,導流翼30沿第三方向D3延伸其片體厚度。Referring to FIG. 3 , the deflector 30 has a sheet structure and is used to span the slot E121 to maintain the flow direction and flow path of the air flow after the third electronic component E3 is installed/installed in the slot E121 . In some embodiments, the deflector 30 is a sheet structure extending along the first direction D1 and the second direction D2. In these embodiments, the deflector 30 extends its sheet thickness along the third direction D3. .
參閱圖1至圖3,一些實施例中,導流翼30在第二方向D2上的兩端與對應的擴充單元E12在第二方向D2上兩兩相鄰且平行間隔的分布範圍長度相同,藉以完整跨越擴充單元E12在第二方向D2上的分布範圍,重現各擴充單元E12裝配有第三電子組件D3的風流狀態。Referring to FIGS. 1 to 3 , in some embodiments, the two ends of the deflector 30 in the second direction D2 have the same length as the distribution range of the corresponding expansion units E12 in the second direction D2 that is adjacent and spaced in parallel. Thereby, the distribution range of the expansion unit E12 in the second direction D2 is completely spanned, and the air flow state in which each expansion unit E12 is equipped with the third electronic component D3 is reproduced.
值得說明的是,擴充單元E12可以是設置於組設部E11的單一側或是同時設置於相對兩側,同時,導流翼30隨擴充單元E12相對於組設部E11的配置方式設置,也就是說,當擴充單元E12僅設置於組設部E11的單一側時,本案單件式虛設裝置M僅於主體10的一側對應設有導流翼30(如圖7所示);而當擴充單元E12同時設置於組設部E11的相對兩側時,本案單件式虛設裝置M即於主體10的相對兩側同時設有導流翼30(如圖3、圖6所示)。It is worth noting that the expansion unit E12 can be disposed on one side of the assembly part E11 or on both opposite sides at the same time. At the same time, the flow guide wings 30 are disposed according to the arrangement of the expansion unit E12 relative to the assembly part E11. That is to say, when the expansion unit E12 is only installed on one side of the assembly part E11, the single-piece dummy device M in this case is only provided with the guide wings 30 corresponding to one side of the main body 10 (as shown in Figure 7); and when When the expansion unit E12 is disposed on opposite sides of the assembly part E11 at the same time, the single-piece dummy device M in this case is provided with flow guide wings 30 on both opposite sides of the main body 10 (as shown in FIGS. 3 and 6 ).
一些實施例中,導流翼30在第二方向D2上的兩端與擴充單元E12在第二方向D2上的分布範圍長度相同的前提下,導流翼30在第二方向D2上的兩端之間的延伸方向不限於是沿第二方向D2延伸,在其他實施例中,導流翼30在第二方向D2上的兩端之間的延伸方向也可以是相對於第二方向D2及第三方向D3分別具有夾角的傾斜態樣(如圖8、圖9所示)。In some embodiments, under the premise that the two ends of the deflector 30 in the second direction D2 are the same as the distribution range length of the expansion unit E12 in the second direction D2, the two ends of the deflector 30 in the second direction D2 are The extending direction is not limited to extending along the second direction D2. In other embodiments, the extending direction between the two ends of the guide vane 30 in the second direction D2 may also be relative to the second direction D2 and the second direction D2. The three directions D3 respectively have inclined patterns at included angles (as shown in Figures 8 and 9).
一些實施例中,單件式虛設裝置M的主體10兩側同時配置有導流翼30,此些實施例中,各導流翼30分別銜接於各結合部20在第三方向D3上的兩端之間的中央位置(如圖6至圖9所示)。藉此使單件式虛設裝置M整體的配重平衡,便於裝配。但本案並不限於此,其他實施例中,導流翼30也可以是銜接於結合部20距離第三方向D3上兩端不同距離的非置中位置(如圖10所示),藉此改變電子裝置內的風流匯集位置,產生不同的熱流控制效果,例如改變風流的流動方向,或是集中/加壓風流的流動,但不以此為限。In some embodiments, the main body 10 of the single-piece dummy device M is provided with flow guide wings 30 on both sides. In these embodiments, each flow guide fin 30 is respectively connected to both sides of each coupling portion 20 in the third direction D3. The center position between the ends (as shown in Figure 6 to Figure 9). Thereby, the overall counterweight of the one-piece dummy device M is balanced to facilitate assembly. However, this case is not limited to this. In other embodiments, the deflector fins 30 can also be connected to non-centered positions (as shown in FIG. 10 ) at different distances from both ends of the connecting portion 20 in the third direction D3, thereby changing the The air flow gathering position in the electronic device produces different heat flow control effects, such as changing the flow direction of the air flow, or concentrating/pressurizing the flow of the air flow, but is not limited to this.
