JP2003218570A - Heat radiator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat radiator which effectively uses a space at the back of a circuit board and cools the elements. <P>SOLUTION: The heat radiator cools the element 7 mounted on the surface of the circuit board 5 and it is provided with a plate-type heat pipe 9 patched on the rear side of the element mounting part of the circuit board 5. The plate- type heat pipe 9 is kept at the rear face of the circuit board 5 by a holder 11 constituted of a retention module 13, a patch 15, a collar 17, conical head screws 19 and nuts 21. Thus, the heat radiator which effectively uses the dead space at the rear side of the circuit board 5 can be supplied with such constitution. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cooling an element such as a CPU mounted on a circuit board in an electronic device such as a computer.

[0002]

2. Description of the Related Art Electronic equipment such as a computer is provided with a heat dissipation device (element cooler) for cooling a semiconductor element such as a CPU mounted on a circuit board. . FIG. 9 is a perspective view schematically showing a conventional example of an element cooler mounted on a circuit board. The element cooler 100 includes a diffusion plate 103 made of copper or aluminum. A plurality of (only two are shown in FIG. 9) radiating fins 105 are provided on the upper surface of the diffusion plate 103.
Are erected in parallel with a predetermined gap. The element cooler 100 includes an element 10 such as a CPU on a circuit board 101.
The lower surface of the diffusion plate 103 is placed on the surface of 2a. The heat generated from the element 102a is dissipated by the heat dissipation plate 10
3 is dissipated and the heat is dissipated from the heat dissipation fin 105. The element cooler 100 includes a circuit board 10 and a band-like band 111.
It is attached to the claw 115 of the first element fixing portion 102b.

As described above, the conventional heat dissipation device is generally attached to the upper surface of the heating element (CPU). In recent years, with the miniaturization of electronic devices, the degree of integration and the mounting density of elements mounted in these electronic devices have been increasing. Therefore, the space above the CPU is also limited, and there is a demand for thinner coolers and further improved heat dissipation capability. In addition, the heat generation density increases with the increase in the degree of integration of the device, and in order to operate the device stably at high speed,
It seems that conventional cooling methods have limitations.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a heat dissipation device for cooling an element by effectively utilizing a space on the back side of a circuit board.

[0005]

In order to solve the above-mentioned problems, the present inventors decided to take heat from the back side of the circuit board through the board when cooling the element mounted on the surface of the circuit board. I paid attention. By doing so, the dead space on the back surface of the substrate can be effectively utilized.

According to the conventional wisdom so far, it is meaningless to radiate the heat of the element to the back side of the circuit board through the circuit board (also through the pin grid array), which is considered to have poor thermal conductivity. Although it does not seem to be true, the inventors of the present invention have conducted various developments and tests and found that it has a considerable cooling effect as described later.

Further, if heat is taken from the surface of the element, the heat dissipation ability can be further enhanced.

Therefore, the heat dissipation device of the present invention is a device for cooling an element mounted on the front surface of a circuit board, which includes a heat dissipation plate applied to the back surface side of the element mounting portion of the board, and the heat dissipation plate. And a holder for holding the substrate so as to contact the substrate. It is possible to provide a heat dissipation device that effectively utilizes the dead space on the back surface of the circuit board.

Further, by providing a heat dissipation plate which is applied to the surface of the element, a heat dissipation device having a higher heat dissipation capability can be provided.

If the heat dissipation plate includes a plate heat pipe, a heat dissipation device having a high heat transport capability can be provided. Here, if the heat dissipation plate is arranged so as to extend to the back surface side of the substrate, the heat dissipation performance can be further enhanced by the synergistic effect of the high heat transport capacity and the wide heat dissipation surface.
Further, if the heat dissipation plate is connected to the casing of the device having the circuit board, it is possible to diffuse the heat radiation through the casing having a large area and a high heat capacity.

In the present invention, if the heat radiating plate is applied to the back surface of the substrate via the good heat conductive insulating plate, the insulating state of the electric wiring portion on the back surface of the substrate is maintained, and
It is possible to closely connect the back surface of the substrate to which the heat of the element, which is the heating element, is transferred to the heat sink.

