TWI566079B - Electronic device - Google Patents

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device having a shape memory alloy component.

The problem of heat dissipation has long been a major problem in the design of portable electronic devices such as notebook computers and tablet computers. The common electronic devices usually use the design of a fan and a heat dissipation hole to dissipate heat, but due to the current electronic devices The design of the body is becoming thinner and lighter, and the available heat dissipation space is relatively reduced, so that the overall heat dissipation efficiency is not ideal, and the heat dissipation requirement of the electronic device with high calculation speed cannot be met. In view of this, how to break through the existing heat dissipation restrictions has become an important issue.

An embodiment of the present invention provides an electronic device including a body and a shape memory alloy component, wherein the body is formed with a surface and a heat dissipation opening, wherein the heat dissipation opening is disposed on the surface, and the shape memory alloy component is disposed on the heat dissipation opening. When the temperature of the shape memory alloy component is lower than a critical temperature, the shape memory alloy component assumes a first shape and shields the heat dissipation opening; when the shape memory alloy component is heated to raise the temperature and exceeds the critical temperature, the shape memory alloy component is deformed and Protruding out of the surface, the shape memory alloy member assumes a second shape and forms a passage with the body.

In one embodiment, when the shape memory alloy component is cooled and warmed When the degree is lowered below the critical temperature, the shape memory alloy member returns from the second shape to the first shape and shields the heat dissipation opening.

In one embodiment, the aforementioned critical temperature is between 40 ° C and 65 ° C.

In one embodiment, the aforementioned shape memory alloy component has a two-way memory effect.

In one embodiment, the material of the shape memory alloy component includes an iron-based alloy, a nickel-titanium alloy, or a copper-based alloy.

In one embodiment, when the shape memory alloy member is heated to raise the temperature and exceed the critical temperature, at least a portion of the shape memory alloy member is converted from the state of the field of the field to the state of the Worth field.

In one embodiment, the shape memory alloy component is formed with a plurality of slits. When the temperature of the shape memory alloy component is lower than the critical temperature, the slit exhibits a closed state; when the shape memory alloy component is heated, the temperature rises and exceeds the critical value. At the temperature, the shape memory alloy member is deformed and the slit is expanded to an open state.

In an embodiment, the slits are arranged at intervals.

In one embodiment, the body includes a chute, and the shape memory alloy component is received in the chute.

In one embodiment, the shape memory alloy component moves within the chute when the shape memory alloy component is deformed.

First, please refer to FIG. 1 and FIG. 2 together. The electronic device E of the embodiment of the present invention is, for example, a notebook computer or a tablet computer, and mainly includes a body 1 and a shape memory alloy component 2, wherein the body 1 is formed with a surface S1. And a heat dissipation opening 11 disposed on the surface S1. In the embodiment, the heat dissipation opening 11 is, for example, a rectangular opening. The shape memory alloy member 2 is substantially a rectangular structure and is disposed on the heat dissipation opening 11, wherein the shape memory alloy member 2 is formed with a plurality of slits 21, and the slits 21 are all extended in the same direction and spaced apart. As shown in FIG. 2, the shape memory alloy member 2 can be deformed when its temperature is higher than a critical temperature, and a passage P is formed with the body 1 to improve the heat dissipation efficiency of the electronic device E.

It should be particularly noted that the material of the shape memory alloy member 2 is an alloy having a two-way shape memory effect, and may be, for example, an iron-based alloy, a nickel-titanium alloy or a copper-based alloy.

In FIG. 1, when the electronic device E has not started to operate or the temperature is low, since the temperature of the shape memory alloy member 2 is lower than a critical temperature, it exhibits a substantially flat plate shape (first shape), wherein the criticality The temperature may be between 40 ° C and 65 ° C, and at this time the shape memory alloy member 2 completely shields the heat dissipation opening 11 . Since the slit 21 is in a closed state at this time, foreign matter such as dust can be prevented from entering the electronic device E via the slit 21 or the heat dissipation opening 11 to cause damage.

Next, referring to Fig. 2, when the electronic device E starts to operate and the internal electronic components generate a large amount of thermal energy, part of the thermal energy is transferred to the shape memory alloy member 2 and is heated. When the temperature of the shape memory alloy member 2 rises and exceeds the critical temperature, at least a portion of the alloy material of the shape memory alloy member 2 is converted from the state of the field of the field to the state of the Worth field, and the shape memory alloy member 2 starts to be deformed. The shape memory alloy member 2 protrudes from the surface S1 and forms an arc shape (second shape), and at the same time forms two passages P with the body 1, so that thermal energy can be dissipated through the passage P, thereby The high electronic device E has a heat dissipation efficiency and prolongs the service life of its internal components.

In particular, when the shape memory alloy member 2 is heated to raise its temperature and exceed the critical temperature, the shape memory alloy member 2 is deformed into an arc shape, and the slit 21 thereon is expanded to an open state (as shown in FIG. 2). Shown). Therefore, the thermal energy can also quickly leave the electronic device E through the expanded slit 21 to further achieve the heat dissipation effect.

In contrast, when the shape memory alloy member 2 is cooled and the temperature is lowered below the critical temperature, the shape memory alloy member 2 is returned to the flat plate shape (first shape) by the arc shape (second shape), and the heat dissipation is again shielded. The opening 11 is at this time the slit 21 is returned from the open state to the closed state.

