TWI572270B - Storage server rack system and storage server host - Google Patents

Description

Storage server rack system and storage server host

The present invention relates to a rack system and a host, and more particularly to a storage server rack system and a storage server host.

With the explosive growth of information, enterprises are increasingly demanding data storage, and increasing the storage density of products is an urgent goal for enterprises. Currently, there are products on the market that are mainly used to store data, such as storage server hosts. In order to improve the space utilization, the appearance of the storage server host is mostly designed according to the unified standard to be used in conjunction with the rack. In general, a storage server rack system includes a multi-layer rack, and the storage server mainframe is mostly flat so as to be pulled out or pushed into the rack like a drawer. A multi-layered storage server host can be housed in the entire rack to achieve high storage density targets.

However, due to the data access of the storage server host, the heating power of the internal electronic components continues to rise. Moreover, other storage server hosts on the rack also have a large amount of real estate heat at the same time. In order to prevent the electronic components inside the storage server host from overheating, which causes temporary or permanent failure of the electronic components, it is very important that the storage server host provides sufficient heat dissipation performance.

The invention provides a storage server rack system and a storage server The main unit provides high storage density and good heat dissipation.

The invention provides a storage server rack system comprising a rack and a plurality of storage server hosts. The rack includes a power module integration and a fan wall. Power module integration distributes power drawn from outside the rack to these storage server hosts. Fan walls are placed on one side of these storage server hosts to dissipate these storage server hosts. These storage server hosts are assembled in a rack. Each storage server host includes a chassis, an electrical connection module, a motherboard, and a plurality of storage units. The chassis has a first side and a second side. The direction from the first side to the second side is the first direction, and the fan wall draws airflow from the chassis in the first direction or blows air into the chassis. The electrical connection module is disposed on the first side of the chassis and is adapted to be connected to the power module integration. The motherboard is disposed in a first heat dissipation space in the chassis and electrically connected to the electrical connection module. The first heat dissipation space extends from the first side to the second side along the first direction. The storage unit is disposed outside the first heat dissipation space in the chassis and electrically connected to the electrical connection module, wherein the electrical connection module is located outside the first heat dissipation space.

In an embodiment of the invention, the storage units are disposed on both sides of the first heat dissipation space.

In an embodiment of the invention, the height of the storage unit is greater than the height of the motherboard, such that the first heat dissipation space becomes a duct, and heat generated by one of the heat sources of the motherboard is adapted to exit the chassis along the air duct.

In an embodiment of the invention, the first side surface has a plurality of heat dissipation holes corresponding to the position of the first heat dissipation space.

In an embodiment of the present invention, each of the storage server hosts described above is further The system includes at least one expansion unit disposed in the chassis and electrically connected to the motherboard.

In an embodiment of the present invention, each of the expansion units includes at least one output interface or at least one input interface, and each output interface or each input interface is exposed on a second side of the chassis.

In an embodiment of the present invention, each expansion unit is configured with an expansion module, each expansion module includes at least one output interface or at least one input interface, and each output interface or each input interface is exposed to the second of the chassis. Side and stacked on the output interface or input interface of each expansion unit.

In an embodiment of the invention, the motherboard and the first side are cleaned.

The invention provides a storage server host suitable for assembly in a rack. The rack includes a power module integration and a fan wall, and the power module integration allocates power obtained from outside the rack to the storage server hosts. Fan walls are placed on one side of these storage servers to dissipate these storage server hosts. The storage server host includes a chassis, an electrical connection module, a motherboard, and a plurality of storage units. The chassis has a first side and a second side. The direction from the first side to the second side is the first direction, and the fan wall draws airflow from the chassis in the first direction or blows air into the chassis. The electrical connection module is disposed on the first side of the chassis and is adapted to be connected to the power module integration. The motherboard is disposed in a first heat dissipation space in the chassis and electrically connected to the electrical connection module. The first heat dissipation space extends from the first side to the second side along the first direction. The storage unit is disposed outside the first heat dissipation space in the chassis and electrically connected to the electrical connection module, wherein the electrical connection module is located outside the first heat dissipation space.

In an embodiment of the invention, the storage units are disposed on both sides of the first heat dissipation space.

In an embodiment of the invention, the height of the storage unit is greater than the height of the motherboard, such that the first heat dissipation space becomes a duct, and heat generated by one of the heat sources of the motherboard is adapted to exit the chassis along the air duct.

In an embodiment of the invention, the first side surface has a plurality of heat dissipation holes corresponding to the position of the first heat dissipation space.

In an embodiment of the present invention, each of the storage server hosts further includes at least one expansion unit disposed in the chassis and electrically connected to the motherboard.