[0012]

DETAILED DESCRIPTION OF THE INVENTION A description will be given below with reference to the drawings. FIG. 1 is a diagram illustrating a structure of a heat dissipation device according to a first embodiment of the present invention, FIG. 1 (A) is a front sectional view,
FIG. 1B is a partial plan view. The heat dissipation device 1 cools a CPU 7 mounted on a circuit board 5 arranged in a personal computer case (housing) 3. The heat dissipation device 1
Includes a plate-type heat pipe (radiating plate) 9 and a holder 11 that holds the plate-type heat pipe 9 against the back surface of the circuit board 5. The holder 11 includes a retention module 13, a backing plate 15, a collar 17, and a flat head screw 1
9 and nut 21 are included. In the case of a commercially available personal computer, there is usually a space between the back surface of the circuit board 5 and the surface of the personal computer case 3, and the distance H is about 5 to 8 mm.

The CPU 7 is fitted in a PGA (Pin Grid Array, socket) 23 fixed to the surface of the circuit board 5. The retention module 13 includes a circuit board 5
Is arranged so as to surround the combined CPU 7 and PGA 23. An annular side wall 13a and a recess 13b surrounded by the side wall 13a are formed on the front side (upper side) of the retention module 13, and on the back side (lower side),
An annular pedestal 13c along the outer periphery and a recess 13d surrounded by the pedestal 13c are formed. The front recess 13b and the back recess 13d are separated by a flange 13e. An opening 13f where the PGA 23 and the CPU 7 are located is opened at the center of the flange 13e.

On the back surface of the circuit board 5, a plate-type heat pipe 9 is provided via a good heat conductive rubber sheet 25,
It is arranged so as to extend laterally (right side in the drawing) from a portion corresponding to the position of 7. Here, the portion corresponding to the position on the back side of the CPU 7 of the plate heat pipe 9 is the heat receiving portion 9a.
Therefore, the part apart from the same part becomes the heat dissipation part 9b. The rubber sheet 25 and the plate heat pipe 9 have substantially the same size. The rubber sheet 25 has high thermal conductivity and electrical insulation, and for example, Sarcon (registered trademark) of thermal conductive / flame retardant silicone rubber (manufactured by Fuji Polymer Co., Ltd., thermal conductivity 29 to 70 ×). 10cal / (cm ・ sec ・ ° C))
Can be used. In this way, by interposing the rubber sheet 25 having high thermal conductivity and electrical insulation between the plate-type heat pipe 9 and the back surface of the circuit board 5, electrical wiring or pins on the back surface of the circuit board 5 and the plate-type heat are provided. It is possible to electrically insulate the pipe 9 and perform good heat conduction between the rubber sheet 25 and the plate-type heat pipe 9. The thickness of the rubber sheet 25 is, for example, about 0.5 mm, and the thickness of the plate heat pipe 9 is, for example, about 1.9 mm.

The plate-type heat pipe 9 should be of the following type in which meandering pores or parallel pores serving as heat medium passages are formed in a relatively thin flat plate, or an eclectic type thereof. Is preferred. (1) Loop type meandering pore heat pipe (Japanese Patent Laid-Open No. 4-19
No. 0090, USP 5,219,020 FIG. 5) This heat pipe has the following characteristics. (A) Both ends of the pores are connected to each other so as to be freely flowable and sealed. (B) Part of the pores is a heat receiving part, and the other part is a heat radiating part. (C) The heat receiving portion and the heat radiating portion are alternately arranged, and the pores meander between the both portions. (D) Two-phase condensable fluid is enclosed in the pores. (E) The inner wall of the pore has a diameter equal to or smaller than the maximum diameter that allows the working fluid to circulate or move while the inside of the pore is always closed.

(2) Non-loop type meandering pore heat pipe (Japanese Patent No. 2714883, USP 5,219,020F)
(See IG1) This heat pipe does not have the characteristic (A) of the heat pipe of (1), that is, both ends of the pores are dead ends and are not connected to each other.

