TWI636357B - Heat sink assembly and motherboard assembly including the same - Google Patents

Abstract

A heat sink assembly adapted to be disposed on a processing chip and an expansion card. The heat sink assembly includes a wafer heat sink and an expansion card heat sink. The wafer heat sink has a set of side edges and the wafer heat sink is used to thermally contact the wafer. The expansion card heat sink includes a heat sink and a set of joints. The assembly protrudes from the heat sink and surrounds a set of slots. The assembly portion can abut the side edges such that the assembly side edges are located in the assembly groove, and the assembly portions are rotatable relative to the assembly side edges to engage each other. The heat sink is used to thermally contact the expansion card.

Description

Heat sink assembly and motherboard assembly containing same

The present invention relates to a heat sink assembly and a motherboard assembly including the same, and more particularly to a heat sink assembly for joining two heat dissipation modules and a motherboard assembly including the same.

As the technology in the electronics field continues to evolve, the performance of electronic devices continues to increase. Among them, the M.2 connector specification is a new generation interface standard developed in recent years, which adopts a more flexible specification, allows more types of module specifications to be connected, and can be matched with higher-order interfaces. Therefore, it is more convenient and more efficient in use. In addition, as the technology of related products becomes more mature and the price becomes more and more close to the people, the expansion device adopting the M.2 connector specification has become more and more popular and popular in recent years.

In general, the efficiency of an electronic device increases, and the amount of heat generated increases. This heat builds up on the device and causes the temperature of the device itself to rise. Failure to effectively lower the temperature of the unit may result in malfunction and damage to the unit and reduce its useful life. Therefore, the general issue in the electronics industry is not only the improvement of device performance, but also how to effectively eliminate the heat emitted by electronic devices.

However, at present, only a few products have a heat dissipation design for the expansion device on the motherboard, and usually these heat dissipation modules are respectively fixed on the expansion device, and the fixing manner and position thereof need to consider the space configuration of the motherboard, and It is not easy to disassemble. In addition, the materials of these heat dissipation modules are usually made of non-metal design, and the heat dissipation effect of the heat dissipation module cannot meet the demand for the expansion device with higher performance. Therefore, how to provide a heat dissipation module can effectively remove the heat of the expansion device, facilitate the disassembly and assembly of the user, and does not interfere with other devices in the space configuration of the motherboard, which is one of the problems that the researcher should solve. .

The present invention provides a heat sink assembly and a motherboard assembly including the same, which solves the problem of heat dissipation of the high-performance expansion device described in the prior art and the problem that the heat dissipation module is not easy to assemble and disassemble.

The heat sink assembly disclosed in one embodiment of the present invention is suitable for being disposed on a processing chip and an expansion card. The heat sink assembly includes a wafer heat sink and an expansion card heat sink. The wafer heat sink has a set of side edges and the wafer heat sink is used to thermally contact the wafer. The expansion card heat sink includes a heat sink and a set of joints. The assembly protrudes from the heat sink and surrounds a set of slots. The assembly portion can abut the side edges such that the assembly side edges are located in the assembly groove, and the assembly portions are rotatable relative to the assembly side edges to engage each other. The heat sink is used to thermally contact the expansion card.

A motherboard assembly according to another embodiment of the present invention includes a circuit board, a processing chip, an expansion card, and a heat sink assembly. The processing chip and the expansion card are all disposed on the circuit board. The heat sink assembly includes a wafer heat sink and an expansion card heat sink. The wafer heat sink has a set of side edges and the wafer heat sink is in thermal contact with the handle wafer. The expansion card heat sink includes a heat sink and a set of joints. The assembly protrudes from the heat sink and surrounds a set of slots. The assembly portion can abut the side edges such that the assembly side edges are located in the assembly groove, and the assembly portions are rotatable relative to the assembly side edges to engage each other. The heat sink is used to thermally contact the expansion card.

