TWM573560U - Heat sink - Google Patents

Abstract

A heat dissipation assembly including a first heat sink, a second heat sink and a hook is provided. The first heat sink includes a first fastening part, a first recess and a second fastening part. The second heat sink is disposed between the first heat sink and the hook. The second heat sink includes a heat dissipative bottom, a first position limiting part bent extending from the heat dissipative bottom. The first position limiting part of the second heat sink extends into the first recess of the first heat sink. The hook is used for removably fastening the first heat sink. The hook includes a third fastening part and a fourth fastening part. The third fastening part and the fourth fastening part of the hook are respectively fastened to the first fastening part and the second fastening part of the first heat sink in a slidable manner so as to have the first heat sink and the second heat sink been separated by a first spacing.

Description

Cooling components

The novel creation relates to a heat dissipation component, and more particularly, to a heat dissipation component commonly used for expansion cards with chips on one or both sides.

The development of solid state drives (Solid State Drives, SSDs) in recent years due to breakthroughs in related technical restrictions has gradually reduced the production costs of solid state drives, and its access speed, tolerance and portability are all higher than traditional discs. Hard disk drives (HDDs) have advantages, so their applications in information hardware are becoming increasingly popular. In addition, the transmission interfaces of solid-state hard disks and information hardware cores have also gradually changed from the mSATA standard to the M.2 standard. Because M.2 has a more diverse design of the connection interface, it allows expansion cards to have different width and length designs, and can Let the expansion card carry more chips. Therefore, the visibility of motherboards equipped with M.2 connectors in the market has gradually increased. For example, the motherboards of desktop, notebook or tablet computers can be connected to SSD expansion cards through M.2 connectors.

However, SSD expansion cards generate more heat during high-efficiency operation. Therefore, a cooling mechanism (such as a cooling component on the SSD expansion card) needs to be used to reduce its own temperature to avoid a reduction in processing efficiency. However, due to differences in storage capacity or design of SSD expansion cards, flash memory may be configured on one or both sides of the SSD expansion card, making SSD expansion cards have different thicknesses. SSD expansion cards of different thicknesses use different heat dissipation components, and have higher mold costs.

The novel creation provides a heat dissipation component that is compatible with single-sided or double-sided expansion cards with chips, and the double-sided heat dissipation structure can effectively reduce the temperature of the expansion card during high-performance operation.

The new-designed heat dissipation component is suitable for the first expansion card. The heat dissipation component includes a first heat dissipation member, a second heat dissipation member, and a buckle member. The first heat sink has a first inner surface and a first side and a second side opposite to the first inner surface. The first heat sink includes a first buckling portion located on the first side, a first recess on the first side, and a second buckling portion on the second side. The second heat sink is stacked under the first heat sink, and the first inner surface of the first heat sink faces the second heat sink. The second heat-dissipating member includes a heat-dissipating bottom and a first limiting portion extending from the heat-dissipating bottom in a bent manner. The first limiting portion of the second heat sink extends into the first recess of the first heat sink. The first expansion card is adapted to be disposed between the first heat sink and the second heat sink. The second heat sink is located between the first heat sink and the buckle. The clip member detachably fixes the first heat sink. The clip includes a third clip portion and a fourth clip portion. The third and fourth fastening portions of the fastening member are slidably engaged with the first and second fastening portions of the first heat dissipation member, respectively, so that the first heat dissipation member and the second heat dissipation member are dissipated. The pieces are spaced a first distance apart.

In an embodiment of the present invention, the buckle of the heat-dissipating component further includes a bottom portion and an upper portion disposed on the bottom portion. When the first expansion card is located between the first heat dissipating member and the second heat dissipating member, and the first heat dissipating member and the second heat dissipating member are fixed together by the fastening member, the top of the buckling member is against the heat dissipation of the second heat dissipating member. bottom.

In an embodiment of the present invention, when the first expansion card to which the above-mentioned heat dissipation assembly is applied is located between the first heat dissipation member and the second heat dissipation member and is commonly fixed by the buckling member, the third buckle of the buckling member The portion abuts against the first limiting portion of the second heat sink.

In an embodiment of the present invention, the first heat-dissipating member of the heat-dissipating component further includes a second notch on the first side and a third notch on the second side. The third and fourth buckling portions of the buckle are adapted to extend into the second and third notches.