(3) Parallel-type micropore heat pipe
-33181, USP 5,737,840 FIG7
(See Reference) This heat pipe is provided with pores that connect adjacent pores in the heat receiving portion and the heat radiating portion (or an intermediate portion thereof).

The plate-type heat pipe 9 applied to the outer surface of the rubber sheet 25 is held on the circuit board 5 by the contact plate 15 applied from the outer surface (lower side of the drawing). The backing plate 15 is a plate made of stainless steel or the like and has a thickness of, for example, about 2.0 mm. The backing plate 15 is fixed to the back surface side of the circuit board 5, and the retention module 13 is fixed to the front surface side of the circuit board 5 with countersunk screws 19. Countersunk screw 19 is a backing plate 1
5 to reach the back surface of the circuit board 5 through the collar 17 and penetrate the circuit board 5 to the front surface. Then, it penetrates the pedestal 13c of the retention module 13, the tip projects from the bottom surface of the front recess 13b on the pedestal 13c, and is fixed by the nut 21. As a result, the retention module 13 is fixed to the front surface of the circuit board 5, and the rubber sheet 25, the plate-type heat pipe 9, and the contact plate 15 are fixed to the rear surface in this order.

The heat generated from the CPU 7 is PGA2.
3. The circuit board 5 is transmitted in the thickness direction to reach the rubber sheet 25. Since the rubber sheet 25 has high thermal conductivity, heat is transmitted in the thickness direction and reaches the heat receiving portion 9a of the plate heat pipe 9. The heat transmitted to the heat receiving portion 9a is directed to the heat radiating portion 9b (a portion away from the portion corresponding to the CPU of the plate heat pipe) along the direction of the pores in this pipe (rightward in the figure in this example). Move and radiate heat in the same area. Since the portion on the rear surface of the circuit board where the electric wiring and the pins are arranged is covered with the electrically insulating rubber sheet 25 as described above, this portion is not electrically connected to the plate heat pipe 9. , Does not hinder the performance of the CPU 7. In addition, the total thickness of each component (plate-type heat pipe 9, rubber sheet 25, contact plate 15) arranged in the space on the back surface of the circuit board is about 4.4 mm. It fits well within (6-8 mm). The plate type heat pipe 9 and the rubber sheet 25 are attached to the holder 1.
Since it is securely fixed to the circuit board 5 by means of 1 (retention module, contact plate, collar, countersunk screw and nut), it does not drop from the circuit board 5 or shift its position.

FIG. 2 is a plan view for explaining an example of the arrangement of the plate heat pipes of the heat dissipation device shown in FIG. Figure 2
(A) and (B) use two plate type heat pipes, and FIG. 2 (C) uses a heat pipe type heat diffusion plate.

In the heat dissipation device shown in FIG. 2A, two plate type heat pipes 9-1 and 9-2 are arranged in an L shape. The heat medium passage in each plate heat pipe 9 mainly extends in the longitudinal direction of each heat pipe. Here, the hatched portion in the drawing where the two plate heat pipes 9-1 and 2 overlap each other serves as a heat receiving portion (a portion corresponding to the position of the CPU), and the end of each plate heat pipe separated from the heat receiving portion. The part becomes a heat dissipation part.
The heat transmitted to the heat receiving portion of the plate heat pipe 9-1 on the upper side (circuit board side) moves to the heat radiating portion of the plate heat pipe and radiates the heat, and at the same time, the plate heat pipe on the lower side (outer side) is radiated. It is also transmitted to the heat receiving part of 9-2. Then, it moves to the heat radiating portion of the lower plate heat pipe to radiate heat.

The heat dissipation device shown in FIG. 2 (B) has two plate type heat pipes 9-1 and 9-2 arranged in a cross shape. Here, two plate type heat pipes 9-
The hatched portion in the drawing of the portion where 1 and 2 overlap is a heat receiving portion (a portion corresponding to the position of the CPU), and both end portions of each plate heat pipe separated from the portion are heat radiating portions.
The heat transmitted to the heat receiving part of the plate heat pipe 9-1 on the upper side (circuit board side) moves to both heat radiating parts of the plate heat pipe and radiates the heat, and at the same time, the plate heat on the lower side (outer side) is radiated. It is also transmitted to the heat receiving portion of the pipe 9-2. Then, it moves to both heat radiating portions of the lower plate heat pipe to radiate heat.