如圖3、圖6所示,在二導流翼30銜接於各結合部20於第三方向D3上的中央位置之一些實施例中,二導流翼30的延伸型態以主體10為基準為對稱配置,藉此便於單件式虛設裝置M之製造及生產。一些實施例中,各導流翼30垂直於各結合部20,如此一來,單件式虛設裝置M整體成為無方向性匹配的外觀型態,而能便於使用者組裝使用。As shown in FIGS. 3 and 6 , in some embodiments in which the two deflection wings 30 are connected to the central position of each connecting portion 20 in the third direction D3 , the extension shape of the two deflection wings 30 is based on the main body 10 It is a symmetrical configuration, thereby facilitating the manufacturing and production of the single-piece dummy device M. In some embodiments, each flow guide fin 30 is perpendicular to each connecting portion 20. In this way, the single-piece dummy device M as a whole has a non-directional matching appearance, which is convenient for users to assemble and use.
參閱圖1至圖3,一些實施例中,主體10包含複數穿口15,各穿口15貫穿上表面11及下表面12。藉此,穿口15供使用者的手指握持單件式虛設裝置M以裝配於第一電子組件E1上。此些實施例中,穿口15的數量至少為二以便於使用者可使用兩隻手指穿入穿口15以取置單件式虛設裝置M。一些實施例中,穿口15的數量為四並且分布於主體10的四角隅位置並且兩兩對稱,藉此提供使用者可使用兩隻以上的手指穿入穿口15以取置單件式虛設裝置M,且同樣地不具操作上的方向性都能進行一致性的操作,提高使用的便利性。Referring to FIGS. 1 to 3 , in some embodiments, the main body 10 includes a plurality of through-holes 15 , and each through-hole 15 penetrates the upper surface 11 and the lower surface 12 . Thereby, the through hole 15 allows the user's fingers to hold the one-piece dummy device M for assembly on the first electronic component E1. In these embodiments, the number of the through holes 15 is at least two so that the user can use two fingers to penetrate the through holes 15 to access the single-piece dummy device M. In some embodiments, the number of the through holes 15 is four and they are distributed at the four corners of the main body 10 and are symmetrical, thereby allowing the user to use more than two fingers to penetrate the through holes 15 to remove the single-piece dummy device. Device M, and similarly has no directionality in operation, can perform consistent operations, improving convenience of use.
參閱圖4,一些實施例中,單件式虛設裝置M更包含延伸部40,一體銜接於主體10的下表面12。延伸部40為沿第一方向D1與第二方向D2延伸而共同建構出的片體結構,此些實施例中,延伸部40沿第三方向D3延伸其片體厚度。藉此,延伸部40能提高主體10的結構強度,也使組設部E11位置的風流相同於裝配第二電子組件E2時的狀態,確保電子裝置E內的散熱控制,又能提高整體裝置的穩定性。Referring to FIG. 4 , in some embodiments, the single-piece dummy device M further includes an extension 40 integrally connected to the lower surface 12 of the main body 10 . The extension part 40 is a sheet structure constructed by extending along the first direction D1 and the second direction D2. In these embodiments, the extension part 40 extends its sheet thickness along the third direction D3. In this way, the extension part 40 can improve the structural strength of the main body 10, and also make the air flow at the assembly part E11 the same as the state when the second electronic component E2 is assembled, ensuring heat dissipation control in the electronic device E, and improving the overall device efficiency. Stability.
參閱圖4,一些實施例中,延伸部40遠離下表面12的一端具有下凹部41,且延伸部40自下表面12至下凹部41於第一方向D1上的延伸長度小於各導流翼30於第一方向D1上的延伸長度。藉此,確保單件式虛設裝置M組裝於第一電子組件E1時不會直接壓抵於組設部E11,避免組設部E11的損壞。此外,下凹部41與組設部E11之間的空間也能允許組設部E11上裝配防塵蓋,以下以CPU防塵蓋為例(圖中未示),在組設部E11裝配有CPU防塵蓋的狀態下維持電子裝置E內部的散熱風流。Referring to FIG. 4 , in some embodiments, the end of the extension part 40 away from the lower surface 12 has a recessed part 41 , and the extension length of the extension part 40 from the lower surface 12 to the recessed part 41 in the first direction D1 is smaller than each deflector 30 The extension length in the first direction D1. This ensures that the single-piece dummy device M will not directly press against the assembly part E11 when assembled in the first electronic component E1, thereby avoiding damage to the assembly part E11. In addition, the space between the lower recess 41 and the assembly part E11 can also allow a dust cover to be installed on the assembly part E11. The following takes a CPU dust cover as an example (not shown in the figure). The assembly part E11 is equipped with a CPU dust cover. The cooling air flow inside the electronic device E is maintained.
參閱圖11,在單件式虛設裝置M包含二導流翼30的一些實施例中,主體10兩側的導流翼30在第二方向D2上的長度不同,藉此得以適用於具有不同擴充單元E12配置的第一電子組件E1。Referring to FIG. 11 , in some embodiments in which the single-piece dummy device M includes two guide fins 30 , the guide fins 30 on both sides of the main body 10 have different lengths in the second direction D2 , thereby being suitable for devices with different expansions. Unit E12 configures the first electronic component E1.