In an embodiment of the present invention, each of the expansion units includes at least one output interface or at least one input interface, and each output interface or each input interface is exposed on a second side of the chassis.

In an embodiment of the present invention, each expansion unit is configured with an expansion module, each expansion module includes at least one output interface or at least one input interface, and each output interface or each input interface is exposed to the second of the chassis. Side and stacked on the output interface or input interface of each expansion unit.

In an embodiment of the invention, the motherboard and the first side are cleaned. Based on the above, the storage server rack system of the present invention distributes power to the storage server host placed on the rack through the power module integration of the rack to uniformly supply power, and sets the fan wall outside the storage server host. One side to dissipate heat from these storage server hosts at the same time. In addition, the storage server host of the present invention uses only a small-sized motherboard, and the motherboard is only located in the first heat dissipation space in the chassis, and the electrical connection module is disposed outside the chassis, so that more storage units can be accommodated. Placed in the chassis, effectively High storage server host storage density. In addition, the storage server host of the present invention configures the storage unit outside the first heat dissipation space. Since the storage unit is slightly higher than the motherboard, a wind channel is formed between the two rows of storage units. Moreover, the position of the first side of the chassis corresponding to the motherboard has a plurality of heat dissipation holes connected to the air channel, and the fan wall can be extracted from the air through the heat dissipation hole and the air channel or blow air into the chassis. The heat source of the board is cooled or the heat generated by the heat source of the motherboard can be separated from the chassis through the air duct to achieve good heat dissipation.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a partial schematic view of a storage server rack system in accordance with an embodiment of the present invention. In order to facilitate the reader to understand the internal configuration relationship of the storage server host placed in the rack, the upper cover of the storage server host in FIG. 1 is hidden, and only the local storage server rack system is shown. 2 is a perspective view showing the internal configuration of the storage server host of FIG. 1. 3 is a top plan view showing the internal configuration of the storage server host of FIG. 1.

Referring to FIG. 1 to FIG. 3, the storage server rack system 1 of the present embodiment includes a rack 10 and a plurality of storage server hosts 100. The frame 10 includes a power module assembly 12 and a fan wall 14. The power module integration 12 distributes power obtained from outside the rack 10 to the storage server host 100. The fan wall 14 is disposed on one side of the storage server host 100 to dissipate heat from the storage server host 100. These storage server host groups 100 is mounted in the frame 10. Since FIG. 1 only shows a partial storage server rack system, the fan wall 14 is only shown as a layer. In fact, the fan wall 14 can be multi-layered to dissipate heat from the storage server host 100 disposed on the rack 10.

Each storage server host 100 includes a chassis 110, an electrical connection module 120, a motherboard 130, and a plurality of storage units 140. The chassis 110 has a first side 112 and a second side 114 opposite to each other. The direction from the first side 112 to the second side 114 is the first direction D1, and the fan wall 14 draws airflow from the chassis 110 in the first direction D1 or blows air into the chassis 110. The electrical connection module 120 is disposed on the first side 112 of the chassis 110 and is adapted to be connected to the power module integration 12 . The motherboard 130 is disposed in a first heat dissipation space 150 in the chassis 110 and electrically connected to the electrical connection module 120 . The first heat dissipation space 150 extends from the first side 112 to the second side 114 along the first direction D1 . The storage unit 140 is disposed outside the first heat dissipation space 150 in the chassis 110 and electrically connected to the electrical connection module 120 , wherein the electrical connection module 120 is located outside the first heat dissipation space 150 .

Since the storage server host 100 can be pushed into or pulled out of the chassis 10 like a drawer, when the storage server host 100 is to be placed on the chassis 10, the first side 112 of the storage server host 100 is directed toward The rack 10 is inserted, and the pushing direction of the storage server host 100 is restricted on both sides of the rack 10, so that the electrical connection module 120 of the storage server host 100 is directly connected to the power module integration 12 of the rack 10. The power of the power module integrated 12 of the rack 10 can be transmitted to the storage server host 100 through the electrical connection module 120.

The motherboard 130 and the storage unit 140 are respectively disposed in the chassis 110 and Connected to the electrical connection module 120. As shown in FIG. 3, in the embodiment, the motherboard 130 and the storage unit 140 are connected to the electrical connection module 120 through a power cable. However, in other embodiments, the motherboard 130 and the storage unit 140 can also pass through the motherboard. The manner in which the interface is connected to the electrical connection module 120 and the motherboard 130 and the storage unit 140 are connected to the electrical connection module 120 is not limited thereto. In this embodiment, the storage server host 100 transmits power from the power module integration 12 of the chassis 10 to the motherboard 130 and the storage unit 140 through the electrical connection module 120 and the power cable to enable the motherboard. The 130 and the storage unit 140 are electrically connected to the power module integration 12 .