Next, please refer to Figures 3 and 4 together, wherein Figure 4 shows a cross-sectional view taken along line A-A' in Figure 3. The electronic device E of another embodiment of the present invention further includes a plurality of heat dissipation holes 12 (Fig. 3) and a plurality of sliding grooves 13 (Fig. 4). The shape memory alloy member 2 is adjacent to the heat dissipation holes 12. When the temperature of the shape memory alloy member 2 is lower than the critical temperature, the shape memory alloy member 2 assumes a flat plate shape (first shape) and shields the heat dissipation opening 11, at which time the electronic device E radiates heat only through the heat dissipation holes 12. As shown in FIG. 4, the chute 13 is disposed on both sides of the heat dissipation opening 11, and both side edges of the shape memory alloy member 2 are accommodated in the chute 13.

Referring again to Figs. 5 and 6, Fig. 6 is a cross-sectional view taken along the line B-B' in Fig. 5. When the temperature of the shape memory alloy member 2 rises and exceeds the critical temperature, the shape memory alloy member 2 starts to deform to form an arc shape (second shape) while forming a passage P with the body 1, wherein the passage P is adjacent to The heat dissipation hole 12, at which time the thermal energy can leave the electronic device E through the channel P and the heat dissipation hole 12 at the same time, thereby making the electronic device E more effective. Rate the heat.

As shown in Fig. 6, when the shape memory alloy member 2 is deformed, the edge portion of the shape memory alloy member 2 can be slid in the sliding groove 13, and the central portion of the shape memory alloy member 2 is convex upward, and A passage P is formed with the body 1.

In summary, the present invention provides an electronic device, which mainly includes a body and a shape memory alloy component, wherein the body is formed with a surface and a heat dissipation opening disposed on the surface, and the shape memory alloy component is disposed on the heat dissipation opening. When the temperature of the shape memory alloy component is lower than a critical temperature, the shape memory alloy component assumes a first shape and shields the heat dissipation opening; when the shape memory alloy component is heated to raise the temperature and exceeds the critical temperature, the shape memory alloy component is deformed. And protruding from the surface, the shape memory alloy component assumes a second shape, and forms a channel with the body, so that the thermal energy can leave the electronic device through the channel, thereby improving the heat dissipation efficiency of the electronic device and extending the interior thereof. The life of the component.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. Those skilled in the art having the ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

1‧‧‧ Ontology

2‧‧‧Shape memory alloy components

11‧‧‧Dissipation opening

12‧‧‧ vents

13‧‧‧Chute

21‧‧‧slit

E‧‧‧Electronic device

P‧‧‧ channel

S1‧‧‧ surface

1 is a schematic view showing a shape memory alloy component according to an embodiment of the present invention in a first shape; FIG. 2 is a schematic view showing a shape memory alloy component according to an embodiment of the present invention in a second shape; and FIG. 3 is a view showing the present invention; A schematic view of the shape memory alloy member of another embodiment in a first shape; and Fig. 4 is a cross-sectional view taken along line A-A' of Fig. 3.

Fig. 5 is a view showing a state in which the shape memory alloy member according to another embodiment of the present invention assumes a second shape; and Fig. 6 is a cross-sectional view taken along line B-B' in Fig. 5.

1‧‧‧ Ontology

2‧‧‧Shape memory alloy components

11‧‧‧Dissipation opening

21‧‧‧slit

E‧‧‧Electronic device

P‧‧‧ channel

S1‧‧‧ surface

Claims (9)

An electronic device includes: a body formed with a surface and a heat dissipation opening, and includes a sliding slot, wherein the heat dissipation opening is disposed on the surface; and a shape memory alloy component disposed on the heat dissipation opening and received In the chute; wherein, when the temperature of the shape memory alloy member is lower than a critical temperature, the shape memory alloy member assumes a first shape and aligns the surface, and shields the heat dissipation opening; when the shape memory alloy member is heated The shape memory alloy member is deformed when the temperature is raised and exceeds the critical temperature, and the shape memory alloy member assumes a second shape and protrudes from the surface and forms a passage with the body. The electronic device of claim 1, wherein the shape memory alloy member returns from the second shape to the first shape when the shape memory alloy member is cooled and the temperature is lowered below the critical temperature, and The heat dissipation opening is shielded. The electronic device of claim 1, wherein the critical temperature is between 40 ° C and 65 ° C. The electronic device of claim 1, wherein the shape memory alloy component has a two-way memory effect. The electronic device of claim 1, wherein the material of the shape memory alloy component comprises an iron-based alloy, a nickel-titanium alloy or a copper-based alloy. The electronic device of claim 1, wherein when the shape memory alloy component is heated to raise the temperature and exceed the critical temperature, At least a portion of the shape memory alloy element is converted from a mascot state to a Worth field state. The electronic device of claim 1, wherein the shape memory alloy component is formed with a plurality of slits, and when the temperature of the shape memory alloy component is lower than the critical temperature, the slits exhibit a closed state; When the shape memory alloy member is heated to raise the temperature and exceed the critical temperature, the shape memory alloy member is deformed and the slits are expanded to an open state. The electronic device of claim 7, wherein the slits are arranged at intervals. The electronic device of claim 1, wherein the shape memory alloy member moves within the chute when the shape memory alloy member is deformed.