TWI799180B - Server - Google Patents
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Abstract
Description
本發明係關於一種電子裝置,特別係關於一種伺服器。The present invention relates to an electronic device, in particular to a server.
隨著雲端技術的快速發展,廠商不斷推出各種伺服器。典型的伺服器包含機殼以及設置於機殼中的主機板、硬碟模組、電源模組、網路卡模組及風扇模組。一般來說,為了方便硬碟模組的拆裝,硬碟模組會設置在機殼的前側。因此,機殼的前側之空間便不足以再設置網路卡,而使得網路卡必須設置在機殼的後側。With the rapid development of cloud technology, manufacturers continue to launch various servers. A typical server includes a casing and a motherboard, a hard disk module, a power supply module, a network card module and a fan module disposed in the casing. Generally speaking, in order to facilitate the disassembly and assembly of the hard disk module, the hard disk module will be arranged on the front side of the casing. Therefore, the space on the front side of the casing is not enough to install the network card, so the network card must be arranged on the rear side of the casing.
然,由於網路卡設置於機殼的後側,因此風扇導引的氣流會先經過主機板上溫度較高的熱源,才會經過網路卡。如此一來,在吸收主機板上的熱源所產生的熱之後,風扇導引的氣流與網路卡之間的溫度差便會減小,而使得網路卡難以被所述氣流冷卻。如此一來,熱便容易累積於伺服器中而降低伺服器整機的散熱效率。總上所述,傳統的伺服器會有難以在維持拆裝硬碟的方便性之同時兼顧伺服器整機的散熱效率之問題。However, since the network card is arranged on the rear side of the casing, the airflow guided by the fan will first pass through the heat source with a higher temperature on the main board before passing through the network card. In this way, after absorbing the heat generated by the heat source on the motherboard, the temperature difference between the airflow guided by the fan and the network card is reduced, making it difficult for the network card to be cooled by the airflow. In this way, the heat is easy to accumulate in the server and reduce the heat dissipation efficiency of the whole server. As mentioned above, traditional servers have the problem that it is difficult to maintain the convenience of disassembling and installing hard disks while taking into account the heat dissipation efficiency of the whole server.
本發明在於提供一種伺服器,以在維持拆裝儲存模組的方便性之同時兼顧伺服器整機的散熱效率。The present invention is to provide a server to maintain the convenience of disassembling and assembling the storage module while taking into account the heat dissipation efficiency of the whole server.
本發明一實施例所揭露之一種伺服器包含一機殼、一主機板組件、一電源模組、一網路卡模組以及一第一儲存模組。機殼具有彼此相對的一前側以及一後側。主機板組件設置於機殼並介於前側以及後側之間。電源模組設置於機殼的後側並電性連接於主機板組件。網路卡模組設置於機殼的前側並電性連接於主機板組件。主機板組件介於電源模組以及網路卡模組之間。第一儲存模組設置於機殼的前側並電性連接於主機板組件。A server disclosed in an embodiment of the present invention includes a casing, a motherboard assembly, a power supply module, a network card module and a first storage module. The casing has a front side and a rear side opposite to each other. The motherboard assembly is arranged on the case and interposed between the front side and the rear side. The power supply module is arranged on the rear side of the casing and is electrically connected to the motherboard assembly. The network card module is arranged on the front side of the casing and is electrically connected to the motherboard assembly. The motherboard components are between the power supply module and the network card module. The first storage module is arranged on the front side of the casing and is electrically connected to the motherboard assembly.