As described above, by using the two plate-type heat pipes, the heat transport capacity is enhanced, and high heat dissipation performance can be exhibited. Moreover, since the plate-type heat pipe is as thin as about 1.9 mm,
Even if two sheets are stacked, they can be placed in the space between the back surface of the circuit board and the personal computer case.

The heat dissipation device shown in FIG. 2C uses a heat pipe type heat diffusion plate 9 '. As an example of the heat pipe type heat diffusion plate 9 ', a plate in which two meandering narrow grooves are formed is surface-bonded through a common plate so that the meandering narrow grooves intersect at right angles (Japanese Patent Laid-Open No. 2001-2001). 1655
No. 82) can be used. The heat pipe type heat diffusion plate 9'can diffuse the amount of heat almost uniformly over the entire surface of the plate. Therefore, the heat is transferred from the heat receiving portion (hatched portion in the figure) of the heat pipe type heat diffusion plate 9'to the vicinity of the outer periphery of the plate and radiated.

FIG. 3 is a front sectional view for explaining the structure of the heat dissipation device according to the second embodiment of the present invention. Hereinafter, each component in the drawings will be denoted by the same reference numeral as that of each component corresponding to the heat dissipation device of FIG. Further, description of parts having the same structure and operation will be omitted, and only parts having different structures near the heat sink will be described. The heat dissipation device 31 of this example is
The heat dissipation portion 9b of the plate-type heat pipe 9 is connected to the back surface of the personal computer case 3.

The plate-type heat pipe 9 is bent so that its side surface has a step shape, and forms a heat receiving portion 9a, a heat radiating portion 9b, and an inclined portion 9c connecting both portions. The inner surface (upper side in the drawing) of the heat receiving portion 9a is fixed to the portion of the back surface of the circuit board facing the CPU 7 with the holder 11 via the rubber sheet 25. The rubber sheet 25 has the same size as the heat receiving portion and is slightly larger than the CPU 7. On the other hand, the heat radiating portion 9b has an outer surface (lower side in the drawing) attached to the back surface of the personal computer case 3 via a rubber sheet 33. The rubber sheet 33 has the above-mentioned high thermal conductivity.
A flame-retardant silicone rubber, Sarcon (registered trademark) (manufactured by Fuji Polymer Industries Co., Ltd.) can be used.

In the heat dissipation device 31 of this example, the heat reaching the heat dissipation portion 9b of the plate heat pipe 9 is transferred to the rubber sheet 33.
It is transmitted to the PC case 3 via and is radiated here.
Since the personal computer case 3 is a plate made of aluminum or the like, it can effectively dissipate heat.

FIG. 4 is a front sectional view for explaining the structure of the heat dissipation device according to the third embodiment of the present invention. The heat dissipation device 41 of this example includes a heat dissipation part 9 of the plate heat pipe 9.
The fin 43 is erected on b.

The plate type heat pipe 9 has a heat receiving portion 9a.
The inner surface (upper side in the figure) is disposed on the rear surface of the circuit board facing the CPU 7 via the rubber sheet 25, and is fixed to the circuit board by the holder 11. The rubber sheet 25 has the same size as the heat receiving portion 9a and is slightly larger than the CPU 7. The heat radiating portion 9c extends laterally (rightward in the drawing) from the heat receiving portion 9a, and the heat radiating fins 43 are fixed to the outer surface of the same portion (the lower side in the drawing) by a heat conductive adhesive 45.

In this heat dissipation device 41, since the heat dissipation fins 43 are provided upright on the heat dissipation part 9b, the heat dissipation capability can be enhanced. When the dimension H of the gap between the circuit board 5 and the personal computer case 3 is large (10 to 20 mm), it is preferable to use this heat dissipation device.

