TWI799180B - Server - Google Patents

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TWI799180B
TWI799180B TW111108711A TW111108711A TWI799180B TW I799180 B TWI799180 B TW I799180B TW 111108711 A TW111108711 A TW 111108711A TW 111108711 A TW111108711 A TW 111108711A TW I799180 B TWI799180 B TW I799180B
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module
server
casing
storage module
front side
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TW111108711A
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Chinese (zh)
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TW202336558A (en
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王淑敏
張帥
趙秀華
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英業達股份有限公司
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Abstract

A server including a chassis, a motherboard assembly, a power assembly, a network card assembly and a first storing assembly is disclosed. The chassis has a front side and a rear side that are opposite. The motherboard assembly is disposed in the chassis and located between the front side and the rear side. The power assembly is disposed on the rear side of the chassis and is electrically connected to the motherboard assembly. The network card assembly is disposed on the front side of the chassis and is electrically connected to the motherboard assembly. The motherboard assembly is located between the power assembly and the network card assembly. The first storing assembly is disposed on the front side of the chassis and is electrically connected to the motherboard assembly.

Description

伺服器server

本發明係關於一種電子裝置,特別係關於一種伺服器。The present invention relates to an electronic device, in particular to a server.

隨著雲端技術的快速發展,廠商不斷推出各種伺服器。典型的伺服器包含機殼以及設置於機殼中的主機板、硬碟模組、電源模組、網路卡模組及風扇模組。一般來說,為了方便硬碟模組的拆裝,硬碟模組會設置在機殼的前側。因此,機殼的前側之空間便不足以再設置網路卡,而使得網路卡必須設置在機殼的後側。With the rapid development of cloud technology, manufacturers continue to launch various servers. A typical server includes a casing and a motherboard, a hard disk module, a power supply module, a network card module and a fan module disposed in the casing. Generally speaking, in order to facilitate the disassembly and assembly of the hard disk module, the hard disk module will be arranged on the front side of the casing. Therefore, the space on the front side of the casing is not enough to install the network card, so the network card must be arranged on the rear side of the casing.

然,由於網路卡設置於機殼的後側,因此風扇導引的氣流會先經過主機板上溫度較高的熱源,才會經過網路卡。如此一來,在吸收主機板上的熱源所產生的熱之後,風扇導引的氣流與網路卡之間的溫度差便會減小,而使得網路卡難以被所述氣流冷卻。如此一來,熱便容易累積於伺服器中而降低伺服器整機的散熱效率。總上所述,傳統的伺服器會有難以在維持拆裝硬碟的方便性之同時兼顧伺服器整機的散熱效率之問題。However, since the network card is arranged on the rear side of the casing, the airflow guided by the fan will first pass through the heat source with a higher temperature on the main board before passing through the network card. In this way, after absorbing the heat generated by the heat source on the motherboard, the temperature difference between the airflow guided by the fan and the network card is reduced, making it difficult for the network card to be cooled by the airflow. In this way, the heat is easy to accumulate in the server and reduce the heat dissipation efficiency of the whole server. As mentioned above, traditional servers have the problem that it is difficult to maintain the convenience of disassembling and installing hard disks while taking into account the heat dissipation efficiency of the whole server.

本發明在於提供一種伺服器,以在維持拆裝儲存模組的方便性之同時兼顧伺服器整機的散熱效率。The present invention is to provide a server to maintain the convenience of disassembling and assembling the storage module while taking into account the heat dissipation efficiency of the whole server.

本發明一實施例所揭露之一種伺服器包含一機殼、一主機板組件、一電源模組、一網路卡模組以及一第一儲存模組。機殼具有彼此相對的一前側以及一後側。主機板組件設置於機殼並介於前側以及後側之間。電源模組設置於機殼的後側並電性連接於主機板組件。網路卡模組設置於機殼的前側並電性連接於主機板組件。主機板組件介於電源模組以及網路卡模組之間。第一儲存模組設置於機殼的前側並電性連接於主機板組件。A server disclosed in an embodiment of the present invention includes a casing, a motherboard assembly, a power supply module, a network card module and a first storage module. The casing has a front side and a rear side opposite to each other. The motherboard assembly is arranged on the case and interposed between the front side and the rear side. The power supply module is arranged on the rear side of the casing and is electrically connected to the motherboard assembly. The network card module is arranged on the front side of the casing and is electrically connected to the motherboard assembly. The motherboard components are between the power supply module and the network card module. The first storage module is arranged on the front side of the casing and is electrically connected to the motherboard assembly.