A heat sink assembly according to still another embodiment of the present invention is suitable for being disposed on a processing chip and an expansion card. The heat sink assembly includes a wafer heat sink and an expansion card heat sink. The chip heat sink comprises a body and a hook portion, and the hook portion protrudes from the body. The wafer heat sink is used to thermally contact the wafer. The expansion card heat sink includes a connected heat sink and a set of joints. The assembly has a hook groove, and the hook portion can be inserted into the hook groove, so that the assembly portion can be rotated relative to the hook portion to engage with each other. The heat sink is used to thermally contact the expansion card.

According to the heat sink assembly and the motherboard assembly including the same, the interference between the expansion card heat sink on the circuit board and other devices can be reduced by bonding the expansion card heat sink to the chip heat sink. The board space can be effectively utilized without additional holes in the board to secure the expansion card heat sink. In addition, the expansion card heat sink is fixed to the chip heat sink by means of bonding, which is convenient for the user to disassemble the expansion card heat sink, and is more beautiful in overall appearance because the use of the screw is reduced.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.

The detailed features and advantages of the embodiments of the present invention are set forth in the Detailed Description of the Detailed Description. The objects and advantages of the present invention can be readily understood by those of ordinary skill in the art in the <RTIgt; The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

Please refer to Figure 1 to Figure 3. 1 is a perspective view of a motherboard assembly according to a first embodiment of the present invention. 2 is a partial exploded view of the motherboard assembly of FIG. 1. 3 is a side cross-sectional view of the heat sink assembly of FIG. 1.

The motherboard assembly 1 of the present embodiment includes a circuit board 10, a processing chip 20, a socket connector 30, an expansion card 40, a support stud 50, and a heat sink assembly 60. The processing chip 20 and the socket connector 30 are disposed adjacent to the circuit board 10, and the expansion card 40 is connected to the socket connector 30. The support stud 50 is screwed on the circuit board 10 and located on a side of the expansion card 40 away from the socket connector 30. The support studs 50 are used to support the expansion card 40. The heat sink assembly 60 is disposed on the processing wafer 20 and the expansion card 40. In addition, the motherboard assembly 1 further includes a heat dissipation pad 70 rotatably disposed on the socket connector 30 and thermally contacting the expansion card 40 to exclude heat generated by the expansion card 40, but the present invention does not limit. In other embodiments, the motherboard component may not include a heat dissipation pad, but directly contacts the expansion card with the expansion card heat sink to achieve heat dissipation.

In the present embodiment, the processing chip 20, the socket connector 30, and the expansion card 40 are respectively exemplified by a south bridge chip, an M.2 socket connector, and an M.2 solid state hard disk device, but the invention is not limited thereto. In other embodiments, the processing chip may be a central processing unit or a north bridge chip or the like; the socket connector may be a mSATA (mini Serial Advanced Technology Attach) standard connector or a PCI-E (PCI Express) standard connector; An expansion device that meets different standard specifications such as mSATA solid state drives or PCI-E solid state drives and has cooling requirements.

The heat sink assembly 60 includes a wafer heat sink 610 and an expansion card heat sink 620 that thermally contact the processing wafer 20 and the expansion card 40, respectively, to exclude heat generated by the processing wafer 20 and the expansion card 40. In this embodiment, the material of the heat sink 610 and the heat sink 620 of the expansion card is made of metal, which has better thermal conductivity, so that the heat sink has better heat dissipation effect. More preferably, the material of the chip heat sink 610 and the expansion card heat sink 620 is aluminum.

As shown in FIG. 2 and FIG. 3, the wafer heat sink 610 has a slot 611 and a set of side edges 612, and the assembly side edge 612 is located on one side of the slot 611. The expansion card heat sink 620 includes a heat dissipation portion 621, a plurality of connection portions 622, and a screw portion 623. The assembly portion 622 protrudes from the heat dissipation portion and surrounds the plurality of sockets 6221. The assembly side edge 612 of the wafer heat sink 610 is located in the assembly groove 6221, and the assembly side edge 612 and the assembly portion 622 abut each other. The screw lock portion 623 is connected to a side of the heat dissipation portion 621 away from the assembly portion 622. The expansion card heat sink 620 has an opening 6231 in the screw locking portion 623, and the opening 6231 is provided with a screw 80 for locking and locking on the supporting stud 50. The expansion card heat sink 620 thermally contacts the heat dissipation pad 70 covering the expansion card 40 with the heat dissipation portion 621.