In an embodiment of the present invention, the first heat-dissipating member of the heat-dissipating component further includes a second notch on the second side. The second heat dissipating member further includes a second limiting portion extending from the bottom of the heat dissipatingly and opposite to the first limiting portion. The second limiting portion of the second heat sink extends into the first recess of the first heat sink.

In an embodiment of the present invention, the second heat dissipating member of the heat dissipating component further includes a second limiting portion bent and extending from the bottom of the heat dissipating member. When the first expansion card is located between the first heat dissipating member and the second heat dissipating member, and the first heat dissipating member and the second heat dissipating member are fixed together by the snap member, the side of the first expansion card abuts against the second heat dissipating member. Second limit section.

In an embodiment of the present invention, the buckle of the heat dissipation component further includes a bottom portion and two side wall portions extending from opposite sides of the bottom portion. The third buckling portion and the fourth buckling portion respectively extend from the two side wall portions in a bent manner.

In an embodiment of the present invention, the first heat-dissipating member of the heat-dissipating component further includes a fifth buckling portion on the first side and a sixth buckling portion on the second side. The distance between the fifth engaging portion and the first inner surface is greater than the distance between the first engaging portion and the first inner surface. The distance between the sixth fastening portion and the first inner surface is greater than the distance between the second fastening portion and the first inner surface.

In an embodiment of the present invention, the heat dissipation component is suitable for a second expansion card, and the thickness of the second expansion card is smaller than the thickness of the first expansion card. When the second expansion card is located between the first heat dissipating member and the second heat dissipating member, the third buckling portion and the fourth buckling portion of the buckling member can be selectively buckled to the fifth buckling portion and the sixth buckling portion, respectively. The buckling portion is such that the first heat dissipating member and the second heat dissipating member are separated by a second distance, and the second distance is smaller than the first distance.

In an embodiment of the present invention, the first expansion card to which the above-mentioned heat dissipation component is applied includes a fixing notch recessed at an edge. The first heat radiating member, the second heat radiating member, and the latching member respectively include a first through hole, a second through hole, and a third through hole corresponding to the fixed notch. The fixing member is adapted to pass through the first through hole, the fixing notch, the second through hole and the third through hole and be fixed to the circuit board.

In an embodiment of the present invention, the first through hole, the second through hole, and the third through hole of the heat dissipation component are circular through holes or semi-circular through holes.

In an embodiment of the present invention, the heat dissipation component further includes a first heat dissipation pad and a second heat dissipation pad. The first heat dissipation pad is disposed between the first heat dissipation member and the second heat dissipation member. The second heat dissipation pad is disposed between the first heat dissipation pad and the second heat dissipation member. The first expansion card is adapted to be disposed between the first heat dissipation pad and the second heat dissipation pad.

Based on the above, the first heat sink and the second heat sink of the heat sink assembly of the present invention are suitable for being disposed on both sides of the expansion card. The first heat sink and the second heat sink can effectively reduce the operating temperature of the expansion card, thereby strengthening the expansion. Card performance. In addition, in the novel creation, the second heat sink is located between the first heat sink and the buckle, and the third buckle portion and the fourth buckle portion of the buckle are slidably fastened to the first heat sink, respectively. The first buckling part and the second buckling part are fixed on the two sides of the expansion card. In addition, the heat dissipating component extends into the first recess of the first heat dissipating member through the first limiting portion of the second heat dissipating member, which can prevent the first heat dissipating member, the expansion card, and the second heat dissipating member from sliding to the snap member. Dislocation occurs during the process to effectively reduce the risk of damage to the expansion card.

In order to make the above-mentioned features and advantages of the novel creation more comprehensible, embodiments are described below in detail with the accompanying drawings as follows.

FIG. 1 is a schematic top view of a heat dissipation component according to an embodiment of the novel creation. FIG. 2 is an exploded view of the heat dissipation component in FIG. 1. Referring to FIGS. 1 and 2, the heat dissipation assembly 100 includes a first heat sink 110, a second heat sink 120, and a buckle 130. The first heat dissipating member 110 and the second heat dissipating member 120 are adapted to be installed on the upper and lower sides of the expansion card 200, so that the expansion card 200 located between the first heat dissipating member 110 and the second heat dissipating member 120 is thermally coupled to the first heat dissipating member 110. And second heat sink 120. In this way, the heat generated by the expansion card 200 during operation can be transferred to the first heat dissipating member 110 and the second heat dissipating member 120 to achieve the effect of heat dissipation.