根據上述實施例所揭露之伺服器,第一儲存模組以及網路卡模組皆設置於機殼的前側。因此,維修人員能從機殼的前側方便地拆裝第一儲存模組。並且,風扇導引的氣流會先經過網路卡才經過主機板組件,這增加了上述氣流與網路卡模組之間的溫度差,而使上述氣流能有效地冷卻網路卡模組。如此一來,便能在維持拆裝儲存模組的方便性之同時兼顧伺服器整機的散熱效率。According to the server disclosed in the above embodiments, the first storage module and the network card module are both arranged on the front side of the casing. Therefore, maintenance personnel can conveniently disassemble and assemble the first storage module from the front side of the casing. Moreover, the airflow guided by the fan passes through the network card first and then passes through the motherboard assembly, which increases the temperature difference between the airflow and the network card module, so that the airflow can effectively cool the network card module. In this way, the heat dissipation efficiency of the whole server can be taken into account while maintaining the convenience of disassembling and assembling the storage module.
以下在實施方式中詳細敘述本發明之實施例之詳細特徵以及優點,其內容足以使任何本領域中具通常知識者了解本發明之實施例之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何本領域中具通常知識者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation modes, the content is enough for anyone with ordinary knowledge in the field to understand the technical content of the embodiments of the present invention and implement them accordingly, and according to the disclosure of this specification Anyone with ordinary knowledge in the art can easily understand the related objectives and advantages of the present invention. The following examples are to further describe the concept of the present invention in detail, but not to limit the scope of the present invention in any way.
請參閱圖1至圖3,圖1為根據本發明一實施例的伺服器之立體分解圖,圖2為圖1中的伺服器之前視圖,且圖3為圖1中的伺服器之後視圖。Please refer to FIGS. 1 to 3 , FIG. 1 is an exploded perspective view of a server according to an embodiment of the present invention, FIG. 2 is a front view of the server in FIG. 1 , and FIG. 3 is a rear view of the server in FIG. 1 .
於本實施例中,伺服器10包含一機殼100、一主機板組件150、二電源模組200、一網路卡模組250以及一第一儲存模組300。In this embodiment, the
機殼100具有彼此相對的一前側101以及一後側102。於本實施例中,機殼100包含一底板110、一第一側板120以及一第二側板130。第一側板120以及第二側板130分別立於底板110的相對兩側。前側101以及後側102位於底板110。第一側板120以及第二側板130從前側101延伸到後側102。須注意的是,為了方便描述,圖1至圖3中省略設置於第一側板120及第二側板130遠離底板110的一側之頂板(未繪示)。於本實施例中,機殼100例如符合2U標準。The
主機板組件150設置於機殼100的底板110並介於前側101以及後側102之間。主機板組件150例如可包含中央處理器及記憶體。The
二電源模組200設置於機殼100的底板110的後側102並電性連接於主機板組件150。於其他實施例中,伺服器亦可僅包含一個電源模組。The two
網路卡模組250設置於機殼100的底板110的前側101並電性連接於主機板組件150。主機板組件150介於電源模組200以及網路卡模組250之間。網路卡模組250例如可包含符合(open compute project,OCP)標準的網路卡。The
第一儲存模組300設置於機殼100的底板110的前側101並電性連接於主機板組件150。第一側板120較第二側板130靠近第一儲存模組300。於本實施例中,第一儲存模組300介於第一側板120以及網路卡模組250之間,但並不以此為限。於其他實施例中,網路卡模組亦可介於第一儲存模組以及第一側板之間。The
於本實施例中,伺服器10更包含一擴充卡模組350。擴充卡模組350電性連接於主機板組件150並設置於機殼100的底板110的前側101。於其他實施例中,伺服器亦可無需包含擴充卡模組350。擴充卡模組350例如可包含符合PCIe規格的顯示卡或網路卡。In this embodiment, the
