TWM565468U - Heat dissipation assembly - Google Patents

Abstract

A heat dissipation assembly includes a first heat sink, a second heat sink and at least one hook. The first heat sink includes a first fastening part, a second fastening part and a third fastening part. Each of the hooks includes a fourth fastening part and a fifth fastening part. Each hook is used for removably fastening the first heat sink, the second heat sink and a first expansion card or a second expansion card located between the first heat sink and the second heat sink together, wherein a thickness of the first expansion card is smaller than a thickness of the second expansion card. The first fastening part and one of the fourth fastening part and the fifth fastening part are fastened together while the rest of the fourth fastening part and the fifth fastening part and one of the second fastening part and the third fastening part are fastened together.

Description

Cooling components

This novel creation relates to a heat dissipation component, and in particular to a heat dissipation component commonly used for expansion cards with chips on one side or both sides.

The development of solid state drives (Solid State Drive, SSD) in recent years due to breakthroughs in related technical limitations has gradually reduced the production cost of solid state drives, and its access speed, tolerance and portability are all better than traditional disks Hard disk drives (Hard Disk Drive, HDD) have advantages, so applications in information hardware are becoming more and more popular. In addition, the transmission interfaces of solid-state hard drives and information hardware cores have gradually shifted from the mSATA standard to the M.2 standard. Because M.2 has a more diversely designed connection interface, it allows expansion cards to have different widths and lengths. Allow expansion cards to carry more chips. As a result, the visibility of motherboards with M.2 connectors on the market has gradually increased. For example, desktop motherboards, notebook computers, or tablet PC motherboards can be connected to SSD expansion cards through M.2 connectors.

However, the SSD expansion card generates more heat during high-efficiency operation. Therefore, a heat dissipation mechanism (such as disposing a heat dissipation component on the SSD expansion card) is required to reduce its own temperature to avoid a reduction in processing performance. However, due to the difference in storage capacity or design of the SSD expansion card, the flash memory may be arranged on one or both sides of the SSD expansion card, so that the SSD expansion card has different thicknesses. Different thickness SSD expansion cards use different heat dissipation components, and have higher mold costs.

The novel creation provides a heat dissipation component, which is compatible with expansion cards with chips on one side or both sides, and the structure of double-sided heat dissipation can effectively reduce the temperature of the expansion card during efficient operation.

The heat dissipation component created by the novel is suitable for a first expansion card and a second expansion card, wherein the thickness of the first expansion card is smaller than the thickness of the second expansion card. The heat dissipation component includes a first heat dissipation component, a second heat dissipation component, and at least one fastener. The first heat dissipation element has a first inner surface, a first side and a second side respectively connected to the first inner surface and opposite to each other. The first heat dissipation element includes a first locking portion located on the first side A second locking portion and a third locking portion on both sides, wherein the distance between the second locking portion and the first inner surface is greater than the distance between the third locking portion and the first inner surface. The second heat dissipation element is stacked under the first heat dissipation element and the first inner surface of the first heat dissipation element faces the second heat dissipation element. The first expansion card or the second expansion card is suitable for being disposed on the first heat dissipation element and the second heat dissipation element Between pieces. Each fastener can detachably fix the first heat sink, the second heat sink, and the first expansion card or the second expansion card between the first heat sink and the second heat sink. Each buckle includes a bottom, two arms extending from opposite sides of the bottom, a fourth buckling extending from the two arms, and a fifth buckling. One of the fourth buckle portion and the fifth buckle portion of each buckle can be selectively buckled to the first buckle portion, and the other of the fourth buckle portion and the fifth buckle portion can be selected It is snap-fitted to one of the second buckling portion and the third buckling portion, so that the first heat dissipation element and the second heat dissipation element are separated by a first distance or a second distance.

In an embodiment of the present invention, when the first expansion card applicable to the above heat dissipation component is located between the first heat dissipation component and the second heat dissipation component and is jointly fixed by each fastener component, each fastener component The fourth locking portion and the fifth locking portion are respectively engaged with the first locking portion and the second locking portion of the first heat sink. When the applicable second expansion card is located between the first heat dissipation element and the second heat dissipation element and is jointly fixed by each fastening element, the fourth fastening portion and the fifth fastening portion of each fastening element are respectively The third buckle portion and the first buckle portion that are engaged with the first heat sink.

