US20110297349A1

US20110297349A1 - Enclosure of electronic device

Info

Publication number: US20110297349A1
Application number: US12/817,204
Authority: US
Inventors: Yan-Li Zhou
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2010-06-02
Filing date: 2010-06-17
Publication date: 2011-12-08
Also published as: CN102270025A

Abstract

An enclosure includes a case and a heat dissipating area formed on the case. The heat dissipating area defines a number of heat dissipating holes in the heat dissipating area. The material of the heat dissipating area is thermo-responsive shape memory polymer. The heat dissipating holes have a first size in response to the temperature around the heat dissipating area being under a predetermined value. The heat dissipating holes can grow to a second size in response to the temperature around the heat dissipating area being greater than the predetermined value. The first size is less than the second size.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to an enclosure of an electronic device.
2. Description of Related Art
Most electronic devices have enclosures to contain electronic elements. These enclosures may define a lot of heat dissipating holes to dissipate the heat in the enclosures. However, if the heat dissipating holes are very small, the heat dissipating effect is not desirable. If the heat dissipating holes are very big, dust and other contaminants will easily enter the enclosures.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an isometric, schematic view of an embodiment of an enclosure of an electronic device.

FIG. 2 is a partial enlarged view of the enclosure of FIG. 1, in a first state.

FIG. 3 is a partial enlarged view of the enclosure of FIG. 1, in a second state.

DETAILED DESCRIPTION

The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to FIG. 1, an embodiment of an enclosure 100 includes a case 10 and a heat dissipating area 12 formed on the case 10. The heat dissipating area 12 defines a plurality of heat dissipating holes 20 therein.
In one embodiment, the heat dissipating holes 20 are round and evenly arrayed in the heat dissipating area 12. In other embodiments, the shape of the heat dissipating holes 20 can be changed according to requirements. The material of the heat dissipating area 12 is thermo-responsive shape memory polymer (SMP).
FIG. 2 shows a first state of the enclosure 100 when the temperature around the heat dissipating area 12 is under a predetermined value, such as 40 degrees Celsius. FIG. 3 shows a second state of the enclosure 100 when the temperature around the heat dissipating area 12 is greater than the predetermined value. Because the material of the heat dissipating area 12 is thermo-responsive SMP, the diameter of each heat dissipating hole 20 changes in response to temperature changes. In this embodiment, when the temperature is low the diameter of each hole 20 is about 0.5 millimeters (mm) in the first state which can prevent dust entering into the case 10. When the temperature is high the diameter of each heat dissipating hole 20 grows to about 0.8 millimeters (mm) in the second state which can increase heat dissipating effect. Once the temperature returns to below the predetermined value the diameter of each hole 20 reverts to 0.5 mm.
It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in details, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. An enclosure comprising:

a case; and

a heat dissipating area formed on the case, the heat dissipating area defining a plurality of heat dissipating holes therein;

wherein the material of the heat dissipating area is thermo-responsive shape memory polymer, the plurality of heat dissipating holes is changed to a first size in response to the temperature around the heat dissipating area being under a predetermined value, the plurality of heat dissipating holes is changed to a second size in response to the temperature around the heat dissipating area being greater than the predetermined value, the first size is less than the second size.

2. The enclosure of claim 1, wherein the plurality of heat dissipating holes are round and defined evenly in the heat dissipating area.