CN102279637A - Expansion card device and radiator thereof - Google Patents
Expansion card device and radiator thereof Download PDFInfo
- Publication number
- CN102279637A CN102279637A CN2010101958289A CN201010195828A CN102279637A CN 102279637 A CN102279637 A CN 102279637A CN 2010101958289 A CN2010101958289 A CN 2010101958289A CN 201010195828 A CN201010195828 A CN 201010195828A CN 102279637 A CN102279637 A CN 102279637A
- Authority
- CN
- China
- Prior art keywords
- expansion board
- radiating part
- substrate
- endothermic section
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Provided is an expansion card device, comprising an expansion card and a radiator. The expansion card comprises a card body and an electronic element which is arranged on the card body and is adjacent to one end of the card body. The radiator comprises a substrate, which is U-shaped and has a heat absorption portion, a radiating portion opposite to the heat absorption portion and a connecting portion which is connected between the heat absorption portion and the radiating portion. An accommodation space is formed between the heat absorption portion and the radiating portion. The end of the card body of the expansion card is inserted in the accommodation space of the substrate of the radiator. The heat absorption portion and the radiating portion of the substrate are respectively located at two sides of the card body of the expansion card, so that ends of the card body are clamped between the heat absorption portion and the radiating portion. The heat absorption portion of the substrate is attached on the electronic element. The radiator allows effective application of the spaces at two sides of the card body of the expansion card.
Description
Technical field
The present invention relates to a kind of heating radiator, relate in particular to a kind of expansion board device that is used for the heating radiator of expansion board and uses this heating radiator.
Background technology
Expansion card, for example sound card, network interface card, video card etc. generally include a plate body and are located at some electronic components on this plate body.This plate body has a component side (component side) and a face of weld (solder side) relative with this component side, these electronic components are set up on this component side, electronic component then seldom is set on this face of weld, it is mainly used to be provided with scolding tin, so that electronic component is welded on the plate body.
Along with the integrated level of chip is more and more higher, chip thermal value on number of chips and the expansion board is also more and more, for heat distributes, normal adopt component side at plate body that one heating radiator is set to come chip is dispelled the heat, this heating radiator comprises a substrate and is located at some heat radiator on this substrate, this substrate is attached on the chip to absorb the heat that it is produced, and under limited space constraint, the area of dissipation of this heating radiator must maximize as far as possible.Yet when being used for thin type electronic device such as rack-mount server, notebook computer when expansion card, owing to be subjected to the restriction in space, and the number of chips on the expansion board component side too much influences the flowability of radiating airflow, causes the radiating requirements that is difficult to satisfy chip.
Summary of the invention
In view of this, be necessary to provide a kind of heating radiator that is used for expansion board, and a kind of expansion board device that uses this heating radiator is provided with better cooling efficiency.
A kind of heating radiator that is used for expansion board, comprise a substrate, described substrate takes the shape of the letter U, comprise an endothermic section, a radiating part relative and be connected in a junction between this endothermic section and the radiating part with this endothermic section, form a receiving space between described endothermic section and the radiating part, described endothermic section is used for being sticked with the electronic component that is arranged on the component side of this expansion board, described receiving space is used to accommodate the end of this expansion board, and described radiating part extends on this expansion board face of weld relative with described component side.
A kind of expansion board device, comprise an expansion board and a heating radiator, this expansion board comprises a plate body and is located on this plate body and an electronic component of close plate body one end setting, described heating radiator comprises a substrate, described substrate takes the shape of the letter U, comprise an endothermic section, a radiating part relative with this endothermic section, and be connected in a junction between this endothermic section and the radiating part, form a receiving space between described endothermic section and the radiating part, the end of the plate body of expansion board is inserted in the receiving space of substrate of heating radiator, the endothermic section of substrate and radiating part respectively in the both sides of the plate body of expansion board so that the end clips of plate body is located between endothermic section and the radiating part, the endothermic section of substrate is attached on the described electronic component.
Compare prior art, in the above-mentioned expansion board device, the radiating part of the substrate of heating radiator walk around expansion board plate body the end and extend to the opposite side of expansion board and the end clips of plate body be located between endothermic section and the radiating part, not only improve the radiating airflow flowability and the radiating effect of plate body component side, and increase total area of dissipation of heating radiator and the space of face of weld one side of expansion board is utilized effectively.
Description of drawings
With reference to the accompanying drawings, in conjunction with the embodiments the present invention is further described.
Fig. 1 is the three-dimensional assembly diagram of expansion board device one preferred embodiment of the present invention.
Fig. 2 is the three-dimensional exploded view of Fig. 1.
Fig. 3 is the three-dimensional exploded view of another embodiment of the heating radiator in the expansion board device of the present invention.
The main element symbol description
Radiating part 212
Connecting portion 213
Receiving space 24
Embodiment
A Fig. 1 and a preferred embodiment that Figure 2 shows that expansion board device of the present invention.The heating radiator 20 that this expansion board device comprises an expansion board 10 and is used for this expansion board 10 is dispelled the heat.