In an embodiment of the present invention, the distance between the first locking portion and the first inner surface of the first heat dissipating member of the heat dissipation assembly is greater than the distance between the third locking portion and the first inner surface, and smaller than the second The distance between the snap portion and the first inner surface.

In an embodiment of the invention, the distance between the fourth buckle portion and the bottom of each buckle of the heat dissipation assembly is smaller than the distance between the fifth buckle portion and the bottom.

In an embodiment of the present invention, the first expansion card applicable to the above heat dissipation component includes a fixed notch recessed at the edge, and the first heat dissipation element and the second heat dissipation element respectively include a first channel corresponding to the fixed notch And a second through hole, and a fixing member is adapted to pass through the first through hole, the fixing notch and the second through hole and be fixed to a circuit board.

In an embodiment of the present invention, the first through hole of the first heat dissipation component of the heat dissipation component is a circular through hole or a semi-circular through hole, and the second through hole of the second heat dissipation component is circular Through holes or semi-circular through holes.

In an embodiment of the present invention, the second heat dissipating member of the heat dissipating component has a third side and a fourth side opposite to it, and two notches formed at corresponding positions on the third side and the fourth side, and The two arms of each fastener extend into two notches.

In an embodiment of the present invention, the first expansion card applicable to the above heat dissipation component includes a fixed notch recessed at the edge, and the second heat dissipation element includes a second through hole corresponding to the fixed notch, the second through hole Stagger the connection between the two notches.

In an embodiment of the present invention, each buckle of the heat dissipation assembly includes an extended handle extending from the fourth buckle.

In an embodiment of the invention, the above heat dissipation component further includes a first heat dissipation cushion and a second heat dissipation cushion. The first heat dissipation cushion is disposed between the first heat dissipation element and the second heat dissipation element. The second heat dissipation cushion is disposed between the first heat dissipation cushion and the second heat dissipation member, and the first expansion card or the second expansion card is suitable to be disposed between the first heat dissipation cushion and the second heat dissipation cushion.

Based on the above, the expansion card is suitable for being disposed between the first heat dissipation component and the second heat dissipation component of the heat dissipation component created by the present invention, and the fourth and fifth fastening portions of the fastening component of the heat dissipation component can be selectively locked The first locking portion of the first heat dissipation member is locked to the second locking portion or the third locking portion of the first heat dissipation member. Since the distance between the second locking portion of the first heat dissipating member and the first inner surface is greater than the distance between the third locking portion of the first heat dissipating member and the first inner surface, the locking members are in different locking positions Next, the distance between the first heat dissipation element and the second heat dissipation element is different, and is suitable for installation on expansion cards of different thicknesses (such as expansion cards with chips on one side or both sides). In addition, the expansion card can simultaneously remove the heat energy generated during operation through the first heat dissipation element and the second heat dissipation element, especially when the expansion card is in high-efficiency operation, it can significantly reduce the operating temperature of the expansion card, thereby enhancing its operating performance .

In order to make the above-mentioned features and advantages of the creation of the new model more obvious and understandable, the embodiments are specifically described below and described in detail in conjunction with the accompanying drawings.

FIG. 1 is a schematic top view of a heat dissipation assembly according to an embodiment of the novel creation. FIG. 2 is an exploded schematic view of the heat dissipation component in FIG. 1. Please refer to FIGS. 1 and 2. In this embodiment, the heat dissipation assembly 100 includes a first heat dissipation element 110, a second heat dissipation element 120, and at least one fastener 160. In this embodiment, the first heat dissipation element 110 and the second heat dissipation element 120 can be installed on the upper and lower sides of the expansion card, so that the expansion card located between the first heat dissipation element 110 and the second heat dissipation element 120 is thermally coupled to the first A heat sink 110 and a second heat sink 120. In this way, the heat generated by the expansion card during operation can be transferred to the first heat sink 110 and the second heat sink 120 to achieve heat dissipation.

