1270765 九、發明說明： 【發明所屬之技術領域】 拄-ir月係有關於一種散熱裳置，尤指-種可經由夾 ^件俾使散熱μ、記憶卡及底_隨合之散熱^ 【先前技術】1270765 IX. Description of the invention: [Technical field to which the invention belongs] 拄-ir is related to a heat-dissipating skirt, especially a kind of heat-dissipating μ, memory card and bottom_heating through the clamps ^ Prior art
隨著大規模積體電路技術之不斷進步，電子 ::速而長遠的發展，而電子產品朝向高密度與高速； =，所衍生的最大問題，莫過於解決散熱問題^ 現今對於積體電路等的要求地提彳，，伴隨著 ^生的熱1亦隨之增加，如果這些熱量不及時散發出 去，則將導致積體電路内溫度迅速升高，進而嚴 積體電路之敎性及仙壽命。With the continuous advancement of large-scale integrated circuit technology, electronic:: rapid and long-term development, while electronic products are oriented toward high density and high speed; =, the biggest problem derived is to solve the heat dissipation problem ^ Nowadays for integrated circuits, etc. The demand for the earthworms, along with the heat of the heat 1 also increases, if the heat is not released in time, it will lead to a rapid rise in the temperature inside the integrated circuit, and then the rigidity of the circuit and the life of the system .
依先前技術，一種 SO-DlMM(Small Outline Dml Mne Memory Module)記憶卡是一種微型記憶卡，常使用於筆記 型電腦，其特點為體積小於一般桌上型電腦所使用的記 憶卡，通常只有其體積的一半，以符合筆記型電腦輕薄 短小的需求。在目前市面上對於S0-DIMM記憶卡散熱 之方式不外有： 1·以鋁製薄片設置於發熱的DRAM上，以達到散熱 之功效，然其缺點在：S0-DIMM記憶卡因不同廠 的DRAM規格有變化時，此固定尺寸之鋁製薄片 不易組裝卡合，造成散熱接觸面積不均。 2·將袖珍型散熱鰭片個別黏貼於發熱之DRAM上， 以達到散熱之功效，然其缺點在：袖珍型散熱鰭 5 1270765 片成本高，黏貼後無法拆除再使用，且散熱面積 小〇 請參閱第一 A圖與第一 B圖，顯示習知SO-DIMM 記憶卡插接於插接槽之示意圖。具有複數記憶體2之 SO-DIMM記憶卡1以傾斜一角度而插接於一插接槽 3，並依第一 A圖中所指示方向A按壓該記憶卡1，俾 使卡扣部4卡扣於該記憶卡1之凹部5而穩固地結合如 第一 B圖所示。由於SO-DIMM記憶卡安裝後，其下方 空間有限，所以一般CPU的散熱模組或如新型專利第 M254645號所揭露之包夾式散熱裝置皆無法適用於 SO-DIMM記憶卡。另外有些包夾式散熱裝置之上下兩 銅片的距離是固定的，無法調整其間距；若記憶卡之記 憶體太高，使得該兩銅片包夾不住該記憶體，而記憶體 太低的話，則該兩銅片又接觸不到該記憶體（即產生空 隙）。 【發明内容】 本發明之目的在提供一種散熱裝置，利用一旋轉式 夾持元件俾使散熱片、記憶卡及底板穩固結合之散熱裝 置，並達到記憶卡優良的散熱效果，且該散熱裝置為一 易於拆卸之裝置。 達到上述目的之一種散熱裝置，包含：一散熱片， 形成複數個散熱鰭片，且該散熱片於兩側邊形成定位 槽，該散熱片於另一側邊設有兩定位孔；一底板，形成 一承接面，該承接面的邊緣延伸兩定位壁，該底板的邊 緣自該承接面垂直延伸兩定位銷，該底板的邊緣自該承 1270765 ，面延伸出兩擋板 ，且由該承接面、該兩定位壁及該兩 定位銷共同定義該底板承載該記憶卡的區域，該承接面 、四個角洛處各具有一轴孔；以及二夾持元件’各具有 二旋轉軸，並由該旋轉軸延伸一彈性部，且該彈性部形 成迴旋狀，而該旋轉軸樞接於該軸孔。 較佳地，該夾持元件的彈性部位於該定位槽。 幸交佳地，該定位銷穿過該定位孔使該散熱片定位於 該承接面的上方。 _ ju 圭地’該夾持元件夾持該散熱片與底板之結合 t ’该擋板用以頂靠該旋轉軸與彈性部之間的部分而提 一轴向彈力所賦予的夾持力。 達到上述目的之一種散熱裝置的組裝方法，包含以 下步驟： & + & 政熱片，提供一底板；提供至少一夾持元件 持该散熱片與底板之結合，·其特徵在於： 在該底板上形成軸孔； 軸孔忒夾持兀件形成一旋轉軸，並使該旋轉軸樞接於該 自”轉軸延伸一彈性部，且該彈性部施予一軸向 Κ施ί式】該軸向彈力J^持錄㈣與敍之結合。 圖弋：：ϋ:月將芩閱含有本發明較佳實施例之所附 θ^々田述，但在此描述之前應瞭解孰养本行之 人士可修改在本文中所描述之發明，同:獲:二= 功效。因此’須瞭解以下之描述對熟悉本 7 1270765 而言為一廣泛之揭示，且其内容不在於限制本發明。 首先，請參閲第二圖，顯示本發明散熱裝置之分解 圖。本發明散熱裝置，包含一散熱片6，形成複數個散 熱鰭片’且該散熱片6於兩側邊形成定位槽7，該散熱 片6於另—側邊設有兩定位孔8 ; —底板9，形成一承 接面12，該承接面12的邊緣延伸兩定位壁14，該底板 9的邊緣自該承接面12垂直延伸兩定位銷11，該底板9 _ 的邊緣自該承接面12延伸出兩擔板15，且由該底板9 之承接面12、兩定位壁14及兩定位銷11共同定義該底 板9承载該記憶卡1的區域，該承接面12於四個角落 處各具有一軸孔13 ;以及雨夾持元件16，夾持元件16 具有一旋轉軸18，並由該旋轉軸18延伸一彈性部17， 、 且彈性部施予一軸向彈力，在此一實施例中，該彈性部 17形成迴旋狀，而該旋轉轴18枢接於該軸孔13。此外， 該記憶卡1之記憶體2因不同廠牌而有高低的不同，而 該定位銷11與該定位孔8之間的配合，可因應不同薇 • 牌高度之記憶體2，俾使該底板9和該散熱片6間之寬 窄距離，可作平行地調整。 、 請參閱第三、四圖，分別顯示本發明散熱裝置之仰 視圖及立體圖。根據本發明之較佳實施例，該夾持元件 =之旋轉軸18樞接於該軸孔13,該底板9之定位銷11 牙經該散熱板6之定位孔8(請配合參閱第二圖），且該 &己卡1位在6玄底板9之承載區域上，俾使該散熱片$、 該記憶卡1與該底板9由上而下依序疊接，故該記憶卡 1所產生之熱量則藉由該散熱片6之散熱鰭片，利用其 8 1270765 金屬之傳導特性來散發熱量。此 進一步包含二導故片，該-、+本备明放熱裝置可 面上以增加接ΐ面l V熱片被置於記憶卡兩側表 請麥閱第五A圖、第五B圖， 熱裝置之立體圖及後視圖。