根據上述實施例所揭露之伺服器,第一儲存模組以及網路卡模組皆設置於機殼的前側。因此,維修人員能從機殼的前側方便地拆裝第一儲存模組。並且,風扇導引的氣流會先經過網路卡才經過主機板組件,這增加了上述氣流與網路卡模組之間的溫度差,而使上述氣流能有效地冷卻網路卡模組。如此一來,便能在維持拆裝儲存模組的方便性之同時兼顧伺服器整機的散熱效率。According to the server disclosed in the above embodiments, the first storage module and the network card module are both arranged on the front side of the casing. Therefore, maintenance personnel can conveniently disassemble and assemble the first storage module from the front side of the casing. Moreover, the airflow guided by the fan passes through the network card first and then passes through the motherboard assembly, which increases the temperature difference between the airflow and the network card module, so that the airflow can effectively cool the network card module. In this way, the heat dissipation efficiency of the whole server can be taken into account while maintaining the convenience of disassembling and assembling the storage module.

以下在實施方式中詳細敘述本發明之實施例之詳細特徵以及優點,其內容足以使任何本領域中具通常知識者了解本發明之實施例之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何本領域中具通常知識者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation modes, the content is enough for anyone with ordinary knowledge in the field to understand the technical content of the embodiments of the present invention and implement them accordingly, and according to the disclosure of this specification Anyone with ordinary knowledge in the art can easily understand the related objectives and advantages of the present invention. The following examples are to further describe the concept of the present invention in detail, but not to limit the scope of the present invention in any way.

請參閱圖1至圖3,圖1為根據本發明一實施例的伺服器之立體分解圖,圖2為圖1中的伺服器之前視圖,且圖3為圖1中的伺服器之後視圖。Please refer to FIGS. 1 to 3 , FIG. 1 is an exploded perspective view of a server according to an embodiment of the present invention, FIG. 2 is a front view of the server in FIG. 1 , and FIG. 3 is a rear view of the server in FIG. 1 .

於本實施例中,伺服器10包含一機殼100、一主機板組件150、二電源模組200、一網路卡模組250以及一第一儲存模組300。In this embodiment, the server 10 includes a casing 100 , a motherboard assembly 150 , two power supply modules 200 , a network card module 250 and a first storage module 300 .

機殼100具有彼此相對的一前側101以及一後側102。於本實施例中,機殼100包含一底板110、一第一側板120以及一第二側板130。第一側板120以及第二側板130分別立於底板110的相對兩側。前側101以及後側102位於底板110。第一側板120以及第二側板130從前側101延伸到後側102。須注意的是,為了方便描述,圖1至圖3中省略設置於第一側板120及第二側板130遠離底板110的一側之頂板(未繪示)。於本實施例中,機殼100例如符合2U標準。The casing 100 has a front side 101 and a rear side 102 opposite to each other. In this embodiment, the casing 100 includes a bottom plate 110 , a first side plate 120 and a second side plate 130 . The first side panel 120 and the second side panel 130 stand on opposite sides of the bottom panel 110 respectively. The front side 101 and the rear side 102 are located on the bottom plate 110 . The first side panel 120 and the second side panel 130 extend from the front side 101 to the rear side 102 . It should be noted that, for convenience of description, the top plate (not shown) disposed on the side of the first side plate 120 and the second side plate 130 away from the bottom plate 110 is omitted in FIGS. 1 to 3 . In this embodiment, the enclosure 100 complies with the 2U standard, for example.

主機板組件150設置於機殼100的底板110並介於前側101以及後側102之間。主機板組件150例如可包含中央處理器及記憶體。The main board assembly 150 is disposed on the bottom plate 110 of the case 100 and interposed between the front side 101 and the rear side 102 . The motherboard assembly 150 may include, for example, a central processing unit and a memory.

二電源模組200設置於機殼100的底板110的後側102並電性連接於主機板組件150。於其他實施例中,伺服器亦可僅包含一個電源模組。The two power supply modules 200 are disposed on the rear side 102 of the bottom plate 110 of the case 100 and electrically connected to the motherboard assembly 150 . In other embodiments, the server may only include one power module.

網路卡模組250設置於機殼100的底板110的前側101並電性連接於主機板組件150。主機板組件150介於電源模組200以及網路卡模組250之間。網路卡模組250例如可包含符合(open compute project,OCP)標準的網路卡。The network card module 250 is disposed on the front side 101 of the bottom plate 110 of the casing 100 and is electrically connected to the motherboard assembly 150 . The motherboard assembly 150 is located between the power module 200 and the network card module 250 . The network card module 250 may include a network card conforming to (open compute project, OCP) standard, for example.