This expansion board 10 comprises a plate body 11 and is located at electronic component 12,13 on this plate body 11.This plate body 11 has a component side that is positioned at upside and a face of weld that is positioned at downside, and described electronic component 12,13 all is located on the component side of plate body 11, and electronic component 12 is near an end setting of plate body 11.
This heating radiator 20 comprises a substrate 21 and is located at some first heat radiator 22 and some second heat radiator 23 on this substrate 21.This substrate 21 takes the shape of the letter U, and comprises a flat endothermic section 211, a flat radiating part 212 relative with this endothermic section 211 and is connected in a flat connecting portion 213 between this endothermic section 211 and the radiating part 212.This endothermic section 211 is the parallel interval setting with radiating part 212, and forms a receiving space 24 between this endothermic section 211 and radiating part 212.The inside surface that described endothermic section 211 has towards radiating part 212 reaches an outside surface of radiating part 212 dorsad, described first heat radiator 22 is located on the outside surface of endothermic section 211 and is the parallel interval setting, forms one first gas channel 221 between every two first adjacent heat radiator 22.Described radiating part 212 has towards the endothermic section 211 inside surface and an outside surface of endothermic section 211 dorsad, described second heat radiator 23 is located on the outside surface of radiating part 212 and is the parallel interval setting, form one second gas channel 231 between every two second adjacent heat radiator 23, the bearing of trend of this second gas channel 231 is parallel with the bearing of trend of first gas channel 221, and vertical with the connecting portion 213 of substrate 21.In the present embodiment, described first heat radiator 22 is extended to form by endothermic section 211 outside surface one, and described second heat radiator 23 is extended to form by the outside surface one of radiating part 212.
This heating radiator 20 is installed on expansion board 10 time, the end that expansion board 10 is provided with electronic component 12 is inserted in the receiving space 24 of heating radiator 20, the endothermic section 211 and the radiating part 212 of heating radiator 20 lays respectively at the both sides of the plate body 11 of expansion board 10, be component side one side that the endothermic section 211 of heating radiator 20 is positioned at plate body 11, the radiating part 212 of heating radiator 20 then is positioned at face of weld one side of plate body 11.The inside surface of this endothermic section 211 is attached on the electronic component 12 and with these electronic component 12 heat conduction and contacts.Also can be coated with one deck heat-conducting medium such as heat conductive silica gel between this endothermic section 211 and the electronic component 12, to increase heat conduction efficiency.
In this expansion board device, the radiating part 212 of the substrate 21 of heating radiator 20 walk around expansion board 10 plate body 11 the end and extend to face of weld one side of expansion board 10 and the end clips of plate body 11 be located between endothermic section 211 and the radiating part 212, and this radiating part 212 is provided with some second heat radiator 23, not only increase the area of dissipation of heating radiator 20, and the space of face of weld one side of expansion board 10 is utilized effectively.
In the above-mentioned heating radiator 20, second heat radiator 23 on the radiating part 212 of substrate 21 is extended to form by the outside surface one of radiating part 212, described second heat radiator 23 also can separate manufacturing with this radiating part 212, and then combines so that process, thereby reduces production costs.Be illustrated in figure 3 as second embodiment of heating radiator 20a, be with the difference of last embodiment, second heat radiator 23 of this heating radiator 20a is manufacturing respectively with substrate 21, these second heat radiator 23 and a flat pedestal 25 are one-body molded, and this pedestal 25 is fixedly arranged on the outside surface of radiating part 212 of substrate 21.Can combine by the mode of welding between the radiating part 212 of described pedestal 25 and substrate 21, or by screw closure together, and between scribbles one deck heat-conducting medium such as heat conductive silica gel.
Claims (9)
1. heating radiator that is used for expansion board, comprise a substrate, it is characterized in that: described substrate takes the shape of the letter U, comprise an endothermic section, a radiating part relative and be connected in a junction between this endothermic section and the radiating part with this endothermic section, form a receiving space between described endothermic section and the radiating part, described endothermic section is used for being sticked with the electronic component that is arranged on the component side of this expansion board, described receiving space is used to accommodate the end of this expansion board, and described radiating part extends on this expansion board face of weld relative with described component side.
2. the heating radiator that is used for expansion board as claimed in claim 1 is characterized in that: the inside surface that this endothermic section has towards radiating part reaches an outside surface of radiating part dorsad, and some first heat radiator are set on the outside surface of described endothermic section at interval.
3. the heating radiator that is used for expansion board as claimed in claim 2 is characterized in that: the inside surface that this radiating part has towards the endothermic section reaches an outside surface of endothermic section dorsad, and some second heat radiator are set on the outside surface of described radiating part at interval.
4. the heating radiator that is used for expansion board as claimed in claim 3, it is characterized in that: form one first gas channel between the two first adjacent heat radiator, form one second gas channel between the two second adjacent heat radiator, the bearing of trend of described first gas channel is parallel with the bearing of trend of described second gas channel.