As can be seen from FIG. 1, the buckle 160 can be used to fix the relative positions between the first heat sink 110, the expansion card, and the second heat sink 120. In this embodiment, the number of the fasteners 160 is two as an example, but in other embodiments, the number of the fasteners 160 may be only one or more than three, and the number of the fasteners 160 is not This is a limitation.

In addition, in this embodiment, the second heat dissipation member 120 of the heat dissipation assembly 100 has a plurality of pairs of notches 125 that are recessed on opposite sides of the second heat dissipation member 120. These notches 125 can be used to define the configuration of the fastener 160 position. In this embodiment, the second heat dissipation member 120 has four pairs of notches 125, and each fastener 160 can extend into one of the notches 125. Of course, the logarithm and relative position of the notch 125 of the second heat sink 120 are not limited thereto.

It is worth mentioning that, in this embodiment, the heat dissipation assembly 100 can be applied to a first expansion card 10 (labeled in FIG. 4) or a second expansion card 20 (labeled in FIGS. 1 and 3), in which the first The thickness of the expansion card 10 is smaller than the thickness of the second expansion card 20. The first expansion card 10 is, for example, a single-sided expansion card, and the second expansion card 20 is, for example, a double-sided expansion card, but the types of the first expansion card 10 and the second expansion card 20 are not limited thereto, as long as the first expansion card 10 It suffices to have a thickness difference from the second expansion card 20. In other words, there may be a first distance S1 (marked in FIG. 4) or a second distance S2 (marked in FIG. 3) between the first heat sink 110 and the second heat sink 120, making the present embodiment The heat dissipation component 100 can be commonly used for expansion cards with different thicknesses. The heat dissipation assembly 100 will be described in detail below.

Fig. 3 is a schematic cross-sectional view of the heat dissipation assembly in Fig. 1 on a plane including section line A-A 'and parallel to X and Z axes. Please refer to FIG. 3. In this embodiment, the first heat sink 110 has a first inner surface 111, a first side 112 and a second side 113 that are respectively connected to the first inner surface 111 and opposite to each other. The first heat dissipation member 110 includes a first buckling portion 114 on the first side 112, a second buckling portion 115 and a third buckling portion 116 on the second side 113 and arranged up and down. In this embodiment, the distance L2 between the second latching portion 115 and the first inner surface 111 is greater than the distance L1 between the first latching portion 114 and the first inner surface 111, and the third latching portion 116 is The distance L3 between the first inner surface 111 is smaller than the distance L1 between the first hook portion 114 and the first inner surface 111. More specifically, in one embodiment, the distances L1, L2, L3 satisfy the following relationship: 2.8 <L2 / L3 <3.2 or / and 1.8 <L1 / L3 <2.2.

In addition, in this embodiment, the second heat sink 120 has a second inner surface 121, a third side 122 and a fourth side 123 respectively connected to the second inner surface 121 and opposite to each other. The second heat dissipation member 120 is stacked under the first heat dissipation member 110 and the first inner surface 111 of the first heat dissipation member 110 faces the second heat dissipation member 120. The expansion card is suitable for being disposed on the first inner surface of the first heat dissipation member 110 111 and the second inner surface 121 of the second heat sink 120.

In this embodiment, the buckle 160 is detachably assembled to the first heat dissipation member 110, and can fix the first heat dissipation member 110, the second heat dissipation member 120, and the first heat dissipation member 110 and the second heat dissipation member 120. The relative position of the second expansion card 20 in between. Each buckle 160 includes a bottom 161, two arm portions 164 extending from opposite sides of the bottom 161, a fourth buckling portion 162 extending from the two arms 164, and a fifth buckle Part 163, an extended handle 1621 extending from the fourth catching part 162. The extended handle 1621 can be used for the user to grip to facilitate disassembly and assembly of the fastener 160.

In this embodiment, the distance L4 between the fourth buckling portion 162 of the buckle 160 and the bottom 161 is smaller than the distance L5 between the fifth buckling portion 163 of the buckle 160 and the bottom 161. One of the fourth buckling portion 162 and the fifth buckling portion 163 of the buckling member 160 can be selectively buckled to the first buckling portion 114 of the first heat sink 110, and the fourth buckling portion 162 and the first The other of the five locking portions 163 can be selectively locked to one of the second locking portion 115 and the third locking portion 116 of the first heat sink 110.