第一儲存模組300設置於機殼100的底板110的前側101並電性連接於主機板組件150。第一側板120較第二側板130靠近第一儲存模組300。於本實施例中,第一儲存模組300介於第一側板120以及網路卡模組250之間,但並不以此為限。於其他實施例中,網路卡模組亦可介於第一儲存模組以及第一側板之間。The first storage module 300 is disposed on the front side 101 of the bottom plate 110 of the casing 100 and is electrically connected to the motherboard assembly 150 . The first side plate 120 is closer to the first storage module 300 than the second side plate 130 . In this embodiment, the first storage module 300 is located between the first side plate 120 and the network card module 250 , but it is not limited thereto. In other embodiments, the network card module can also be interposed between the first storage module and the first side plate.

於本實施例中,伺服器10更包含一擴充卡模組350。擴充卡模組350電性連接於主機板組件150並設置於機殼100的底板110的前側101。於其他實施例中,伺服器亦可無需包含擴充卡模組350。擴充卡模組350例如可包含符合PCIe規格的顯示卡或網路卡。In this embodiment, the server 10 further includes an expansion card module 350 . The expansion card module 350 is electrically connected to the motherboard assembly 150 and disposed on the front side 101 of the bottom plate 110 of the case 100 . In other embodiments, the server does not need to include the expansion card module 350 . The expansion card module 350 may include, for example, a graphics card or a network card conforming to the PCIe specification.

於本實施例中,伺服器10更包含二第二儲存模組400。二第二儲存模組400設置於機殼100的底板110的前側101。網路卡模組250介於二第二儲存模組400以及底板110之間,但並不以此為限。於其他實施例中,網路卡模組亦可介於二第二儲存模組以及底板之間。須注意的是,於其他實施例中,伺服器亦可無需包含二第二儲存模組400。In this embodiment, the server 10 further includes two second storage modules 400 . The two second storage modules 400 are disposed on the front side 101 of the bottom plate 110 of the casing 100 . The network card module 250 is interposed between the two second storage modules 400 and the bottom plate 110 , but it is not limited thereto. In other embodiments, the network card module can also be interposed between the two second storage modules and the bottom plate. It should be noted that, in other embodiments, the server does not need to include the two second storage modules 400 .

此外,於本實施例中,第一儲存模組300介於二第二儲存模組400以及第一側板120之間,但並不以此為限。於其他實施例中二第二儲存模組亦可介於第一儲存模組以及第一側板之間。In addition, in this embodiment, the first storage module 300 is interposed between the two second storage modules 400 and the first side plate 120 , but it is not limited thereto. In other embodiments, the two second storage modules can also be located between the first storage module and the first side plate.

於本實施例中,伺服器10更包含一第三儲存模組450以及一第四儲存模組500。第三儲存模組450以及第四儲存模組500設置於機殼100的底板110之後側102並電性連接於主機板組件150。二電源模組200介於第三儲存模組450以及第四儲存模組500之間。於其他實施例中,第三儲存模組以及第四儲存模組亦可介於二電源模組之間。於再其他實施例中,伺服器亦可無需包含第三儲存模組450以及第四儲存模組500。In this embodiment, the server 10 further includes a third storage module 450 and a fourth storage module 500 . The third storage module 450 and the fourth storage module 500 are disposed on the rear side 102 of the bottom plate 110 of the case 100 and electrically connected to the motherboard assembly 150 . The second power supply module 200 is located between the third storage module 450 and the fourth storage module 500 . In other embodiments, the third storage module and the fourth storage module can also be placed between the two power supply modules. In still other embodiments, the server does not need to include the third storage module 450 and the fourth storage module 500 .

於本實施例中,伺服器10更包含一第五儲存模組550。第五儲存模組550設置於機殼100的底板110之後側102並電性連接於主機板組件150。二電源模組200介於第五儲存模組550以及底板110之間。於其他實施例中,第五儲存模組亦可介於二電源模組以及底板之間。於再其他實施例中,伺服器亦可無需包含第五儲存模組550。In this embodiment, the server 10 further includes a fifth storage module 550 . The fifth storage module 550 is disposed on the rear side 102 of the bottom plate 110 of the casing 100 and is electrically connected to the motherboard assembly 150 . The second power supply module 200 is located between the fifth storage module 550 and the bottom plate 110 . In other embodiments, the fifth storage module can also be located between the two power supply modules and the bottom plate. In still other embodiments, the server does not need to include the fifth storage module 550 .