As shown in FIG. 1, the rack 10 includes a plurality of spaces for storing the storage server host 100. If a plurality of storage server hosts 100 are placed in the rack 10, the storage server hosts 100 can transmit their respective powers. The connection module 120 is docked with the power module 12 in the rack 10, and is uniformly powered by the power module integration 12 of the rack 10 to each storage server host 100.

In addition, since the width of the motherboard 130 of the embodiment is only about half of the width of the chassis 110, when the motherboard 130 is stored in the chassis 110, there is still space on both sides of the motherboard 130 for storing the storage unit 140. Therefore, the storage unit 140 can be disposed on two sides of the motherboard 130 in two rows, that is, the storage unit 140 is disposed on both sides of the first heat dissipation space 150. In addition, since the storage server host 100 of the present embodiment is integrated with the power module 12 of the rack 10 by the electrical connection module 120, the power of the power module integration 12 is introduced into the storage server host 100, and stored. There is no need to set up a power module integration device inside the server host 100. The interior of the chassis 110 can provide more space for accommodating more storage units 140. Therefore, the present implementation For example, the storage server host 100 has a high storage density.

In this embodiment, the storage unit 140 in the chassis 110 has a total of eight 3.5-inch hard disks disposed on two sides of the motherboard 130 in two rows. Of course, in other embodiments, the storage unit 140 can also be a 2.5-inch hard disk or a solid-state hard disk. The type and quantity of the storage unit 140 are not limited thereto. In addition, in other embodiments, the storage unit 140 may be disposed only on one side of the motherboard 130. The configuration relationship between the storage unit 140 and the motherboard 130 is not limited to the above.

The main board 130 of the present embodiment includes a heat source 132. In this embodiment, the heat source 132 is a central processing unit, but the type of the heat source 132 is not limited thereto. Since the storage unit 140 of the storage server host 100 accesses the data storage and reading through the central processing unit of the motherboard 130. During this distribution process, the central processing unit operates to generate a significant amount of heat, which may overheat the central processing unit and cause temporary or permanent failure. Even the mistakes in the access of the data or the omission of data.

In the present embodiment, in the chassis 110 of the storage server host 100, since the height of the storage unit 140 is greater than the height of the motherboard 130, the first heat dissipation space 150 becomes a duct 152, and the heat source 132 of the motherboard 130 The heat generation is adapted to exit the chassis 110 along the air duct 152.

In addition, as shown in FIG. 3, the projection of the storage unit 140 on the first side 112 does not overlap the projection of the motherboard 130 on the first side 112, and the storage unit is not disposed between the motherboard 130 and the first side 112. 140 or power module integrated 12 components. That is, the motherboard 130 and the first The air gap 152 between the main board 130 and the first side surface 112 is clear in a state of being cleaned between the side surfaces 112.

As shown in FIG. 3 , in the embodiment, the first side surface 112 has a plurality of heat dissipation holes 112 a corresponding to the position of the first heat dissipation space 150 , and the heat dissipation holes 112 a are located at a projection position of the motherboard 130 on the first side surface 112 . The heat dissipation holes 112a communicate with the first heat dissipation space 150 (that is, the air passage 152). Therefore, the fan wall 14 of the rack 10 can draw airflow from the chassis 110 or blow airflow into the chassis 110 to lower the temperature of the storage server host 100. The storage server host 100 of the present embodiment forms the air channel 152 by placing the storage unit 140 on both sides of the motherboard 130, and the main board 130 is disposed in the air duct 152, and the heat dissipation hole 112a of the first side surface 112 is matched. The heat source 132 of the motherboard 130 in the chassis 110 can provide a good heat dissipation effect.

In this embodiment, the position of the electrical connection module 120 disposed on the first side 112 corresponds to the position of one of the rows of storage units 140. Therefore, the projection of the electrical connection module 120 on the first side 112 does not overlap the projection of the motherboard 130 on the first side 112. That is to say, the electrical connection module 120 does not block the heat dissipation hole 112a of the first side surface 112, and the configuration of the electrical connection module 120 does not affect the smooth flow of the air channel 152.

In addition, in the embodiment, the storage server host 100 further includes at least one expansion unit 160 disposed in the chassis 110 and electrically connected to the motherboard 130. As shown in FIG. 1, the storage server host 100 of the present embodiment includes two expansion units 160, one expansion unit 160 includes an output interface 162, and the other expansion unit 160 includes an input interface 164. The output interface 162 or the input interface 164 is exposed to the second side 114 of the chassis 110.