As can be seen from FIG. 1, the fastener 130 can be used to fix the relative positions between the first heat sink 110, the expansion card 200 and the second heat sink 120. In detail, the second heat sink 120 is stacked under the first heat sink 110, and is located between the first heat sink 110 and the buckle 130. The first heat sink 110 has a plurality of first recesses 115 that are recessed on the opposite first and second sides 110a and 110b of the first heat sink 110. These first notches 115 can be used to limit the length of the second heat sink 120 in length. The position in the direction (ie, the Y direction) relative to the first heat sink 110.

In detail, the second heat sink 120 has a heat sink bottom 121 and a first limiting portion 122 extending from the heat sink bottom 121. When the expansion card 200 is located between the first heat dissipating member 110 and the second heat dissipating member 120, and the first heat dissipating member 110, the expansion card 200, and the second heat dissipating member 120 are fixed together by the snap member 130, the The first limiting portion 122 extends into the first recess 115 of the first heat sink 110 to fix the relative positions of the first heat sink 110 and the second heat sink 120.

It should be noted that, in this embodiment, the number of the first recesses 115 of the first heat sink 110 and the first limiting portions 122 of the second heat sink 120 are set in four groups as an example. New creations are not limited to this. In other embodiments, the number of the first recesses 115 of the first heat sink 110 and the first limiting portion 122 of the second heat sink 120 may be set in one, two, three or five. More than.

It is worth mentioning that in this embodiment, the heat dissipating component 100 can be applied to the first expansion card 200A (shown in FIGS. 2 and 3) or the second expansion card 200B (shown in FIG. 4), of which the second The thickness of the expansion card 200B is smaller than the thickness of the first expansion card 200A. The first expansion card 200A is, for example, an expansion card with chips on both sides, and the second expansion card 200B is, for example, an expansion card with chips on one side, but the types of the first expansion card 200A and the second expansion card 200B are not limited to this. As long as the first expansion card 200A and the second expansion card 200B have different thicknesses. In other words, there may be a first distance S1 (labeled in FIG. 3) or a second distance S2 (labeled in FIG. 4) between the first heat sink 110 and the second heat sink 120, so that the heat dissipation of this embodiment The assembly 100 can be commonly used for expansion cards of different thicknesses. The heat dissipation assembly 100 will be described in detail below.

FIG. 3 is a schematic cross-sectional view of the heat dissipation component of FIG. 1 configured on the first expansion card 200A. In particular, Fig. 3 corresponds to the section line A-A 'of Fig. 1. Referring to FIG. 3, the first heat sink 110 further includes a first latching portion 111 on the first side 110a, a second latching portion 112 on the second side 110b, and one of the first and second sides 110a and 110b. The first inner surface 110s between the first and second heat sinks 110s faces the second inner heat sink 120s. In addition, the second heat sink 120 also has a second inner surface 120s, and the second inner surface 120s of the second heat sink 120 faces the first inner surface 110s of the first heat sink 110. The expansion card 200 is adapted to be disposed between the first inner surface 110s of the first heat sink 110 and the second inner surface 120s of the second heat sink 120.

In this embodiment, the snap member 130 is detachably assembled to the first heat sink 110, and can fix the first heat sink 110, the second heat sink 120, and be located between the first heat sink 110 and the second heat sink 120. Relative position of the first expansion card 200A. In detail, the fastening member 130 includes a bottom portion 131, two opposite side wall portions 132 extending from the bottom portion 131, and a third fastening portion 133 and a fourth fastening portion 134 extending from the two side wall portions 132 in a bent manner. In particular, the third locking portion 133 and the fourth locking portion 134 of the locking member 130 are slidably fastened to the first locking portion 111 and the second locking portion 112 of the first heat sink 110, respectively.

More specifically, as shown in FIG. 3, the heat dissipation assembly 100 is mounted on a first expansion card 200A. The first expansion card 200A includes a circuit board 210 and a plurality of chips 220 disposed on opposite sides of the circuit board 210. 220 is, for example, a Flash chip or a control chip, but the type of the chip 220 is not limited thereto. That is, the first expansion card 200A is an expansion card with a chip on both sides, for example, a double-sided SSD expansion card with an M.2 interface. When the heat dissipation assembly 100 is installed on the first expansion card 200A, the third buckling portion 133 and the fourth buckling portion 134 of the buckling member 130 are respectively fastened to the first buckling portion 111 and the first buckling portion 111 of the first heat sink 110. The two buckling portions 112 are arranged such that the first inner surface 110s of the first heat sink 110 and the second inner surface 120s of the second heat sink 120 are spaced apart by a first distance S1. In this embodiment, the thickness of the first expansion card 200A is close to the first pitch S1.