In the present embodiment, the screw locking portion 623 is fixed to the circuit board 10 via the screw 80, but the invention is not limited thereto. In other embodiments, the screw lock can be fixed to the circuit board through the cassette. In addition, in the embodiment, the expansion card heat dissipation member includes a screw lock portion, but the invention is not limited thereto. In other embodiments, the expansion card heat sink may not include a screw lock portion, but has a buckle portion that is connected to the air. The hot portion is away from one side of the assembly portion, and the buckle portion is fixed to a circuit board. That is, the expansion card heat sink can replace the screw lock portion with a buckle portion, for example, and is fastened to the circuit board by snapping.

The bonding step of the expansion card heat sink 620 and the wafer heat sink 610 will be described below. Please refer to Figure 4 and Figure 5. 4 is a side cross-sectional view of the expansion card heat sink of FIG. 1 in an open position. 5 is a side cross-sectional view of the expansion card heat sink of FIG. 1 in a heat dissipating position.

As shown in FIG. 4, after the expansion card 40 is connected to the socket connector 30, and the heat dissipation pad 70 covers the expansion card 40, the assembly portion 622 of the expansion card heat sink 620 is obliquely inserted into the slot 611, so that the assembly side is The edge 612 is located in the assembly groove 6221 and abuts the assembly portion 622 to position the expansion card heat sink 620 in an open position. Next, the assembly portion 622 is rotated relative to the wafer heat sink 610 with the assembly side edge 612 as a fulcrum, so that the expansion card heat sink 620 is rotated from the tilted open position toward the wafer heat sink 610 to A heat dissipation position placed horizontally (as shown in Figure 5). When the expansion card heat sink 620 is in the heat dissipation position, the heat dissipation portion 621 of the expansion card heat sink 620 is partially overlapped on the wafer heat sink 610, and the other portion is in thermal contact with the heat dissipation pad 70. Finally, the opening 8031 of the expansion card heat sink 620 on the screw locking portion 623 is inserted by the screw 80, and is correspondingly locked to the support stud 50, so that the expansion card heat sink 620 can be closely attached to the heat dissipation pad 70. In order to expand the contact area, a better heat dissipation effect is achieved.

In the present embodiment, the slot 611 of the chip heat sink 610 is disposed on the side of the chip heat sink 610 away from the expansion card 40, but the invention is not limited thereto. In other embodiments, the slot of the heat sink of the chip may be disposed on a side of the heat sink of the chip near the expansion card, and the length of the heat sink of the expansion card is adjusted to be shorter, so that the opening and the connecting portion substantially correspond to the supporting stud. Slotting with the heat sink of the wafer.

In this embodiment, the number of the expansion card heat sinks 620 is one, but the present invention Not limited to this. In other embodiments, the number of expansion card heat sinks may be multiple and bonded to the chip heat sink for thermally contacting the plurality of expansion cards.

In this embodiment, the wafer heat sink 610 has a slot 611, and the assembly side edge 612 is located on one side of the slot 611, but the invention is not limited thereto. Referring to Figure 6, there is shown a side cross-sectional view of a heat sink assembly in accordance with a second embodiment of the present invention.

In this embodiment, the wafer heat sink 610a includes a body 615a, a support post 613a, and a set of side edges 612a. The support post 613a protrudes from the body 615a, and the assembly side edge 612a is located on one side of the support post 613a. The expansion card heat sink 620a includes a heat dissipation portion 621a and a plurality of connection portions 622a, and the assembly portion 622a protrudes from the heat dissipation portion and surrounds the plurality of sockets 6221a. The assembly slot 6221a can accommodate the assembly side edge 612a of the chip heat sink 610a, so that the assembly portion 622a of the expansion card heat sink 620a can rotate relative to the assembly side edge 612a to engage with each other, and simultaneously drive the expansion card heat sink 620a to rotate, and The expansion card heat sink 620a is caused to cover the wafer heat sink 610a.