於本實施例中,伺服器10更包含二第二儲存模組400。二第二儲存模組400設置於機殼100的底板110的前側101。網路卡模組250介於二第二儲存模組400以及底板110之間,但並不以此為限。於其他實施例中,網路卡模組亦可介於二第二儲存模組以及底板之間。須注意的是,於其他實施例中,伺服器亦可無需包含二第二儲存模組400。In this embodiment, the
此外,於本實施例中,第一儲存模組300介於二第二儲存模組400以及第一側板120之間,但並不以此為限。於其他實施例中二第二儲存模組亦可介於第一儲存模組以及第一側板之間。In addition, in this embodiment, the
於本實施例中,伺服器10更包含一第三儲存模組450以及一第四儲存模組500。第三儲存模組450以及第四儲存模組500設置於機殼100的底板110之後側102並電性連接於主機板組件150。二電源模組200介於第三儲存模組450以及第四儲存模組500之間。於其他實施例中,第三儲存模組以及第四儲存模組亦可介於二電源模組之間。於再其他實施例中,伺服器亦可無需包含第三儲存模組450以及第四儲存模組500。In this embodiment, the
於本實施例中,伺服器10更包含一第五儲存模組550。第五儲存模組550設置於機殼100的底板110之後側102並電性連接於主機板組件150。二電源模組200介於第五儲存模組550以及底板110之間。於其他實施例中,第五儲存模組亦可介於二電源模組以及底板之間。於再其他實施例中,伺服器亦可無需包含第五儲存模組550。In this embodiment, the
於本實施例中,伺服器10更包含一管理模組600。管理模組600設置於機殼100的底板110的前側101並電性連接於主機板組件150。於本實施例中,網路卡模組250介於管理模組600以及第一儲存模組300之間,但並不以此為限。於其他實施例中,管理模組亦可介於網路卡模組以及第一儲存模組之間。In this embodiment, the
此外,於本實施例中,管理模組600介於擴充卡模組350以及底板110之間,但本發明並不以此為限。於其他實施例中,擴充卡模組亦可介於管理模組以及底板之間。In addition, in this embodiment, the
於本實施例中,管理模組600包含一電路板610、一第一連接埠620、一第二連接埠630、一第三連接埠640以及一指示燈650。第一連接埠620、第二連接埠630、第三連接埠640以及指示燈650設置並電性連接於電路板610。第二連接埠630介於第一連接埠620以及第三連接埠640之間。第三連接埠640介於第二連接埠630以及指示燈650之間。第一連接埠620例如為管理(management,MGMT)埠。第二連接埠630例如為積體匯流排電路(Inter-Integrated Circuit,I2C)埠。第三連接埠640例如為視訊圖形陣列(Video Graphics Array,VGA)埠。指示燈650例如為發光二極體。於其他實施例中,伺服器亦可無需包含管理模組600。In this embodiment, the
於本實施例中,伺服器10更包含一風扇模組700以及一導風罩750。風扇模組700設置於機殼100的底板110並電性連接於主機板組件150。主機板組件150介於網路卡模組250以及風扇模組700之間。導風罩750設置於主機板組件150遠離底板110的一側。In this embodiment, the
須注意的是,第一儲存模組300、第二儲存模組400、第三儲存模組450、第四儲存模組500以及第五儲存模組550可包含U.2固態硬碟、E3.S固態硬碟、NVMe固態硬碟或傳統硬碟(HDD)。It should be noted that the
須注意的是,於本實施例中,主機板組件150、電源模組200、網路卡模組250、第一儲存模組300、擴充卡模組350、第二儲存模組400、第三儲存模組450、第四儲存模組500以及第五儲存模組550、管理模組600及風扇模組700例如以手轉螺絲或無工具的方式組裝於機殼100,以提升維修人員維修的便利性。It should be noted that, in this embodiment, the
根據上述實施例所揭露之伺服器,第一儲存模組以及網路卡模組皆設置於機殼的前側。因此,維修人員能從機殼的前側方便地拆裝第一儲存模組。並且,風扇導引的氣流會先經過網路卡才經過主機板組件,這增加了上述氣流與網路卡模組之間的溫度差,而使上述氣流能有效地冷卻網路卡模組。如此一來,便能在維持拆裝儲存模組的方便性之同時兼顧伺服器整機的散熱效率。According to the server disclosed in the above embodiments, the first storage module and the network card module are both arranged on the front side of the casing. Therefore, maintenance personnel can conveniently disassemble and assemble the first storage module from the front side of the casing. Moreover, the airflow guided by the fan passes through the network card first and then passes through the motherboard assembly, which increases the temperature difference between the airflow and the network card module, so that the airflow can effectively cool the network card module. In this way, the heat dissipation efficiency of the whole server can be taken into account while maintaining the convenience of disassembling and assembling the storage module.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.