In particular, the first heat dissipating member 110 further includes a fifth latching portion 113 on the first side 110a and a sixth latching portion 114 on the second side 110b. The fifth latching portion 113 and the first inner portion The distance between the surfaces 110s is greater than the distance between the first fastening portion 111 and the first inner surface 110s, and the distance between the sixth fastening portion 114 and the first inner surface 110s is greater than the distance between the second fastening portion 112 and the first inner surface 110s. The third fastening portion 133 and the fourth fastening portion 134 of the fastening member 130 can be selectively fastened to the fifth fastening portion 113 and the sixth fastening portion 114 of the first heat sink 110, respectively.

In addition, as can be seen from FIG. 3, in this embodiment, the heat dissipating component 100 may further include a first heat dissipating pad 140 and a second heat dissipating pad 150. The first heat dissipation pad 140 is sandwiched between the first heat dissipation member 110 and the first expansion card 200A, and is in thermal contact with the first expansion card 200A and the first heat dissipation member 110, respectively. The second heat dissipation pad 150 is sandwiched between the second heat dissipation member 120 and the first expansion card 200A, and is in thermal contact with the first expansion card 200A and the second heat dissipation member 120, respectively.

In particular, because the first heat dissipation pad 140 and the second heat dissipation pad 150 are flexible, the first heat dissipation pad 140 and the second heat dissipation pad 150 can conform to the upper and lower contours of the first expansion card 200A. Therefore, a larger contact area can be provided between the first heat dissipation pad 140 and the first expansion card 200A and between the second heat dissipation pad 150 and the first expansion card 200A. Therefore, when the chips 220 of the first expansion card 200A are operating at high efficiency, the heat generated can be preferably conducted to the first heat dissipation member 110 and the first heat dissipation member 140 through the first heat dissipation pad 140 and the second heat dissipation pad 150, respectively. The two heat dissipating members 120 discharge the generated heat through the contact surfaces of the first and second heat dissipating members 110 and 120 with the air.

In addition, since the M.2 interface expansion card has various lengths, in this embodiment, the second heat sink 120 may further include a plurality of second limiting portions 123 that are bent and extended from both sides of the heat sink bottom 121. In particular, the second limiting portions 123 of the second heat sink 120 can be used to define an expansion card 200 with a smaller length (for example, the third expansion card 200C in FIG. 6) in the direction X with the second heat sink 120. Relative position relationship.

Specifically, when the expansion card 200 is located between the first heat dissipating member 110 and the second heat dissipating member 120, and the first heat dissipating member 110, the expansion card 200, and the second heat dissipating member 120 are fixed together by the clip 130, the expansion card The circuit board 210 of 200 is disposed between two second limiting portions 123 on opposite sides of the second heat sink 120, which can prevent the heat dissipation module 100 from being misaligned during the process of installing the expansion card 200. Interference with the buckle 130 can reduce the risk of damage to the expansion card 200. In this embodiment, the number of the second limiting portions 123 is two groups (ie, four) as an example, but the number of the second limiting portions 123 is not limited thereto.

Please refer to FIG. 2 and FIG. 3. The first heat sink 110 may further include a plurality of second notches 116 located on the first side 110 a and the second side 110 b. During the process of installing the heat sink 100, the buckle 130 The third buckling portion 133 and the fourth buckling portion 134 respectively extend into the corresponding set of second notches 116 to buckle to the first buckling portion 111 and the second buckling portion 112 of the first heat sink 110. . It should be noted that, in this embodiment, the number of groups of the third and fourth latching portions 133 and 134 of the latching member 130 and the number of the second notches 116 of the first heat sink 110 are set in three groups. For example, but this new creation is not limited to this. In other embodiments, the number of groups of the third and fourth locking portions 133 and 134 of the locking member 130 and the number of the second notches 116 of the first heat sink 110 may be one or two. Or more than four groups.

In addition, in this embodiment, the second notch 116 on the first side 110a is provided between the two first notches 115 on the first side 110a, and the second notch 116 on the second side 110b is provided at It is located between the two first notches 115 on the second side 110b, but the relative arrangement relationship of the plurality of first notches 115 and the plurality of second notches 116 is not limited thereto. In other embodiments, the first notch 115 located on the first side 110a may be disposed between two second notches 116 located on the first side 110a, and the first notch 115 located on the second side 110b may be provided. It is provided between two second notches 116 located on the second side 110b.