In addition, in the first embodiment, the expansion card heat sink 620 and the chip heat sink 610 are coupled to each other through the assembly portion 622 and the slot 611, but the invention is not limited thereto. Referring to Figure 7, there is shown a side cross-sectional view of a heat sink assembly in accordance with a third embodiment of the present invention.

In this embodiment, the wafer heat sink 610b includes a body 615b and a hook portion 616b, and the hook portion 616b protrudes from the body 615b. The expansion card heat sink 620b includes a heat dissipation portion 621b and a plurality of connection portions 622b. The hook portion 622b has a hook groove 6221b, the hook portion 616b of the chip heat sink 610b can be correspondingly inserted into the hook groove 6221b, and the joint portion 622b can be rotated relative to the hook portion 616b, so that the hook portion 616b gradually penetrates into the hook groove 6221b to engage with each other. At the same time, the expansion card heat sink 620b is rotated and superposed on the chip heat sink 610b.

According to an exemplary embodiment of the present invention, heat dissipation measurement of the expansion card heat sink is performed test. This test compares the normal operating temperature of the expansion card heatsink and the expansion card heatsink on the M.2 solid state disk device, the M.2 solid state disk device, and the M.2 solid state disk at this temperature. The data transfer speed of the device.

Please refer to Table 1 below.

As shown in Table 1, there is a significant difference in temperature before and after the expansion card heat sink is set. In the case where the expansion card heat sink was not provided, the temperature of the M.2 solid state drive unit was 87.2 degrees, and the data transfer speed of the hard disk was 1249 MB/s. In the case of an expansion card heat sink, the temperature of the solid state drive is 74.0 degrees, and the data transfer speed of the hard disk is 1580 MB/s. The temperature difference is about 13.2 degrees, and the data transfer speed difference is about 331MB/s. It can be seen from the measurement data of the foregoing test that the expansion card heat sink on the M.2 solid state hard disk device can effectively reduce the temperature of the M.2 solid state hard disk device, thereby maintaining the data transmission speed of the hard disk without The phenomenon of slowing down due to temperature rise.

According to the heat sink assembly of the above embodiment and the motherboard assembly including the same, by engaging the expansion card heat sink with the chip heat sink, interference between the expansion card heat sink on the circuit board and other devices can be reduced, and Additional holes are required on the board to secure the expansion card heatsink, making efficient use of board space. In addition, the expansion card heat sink is fixed to the chip heat sink by means of bonding, which is convenient for the user to disassemble the expansion card heat sink, and is more beautiful in overall appearance because the use of the screw is reduced.

And, by the heat dissipation test of the expansion card heat sink, the result shows the expansion card The operating temperature difference is approximately 13.2 degrees and the data transfer speed difference is approximately 331 MB/s. The data results prove that the expansion card heat sink can effectively reduce the operating temperature of the expansion card and maintain high-efficiency data transmission speed, so that the expansion card can optimize its performance and extend its service life.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