More specifically, as shown in FIG. 3, the heat dissipation assembly 100 is installed on the second expansion card 20. The second expansion card 20 includes a circuit board 22 and a plurality of chips 21 disposed on opposite sides of the circuit board 22, in other words The second expansion card 20 is an expansion card with a double-sided chip, for example, a double-sided SSD expansion card with an M.2 interface. When the heat dissipation assembly 100 is installed on the second expansion card 20 with a larger thickness, the fifth hook portion 163 of the hook 160 is locked to the first hook portion 114 of the first heat sink 110, The fourth buckling portion 162 is buckled to the third buckling portion 116 of the first heat sink 110 so that the first heat sink 110 and the second heat sink 120 are separated by a second distance S2. In the embodiment, the second distance S2 is, for example, the thickness of the double-sided expansion card, for example, between 2.8 mm and 3.88 mm.

In addition, as can be seen from FIG. 3, in this embodiment, the heat dissipation assembly 100 may further include a first heat dissipation cushion 130 and a second heat dissipation cushion 140. The first heat dissipation cushion 130 is interposed between the first heat dissipation element 110 and the second expansion card 20 and is in thermal contact with the second expansion card 20 and the first heat dissipation element 110, respectively. The second heat dissipation cushion 140 is interposed between the second heat dissipation element 120 and the second expansion card 20 and is in thermal contact with the second expansion card 20 and the second heat dissipation element 120 respectively. Since the first heat dissipation cushion 130 and the second heat dissipation cushion 140 are flexible, the first heat dissipation cushion 130 and the second heat dissipation cushion 140 can conform to the top and bottom contours of the second expansion card 20, making the first heat dissipation soft There may be a larger contact area between the pad 130 and the second expansion card 20 and between the second thermal pad 140 and the second expansion card 20. Therefore, when the chips 21 of the second expansion card 20 operate at high efficiency, the generated heat can be better conducted to the first heat dissipating member 110 and the first heat dissipating pad 130 and the second heat dissipating pad 140, respectively. The second heat dissipation member 120 discharges the generated heat through the contact surface of the first heat dissipation member 110 and the second heat dissipation member 120 with the air.

FIG. 4 is a schematic cross-sectional view of the heat dissipation assembly of FIG. 1 configured on another expansion card. Please refer to FIG. 4. The main difference between FIG. 4 and FIG. 3 is that in FIG. 3, the second expansion card 20 with a larger thickness is disposed between the first heat sink 110 and the second heat sink 120. In FIG. 4, the first expansion card 10 with a smaller thickness is disposed between the first heat sink 110 and the second heat sink 120. In this embodiment, the first expansion card 10 includes a circuit board 12 and a plurality of chips 11 disposed only on one side of the circuit board 12, in other words, the first expansion card 10 is an expansion card with a single-sided chip, for example: Single-sided SSD expansion card with M.2 interface.

When the heat dissipation component 100 is to be disposed on the first expansion card 10 with a small thickness, the fourth fastening portion 162 of the fastening component 160 of the heat dissipation component 100 can be fastened to the first fastening component of the first heat dissipation component 110 114, and the fifth buckling portion 163 of the buckling member 160 can be buckled to the second buckling portion 115 of the first heat sink 110, so that the first heat sink 110 and the second heat sink 120 are separated by a first distance S1 . In this embodiment, the thickness of the first expansion card 10 is close to the first distance S1.

It should be noted that the manner in which the locking member 160 is fixed to the first heat dissipating member 110 is not limited to the above. In another embodiment, when the fifth locking portion 163 of the locking member 160 is locked to the first heat dissipation When the first buckling portion 114 of the component 110, the fourth buckling portion 162 of the buckling component 160 can also be buckled to the second buckling portion 115 of the first heat dissipating component 110, so that the first heat dissipating component 110 and the second The heat dissipating members 120 can provide other sizes of spacing.