In this embodiment, the buckle 130 further includes at least one top portion 135 disposed on the bottom portion 131. When the first expansion card 200A is located between the first heat dissipating member 110 and the second heat dissipating member 120, and the first heat dissipating member 110, the first expansion card 200A, and the second heat dissipating member 120 are fixed together by the snap member 130, the buckle The abutting top portion 135 of the component 130 abuts against the heat dissipating bottom portion 121 of the second heat dissipating component 120. In this embodiment, the number of the abutting parts 135 against the top 135 is four, but the number of the abutting parts 135 is not limited thereto. In other embodiments, the number of the abutting parts 135 against the top 135 is not limited. The quantity can also be one, two, three, or more than five.

It is worth mentioning that because the circuit board and chip of the expansion card can have different thicknesses due to the difference in specifications, the thickness of different double-sided (single-sided) expansion cards has slightly different dimensions. Therefore, the abutting portion 135 of the buckle 130 has elasticity, which can increase the range of the thickness dimension of the double-sided (single-sided) expansion card applicable to the heat dissipation component 100.

FIG. 4 is a schematic cross-sectional view of the heat dissipation component of FIG. 1 configured on the second expansion card 200B. Please refer to FIG. 4. The main difference between FIG. 4 and FIG. 3 is that in FIG. 3, a first expansion card 200A having a relatively large thickness is disposed between the first heat dissipating member 110 and the second heat dissipating member 120. In FIG. 4, a second expansion card 200B with a smaller thickness is disposed between the first heat dissipating member 110 and the second heat dissipating member 120. In this embodiment, the second expansion card 200B includes a circuit board 210B and a plurality of chips 220B disposed on one side of the circuit board 210B. The chip 220B is, for example, a flash chip or a control chip, but the type of the chip 220B is not the same. For restrictions. That is, the second expansion card 200B is an expansion card with a chip on one side, for example, a single-sided SSD expansion card with an M.2 interface.

When the heat dissipation assembly 100 is installed on the second expansion card 200B, the third buckling portion 133 and the fourth buckling portion 134 of the buckling member 130 are fastened to the fifth buckling portion 113 and the first buckling portion 113 of the first heat sink 110, respectively. The six buckling portions 114 are arranged such that the first inner surface 110s of the first heat sink 110 and the second inner surface 120s of the second heat sink 120 are spaced apart by a second distance S2, and the second space S2 is smaller than the first space S1. In this embodiment, the thickness of the second expansion card 200B is close to the second pitch S2.

As can be seen from FIG. 3 and FIG. 4, the heat dissipating component 100 of this embodiment can be selectively fastened to the first heat dissipating member 110 respectively by the third and fourth fastening portions 133 and 134 of the fastening member 130. The first buckling portion 111 and the second buckling portion 112 are combined with one of the fifth buckling portion 113 and the sixth buckling portion 114 of the first heat sink 110, so that the first heat sink 110 and the second heat sink 120 is separated by a first pitch S1 or a second pitch S2. Therefore, in this embodiment, the heat dissipation component 100 can be applied to the expansion cards 200 having different thicknesses.

FIG. 5 is a schematic cross-sectional view of the heat dissipation component of FIG. 1 configured on the first expansion card 200A. In particular, Fig. 5 may correspond to the section line B-B 'of Fig. 1. Referring to FIG. 5, the first expansion card 200A equipped with the heat dissipation assembly 100 can be inserted into the connector 310 of the circuit board 300 and fixed to the circuit board 300. In this embodiment, the heat dissipation component 100 has a special design, so that the expansion card 200 can be fixed to the circuit board 300 after the heat dissipation component 100 is installed.

Please refer to FIG. 2 and FIG. 5 at the same time. The first expansion card 200A includes a fixing notch 211 recessed at an edge, a first heat dissipation member 110, a second heat dissipation member 120, a buckle member 130, a first heat dissipation pad 140, and a second heat dissipation member. The cushion 150 includes at least one first through hole 118, at least one second through hole 128, at least one third through hole 138, at least one fourth through hole 148, and at least one fifth through hole 158 corresponding to the fixing gap 211, respectively. A fixing member 350 is adapted to pass through the first through hole 118, the fourth through hole 148, the fixing gap 211, the fifth through hole 158, the second through hole 128, and the third through hole 138 and be fixed to the circuit board 300.的 孔 孔 300a。 The fixing hole 300a. In this embodiment, the fixing member 350 is, for example, a screw, but the type of the fixing member 350 is not limited thereto.