In this embodiment, the transmission interface of the output interface 162 or the input interface 164 of the expansion unit 160 may be Serial ATA (Serial Advanced Technology Attachment, SATA), Integrated Drive Electronics (IDE), and peripheral component interconnection ( Peripheral Component Interconnect (PCI-E) or Universal Serial Bus (USB), etc., but the transmission interface of the output interface 162 or the input interface 164 of the expansion unit 160 is not limited to the above.

The storage server host 100 of the embodiment is disposed on the second side 114 by the output interface 162 or the input interface 164, and the electrical connection module 120 is disposed on the first side 112, when the storage server host 100 is placed on the rack. At time 10, the first side 112 of the storage server host 100 is inserted to directly connect the electrical connection module 120 of the storage server host 100 to the power module integration 12 of the chassis 10. Moreover, since the output interface 162 or the input interface 164 is exposed on the second side 114 of the chassis 110, when the storage server host 100 is placed on the chassis 10, the second side 114 is located on the outer side of the chassis 10, which is convenient to use. The external device is inserted into the input interface 164 or the output interface 162 at the second side 114.

In addition, in the embodiment, each expansion unit 160 is provided with an expansion module 170. Each expansion module 170 includes at least one output interface 172 or at least one input interface 174, and each output interface 172 or each input interface 174 is exposed. The second side 114 of the chassis 110 is stacked on the output interface 162 or the input interface 164 of each expansion unit 160.

In addition, the storage unit 140 also generates heat during operation. Since the heat is transferred from the high temperature to the low temperature, the motherboard 130 located in the air duct 152 The temperature does not continue to rise by means of thermal convection. The motherboard 130 can maintain a lower temperature than the storage unit 140. In this state, the heat of the storage unit 140 located on both sides of the air duct 152 is transmitted to the direction (center) of the air duct 152, and the heat generation of the storage unit 140 can be carried away from the chassis 110 via the air duct 152. In addition, as shown in FIG. 1A, the second side surface 114 is also provided with a plurality of heat dissipation holes 114a1 corresponding to the position of the storage unit 140. The heat generation of the storage unit 140 can also be eliminated, and the heat dissipation mode of the storage unit 140 is not limit.

In summary, the storage server rack system of the present invention distributes power to the storage server host placed on the rack through the power module integration of the rack to uniformly supply power, and sets the fan wall to the storage server host. One side of the outside to dissipate heat from these storage server hosts at the same time. In addition, the storage server host of the present invention uses only a small-sized motherboard, and the motherboard is only located in the first heat dissipation space in the chassis, and the electrical connection module is disposed outside the chassis, so that more storage units can be accommodated. Placed in the chassis to effectively increase the storage density of the storage server host. In addition, the storage server host of the present invention configures the storage unit outside the first heat dissipation space. Since the storage unit is slightly higher than the motherboard, a wind channel is formed between the two rows of storage units. Moreover, the position of the first side of the chassis corresponding to the motherboard has a plurality of heat dissipation holes connected to the air channel, and the fan wall can be extracted from the air through the heat dissipation hole and the air channel or blow air into the chassis. The heat source of the board is cooled or the heat generated by the heat source of the motherboard can be separated from the chassis through the air duct to achieve good heat dissipation.

Although the invention has been disclosed above by way of example, it is not intended to be limiting The scope of the present invention is defined by the scope of the appended claims, and the scope of the invention is defined by the scope of the appended claims. Prevail.

D1‧‧‧ first direction

1‧‧‧Storage Server Rack System

10‧‧‧Rack

12‧‧‧Power Module Integration

14‧‧‧Fan wall

100‧‧‧Storage server host

110‧‧‧Chassis

112‧‧‧ first side

112a‧‧‧ vents

114‧‧‧ second side

114a‧‧‧ vents

120‧‧‧Electrical connection module

130‧‧‧ motherboard

132‧‧‧heat source

140‧‧‧ storage unit

150‧‧‧First cooling space

152‧‧‧ wind tunnel

160‧‧‧Extension unit

162‧‧‧ Output interface

164‧‧‧Input interface

170‧‧‧Extension module

172‧‧‧ Output interface

174‧‧‧Input interface

1 is a schematic diagram of a storage server host inserted in a rack according to an embodiment of the invention.

2 is a perspective view showing the internal configuration of the storage server host of FIG. 1.

3 is a top plan view showing the internal configuration of the storage server host of FIG. 1.