於本實施例中,伺服器10更包含一管理模組600。管理模組600設置於機殼100的底板110的前側101並電性連接於主機板組件150。於本實施例中,網路卡模組250介於管理模組600以及第一儲存模組300之間,但並不以此為限。於其他實施例中,管理模組亦可介於網路卡模組以及第一儲存模組之間。In this embodiment, the server 10 further includes a management module 600 . The management module 600 is disposed on the front side 101 of the bottom plate 110 of the casing 100 and is electrically connected to the motherboard assembly 150 . In this embodiment, the network card module 250 is interposed between the management module 600 and the first storage module 300, but it is not limited thereto. In other embodiments, the management module can also be placed between the network card module and the first storage module.

此外,於本實施例中,管理模組600介於擴充卡模組350以及底板110之間,但本發明並不以此為限。於其他實施例中,擴充卡模組亦可介於管理模組以及底板之間。In addition, in this embodiment, the management module 600 is interposed between the expansion card module 350 and the bottom plate 110 , but the present invention is not limited thereto. In other embodiments, the expansion card module can also be interposed between the management module and the backplane.

於本實施例中,管理模組600包含一電路板610、一第一連接埠620、一第二連接埠630、一第三連接埠640以及一指示燈650。第一連接埠620、第二連接埠630、第三連接埠640以及指示燈650設置並電性連接於電路板610。第二連接埠630介於第一連接埠620以及第三連接埠640之間。第三連接埠640介於第二連接埠630以及指示燈650之間。第一連接埠620例如為管理(management,MGMT)埠。第二連接埠630例如為積體匯流排電路(Inter-Integrated Circuit,I2C)埠。第三連接埠640例如為視訊圖形陣列(Video Graphics Array,VGA)埠。指示燈650例如為發光二極體。於其他實施例中,伺服器亦可無需包含管理模組600。In this embodiment, the management module 600 includes a circuit board 610 , a first connection port 620 , a second connection port 630 , a third connection port 640 and an indicator light 650 . The first connection port 620 , the second connection port 630 , the third connection port 640 and the indicator light 650 are disposed and electrically connected to the circuit board 610 . The second connection port 630 is located between the first connection port 620 and the third connection port 640 . The third connection port 640 is located between the second connection port 630 and the indicator light 650 . The first connection port 620 is, for example, a management (MGMT) port. The second connection port 630 is, for example, an Inter-Integrated Circuit (I2C) port. The third connection port 640 is, for example, a video graphics array (Video Graphics Array, VGA) port. The indicator light 650 is, for example, a light emitting diode. In other embodiments, the server does not need to include the management module 600 .

於本實施例中,伺服器10更包含一風扇模組700以及一導風罩750。風扇模組700設置於機殼100的底板110並電性連接於主機板組件150。主機板組件150介於網路卡模組250以及風扇模組700之間。導風罩750設置於主機板組件150遠離底板110的一側。In this embodiment, the server 10 further includes a fan module 700 and an air guide cover 750 . The fan module 700 is disposed on the bottom plate 110 of the casing 100 and electrically connected to the motherboard assembly 150 . The motherboard assembly 150 is located between the network card module 250 and the fan module 700 . The wind deflector 750 is disposed on a side of the motherboard assembly 150 away from the bottom plate 110 .

須注意的是,第一儲存模組300、第二儲存模組400、第三儲存模組450、第四儲存模組500以及第五儲存模組550可包含U.2固態硬碟、E3.S固態硬碟、NVMe固態硬碟或傳統硬碟(HDD)。It should be noted that the first storage module 300, the second storage module 400, the third storage module 450, the fourth storage module 500 and the fifth storage module 550 may include U.2 solid state drives, E3. S SSD, NVMe SSD or traditional hard disk drive (HDD).

須注意的是,於本實施例中,主機板組件150、電源模組200、網路卡模組250、第一儲存模組300、擴充卡模組350、第二儲存模組400、第三儲存模組450、第四儲存模組500以及第五儲存模組550、管理模組600及風扇模組700例如以手轉螺絲或無工具的方式組裝於機殼100,以提升維修人員維修的便利性。It should be noted that, in this embodiment, the motherboard assembly 150, the power supply module 200, the network card module 250, the first storage module 300, the expansion card module 350, the second storage module 400, the third The storage module 450, the fourth storage module 500 and the fifth storage module 550, the management module 600 and the fan module 700 are assembled in the casing 100, for example, by thumb screws or without tools, so as to improve maintenance personnel's maintenance efficiency. convenience.