FIG. 5 is a front sectional view for explaining the structure of the heat dissipation device according to the fourth embodiment of the present invention. The heat dissipation device 51 of this example uses a general element cooler 53 as a heat dissipation plate instead of the plate heat pipe. The element cooler 53 includes a heat receiving plate 55 and radiating fins 57. The heat receiving plate 55 is made of a material having high thermal conductivity such as aluminum.

The heat receiving plate 55 of the element cooler 53 is a holder 11 which is arranged on the rear surface of the circuit board facing the CPU 7 via the rubber sheet 25 and which includes the retention module 13, the collar 17, the flat head screw 19, and the nut 21. It is fixed to the circuit board. The countersunk screw 19 is directly passed through the heat receiving plate 55. On the outer surface (lower surface in the figure) of the heat receiving plate 55, heat radiation fins 57 are thermally connected and erected. The size of the heat receiving plate 55 is substantially equal to the size of the retention module 13.

The heat dissipation device 51 uses a general element cooler 53 as a heat dissipation plate, but a certain cooling effect can be expected. Also in this heat dissipation device 51, since the heat dissipation fins are provided upright in the heat dissipation part, it is suitable when the clearance between the circuit board and the personal computer case is large.

FIG. 6 is a front sectional view for explaining the structure of the heat dissipation device according to the fifth embodiment of the present invention. The back surface side of the circuit board of the heat dissipation device 61 of this example has substantially the same structure as the heat dissipation device of FIG. Then, on the surface side of the circuit board, C
A general element cooler (heat sink) applied to the surface of PU
Further has 63. The element cooler 63 includes a heat receiving plate 65 and heat radiation fins 67. The heat receiving plate 65 is made of a material having high thermal conductivity such as aluminum.

The upper surface of the CPU 7 is coated with grease having high thermal conductivity, and the back surface of the heat receiving plate 65 of the element cooler 63 is applied. The heat receiving plate 65 is arranged on the upper surface of the CPU 7 via a spacer 69, and is a holder 11 made up of a retention module 13, a collar 17, a backing plate 15, countersunk screws 19 and nuts (not shown). It is fixed together with the mold heat pipe 9. Since the heat dissipation device 61 can radiate heat from the front and back surfaces of the CPU, it is suitable for cooling the CPU that generates a large amount of heat.

FIG. 7 is a front sectional view illustrating a heat dissipation device according to a sixth embodiment of the present invention. The back side of the heat dissipation device 71 of this example has a structure substantially similar to that of the heat dissipation device of FIG. However, on the surface of the circuit board 7, the element cooler 7
00 (heat sink, Zen-SCR325-2F (registered trademark), manufactured by TS Heatronix, Japanese Patent Application 2001-
No. 2212) is attached. Element cooler 7
00 is mainly the heat lane radiator 703 and the case 7
10 and clips 730. Same element cooler 7
00 is attached to the surface of the circuit board 7 by the attachment plate 73.

The mounting plate 73 is provided on the front surface side of the circuit board 5,
It is fixed with countersunk screws 19. The countersunk screw 19 is passed through the backing plate 15 and reaches the back surface of the circuit board 5 through the collar 17,
The circuit board 5 is penetrated to the surface. Plate screw 19 is color 75
Project the mounting plate 73 through the
Fixed by.

The heat lane radiator 703 comprises a heat receiving plate 704, a plate type heat pipe 705 which is thermally connected to the heat receiving plate 704, and radiating fins 707 which are thermally connected to the plate type heat pipe 705. To be done. As shown in the figure, the plate heat pipe 705 is spirally bent to form five rectangular loops. Further, one side (bottom side in this example) of each rectangular loop is overlapped, and a space is formed between the sides (top side in this example) of each loop that face this side. The overlapped sides have high thermal conductivity with each other (such as brazing)
The heat receiving plate 704 is connected to the lower surface of the lowermost side by a method having high thermal conductivity. Further, a radiation fin 707 is arranged in the space between the upper sides, and the upper and lower sides of the fin are connected to the upper sides of the loops by a method having high thermal conductivity (brazing or the like).