# 本㈣散 性部π定位於該定位槽7時，該使彈According to the prior art, a SO-DlMM (Small Outline Dml Mne Memory Module) memory card is a micro memory card, which is often used in a notebook computer, and is characterized by a memory card smaller than that of a general desktop computer, usually only Half the size to meet the light and short needs of notebooks. In the current market, there are no other ways to dissipate the S0-DIMM memory card: 1. The aluminum foil is placed on the hot DRAM to achieve the heat dissipation effect. However, the disadvantages are: S0-DIMM memory card is different from the factory. When the DRAM specification is changed, the aluminum sheet of the fixed size is not easily assembled and engaged, resulting in uneven heat dissipation contact area. 2. Stick the pocket-type heat-dissipating fins on the heat-generating DRAM to achieve the heat-dissipating effect. However, the disadvantages are: the pocket-type heat-dissipating fins 5 1270765 are costly, can not be removed after use, and the heat-dissipating area is small. Referring to the first A diagram and the first B diagram, a schematic diagram of a conventional SO-DIMM memory card inserted into the insertion slot is shown. The SO-DIMM memory card 1 having the plurality of memories 2 is inserted into a slot 3 at an oblique angle, and the memory card 1 is pressed in the direction A indicated by the first A picture, so that the card portion 4 is stuck. The recess 5 of the memory card 1 is fastened to be firmly coupled as shown in FIG. Since the space under the SO-DIMM memory card is limited, the general CPU cooling module or the clip-type heat sink disclosed in the new patent No. M254645 cannot be applied to the SO-DIMM memory card. In addition, the distance between the upper and lower copper plates of some clip-on heat sinks is fixed, and the distance cannot be adjusted; if the memory of the memory card is too high, the two copper sheets cannot clamp the memory, and the memory is too low. If the two copper sheets are not in contact with the memory (ie, a void is generated). SUMMARY OF THE INVENTION An object of the present invention is to provide a heat dissipating device that utilizes a rotating clamping element to stably dissipate a heat sink, a memory card, and a bottom plate, and achieve an excellent heat dissipation effect of the memory card, and the heat dissipating device is An easy to disassemble device. A heat dissipating device for achieving the above object comprises: a heat sink, forming a plurality of heat dissipating fins, wherein the heat dissipating fins form positioning grooves on both sides, the heat dissipating fins are provided with two positioning holes on the other side; Forming a receiving surface, the edge of the receiving surface extending two positioning walls, the edge of the bottom plate extending perpendicularly from the receiving surface, two positioning pins, the edge of the bottom plate extending from the bearing 1270765, two baffles, and the receiving surface The two positioning walls and the two positioning pins jointly define an area of the bottom plate carrying the memory card, the receiving surface and the four corners each have a shaft hole; and the two clamping elements each have two rotating axes, and The rotating shaft extends an elastic portion, and the elastic portion forms a convoluted shape, and the rotating shaft is pivotally connected to the shaft hole. Preferably, the elastic portion of the clamping member is