根據上述實施例所揭露之伺服器,第一儲存模組以及網路卡模組皆設置於機殼的前側。因此,維修人員能從機殼的前側方便地拆裝第一儲存模組。並且,風扇導引的氣流會先經過網路卡才經過主機板組件,這增加了上述氣流與網路卡模組之間的溫度差,而使上述氣流能有效地冷卻網路卡模組。如此一來,便能在維持拆裝儲存模組的方便性之同時兼顧伺服器整機的散熱效率。According to the server disclosed in the above embodiments, the first storage module and the network card module are both arranged on the front side of the casing. Therefore, maintenance personnel can conveniently disassemble and assemble the first storage module from the front side of the casing. Moreover, the airflow guided by the fan passes through the network card first and then passes through the motherboard assembly, which increases the temperature difference between the airflow and the network card module, so that the airflow can effectively cool the network card module. In this way, the heat dissipation efficiency of the whole server can be taken into account while maintaining the convenience of disassembling and assembling the storage module.

雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

10:伺服器 100:機殼 101:前側 102:後側 110:底板 120:第一側板 130:第二側板 150:主機板組件 200:電源模組 250:網路卡模組 300:第一儲存模組 350:擴充卡模組 400:第二儲存模組 450:第三儲存模組 500:第四儲存模組 550:第五儲存模組 600:管理模組 610:電路板 620:第一連接埠 630:第二連接埠 640:第三連接埠 650:指示燈 700:風扇模組 750:導風罩 10:Server 100: Chassis 101: front side 102: Rear side 110: Bottom plate 120: The first side panel 130: Second side panel 150: Motherboard components 200: Power module 250: Network card module 300: The first storage module 350: expansion card module 400: Second storage module 450: The third storage module 500: The fourth storage module 550: Fifth storage module 600: Management module 610: circuit board 620: the first port 630: Second port 640: The third port 650: indicator light 700: Fan module 750: Windshield

圖1為根據本發明一實施例的伺服器之立體分解圖。 圖2為圖1中的伺服器之前視圖。 圖3為圖1中的伺服器之後視圖。 FIG. 1 is an exploded perspective view of a server according to an embodiment of the present invention. FIG. 2 is a front view of the server in FIG. 1 . FIG. 3 is a rear view of the server in FIG. 1 .

10:伺服器 10:Server

101:前側 101: front side

110:底板 110: Bottom plate

120:第一側板 120: The first side panel

130:第二側板 130: Second side panel

250:網路卡模組 250: Network card module

300:第一儲存模組 300: The first storage module

350:擴充卡模組 350: expansion card module

400:第二儲存模組 400: Second storage module

600:管理模組 600: Management module

610:電路板 610: circuit board

620:第一連接埠 620: the first port

630:第二連接埠 630: Second port

640:第三連接埠 640: The third port

650:指示燈 650: indicator light

Claims (10)