As can be seen from FIGS. 3 and 4, the heat dissipation assembly 100 of this embodiment can be selectively locked to the first heat dissipation member by one of the fourth buckling portion 162 and the fifth buckling portion 163 of the buckling member 160 The other of the first buckling portion 114, the fourth buckling portion 162 and the fifth buckling portion 163 can be selectively buckled to one of the second buckling portion 115 and the third buckling portion 116, The first heat sink 110 and the second heat sink 120 are separated by a first distance S1 or a second distance S2. Therefore, in this embodiment, the heat dissipation assembly 100 can be applied to the first expansion card 10 or the second expansion card 20 with different thicknesses.

Fig. 5 is a schematic cross-sectional view of the heat dissipation assembly in Fig. 1 on a plane including the cross-sectional line B-B 'and parallel to the Y and Z axes. Referring to FIG. 5, the first expansion card 10 (labeled in FIG. 4) or the second expansion card 20 is inserted into the connector 310 of the circuit board 300 and fixed to the circuit board 300. In this embodiment, the heat dissipation component 100 has a special design, so that the first expansion card 10 or the second expansion card 20 can still be fixed to the circuit board 300 after the heat dissipation component 100 is installed.

2 and FIG. 5, the second expansion card 20 includes a fixed notch 28 recessed in the edge. In this embodiment, the first heat dissipation member 110, the second heat dissipation member 120, the first heat dissipation cushion 130 and the second The heat dissipation cushion 140 includes at least one first through hole 118, at least one second through hole 128, at least one third through hole 138, and at least one fourth through hole 148 corresponding to the fixing notch 28, respectively, and a fixing member 70 is suitable for The first through hole 118, the fixing notch 28 and the second through hole 128 are passed through and fixed to a fixing hole on a circuit board 300. In this embodiment, the fixing member 70 is, for example, a screw, but the type of the fixing member 70 is not limited thereto.

In addition, in this embodiment, the second through holes 128 of the second heat dissipation member 120 of the heat dissipation assembly 100 are staggered from the connection line of the two recesses 125, so that the second heat dissipation member 120 has better structural strength. Of course, the relationship between the second through hole 128 and the recess 125 is not limited thereto. In addition, the first through holes 118 may be round holes or semi-circular holes, and the second through holes 128 may be round holes or semi-circular holes. The shapes of the first through holes 118 and the second through holes 128 are not limited to the above. As long as the fixing member 70 can be passed through.

Since the expansion card with the M.2 interface has various lengths, in this embodiment, the first heat dissipation member 110, the second heat dissipation member 120, the first heat dissipation cushion 130, and the second heat dissipation cushion 140 are in the extension direction of the expansion card (Y Different positions in the axial direction) have a plurality of first through holes 118, a plurality of second through holes 128, a plurality of third through holes 138 and a plurality of fourth through holes 148 corresponding to each other, so as to be suitable for different lengths The size of the M.2 interface expansion card allows the expansion card installed with the heat dissipation component 100 to be easily fixed to the circuit board 300. FIG. 6 is a schematic cross-sectional view of a heat dissipation assembly according to another embodiment of the new creation. Referring to FIG. 6, in this embodiment, the heat dissipation assembly 100 is installed on the second expansion card 20 'having a shorter length. The second expansion card 20 'together with the heat dissipation assembly 100 can still be fixed to the circuit board 300 by the fixing member 70.

It is worth mentioning that, in this embodiment, the expansion card can have a good heat dissipation effect after the heat dissipation component 100 is configured. 7 is a schematic top view of a first expansion card to which the heat dissipation component in FIG. 4 is applied. FIG. 8 is a schematic side view of the first expansion card in FIG. 7. 9 is a schematic bottom view of the first expansion card in FIG. 7. Please refer to FIG. 7 to FIG. 9, when the first expansion card 10 equipped with the heat dissipation assembly 100 is actually measured, the P1 position directly above the chip 11 of the first expansion card 10, the P2 position on the side of the chip 11 and the chip The P4 position on the other side of the 11 and the P3 position corresponding to the P1 position on the side of the circuit board 12 where the wafer 11 is not provided are: 62.9 degrees, 63.9 degrees, 58.2 degrees, and 63.8 degrees, respectively. If the first expansion card 10 is equipped with other heat sinks only on one side, the temperatures at the positions of P1, P2, P3, and P4 are: 66.4 degrees, 71.8 degrees, 66 degrees, and 75.3 degrees. The first expansion card 10 is provided with a first heat dissipation element 110 and a second heat dissipation element 120 on the upper and lower sides, and the heat dissipation component 100 clamped by the buckling element 160 obviously has better heat dissipation effect.