located in the positioning groove. Fortunately, the locating pin passes through the locating hole to position the heat sink above the receiving surface. _ ju Guidi 'The clamping element holds the combination of the heat sink and the bottom plate. The baffle is used to abut against the portion between the rotating shaft and the elastic portion to provide a clamping force imparted by the axial elastic force. A method for assembling a heat dissipating device for achieving the above object comprises the steps of: & + & + &+& heat sheet providing a bottom plate; providing at least one clamping member for holding the heat sink and the bottom plate, wherein: a shaft hole is formed on the bottom plate; the shaft hole 忒 clamping member forms a rotating shaft, and the rotating shaft is pivotally connected to the elastic portion extending from the rotating shaft, and the elastic portion is applied with an axial ί The axial elastic force J^ is recorded in conjunction with the narrative. Figure::ϋ: The attached θ^々田述 containing the preferred embodiment of the present invention will be described, but it should be understood before the description. A person skilled in the art can revise the invention described herein, and obtain the following: a description of the following description is a broad disclosure of the present invention and is not intended to limit the invention. Referring to the second figure, an exploded view of the heat dissipating device of the present invention is shown. The heat dissipating device of the present invention comprises a heat sink 6 forming a plurality of heat dissipating fins ' and the heat dissipating fins 6 form positioning grooves 7 on both sides thereof. The heat sink 6 has two positioning on the other side The bottom plate 9 defines a receiving surface 12, and the edge of the receiving surface 12 extends two positioning walls 14. The edge of the bottom plate 9 extends perpendicularly from the receiving surface 12 to two positioning pins 11, and the edge of the bottom plate 9_ The receiving surface 12 extends from the two supporting plates 15 , and the receiving surface 12 of the bottom plate 9 , the two positioning walls 14 and the two positioning pins 11 jointly define an area where the bottom plate 9 carries the memory card 1 , and the receiving surface 12 is in four corners. Each has a shaft hole 13; and a rain clamping member 16, the clamping member 16 has a rotating shaft 18, and an elastic portion 17 is extended from the rotating shaft 18, and the elastic portion applies an axial elastic force. In the embodiment, the elastic portion 17 is formed in a convoluted shape, and the rotating shaft 18 is pivotally connected to the shaft hole 13. In addition, the memory 2 of the memory card 1 has different heights due to different labels, and the positioning pin 11 The matching with the positioning hole 8 can be adjusted in parallel according to the memory 2 of different heights of the card, so that the width and the distance between the bottom plate 9 and the heat sink 6 can be adjusted in parallel. The figure shows a bottom view and a perspective view of the heat sink of the present invention, respectively. In the preferred embodiment, the rotating shaft 18 of the clamping member is pivotally connected to the shaft hole 