In addition, in this embodiment, the first through hole 118, the second through hole 128, and the third through hole 138 may be circular through holes or semi-circular through holes, and the first through holes 118 and the second through holes The number of 128 and the third through holes 138 is four as an example, but the shapes and number of the first through holes 118, the second through holes 128, and the third through holes 138 are not limited to the above, as long as the fixing members can be made 350 passes.

Since the M.2 interface expansion card has various lengths, the first heat dissipation member 110, the second heat dissipation member 120, the buckle member 130, the first heat dissipation pad 140, and the fifth heat dissipation pad 150 are being expanded in this embodiment. The card 200 has a plurality of first through holes 118, a plurality of second through holes 128, a plurality of third through holes 138, a plurality of fourth through holes 148, and The plurality of fifth through holes 158 are suitable for M.2 interface expansion cards with different lengths, so that the expansion card with the heat dissipation component 100 can still be fixed to the circuit board 300 quite conveniently. FIG. 6 is a schematic cross-sectional view of the heat dissipation component of FIG. 1 configured on the third expansion card 200C. As can be seen from FIG. 6, the length of the third expansion card 200C is smaller than that of the first expansion card 200A, but the third expansion card 200C and the heat dissipation component 100 can still be fixed to the circuit board 300 by the fixing member 350.

In particular, in this embodiment, the abutting portions 135 of the latching members 130 are disposed between the lines of the plurality of third through holes 138 and the side wall portions 132; that is, the abutting portions of the latching members 130 The top portion 135 is staggered from the connecting lines of the plurality of third through holes 138. In this way, during the process of installing the heat dissipating component 100, the abutting portion 135 of the buckle 130 can be prevented from protruding into the second through hole 128 of the second heat dissipating member 120 and the fifth through hole 158 of the second heat dissipating pad 150. As a result, the expansion card 200 is damaged.

In order to more clearly show the relative configuration relationship of the components of the heat dissipation assembly 100 in this embodiment, the following describes the process of installing the first expansion card 200A in the heat dissipation assembly 100 by way of example. FIG. 7A to FIG. 7D are assembling flowcharts of disposing the heat dissipation component of FIG. 1 on the expansion card 200.

Referring to FIG. 7A, first, a first expansion card 200A is arranged between the first heat sink 110 and the second heat sink 120, and the two sets of first notches 115 of the first heat sink 110 are aligned with the second heat sink The two sets of first limiting portions 122 of 120 perform the first-stage pairing (in the direction Z). During the first-stage alignment process, the first limiting portion 122 of the second heat sink 120 extends into the first recess 115 of the first heat sink 110. Of course, in this embodiment, a first heat dissipation pad 140 (shown in FIG. 3) may be selectively disposed between the first expansion card 200A and the first heat dissipation member 110, and the first expansion card 200A and the second heat dissipation device may be selectively disposed. A second heat dissipation pad 150 can be selectively disposed between the pieces 120.

In particular, the second heat sink 120 may further include a third limiting portion 124. During the process in which the first expansion card 200A is installed between the first heat sink 110 and the second heat sink 120, the first expansion card 200A is installed. The circuit board 210 of the expansion card 200A abuts on the side 210 a of the extension card 200A away from the pin 212 against the third position 124 of the second heat sink 120 (please also refer to FIG. 7B). In this way, during the process of inserting the first expansion card 200A equipped with the heat dissipation assembly 100 into the connector 310 (shown in FIG. 5) of the motherboard 300, the first expansion card 200A can be prevented from acting on the connector 310. The feedback and heat dissipation component 100 is misaligned and the first expansion card 200A (or the thermal pad) is damaged. In this embodiment, the number of the third limiting portions 124 is two, but the number of the third limiting portions 124 is not limited thereto.

Please refer to FIG. 7B. Next, the three sets of the third locking portions 133 and the fourth locking portions 134 of the locking member 130 are respectively aligned with the three sets of the second notches 116 of the first heat sink 110 to perform the second stage alignment. Group (in direction Z). During the second stage of the grouping process, the third buckling portion 133 and the fourth buckling portion 134 of the buckling member 130 respectively extend into the corresponding second recesses 116 of the first heat sink 110.

