CN101231546A - Combination of cooling device - Google Patents

Combination of cooling device Download PDF

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Publication number
CN101231546A
CN101231546A CNA2007102001047A CN200710200104A CN101231546A CN 101231546 A CN101231546 A CN 101231546A CN A2007102001047 A CNA2007102001047 A CN A2007102001047A CN 200710200104 A CN200710200104 A CN 200710200104A CN 101231546 A CN101231546 A CN 101231546A
Authority
CN
China
Prior art keywords
heat abstractor
radiating fin
fin group
abstractor combination
heating radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007102001047A
Other languages
Chinese (zh)
Inventor
叶振兴
孙珂
陈明科
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNA2007102001047A priority Critical patent/CN101231546A/en
Priority to US11/857,452 priority patent/US20080174952A1/en
Publication of CN101231546A publication Critical patent/CN101231546A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat elimination device assembly is provided, which comprises a radiator and a clamper arranged at one side of a computer motherboard. The radiator is fastened with the clamper and can rotate relative to the clamper. The heat elimination device assembly can change the direction of an air outlet of the CPU radiator relative to the position of the north bridge, thereby efficiently eliminating the heat of the north bridge.

Description

The heat abstractor combination
Technical field
The present invention relates to a kind of heat abstractor combination, refer to a kind of central processing unit heat abstractor combination of computer main board especially.
Background technology
Along with popularizing day by day of computer and improving constantly of its performance, heat dissipation problem also more and more is subject to people's attention.Relative position and the form that reaches central processing unit on the computer main board between each ingredient of the heat abstractor of central processing unit all fixed usually at present, and this makes that the air outlet direction of heat abstractor is single fixing; In addition, because the central processing unit on the different mainboards and the relative position of north bridge are not quite similar, this just makes the distinguished and admirable of air outlet of central processing unit heat abstractor can not guarantee the north bridge of effectively flowing through, thereby unfavorable to the heat radiation of north bridge.
Summary of the invention
In view of above content, be necessary to provide a kind of heat abstractor combination that can change the central processing unit of heating radiator air outlet direction.
A kind of heat abstractor combination comprises that a heating radiator and is installed in the fastener of a computer main board one side, and described heating radiator is sticked in described fastener and can rotates with respect to described fastener
Heat abstractor combination of the present invention, its heating radiator and fastener can relatively rotate, and make the air outlet of heating radiator to change direction according to the position of north bridge, thereby help the north bridge heat radiation effectively.Simultaneously, for the designer of mainboard, the present invention also provides more choices for the wiring of north bridge.
Description of drawings
The present invention is further illustrated in conjunction with embodiment below with reference to accompanying drawing.
Fig. 1 is the three-dimensional exploded view of heat abstractor combination better embodiment of the present invention.
Fig. 2 is the other direction stereographic map of the heating radiator of heat abstractor combination better embodiment of the present invention.
Fig. 3 makes up better embodiment in the installation process synoptic diagram of a computer main board for heat abstractor of the present invention.
Fig. 4 is the user mode figure of heat abstractor combination better embodiment of the present invention.
Fig. 5 is another user mode figure of heat abstractor combination better embodiment of the present invention.
Embodiment
Please refer to Fig. 1 and Fig. 3, the better embodiment of heat abstractor combination 1 of the present invention comprises a fan assembly 50, a heating radiator 10, a fastener 40 and a backboard 60, is used to a computer main board 2 heat radiations.
Fan assembly 50 comprises the installing plate 54 of a fan body 52 and an installing fan body 52,52 4 angles of fan body are respectively equipped with mounting hole 57, some grabs 56 are extended at the two ends of installing plate 54 respectively downwards, the air outlet of the corresponding fan body 52 in installing plate 54 centers (figure does not show) is established a hole, and the mounting hole 57 of 54 4 corresponding respectively fan body 52 in angle of installing plate is provided with screw 59.Fan body 52 and installing plate 54 link together by pack into the corresponding mounting hole 57 and the screw 58 of screw 59.
Please in conjunction with Fig. 2, heating radiator 10 comprises that a base 20 and is connected in the radiating fin group 30 on the base 20.Base 20 comprise one be used to carry the square plate shape supporting part 22 that connects described radiating fin group 30 and one with the buckling parts that is oblate bar shape 24 of supporting part 22 one, formation one toroidal cavity 26 between supporting part 22 and the buckling parts 24.It is rectangular-shaped that radiating fin group 30 generally is, it comprises and being arranged in parallel and perpendicular to some radiating fins of the supporting part 22 of base 20, make by distinguished and admirable can only the outflow in the radiating fin group 30 by two ends of these radiating fins, thereby form two air outlets 32 and 38 on all sides of radiating fin group 30, air outlet 32 and 38 is in respectively forming a draw-in groove 34 near heating radiator 10 end face places.Described heating radiator 10 dresses are inserted the heat pipe 36 of " C " shape of some being, wherein, the epimere dress of heat pipe 36 is inserted in the radiating fin group 30, and the hypomere of described heat pipe 36 dress is inserted between radiating fin group 30 and the base 20, improves the heat exchanger effectiveness of radiating fin group 30 and base 20 with this.
Fastener 40 comprises a circular clasp 42 and symmetrical extended four protruding tongues 44 in clasp 42 outsides, clasp 42 is made for material such as resin, duroplasts etc. with micro-elastic deformability, clasp 42 is snapped in the groove 26 of heating radiator 10 bases 20 rotationally, each protruding tongue 44 is provided with a hole 46, be equiped with a screw 48 in each hole 46, screw 48 is arranged with spring 49 and snap ring 47 from top to bottom, spring 49 is positioned at protruding tongue 44 tops, and snap ring 47 is positioned at protruding tongue 44 belows and makes screw not break away from protruding tongue 44.
Backboard 60 is " ten " font, and its center is established a circular hole and respectively is provided with a screw 62 four ends.
Please continue with reference to figure 3, during assembling, grab 56 correspondences on the installing plate 54 of fan assembly 50 are snapped in the draw-in groove 34 of radiating fin group 30 of heating radiator 10, the clasp 42 of fastener 40 is snapped in the groove 26 of heating radiator 10 bases 20, here, the gap between clasp 42 and the groove 26 makes clasp 42 to rotate with respect to groove 26.The part that said process is assemblied places the central processing unit top of computer main board 2, and backboard 60 correspondences are placed the central processing unit below of computer main board 2, and backboard 60 is made up 1 fastener 40 by screw 48 and heat abstractor is connected.
As shown in Figure 4 and Figure 5, using heat abstractor to make up at 1 o'clock, when screw 48 does not screw, heating radiator 10 can rotate with respect to described fastener 40, because from distinguished and admirablely not dispersing that the air outlet 32 of heating radiator 10 and 38 flows out, but directive property is arranged, so can come rotation heat sink 10 according to the diverse location of north bridge 4a or 4b above the computer main board 2, make the air outlet 32 or 38 on the heating radiator 10 point to north bridge 4a or 4b, help north bridge 4a or 4b fully to dispel the heat.Then screw 48 is screwed, the buckling parts 24 of the base 20 of heating radiator 10 is compressed by fastener 40 and computer main board 2, and heating radiator 10 is fastened onto computer main board 2.
In addition, for concentrate better from heating radiator 10 flow out distinguished and admirable, can be with a sealing in its air outlet 32 and 38, another provides distinguished and admirable for north bridge 4a or 4b, thereby makes north bridge 4a or 4b obtain better radiating effect.