13. The positioning pin 11 of the bottom plate 9 passes through the positioning hole 8 of the heat dissipation plate 6 (please refer to the second figure), and & 1 card is placed on the carrying area of the 6 floor, so that the heat sink $, the memory card 1 and the bottom plate 9 are sequentially stacked from top to bottom, so the heat generated by the memory card 1 The heat-dissipating fins of the heat sink 6 utilize the conductive properties of the 8 1270765 metal to dissipate heat. This further includes a two-conductor film, and the surface of the heat-dissipating device can be added to the surface to increase the contact surface. The hot film is placed on both sides of the memory card. Please refer to the fifth and fifth B pictures, the perspective view and the rear view of the thermal device. #本(4) The diverting part π is positioned in the positioning groove 7, the bomb
軸18與該彈性部”之間的部分Γ而擔部=該旋轉 旋轉軸18與該彈性部17之間 田 °防止該 該彈性部18提供一軸向彈力所二向:=多。因此’ 該定位槽7，可藉由擔部υ的頂靠提彈而=蜀於 軸向彈力，俾使該夾持元件16穩固地夾以：7之 該記憶卡1與該底板9之結合。 Μ政熱片6、 請參閱第六Α圖、第六Β圖，分別顯 — 之側視圖及本發明散熱裝置之侧視圖。第^A、图站兀件 自由狀態之夾持元件16，t該央持元件_ 明散熱裝置時，因該夾持元件16之彈性部^ 於該定位槽7上(請配合參閱第五A 接觸 6 提供-軸向彈力所賦予的爽持力，俾以二部π 該記憶卡1與該底板9穩固地結合。 請參閱第七A圖、第七B圖，分別顯示失 之侧視圖及本發明散熱裝置之側視圖。根據本發明=牛 —較佳實施例，第七A圖顯示一自由狀態之失持元: j6，且該夾持元件26之彈性部27形成下凹彎曲狀兀卷 遠失持元件26應用於本發明散熱裝置時，因該失持： 件26之彈性部27壓縮接觸於該定位槽7上（請配合= 1270765 J第二圖）’該彈性部27提供—轴向彈力所賦予 合。’俾使該韻Μ 6、雜料丨與該底板9穩固地結 - 啼苓閱第八圖，顯示夾持元件之侧視圖。本發明夾 水，件之另一較佳實施例，夾持元件36在旋轉軸38中 =形成-曲折部39 ’當該旋轉軸38樞接於該底板9 ^軸孔13時，該曲折部39提供該旋轉軸38定位之用， • 4使該夾持元件36於旋轉時，該旋轉軸38仍位於軸孔 13内而不會脫落。 、 明參閱弟九Α圖，顯示夾持元件之立體圖。本發明 f 一較佳實施例，夾持元件16在旋轉軸18末端處形成 一曲19，該夾持元件16的彈性部17形成迴旋狀。 明參閱第九B圖並配合第九A圖，顯示本發明散 ，裝置之後視圖。該夾持元件16實施於一定位槽7上； 當該旋轉軸18樞接於該底板9之軸孔13時，該曲折部 19提供該旋轉軸18定位之用，俾使該夾持元件16於旋 • 轉時，該旋轉軸丨8仍位於該軸孔13内而不會脫落。 在詳細說明本發明的較佳實施例之後，熟悉該項技 術人士可清楚的瞭解，在不脫離下述申請專利範圍與精 神下可進行各種變化與修改，且本發明亦不受限於說明 書中所舉實施例的實施方式。 1270765 【圖式簡單說明】 第一 A、一 B圖係顯示記憶卡插接於插接槽之示意 圖。 第二圖係顯示本發明散熱裝置之分解圖。 第三係顯示本發明散熱裝置之仰視圖。 第四圖係顯示本發明散熱裝置之立體圖。 第五A圖係顯示本發明散熱裝置之立體圖；第五B 圖係顯示本發明散熱裝置之後視圖。 第六A係顯示夾持元件之側視圖；第六B圖係顯 示本發明散熱裝置之側視圖。 第七A係顯示夾持元件之側視圖；第七B圖係顯 示本發明散熱裝置之側視圖。 弟八圖係顯不夹持元件之側視圖。 第九A圖係顯示夾持元件之立體圖；第九B圖係 顯示本發明散熱裝置之後視圖。 【主要元件符號說明】 1…記憶卡 2—記憶體 3…插接槽 4-—卡扣部 5_—凹部 6…散熱片 7™定位槽 8— 定位孔 9— 底板 1270765 11 —-定位銷 12—承接面 13…轴孔 14…定位壁 15—擔板 16、 26、36…夾持元件 17、 27、37…彈性部 18、 28、38——旋轉軸A portion between the shaft 18 and the elastic portion" and a portion between the rotating rotating shaft 18 and the elastic portion 17 prevents the elastic portion 18 from providing an axial elastic force in two directions: = more. The positioning groove 7 can be elastically clamped by the top of the shoulder portion, so that the clamping member 16 is firmly clamped: 7 the combination of the memory card 1 and the bottom plate 9. For the hot film 6, please refer to the sixth and sixth figures, respectively, the side view and the side view of the heat sink of the present invention. The ^A, the clamping element of the free state of the station, 16 When the heat dissipating device is used, the elastic portion of the clamping member 16 is on the positioning groove 7 (please refer to the fifth A contact 6 to provide the tension imparted by the axial elastic force, π The memory card 1 is firmly coupled to the bottom plate 9. Referring to Figures 7A and 7B, respectively, a side view of the lost side and a side view of the heat sink of the present invention are shown. 