Please refer to FIG. 7C. Next, the fastener 130 is moved in the direction Y, so that the third fastener portion 133 (shown in FIG. 7B) and the fourth fastener portion 134 of the fastener 130 are slid into the first heat sink, respectively. Between the first buckling portion 111 and the fifth buckling portion 113 of the element 110 and between the second buckling portion 112 and the sixth buckling portion 114 of the first heat sink 110 to be fastened to the first heat sink 110 The first buckling portion 111 and the second buckling portion 112.

It is worth mentioning that from FIG. 7D, when the first heat sink 110, the first expansion card 200A, and the second heat sink 120 are fixed together by the buckle 130, the third buckle portion 133 of the buckle 130 ( 7B) and the fourth buckling portion 134 abut against a set of the first limiting portions 122 of the second heat sink 120, respectively. In other words, the first limiting portion 122 of the second heat sink 120 can also fix the relative position of the buckling member 130 and the first heat sink 110.

To sum up, the first and second heat sinks of the heat sink assembly of the present invention are suitable for being disposed on both sides of the expansion card. The first and second heat sinks can effectively reduce the operating temperature of the expansion card, and further Enhance the operating efficiency of expansion cards. In addition, in the novel creation, the second heat sink is located between the first heat sink and the buckle, and the third buckle portion and the fourth buckle portion of the buckle are slidably fastened to the first heat sink, respectively. The first buckling part and the second buckling part are fixed on the two sides of the expansion card. In addition, the heat dissipating component extends into the first recess of the first heat dissipating member through the first limiting portion of the second heat dissipating member, which can prevent the first heat dissipating member, the expansion card, and the second heat dissipating member from sliding to the snap member. Dislocation occurs during the process to effectively reduce the risk of damage to the expansion card.

Although this new type of creation has been disclosed in the above examples, it is not intended to limit the new type of creation. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of this new type of creation. Retouching, so the protection scope of this new type of creation shall be determined by the scope of the attached patent application.

100‧‧‧ Thermal Assembly

110‧‧‧The first heat sink

110a‧‧‧first side

110b‧‧‧second side

110s‧‧‧first inside

111‧‧‧First buckle section

112‧‧‧Second buckle section

113‧‧‧Fifth buckle section

114‧‧‧The sixth buckle section

115‧‧‧first notch

116‧‧‧Second notch

118‧‧‧The first through hole

120‧‧‧Second heat sink

120s‧‧‧ the second inside

121‧‧‧ Thermal bottom

122‧‧‧First limit department

123‧‧‧Second Limiting Department

124‧‧‧The third limit department

128‧‧‧second through hole

130‧‧‧Snap fastener

131‧‧‧ bottom

132‧‧‧ sidewall

133‧‧‧The third buckle section

134‧‧‧Fourth buckle section

135‧‧‧ arrived at the top

138‧‧‧Third through hole

140‧‧‧The first thermal pad

148‧‧‧Fourth through hole

150‧‧‧second thermal pad

158‧‧‧Fifth through hole

200, 200A ~ 200C‧‧‧Expansion card

210, 300‧‧‧ circuit board

210a‧‧‧side

211‧‧‧Fixed gap

212‧‧‧pin

220‧‧‧Chip

300a‧‧‧Fixing hole

310‧‧‧Connector

350‧‧‧Fixed parts

S1‧‧‧First distance

S2‧‧‧Second Distance

X, Y, Z‧‧‧ directions

A-A ’, B-B’‧‧‧ hatching

FIG. 1 is a schematic top view of a heat dissipation component according to an embodiment of the novel creation. FIG. 2 is an exploded view of the heat dissipation component in FIG. 1. FIG. 3 is a schematic cross-sectional view of the heat dissipation component in FIG. 1 configured on the first expansion card. FIG. 4 is a schematic cross-sectional view of the heat dissipating component in FIG. 1 configured on the second expansion card. FIG. 5 is a schematic cross-sectional view of the heat dissipation component in FIG. 1 configured on the first expansion card. FIG. 6 is a schematic cross-sectional view of the heat dissipation component in FIG. 1 configured on a third expansion card. FIG. 7A to FIG. 7D are assembling flowcharts of disposing the heat dissipation component in FIG. 1 on the expansion card.