1‧‧‧ motherboard components

10‧‧‧ boards

20‧‧‧Processing wafer

30‧‧‧Socket connector

40‧‧‧Expansion card

50‧‧‧Support studs

60‧‧‧ radiator assembly

610, 610a, 610b‧‧‧ wafer heat sink

611‧‧‧ slotting

612, 612a‧‧‧ group side edges

613a‧‧‧Support column

615a, 615b‧‧‧ ontology

616b‧‧‧Hook

620, 620a, 620b‧‧‧ expansion card heat sink

621, 612a, 621b‧‧ ‧ heat dissipation department

622, 622a, 622b‧‧ ‧ joints

6221, 6221a‧‧‧ joint slots

6221b‧‧‧Check groove

623‧‧‧Silver lock

6231‧‧‧Opening

70‧‧‧heating gasket

80‧‧‧ screws

1 is a perspective view of a motherboard assembly according to a first embodiment of the present invention. 2 is a partial exploded view of the motherboard assembly of FIG. 1. 3 is a side cross-sectional view of the heat sink assembly of FIG. 1. 4 is a side cross-sectional view of the expansion card heat sink of FIG. 1 in an open position. 5 is a side cross-sectional view of the expansion card heat sink of FIG. 1 in a heat dissipating position. Figure 6 is a side cross-sectional view of a heat sink assembly in accordance with a second embodiment of the present invention. Figure 7 is a side cross-sectional view of a heat sink assembly in accordance with a third embodiment of the present invention.

Claims (12)

A heat sink assembly adapted to be disposed on a processing chip and an expansion card, the heat sink assembly comprising: a wafer heat sink having a plurality of side edges, the wafer heat sink for thermally contacting the processing wafer; and an expansion The heat dissipating component includes a heat dissipating portion and a plurality of connecting portions protruding from the heat dissipating portion and surrounding a set of connecting grooves, wherein the connecting portion can abut the side edge of the set, so that the connecting side The edge is located in the set of slots, and the set of parts is rotatable relative to the set of side edges for mutual engagement, and the heat dissipating portion is configured to thermally contact the expansion card. The heat sink assembly of claim 1, wherein the expansion card heat sink further has a screw locking portion connected to a side of the heat dissipation portion away from the assembly portion, and the screw locking portion Used to fix on a circuit board. The heat sink assembly of claim 1, wherein the expansion card heat sink further has a buckle portion connected to a side of the heat dissipation portion away from the assembly portion, and the buckle portion Used to fix on a circuit board. The heat sink assembly of claim 1, wherein the heat sink member further has a slot, the slot having a complete inner annular wall surface at a periphery thereof, the set side edge being located at one side of the slot. The heat sink assembly of claim 1, wherein the heat sink comprises a body and a support column, the support column protrudes from the body, and the set of side edges is located at one side of the support column. A motherboard component comprising: a circuit board; a processing chip disposed on the circuit board; an expansion card disposed on the circuit board; and a heat sink assembly comprising: a wafer heat sink having a set of side edges, the chip heat sink Thermally contacting the processing chip; and an expansion card heat dissipating member comprising a heat dissipating portion and a set of connecting portions protruding from the heat dissipating portion and surrounding a set of connecting grooves, the connecting portion being capable of abutting the group The side edges are disposed such that the set of side edges are located in the set of slots, and the set of parts is rotatable relative to the set of side edges, and the heat dissipating portion is in thermal contact with the expansion card. The motherboard assembly of claim 6, wherein the expansion card heat sink further has a screw locking portion, the screw locking portion is connected to a side of the heat dissipation portion away from the assembly portion, and the screw locking portion is Fixed to the board. The motherboard assembly of claim 6, wherein the expansion card heat sink further has a buckle portion, the buckle portion is located at a side of the heat dissipation portion away from the assembly portion, and the buckle portion is fixed On the board. The motherboard assembly of claim 6, wherein the wafer heat sink further has a slot, the slot having a complete inner annular wall surface at a periphery, the set of side edges being located on one side of the slot. The motherboard assembly of claim 6, wherein the heat sink comprises a body and a support column, the support column protrudes from the body, and the set of side edges is located at one side of the support column. The motherboard assembly of claim 6, further comprising a heat dissipating spacer disposed between the heat dissipating portion of the expansion card heat dissipating member and the expansion card. A heat sink assembly is disposed on a processing chip and an expansion card. The heat sink assembly includes: a heat sink member, including a body and a hook portion, the hook portion protrudes from the body, and the chip heat sink is used for the heat sink Thermally contacting the processing chip; and an expansion card heat dissipating member, comprising a connected heat dissipating portion and a set of connecting portions, the connecting portion having a hook groove, the hook portion being insertable into the hook groove, so that the connecting portion can be The hook portion is rotated to be engaged with each other, and the heat dissipating portion is for thermally contacting the expansion card.