D1‧‧‧ first direction

1‧‧‧Storage Server Rack System

10‧‧‧Rack

12‧‧‧Power Module Integration

14‧‧‧Fan wall

100‧‧‧Storage server host

110‧‧‧Chassis

112‧‧‧ first side

112a‧‧‧ vents

114‧‧‧ second side

114a‧‧‧ vents

120‧‧‧Electrical connection module

130‧‧‧ motherboard

132‧‧‧heat source

140‧‧‧ storage unit

150‧‧‧First cooling space

152‧‧‧ wind tunnel

160‧‧‧Extension unit

162‧‧‧ Output interface

164‧‧‧Input interface

170‧‧‧Extension module

172‧‧‧ Output interface

174‧‧‧Input interface

Claims (16)

A storage server rack system includes: a rack including a power module integration and a fan wall; and a plurality of storage server hosts assembled in the rack, the power module integrated from the rack The externally obtained power is allocated to the storage server hosts, and the fan wall is disposed on one side of the storage server hosts to dissipate heat from the storage server hosts, and each of the storage server hosts includes: a chassis And having a first side and a second side opposite to each other, wherein the direction of the first side to the second side is a first direction, and the fan wall draws airflow from the chassis or blows into the chassis along the first direction An electrical connection module is disposed on the first side of the chassis and is adapted to be connected to the power module for integration; a motherboard disposed in a first heat dissipation space in the chassis and electrically connected to The first heat dissipation space extends from the first side to the second side along the first direction; and a plurality of storage units are located at two sides of the motherboard, and the storage units are disposed in the chassis inside A first outer heat-dissipation space and electrically connected to the electrical connector module, wherein the module is electrically connected to the first heat sink is located outside of the space. The storage server rack system of claim 1, wherein the storage units are disposed on both sides of the first heat dissipation space. The storage server rack system of claim 2, wherein the height of the storage unit is greater than the height of the motherboard, so that the first heat dissipation space becomes a wind channel, and the heat source of the motherboard is produced. The heat is adapted to exit the chassis along the air duct. The storage server rack system of claim 1, wherein the first side has a plurality of heat dissipation holes corresponding to the position of the first heat dissipation space. The storage server rack system of claim 1, wherein each of the storage server hosts further includes at least one expansion unit disposed in the chassis and electrically connected to the motherboard. The storage server rack system of claim 5, wherein each of the expansion units includes at least one output interface or at least one input interface, and each of the output interfaces or each of the input interfaces is exposed to the chassis Two sides. The storage server rack system of claim 6, wherein each expansion unit is provided with an expansion module, each expansion module comprising at least one output interface or at least one input interface, and each expansion unit Each of the output interfaces or each of the input interfaces is exposed on the second side of the chassis and is stacked on the output interface or the input interface of each expansion unit. The storage server rack system of claim 1, wherein the motherboard is cleaned from the first side. A storage server host adapted to be assembled in a rack, the rack includes a power module integration and a fan wall, and the power module integrates power obtained from the rack to the storage server host The fan wall is disposed on an outer side of the storage server to dissipate heat from the storage server host. The storage server host includes: a chassis having a first side and a second side, the first a direction from the side to the second side is a first direction, the fan wall extracts airflow from the chassis or blows air into the chassis along the first direction; an electrical connection module is disposed in the chassis One side is adapted to be connected to the power module for integration; a motherboard is disposed in a first heat dissipation space in the chassis and electrically connected to the electrical connection module, the first heat dissipation space is along the first direction And extending from the first side to the second side; and the plurality of storage units are located at two sides of the motherboard, and the storage units are disposed outside the first heat dissipation space in the chassis and electrically connected to the battery The connection module, wherein the electrical connection module is located outside the first heat dissipation space. The storage server host of claim 9, wherein the storage units are disposed on both sides of the first heat dissipation space. The storage server host according to claim 10, wherein the height of the storage unit is greater than the height of the motherboard, so that the first heat dissipation space becomes a wind channel, and heat generation of a heat source of the motherboard is suitable. Leave the chassis along the air duct. The storage server host of claim 9, wherein the first side has a plurality of heat dissipation holes corresponding to the position of the first heat dissipation space. The storage server host of claim 9, wherein the storage server host further comprises at least one expansion unit disposed in the chassis and electrically connected to the motherboard. The storage server host of claim 13, wherein each of the expansion units includes at least one output interface or at least one input An interface, and each of the output interfaces or each of the input interfaces is exposed on the second side of the chassis. The storage server host of claim 14, wherein each expansion unit is provided with an expansion module, each expansion module comprising at least one output interface or at least one input interface, and each of the expansion units The output interface or each of the input interfaces is exposed on the second side of the chassis and is stacked on the output interface or the input interface of each expansion unit. The storage server host according to claim 9, wherein the motherboard is cleaned from the first side.