The case 710 has a cubic box shape and an open bottom. A leaf spring 727 is attached to the lower surface of the top plate 711 of the case 710. The leaf spring 727 has a shape in which the central portion projects downward, one end is fixed to a pin 726 provided on the lower surface of the top plate 711, and the other end is a free end. A protrusion 728 is formed on the lower surface of the central portion of the spring 727.
Are formed. Fans (not shown) are incorporated in the front and rear side plates of the case 710.

The clip 730 is provided on the left and right side plates 714 and 715 of the case 710, and is a combination of a clip catch piece 731, a clip lever piece 734, and a clip cover 737 that covers a part of them. An engaging portion that engages with the mounting plate 73 is formed at one end of the clip catch piece 731, and the other end is slidably engaged with one end of the clip lever 734. When the clip lever 734 is pushed toward the case, the engaging portion of the clip catch piece 731 engages with the engaging portion of the mounting plate 73, and when the lever 734 is released from the case, the engaging portion of the mounting plate 73 engages. Remove from the joint.

When the element cooler 700 is attached to the upper surface of the CPU, first, heat conductive grease is applied to the surface of the CPU 7. Then, one clip lever 734 is expanded outward so that the engaging portion of the clip catch piece 731 is engaged with the engaging portion of the mounting plate 73. After the engagement, while pushing the clip lever 734 toward the case, the case 710 is slid to bring the heat receiving plate 704 of the heat lane radiator 703 into close contact with the surface of the CPU 7. Next, the other clip lever 734 is expanded outward so that the engaging portion of the clip catch piece 731 is engaged with the engaging portion of the mounting plate 73. At this time, the leaf spring 727 inside the case pushes the heat lane radiator 703 downward, and the heat receiving plate 704 and the CP
Maintains U7 adhesion.

FIG. 8 is a plan view illustrating the structure of a pad plate that can be used in the heat dissipation device of FIG. Pad plate 85 of this example
Is made of stainless steel or the like, and has a rubber sheet 86 on one surface.
Are glued together. The rubber sheet 86 can also use the above-mentioned highly heat-conductive and flame-retardant silicone rubber. Pad 8
Through holes 85a for countersunk screws are formed at the four corners of No. 5.
The backing plate 85 is arranged so that the rubber sheet 86 is in contact with the CPU facing portion on the back surface of the circuit board 5, and the through hole 8 of the same plate
It is fixed to the circuit board with countersunk screws 19 which are passed through from 5a.

The heat dissipation device 71 dissipates heat from the front and back surfaces of the CPU 7, and the element cooler 700 mounted on the front surface has a particularly high heat dissipation capability, so that it can be applied to a CPU having a considerably large heat generation amount.

Next, the test results of the cooling effect of the heat dissipation device of this embodiment will be described. Start the computer, C
The temperature difference between the temperature of the CPU after the load on the PU and the inner surface of the personal computer case was measured for this example and the comparative example.

Test conditions CPU: Intel Pentium (registered trademark) 4, 2.0 GH
z, motherboard: ASUS P4B, memory: SDRAM 384MB, OS: Windows (registered trademark) Me, measurement software: ASUS PC Probe, thermometer: CPU and built-in motherboard.

Measuring method After starting the personal computer and the OS, start the measurement software. Then, it waits until the CPU and the temperature inside the case that can be read by the measurement software become constant (about 15 minutes). After that, the benchmark software Super π (2,900,000 digits) is activated to load the CPU. The CPU and the temperature inside the case at the end of the software are measured.

Table 1 shows the samples (comparative examples and examples) and the results.

[Table 1] Here, Samples 1 and 2 are cases where a heat dissipation device (see FIG. 9) is attached only to the front side of the CPU (comparative example), and Samples 3, 4, and 5 are cases where heat dissipation devices are attached to the front and back sides of the CPU. This is the present embodiment. Sample 3 standard product (B
ox cooler) indicates an element cooler of the heat dissipation device of FIG. 9. Zen-SCR325-2F for samples 4 and 5
Is an element cooler used on the surface side of the heat dissipation device of FIG. 7, and the backing plate of Sample 4 is the backing plate 85 shown in FIG.