Claims (12)

A heat dissipating component is suitable for a first expansion card. The heat dissipating component includes: a first heat dissipating member having a first inner surface and a first side and a second side opposite to the first inner surface, and the The first heat sink includes a first buckle portion on the first side, a first notch on the first side, and a second buckle portion on the second side; a second heat sink, a stack The first heat sink is placed under the first heat sink, and the first inner surface of the first heat sink faces the second heat sink. The second heat sink includes a heat sink bottom and a first heat sink extending from the heat sink bottom. A limiting portion, the first limiting portion of the second heat sink extends into the first notch of the first heat sink, and the first expansion card is adapted to be disposed between the first heat sink and the second heat sink Between the first heat sink and the second heat sink, the second heat sink is located between the first heat sink and the second buckle, and the first heat sink is detachably fixed by the second buckle, and the second buckle includes a first Three buckle portions and a fourth buckle portion, wherein the third buckle portion and the fourth buckle portion of the buckle are slidably buckled, respectively The first heat-dissipating element and the second heat-dissipating element are combined on the first heat-dissipating element, so that the first heat-dissipating element and the second heat-dissipating element are separated by a first distance. The heat dissipating component according to item 1 of the patent application scope, wherein the buckle further includes a bottom and an abutting top disposed on the bottom. When the first expansion card is located on the first heat dissipating member and the second heat dissipating member Between, and when the first heat sink and the second heat sink are fixed together by the buckle, the abutting top of the buckle abuts against the heat sink bottom of the second heat sink. The heat dissipation assembly according to item 1 of the scope of patent application, wherein when the first expansion card is located between the first heat sink and the second heat sink, and the first heat sink and the second heat sink are jointly When the fastening member is fixed, the third fastening portion of the fastening member abuts against the first limiting portion of the second heat sink. The heat dissipation assembly according to item 1 of the scope of patent application, wherein the first heat dissipation member further includes a second notch on the first side and a third notch on the second side, and the snap member The third buckling portion and the fourth buckling portion are adapted to extend into the second notch and the third notch. The heat dissipation component according to item 1 of the patent application scope, wherein the first heat dissipation member further includes a second notch located on the second side, and the second heat dissipation member further includes a bend extending from the bottom of the heat sink and oppositely. A second limiting portion is located at the first limiting portion, and the second limiting portion of the second heat sink extends into the first notch of the first heat sink. The heat dissipation assembly according to item 1 of the scope of patent application, wherein the second heat dissipation member further includes a second limiting portion bent and extending from the bottom of the heat dissipation. When the first expansion card is located between the first heat dissipation member and the first heat dissipation member, When the second heat sink is fixed between the first heat sink and the second heat sink by the fastening member, one side of the first expansion card abuts against the second limit of the second heat sink. Bit Department. The heat dissipating component according to item 1 of the scope of patent application, wherein the fastening member further includes a bottom portion and two side wall portions extending from opposite sides of the bottom portion, the third fastening portion and the fourth fastening portion, respectively Bently extending from the two side wall portions. The heat dissipating component according to item 1 of the scope of patent application, wherein the first heat dissipating member further includes a fifth latching portion on the first side and a sixth latching portion on the second side. The distance between the buckle portion and the first inner surface is greater than the distance between the first buckle portion and the first inner surface, and the distance between the sixth buckle portion and the first inner surface is greater than the distance between the second buckle portion and the first inner surface. The first inside distance. The heat dissipating component according to item 8 of the scope of the patent application, wherein the heat dissipating component is suitable for a second expansion card, and the thickness of the second expansion card is smaller than the thickness of the first expansion card. When a heat sink is between the second heat sink and the third buckle and the fourth buckle of the buckle, the third buckle and the fourth buckle can be selectively fastened to the fifth buckle and the sixth card, respectively. The buckling portion is such that the first heat sink is spaced a second distance from the second heat sink, and the second space is smaller than the first space. The heat dissipation assembly according to item 1 of the scope of patent application, wherein the first expansion card includes a fixing notch recessed at an edge, and the first heat dissipation member, the second heat dissipation member, and the buckle member respectively correspond to the fixing member. A first through hole, a second through hole and a third through hole, and a fixing member is adapted to pass through the first through hole, the fixed notch, the second through hole and the third through hole and Fixed to a circuit board. The heat dissipation component according to item 10 of the scope of patent application, wherein the first through hole, the second through hole and the third through hole are circular through holes or semi-circular through holes. The heat dissipation component according to item 1 of the scope of patent application, further comprising: a first heat dissipation pad disposed between the first heat dissipation member and the second heat dissipation member; and a second heat dissipation pad disposed on the A first heat dissipation pad and the second heat dissipation member, and the first expansion card is adapted to be disposed between the first heat dissipation pad and the second heat dissipation pad.