5. the heating radiator that is used for expansion board as claimed in claim 4 is characterized in that: the bearing of trend of the bearing of trend of described first gas channel and second air-flow is vertical with the connecting portion of substrate.
6. the heating radiator that is used for expansion board as claimed in claim 3 is characterized in that: the endothermic section of described substrate, radiating part and connecting portion all are tabular.
7. the heating radiator that is used for expansion board as claimed in claim 3 is characterized in that: described first heat radiator and second heat radiator and substrate are one-body molded.
8. the heating radiator that is used for expansion board as claimed in claim 3 is characterized in that: described second heat radiator separates with substrate to be made, and described second heat radiator and a pedestal are one-body molded, and this pedestal is fixed on the radiating part of substrate.
9. expansion board device, comprise an expansion board and a heating radiator, this expansion board comprises a plate body and is located on this plate body and an electronic component of close plate body one end setting, it is characterized in that: described heating radiator is any described heating radiator in the claim 1 to 8, the end of the plate body of this expansion board is inserted in the receiving space of substrate of heating radiator, the endothermic section of this substrate and radiating part respectively in the both sides of the plate body of expansion board so that the end clips of plate body is located between endothermic section and the radiating part, the endothermic section of substrate is attached on the described electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101958289A CN102279637A (en) | 2010-06-09 | 2010-06-09 | Expansion card device and radiator thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101958289A CN102279637A (en) | 2010-06-09 | 2010-06-09 | Expansion card device and radiator thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102279637A true CN102279637A (en) | 2011-12-14 |
Family
ID=45105124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101958289A Pending CN102279637A (en) | 2010-06-09 | 2010-06-09 | Expansion card device and radiator thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102279637A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106933317A (en) * | 2017-03-21 | 2017-07-07 | 中车青岛四方车辆研究所有限公司 | A kind of heat abstractor for electronic element radiating |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1722057A (en) * | 2004-07-16 | 2006-01-18 | 富准精密工业(深圳)有限公司 | Heat dissipation device |
| CN200990051Y (en) * | 2006-09-01 | 2007-12-12 | 利民科技开发有限公司 | Main board internal storage radiating device |
| CN201066482Y (en) * | 2007-02-05 | 2008-05-28 | 深圳市鑫全盛工贸有限公司 | A memory heat radiator |
| CN101557696A (en) * | 2008-04-11 | 2009-10-14 | 富准精密工业(深圳)有限公司 | Radiator unit |
-
2010
- 2010-06-09 CN CN2010101958289A patent/CN102279637A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1722057A (en) * | 2004-07-16 | 2006-01-18 | 富准精密工业(深圳)有限公司 | Heat dissipation device |
| CN200990051Y (en) * | 2006-09-01 | 2007-12-12 | 利民科技开发有限公司 | Main board internal storage radiating device |
| CN201066482Y (en) * | 2007-02-05 | 2008-05-28 | 深圳市鑫全盛工贸有限公司 | A memory heat radiator |
| CN101557696A (en) * | 2008-04-11 | 2009-10-14 | 富准精密工业(深圳)有限公司 | Radiator unit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106933317A (en) * | 2017-03-21 | 2017-07-07 | 中车青岛四方车辆研究所有限公司 | A kind of heat abstractor for electronic element radiating |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7839643B1 (en) | Heat spreader for memory modules | |
| US7079396B2 (en) | Memory module cooling | |
| CN101188217B (en) | Cooling structure for array chip module | |
| US8459343B2 (en) | Thermal module assembly and heat sink assembly having at least two engageable heat sinks | |
| US8004846B2 (en) | Heat radiator | |
| CN109588006B (en) | Heat dissipation device of expansion card and expansion card assembly with heat dissipation function | |
| CN203839574U (en) | Connector, connector assembly and equipment | |
| US20130206367A1 (en) | Heat dissipating module | |
| CN106233552A (en) | circuit structure and electric connection box | |
| CN102439714A (en) | Heat sink for a protrusion-type ic package | |
| CN109727937A (en) | Sub-assembly and related systems and methods comprising heat dissipation element | |
| CN101808490A (en) | Heat dissipating device | |
| US8579016B2 (en) | Heat dissipation device with heat pipe | |
| US7248479B2 (en) | Thermal management for hot-swappable module | |
| KR101002989B1 (en) | heat sink for electric and electronic products with propagation heat | |
| CN102142407B (en) | Heat conducting pad | |
| US20070102795A1 (en) | Radiator plate and semiconductor device | |
| CN100464622C (en) | Radiator | |
| CN103563501A (en) | Radiator structure | |
| CN1964614B (en) | Circuit arrangement, especially frequency converter | |
| CN101203122A (en) | Dual heat source radiating module | |
| JP2016071269A (en) | Electronic apparatus and system | |
| CN102279637A (en) | Expansion card device and radiator thereof | |
| CN101115368A (en) | Heat radiating device | |
| US20050199377A1 (en) | Heat dissipation module with heat pipes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111214 |