In summary, in the heat dissipation assembly created by the present invention, the fourth buckle portion and the fifth buckle portion of the buckle can be selectively buckled to the first buckle portion of the first heat sink, and the other buckle The second buckling portion or the third buckling portion that is joined to the first heat dissipating member, because the distance between the second buckling portion and the first inner surface is greater than the distance between the third buckling portion and the first inner surface, At different fastening positions, the distance between the first heat dissipation element and the second heat dissipation element is different, and it is suitable for installation on expansion cards of different thicknesses (such as expansion cards with chips on one side or both sides) . In addition, the expansion card can simultaneously remove the heat energy generated during operation through the first heat dissipation element and the second heat dissipation element, especially when the expansion card is in high-efficiency operation, it can significantly reduce the operating temperature of the expansion card, thereby enhancing its operating performance . In addition, in an embodiment, the first heat dissipation element and the second heat dissipation element of the heat dissipation component have a plurality of corresponding first through holes and second through holes, and the arrangement of the first through holes and the second through holes The positions correspond to the fixing gaps of expansion cards of various sizes. Therefore, the expansion card equipped with the heat dissipation component can still be easily fixed to the circuit board.

Although the new creation has been disclosed as above with examples, it is not intended to limit the creation of the new creation. Anyone with ordinary knowledge in the technical field of the subject can make some changes and without departing from the spirit and scope of the creation of the new creation. Retouching, so the scope of protection of this new creation shall be subject to the scope defined in the appended patent application.

10‧‧‧First expansion card
11.21‧‧‧chip
12, 22, 300 ‧‧‧ circuit board
20, 20'‧‧‧Second expansion card
28‧‧‧Fixed gap
70‧‧‧Fixed parts
100‧‧‧Cooling components
110‧‧‧The first heat sink
111‧‧‧First inner face
112‧‧‧First side
113‧‧‧Second side
114‧‧‧The first snap part
115‧‧‧Second snap part
116‧‧‧The third snap part
118‧‧‧First through hole
120‧‧‧second heat sink
121‧‧‧Second inner face
122‧‧‧The third side
123‧‧‧The fourth side
125‧‧‧Notch
128‧‧‧The second through hole
130‧‧‧The first thermal pad
138‧‧‧th through hole
140‧‧‧Second cooling pad
148‧‧‧The fourth through hole
160‧‧‧Snap fastener
161‧‧‧Bottom
162‧‧‧The fourth snap part
163‧‧‧The fifth snap part
164‧‧‧ Arms
310‧‧‧Connector
1621‧‧‧handle
A-A ', B-B' ‧‧‧ section line
L1, L2, L3, L4, L5 ‧‧‧ distance
P1, P2, P3, P4 ‧‧‧ position
X, Y, Z‧‧‧ axis
S1‧‧‧ First distance
S2‧‧‧Second distance

FIG. 1 is a schematic diagram of a heat dissipation assembly according to an embodiment of the present invention. FIG. 2 is an exploded schematic view of the heat dissipation component in FIG. 1. Fig. 3 is a schematic cross-sectional view of the heat dissipation assembly in Fig. 1 on a plane including section line A-A 'and parallel to X and Z axes. FIG. 4 is a schematic cross-sectional view of the heat dissipation assembly of FIG. 1 configured on another expansion card. Fig. 5 is a schematic cross-sectional view of the heat dissipation assembly in Fig. 1 on a plane including the cross-sectional line B-B 'and parallel to the Y and Z axes. 6 is a schematic cross-sectional view of a heat dissipation assembly according to another embodiment of the present invention. 7 is a schematic top view of a first expansion card to which the heat dissipation component in FIG. 4 is applied. FIG. 8 is a schematic side view of the first expansion card in FIG. 7. 9 is a schematic bottom view of the first expansion card in FIG. 7.