參閱圖12,一些實施例中,單件式虛設裝置M的結合部20與主體10的第二側邊14之間具有間距,藉此得以適用於不同空間配置的第一電子組件E1。Referring to FIG. 12 , in some embodiments, there is a distance between the connecting portion 20 of the single-piece dummy device M and the second side 14 of the main body 10 , thereby being suitable for the first electronic component E1 in different spatial configurations.
雖然本揭露已以一些實施例揭露如上,然其並非用以限定本揭露,任何所屬技術領域中具有通常知識者,在不脫離本揭露之精神及範圍內,當可作些許更動及潤飾。因此本案之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present disclosure has been disclosed in some embodiments, this is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art may make slight changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of patent protection in this case must be determined by the scope of the patent application attached to this specification.
E:電子裝置E: Electronic device
E1:第一電子組件E1: First electronic component
E11:組設部E11: Organization Department
E12:擴充單元E12: expansion unit
E121:插槽E121: Slot
E122:卡扣件E122: fasteners
E2:第二電子組件E2: Second electronic component
E3:第三電子組件E3: Third electronic component
M:單件式虛設裝置M: One-piece dummy device
10:主體10:Subject
11:上表面11: Upper surface
12:下表面12: Lower surface
13:第一側邊13:First side
14:第二側邊14:Second side
15:穿口15:Piercing
20:結合部20:joint part
21:卡槽21:Card slot
30:導流翼30: deflector wing
40:延伸部40:Extension part
41:下凹部41: concave part
D1:第一方向D1: first direction
D2:第二方向D2: second direction
D3:第三方向D3: Third direction
圖1為本案單件式虛設裝置之一實施例裝配於電子裝置之立體外觀示意圖。 圖2為本案單件式虛設裝置之一實施例裝配於電子裝置之分解示意圖。 圖3為本案單件式虛設裝置之一實施例的立體外觀示意圖。 圖4為沿圖1中4-4割面線繪製的剖視示意圖。 圖5為沿圖1中5-5割面線繪製的剖視示意圖。 圖6為本案單件式虛設裝置之第一實施例的平面示意圖。 圖7為本案單件式虛設裝置之第二實施例的平面示意圖。 圖8為本案單件式虛設裝置之第三實施例的平面示意圖。 圖9為本案單件式虛設裝置之第四實施例的平面示意圖。 圖10為本案單件式虛設裝置之第五實施例的平面示意圖。 圖11為本案單件式虛設裝置之第六實施例的平面示意圖。 圖12為本案單件式虛設裝置之第七實施例的平面示意圖。 FIG. 1 is a schematic three-dimensional view of an embodiment of the single-piece dummy device assembled in an electronic device. FIG. 2 is an exploded schematic diagram of an embodiment of the single-piece dummy device assembled in an electronic device. Figure 3 is a schematic three-dimensional view of one embodiment of the single-piece dummy device in this case. Figure 4 is a schematic cross-sectional view drawn along the 4-4 section line in Figure 1. Figure 5 is a schematic cross-sectional view drawn along the 5-5 cut plane line in Figure 1. Figure 6 is a schematic plan view of the first embodiment of the single-piece dummy device in this case. FIG. 7 is a schematic plan view of the second embodiment of the single-piece dummy device of the present invention. Figure 8 is a schematic plan view of the third embodiment of the single-piece dummy device in this case. Figure 9 is a schematic plan view of the fourth embodiment of the single-piece dummy device in this case. Figure 10 is a schematic plan view of the fifth embodiment of the single-piece dummy device in this case. Figure 11 is a schematic plan view of the sixth embodiment of the single-piece dummy device in this case. Figure 12 is a schematic plan view of the seventh embodiment of the single-piece dummy device of the present invention.
E:電子裝置 E: Electronic device
E1:第一電子組件 E1: First electronic component
E11:組設部 E11: Organization Department
E12:擴充單元 E12: expansion unit
E121:插槽 E121: Slot
E122:卡扣件 E122: fasteners
E2:第二電子組件 E2: Second electronic component
E3:第三電子組件 E3: Third electronic component
M:單件式虛設裝置 M: One-piece dummy device
10:主體 10:Subject
11:上表面 11: Upper surface
12:下表面 12: Lower surface
13:第一側邊 13:First side
14:第二側邊 14:Second side
15:穿口 15:Piercing
20:結合部 20:joint part
30:導流翼 30: deflector wing
D1:第一方向 D1: first direction
D2:第二方向 D2: second direction
D3:第三方向 D3: Third direction
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Citations (3)
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US20160192538A1 (en) * | 2014-12-25 | 2016-06-30 | Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. | Heat dissipation device and electronic device |
TW201818797A (en) * | 2016-11-11 | 2018-05-16 | 英業達股份有限公司 | Server |
CN110134207A (en) * | 2018-02-09 | 2019-08-16 | 纬创资通股份有限公司 | Computing electronics and its pod |
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US20160192538A1 (en) * | 2014-12-25 | 2016-06-30 | Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. | Heat dissipation device and electronic device |
TW201818797A (en) * | 2016-11-11 | 2018-05-16 | 英業達股份有限公司 | Server |
CN110134207A (en) * | 2018-02-09 | 2019-08-16 | 纬创资通股份有限公司 | Computing electronics and its pod |
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