10:伺服器 100:機殼 101:前側 102:後側 110:底板 120:第一側板 130:第二側板 150:主機板組件 200:電源模組 250:網路卡模組 300:第一儲存模組 350:擴充卡模組 400:第二儲存模組 450:第三儲存模組 500:第四儲存模組 550:第五儲存模組 600:管理模組 610:電路板 620:第一連接埠 630:第二連接埠 640:第三連接埠 650:指示燈 700:風扇模組 750:導風罩 10:Server 100: Chassis 101: front side 102: Rear side 110: Bottom plate 120: The first side panel 130: Second side panel 150: Motherboard components 200: Power module 250: Network card module 300: The first storage module 350: expansion card module 400: Second storage module 450: The third storage module 500: The fourth storage module 550: Fifth storage module 600: Management module 610: circuit board 620: the first port 630: Second port 640: The third port 650: indicator light 700: Fan module 750: Windshield
圖1為根據本發明一實施例的伺服器之立體分解圖。 圖2為圖1中的伺服器之前視圖。 圖3為圖1中的伺服器之後視圖。 FIG. 1 is an exploded perspective view of a server according to an embodiment of the present invention. FIG. 2 is a front view of the server in FIG. 1 . FIG. 3 is a rear view of the server in FIG. 1 .
10:伺服器 10:Server
101:前側 101: front side
110:底板 110: Bottom plate
120:第一側板 120: The first side panel
130:第二側板 130: Second side panel
250:網路卡模組 250: Network card module
300:第一儲存模組 300: The first storage module
350:擴充卡模組 350: expansion card module
400:第二儲存模組 400: Second storage module
600:管理模組 600: Management module
610:電路板 610: circuit board
620:第一連接埠 620: the first port
630:第二連接埠 630: Second port
640:第三連接埠 640: The third port
650:指示燈 650: indicator light
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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TW201331740A (en) * | 2011-10-31 | 2013-08-01 | Radisys Corp | Compact network server or appliance |
TWI536178B (en) * | 2014-12-04 | 2016-06-01 | 英業達股份有限公司 | Server |
TWI558298B (en) * | 2014-12-09 | 2016-11-11 | 英業達股份有限公司 | Sever |
US20170135242A1 (en) * | 2015-11-10 | 2017-05-11 | Fujitsu Limited | Information processing apparatus |
TWI599300B (en) * | 2015-09-03 | 2017-09-11 | 廣達電腦股份有限公司 | Rack systems and methods for configuring one or more servers |
TWI702895B (en) * | 2019-06-24 | 2020-08-21 | 英業達股份有限公司 | Server case |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201331740A (en) * | 2011-10-31 | 2013-08-01 | Radisys Corp | Compact network server or appliance |
TWI536178B (en) * | 2014-12-04 | 2016-06-01 | 英業達股份有限公司 | Server |
TWI558298B (en) * | 2014-12-09 | 2016-11-11 | 英業達股份有限公司 | Sever |
TWI599300B (en) * | 2015-09-03 | 2017-09-11 | 廣達電腦股份有限公司 | Rack systems and methods for configuring one or more servers |
US20170135242A1 (en) * | 2015-11-10 | 2017-05-11 | Fujitsu Limited | Information processing apparatus |
TWI702895B (en) * | 2019-06-24 | 2020-08-21 | 英業達股份有限公司 | Server case |
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