Claims (10)

A heat dissipation component is suitable for a first expansion card and a second expansion card, wherein the thickness of the first expansion card is smaller than the thickness of the second expansion card, the heat dissipation component includes: a first heat dissipation element with a first An inner surface, a first side and a second side respectively connected to the first inner surface and opposite to each other, the first heat dissipation element includes a first buckling portion on the first side, and a A second locking portion and a third locking portion, wherein the distance between the second locking portion and the first inner surface is greater than the distance between the third locking portion and the first inner surface; a first Two heat dissipation elements are stacked under the first heat dissipation element and the first inner surface of the first heat dissipation element faces the second heat dissipation element. The first expansion card or the second expansion card is suitable for being disposed in the first Between a heat dissipation element and a second heat dissipation element; and a fastener that detachably fixes the first heat dissipation element, the second heat dissipation element and the first heat dissipation element between the first heat dissipation element and the second heat dissipation element An expansion card or the second expansion card, the fastener includes a bottom portion, two arm portions extending from opposite sides of the bottom portion, and a fourth latch portion extending from the two arm portions And a fifth buckle portion, wherein one of the fourth buckle portion and the fifth buckle portion of the buckle is selectively buckled to the first buckle portion, the fourth buckle portion The other of the fifth buckling portion can be selectively buckled to one of the second buckling portion and the third buckling portion, so that the first heat dissipation element is spaced apart from the second heat dissipation element The first pitch or a second pitch. The heat dissipation assembly as described in item 1 of the patent application scope, wherein when the first expansion card is located between the first heat dissipation element and the second heat dissipation element and is jointly fixed by the fastening element, the The fourth buckling portion and the fifth buckling portion are respectively engaged with the first buckling portion and the second buckling portion of the first heat sink, when the second expansion card is located on the first heat sink and When the second heat dissipating members are fixed together by the locking member, the fourth locking portion and the fifth locking portion of the locking member are respectively engaged with the third locking portion of the first cooling member With the first snap part. The heat dissipation assembly as described in item 1 of the patent application, wherein the distance between the first buckle portion and the first inner surface is greater than the distance between the third buckle portion and the first inner surface, and is smaller than the second buckle The distance between the buckle and the first inner surface. The heat dissipation assembly as recited in item 1 of the patent application range, wherein the distance between the fourth snap portion and the bottom is smaller than the distance between the fifth snap portion and the bottom. The heat dissipation assembly as described in item 1 of the patent application scope, wherein the first expansion card includes a fixed notch recessed at an edge, and the first heat dissipation element and the second heat dissipation element respectively include a first corresponding to the fixed notch A through hole and a second through hole, and a fixing member is adapted to pass through the first through hole, the fixing notch and the second through hole and be fixed to a circuit board. The heat dissipation component as described in item 5 of the patent application, wherein the first through hole is a circular through hole or a semi-circular through hole, and the second through hole is a circular through hole or a semi-circular through hole . The heat dissipation assembly as described in item 1 of the patent application scope, wherein the second heat dissipation element has a third side and a fourth side opposite to each other and two notches formed at corresponding positions on the third side and the fourth side , And the two arm portions of the fastener extend into the two notches. The heat dissipation assembly as recited in item 7 of the patent application range, wherein the first expansion card includes a fixed notch recessed at an edge, and the second heat dissipation element includes a second through hole corresponding to the fixed notch, the second through The hole is staggered in the line of the two notches. The heat dissipation assembly as described in item 1 of the patent application scope, wherein the buckle includes an extended handle extending from the fourth buckle portion. The heat dissipation assembly as described in item 1 of the patent application scope further includes: a first heat dissipation cushion, disposed between the first heat dissipation member and the second heat dissipation member; and a second heat dissipation cushion, disposed on the first A heat dissipation cushion and a second heat dissipation element, and the first expansion card or the second expansion card are suitable for being disposed between the first heat dissipation cushion and the second heat dissipation cushion.