一種伺服器,包含:一機殼,具有彼此相對的一前側以及一後側;一主機板組件,設置於該機殼並介於該前側以及該後側之間;一電源模組,設置於該機殼的該後側並電性連接於該主機板組件;一網路卡模組,設置於該機殼的該前側並電性連接於該主機板組件,該主機板組件介於該電源模組以及該網路卡模組之間;以及一第一儲存模組,設置於該機殼的該前側並電性連接於該主機板組件;其中,該機殼包含一底板、一第一側板以及一第二側板,該第一側板以及該第二側板分別立於該底板的相對兩側,該前側以及該後側位於該底板,該第一側板以及該第二側板從該前側延伸到該後側;其中,該伺服器更包含一風扇模組以及一導風罩,該風扇模組設置於該機殼的該底板並電性連接於該主機板組件,該主機板組件介於該網路卡模組以及該風扇模組之間,該導風罩設置於該主機板組件遠離該底板的一側。 A server, comprising: a casing, having a front side and a rear side opposite to each other; a motherboard assembly, arranged on the casing and between the front side and the rear side; a power supply module, arranged on The rear side of the casing is electrically connected to the motherboard assembly; a network card module is arranged on the front side of the casing and electrically connected to the motherboard assembly, and the motherboard assembly is interposed between the power supply between the module and the network card module; and a first storage module, which is arranged on the front side of the casing and is electrically connected to the motherboard assembly; wherein, the casing includes a bottom plate, a first A side plate and a second side plate, the first side plate and the second side plate stand on opposite sides of the bottom plate respectively, the front side and the rear side are located on the bottom plate, the first side plate and the second side plate extend from the front side to The rear side; wherein, the server further includes a fan module and an air guide cover, the fan module is arranged on the bottom plate of the casing and is electrically connected to the main board assembly, and the main board assembly is interposed between the Between the network card module and the fan module, the air guide cover is arranged on the side of the motherboard assembly away from the bottom plate. 如請求項1所述之伺服器,更包含一擴充卡模組,該擴充卡模組電性連接於該主機板組件並設置於該機殼的該前側。 The server as described in claim 1 further includes an expansion card module, the expansion card module is electrically connected to the motherboard assembly and disposed on the front side of the casing. 如請求項1所述之伺服器,其中該第一儲存模組介於該第一側板以及該網路卡模組之間。 The server according to claim 1, wherein the first storage module is located between the first side plate and the network card module. 如請求項3所述之伺服器,更包含二第二儲存模組,該二第二儲存模組設置於該機殼的該前側,該網路卡模組介於該二第二儲存模組以及該底板之間。 The server as described in claim 3 further includes two second storage modules, the two second storage modules are arranged on the front side of the casing, and the network card module is interposed between the two second storage modules and between the base plates. 如請求項4所述之伺服器,其中該第一儲存模組介於該二第二儲存模組以及該第一側板之間。 The server according to claim 4, wherein the first storage module is located between the two second storage modules and the first side plate. 如請求項4所述之伺服器,更包含一第三儲存模組以及一第四儲存模組,該第三儲存模組以及該第四儲存模組設置於該後側並電性連接於該主機板組件,該電源模組介於該第三儲存模組以及該第四儲存模組之間。 The server as described in claim 4 further includes a third storage module and a fourth storage module, the third storage module and the fourth storage module are arranged on the rear side and electrically connected to the The motherboard assembly, the power supply module is interposed between the third storage module and the fourth storage module. 如請求項5所述之伺服器,更包含一第五儲存模組,該第五儲存模組設置於該後側並電性連接於該主機板組件,該電源模組介於該第五儲存模組以及該底板之間。 The server as described in claim 5 further includes a fifth storage module, the fifth storage module is arranged on the rear side and electrically connected to the motherboard assembly, and the power supply module is interposed between the fifth storage module between the module and the backplane. 如請求項1所述之伺服器,更包含一管理模組,該管理模組設置於該機殼的該前側並電性連接於該主機板組件。 The server as described in claim 1 further includes a management module, the management module is arranged on the front side of the casing and is electrically connected to the motherboard assembly. 如請求項8所述之伺服器,其中該網路卡模組介於該管理模組以及該第一儲存模組之間。 The server according to claim 8, wherein the network card module is interposed between the management module and the first storage module. 如請求項8所述之伺服器,更包含一擴充卡模組,該擴充卡模組電性連接於該主機板組件並設置於該機殼的該前側,該管理模組介於該擴充卡模組以及該底板之間。 The server as described in claim 8 further includes an expansion card module, the expansion card module is electrically connected to the motherboard assembly and is arranged on the front side of the casing, the management module is inserted between the expansion card between the module and the backplane.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201331740A (en) * 2011-10-31 2013-08-01 Radisys Corp Compact network server or appliance
TWI536178B (en) * 2014-12-04 2016-06-01 英業達股份有限公司 Server
TWI558298B (en) * 2014-12-09 2016-11-11 英業達股份有限公司 Sever
US20170135242A1 (en) * 2015-11-10 2017-05-11 Fujitsu Limited Information processing apparatus
TWI599300B (en) * 2015-09-03 2017-09-11 廣達電腦股份有限公司 Rack systems and methods for configuring one or more servers
TWI702895B (en) * 2019-06-24 2020-08-21 英業達股份有限公司 Server case

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201331740A (en) * 2011-10-31 2013-08-01 Radisys Corp Compact network server or appliance
TWI536178B (en) * 2014-12-04 2016-06-01 英業達股份有限公司 Server
TWI558298B (en) * 2014-12-09 2016-11-11 英業達股份有限公司 Sever
TWI599300B (en) * 2015-09-03 2017-09-11 廣達電腦股份有限公司 Rack systems and methods for configuring one or more servers
US20170135242A1 (en) * 2015-11-10 2017-05-11 Fujitsu Limited Information processing apparatus
TWI702895B (en) * 2019-06-24 2020-08-21 英業達股份有限公司 Server case

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