7A shows a loss state of a free state: j6, and the elastic portion 27 of the clamping member 26 forms a concave curved shape and a long lost bearing element. When applied to the heat dissipating device of the present invention, the elastic portion 27 of the member 26 is compressed and contacted with the positioning groove 7 (please cooperate with = 1270765 J, second figure) 'the elastic portion 27 provides - the axial elastic force imparted俾 俾 俾 俾 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 第八The clamping member 36 is in the rotating shaft 38 = forming - bending portion 39 '. When the rotating shaft 38 is pivotally connected to the bottom plate 9 ^ shaft hole 13 , the bent portion 39 provides the positioning of the rotating shaft 38, When the clamping member 36 is rotated, the rotating shaft 38 is still located in the shaft hole 13 without falling off. Referring to the drawings, a perspective view of the clamping member is shown. The preferred embodiment of the present invention, the clamping member 16 is formed at the end of the rotating shaft 18, and the elastic portion 17 of the clamping member 16 is formed in a convoluted shape. Referring to Figure 9B and in conjunction with Figure 9A, the present invention is shown in a rear view of the device. The component 16 is implemented on a positioning groove 7; when the rotating shaft 18 is pivotally connected to the shaft hole 13 of the bottom plate 9, the bent portion 19 is provided for positioning the rotating shaft 18, so that when the clamping member 16 is rotated, the rotating shaft 8 is still located in the shaft hole 13 without falling off. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the scope and spirit of the invention, and the invention is not limited to the embodiments of the embodiments set forth in the specification. BRIEF DESCRIPTION OF THE DRAWINGS The first A and B diagrams show a schematic view of the memory card being inserted into the insertion slot. The second figure shows an exploded view of the heat dissipation device of the present invention. The third system shows a bottom view of the heat dissipation device of the present invention. The fourth figure shows a perspective view of the heat sink of the present invention. Fig. 5A is a perspective view showing the heat sink of the present invention; and Fig. 5B is a rear view showing the heat sink of the present invention. The sixth A shows a side view of the clamping member; the sixth B shows a side view of the heat sink of the present invention. The seventh A shows a side view of the clamping member; the seventh B shows a side view of the heat sink of the present invention. The figure 8 shows a side view of the component that is not clamped. Fig. 9A is a perspective view showing the holding member; and Fig. B is a rear view showing the heat sink of the present invention. [Main component symbol description] 1... Memory card 2 - Memory 3... Insert slot 4 - Buckle portion 5_ - Concave portion 6 - Heat sink 7TM Locating slot 8 - Positioning hole 9 - Base plate 1270765 11 - Locating pin 12 - receiving surface 13 ... shaft hole 14 ... positioning wall 15 - support plate 16, 26, 36 ... clamping elements 17, 27, 37 ... elastic portion 18, 28, 38 - rotating shaft
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