When the heat dissipation device is attached only to the surface of the CPU (Samples 1 and 2), the temperature difference is 27 ° C. when the standard product is used, and 23 ° C. when the Zen-SCR325-2F is used. It is 4 ℃ lower than the product. On the other hand, Samples 3 to 5 have a temperature of 18 to 21 ° C. As described above, in the case where the heat dissipation devices are attached to the front and back surfaces of the CPU (Samples 3 to 5), the temperature drop is larger than that in the case where they are attached only to the front surface. Furthermore, when a plate type heat pipe is used for the heat dissipation device attached to the back surface of the CPU, the temperature difference is the largest, which is particularly effective.

[0049]

As is apparent from the above description, according to the present invention, it is possible to provide a heat dissipation device and method for effectively utilizing the space on the back side of the circuit board to cool the element.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a structure of a heat dissipation device according to a first embodiment of the present invention, FIG. 1 (A) is a front sectional view, FIG.
(B) is a partial plan view.

FIG. 2 is a plan view illustrating an example of an arrangement state of plate heat pipes of the heat dissipation device of FIG.

FIG. 3 is a front cross-sectional view illustrating the structure of the heat dissipation device according to the second embodiment of the invention.

FIG. 4 is a front sectional view illustrating the structure of a heat dissipation device according to a third embodiment of the invention.

FIG. 5 is a front sectional view illustrating the structure of a heat dissipation device according to a fourth embodiment of the present invention.

FIG. 6 is a front sectional view for explaining the structure of a heat dissipation device according to a fifth embodiment of the present invention.

FIG. 7 is a front sectional view illustrating a structure of a heat dissipation device according to a sixth embodiment of the present invention.

8 is a plan view illustrating the structure of a pad plate that can be used in the heat dissipation device of FIG.

FIG. 9 is a perspective view schematically showing a conventional example of an element cooler mounted on a circuit board.

[Explanation of symbols]

1 Heat Dissipator 3 PC Case (Case) 5 Circuit Board 7 CPU 9 Plate Type Heat Pipe (Heat Radiating Plate) 11 Holding Tool 13 Retention Module 15 Retaining Plate 17 Color 19 Flat Head Screw 21 Nut 23 PGA 25 Good Thermal Conductive Rubber Sheet 31 Heat dissipation device 33 Rubber sheet 41 Heat dissipation device 43 Fin 45 Heat conductive adhesive 51 Heat dissipation device 53 Element cooler 55 Heat receiving plate 57 Heat dissipation fin 61 Heat dissipation device 63 Element cooler (heat dissipation plate) 65 Heat receiving plate 67 Radiation fin 69 Spacer 71 Heat dissipation Device 73 Mounting plate 75 Color 85 Patch plate 86 Rubber sheet 700 Element cooler 703 Heat lane radiator 704 Heat receiving plate 710 Case 730 Clip

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 23/427 H01L 23/36 Z H05K 1/02 23/46 B 23/36 D (72) Inventor Matsumoto Toshihiro 3-11-4 Iwatokita, Komae-shi, Tokyo F-Term inside Thies Heatronics Co., Ltd. (reference) 5E322 AA02 AB01 AB02 DB08 FA04 5E338 BB71 EE02 5F036 AA01 BB05 BB21 BB60 BC03 BC23 BC33 BC35

Claims (6)

[Claims] 1. A device for cooling an element mounted on a front surface of a circuit board, comprising: a heat radiating plate applied to the back surface side of the element mounting portion of the board; and a heat radiating plate held so as to contact the board. A heat dissipation device, comprising: 2. The heat dissipation device according to claim 1, further comprising a heat dissipation plate applied to the surface of the element. 3. The heat dissipation device according to claim 1, wherein the heat dissipation plate includes a plate heat pipe. 4. The heat dissipation device according to claim 1, wherein the heat dissipation plate is applied to the back surface of the substrate via a good heat conductive insulating plate. 5. The heat dissipation device according to claim 1, wherein the heat dissipation plate extends to the back surface side of the substrate. 6. The heat dissipation device according to claim 1, wherein the heat dissipation plate is connected to a casing of a device having the circuit board.