Claims (10)

1. heat abstractor combination comprises that a heating radiator and is installed in the fastener of a computer main board one side, is characterized in that: described heating radiator is sticked in described fastener and can rotates with respect to described fastener.
2. heat abstractor combination as claimed in claim 1, it is characterized in that: described heating radiator comprises that a base and is connected in the radiating fin group on the described base, described base comprises that a supporting part and that is used to carry described radiating fin group is the buckling parts of oblate bar shape, form a toroidal cavity between described supporting part and the described buckling parts, described fastener comprises a circular clasp, and described clasp is snapped in the described groove rotationally.
3. heat abstractor combination as claimed in claim 2 is characterized in that: form at least one air outlet on the described radiating fin group.
4. heat abstractor combination as claimed in claim 3, it is characterized in that: described radiating fin group is rectangular-shaped, and it comprises the some radiating fins that are arranged in parallel.
5. heat abstractor combination as claimed in claim 4, it is characterized in that: described radiating fin group respectively forms an air outlet along the direction of described radiating fin in its two ends.
6. heat abstractor combination as claimed in claim 5, it is characterized in that: described fastener extends some protruding tongues in its clasp outside, each protruding tongue is provided with a hole, be equiped with a screw in the described hole, be arranged with a spring on the described screw, described spring relies on described protruding tongue, and the opposite side of described computer main board is provided with a backboard, the corresponding described some screws of described backboard are provided with some screws, and described some screws pass described computer main board screw lock in corresponding screw.
7. heat abstractor combination as claimed in claim 5 is characterized in that: described heat abstractor combination comprises that further one is installed in the fan assembly on described radiator heat-dissipation fins group top.
8. heat abstractor combination as claimed in claim 7, it is characterized in that: two air outlets of the radiating fin group of described heating radiator are in respectively forming a draw-in groove near the end face place, described fan assembly comprises the installing plate of a fan body and the described fan body of an installing, some grabs are extended at the two ends of described installing plate respectively downwards, and described some grab correspondences are snapped in the draw-in groove of described radiating fin group.
9. heat abstractor combination as claimed in claim 8, it is characterized in that: described heating radiator also comprises the heat pipe of " C " shape of some being, and the epimere dress of each heat pipe is inserted in the described radiating fin group, and the hypomere dress is inserted between described radiating fin group and the described base.
10. heat abstractor combination as claimed in claim 9, it is characterized in that: the supporting part of the base of described heating radiator and buckling parts are one, the described supporting part side of being plate shape.
CNA2007102001047A 2007-01-24 2007-01-24 Combination of cooling device Pending CN101231546A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNA2007102001047A CN101231546A (en) 2007-01-24 2007-01-24 Combination of cooling device
US11/857,452 US20080174952A1 (en) 2007-01-24 2007-09-19 Heat dissipation assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2007102001047A CN101231546A (en) 2007-01-24 2007-01-24 Combination of cooling device

Publications (1)

Publication Number Publication Date
CN101231546A true CN101231546A (en) 2008-07-30

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ID=39640973

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007102001047A Pending CN101231546A (en) 2007-01-24 2007-01-24 Combination of cooling device

Country Status (2)

Country Link
US (1) US20080174952A1 (en)
CN (1) CN101231546A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114710945A (en) * 2022-06-07 2022-07-05 广东电网有限责任公司广州供电局 Rapid heat dissipation device and method for winding heating head of distribution transformer

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Open date: 20080730