201202898 100363.TW 34773twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種一種伺服器，且特別是有關於一 種機架伺服器。 【先前技術】201202898 100363.TW 34773twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a server, and more particularly to a rack server. [Prior Art]
祠服器係為網路糸統中服務各電腦之核心電腦，可提 供網路使用者需要之磁碟與列印服務等功能，同時也可供 各用戶端彼此分享網路環境内之各項資源。飼服器之基本 架構和一般之個人電腦大致相同，是由中央處理器 (CPU)、記憶體(Memory)及輪入/輸出(1/〇)設備等部件所組 成，並由匯流排(Bus)在内部將其連接起來，透過北橋晶片 ft央處理器和記憶體，而透過南橋晶片連接輸入^出 S又備翼〇 在此以機架値器為例，機架舰器是—種外觀㈣ 統-標準設計_服||，gi合機櫃統—使用 : 路設備都是採關架式的結構，其多為扁二3相 屜一般。例如交換機、路由器、硬體’就如同相 亳器:)寬度通為4英寸，高度，單^ 2U5U，7U 幾種：糊 然而，機架式伺服器因為空 小，機箱内往往已經佈滿電子元件;服器大大縮 飼服器在散熱問題上受到-定的限制兴：f ’所以這類 舉例來說，現有技 201202898 1WJ0J.1W 34773twf.doc/n 術中的機架伺服器，其風屬多配 而在機箱__流動方岐^板處，故 般而言，機箱多為前後距離較長 致。- ==果故而氣流在機箱内會因其流動== ’機箱的前、後面板㈣時作為各式 再者 :配=因此機箱上用以作為氣流流經: 與這些輸入/輸出口彼此限制。此外 ：：彺彺會 =電源供應器經由緵線連接至機箱 些繞線阻礙氣流在機箱㈣流動。 了會讓k 財機箱⑽流動’進而降低機 :便成：2。因此’思考如何增進機架伺服器的散教效 月匕便成為相關人員所需解決的問題。 【發明内容】 率。本發明提供-種機架做器，其具有較佳的散熱效 本發明的-實施例提出—種機架舰器，包括一機 汾、至少-機箱、至少—可抽換模組以及至少—風扇。機 相可移動地配置在機櫃内，且機箱具有一開口與多個通風 :、°風扇配置在機櫃與機箱之間，线扇產生的—氣流經 通風Π流人及流出機箱，且氣流在機箱内沿著—第二轴 向流動，其中第一軸向實質上垂直於第二軸向。 基於上述，在本發明的上述實施例中，機架伺服器利 201202898 100363.TW 34773twf.doc/n 用機箱及其内部的配置以形成適當的流動氣流，盆包含將 機箱的側板設置多個通風π 1及其喊置電子;;件形成 連通這些通風π的通道。如此—來，風扇便可配置在機箱 外的側板旁，而使風扇所產生軌流經由通風口流入及流 出機箱，並因其_構件配置而使氣流在機箱内的流動方 向垂直於機箱内可抽換模組的移動轴向，藉以提高舰器 機箱的散熱效能。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 圖1疋依照本發明一實施例的一種機架飼服器的示意 圖。圖2是圖1的機架词服器中機箱的示意圖，其中在圖 2中省略機櫃以清楚辨識機箱的内部構件配置。請同時參 考圖1及圖2，在本實施例中，機架伺服器1〇包括多個機 • 箱100、一機櫃200、多個風扇300與可抽換模組4〇〇。機 箱1〇〇藉由軌道210而可移動地配置在機櫃2〇〇内，可抽 換模組400可移動地配置在機箱1〇〇内，並適於沿著一第 一軸向A1而移入或移出機箱1〇〇。由於各個機箱1〇〇在機 櫃200内的配置情形皆相同，因此在下述說明中，將以其 中一個機箱100作為說明標的。 請再參考圖2，機箱1〇〇包括一底板11〇、立設在底 板Π0周緣的一後面板13〇與彼此平行的一對側板14〇， 其中後面板130連接在此對側板140之間。再者，底板11〇 201202898 iuwo^.x w 34773twf.doc/n 與此對側板140形成一開口 120 ’後面板i3〇正位於開口 120的對側。值得注意的是’側板140具有多個通風口 142, 而風扇300配置在其中一侧板140與機櫃200之間，以使 風扇300所產生的氣流經由通風口 142流入及流出機箱 100。 此外，在本實施例中，機架伺服器10更包括一前面 板150、一承載架500與一主機板模組600，主機板模組 600配置在底板11〇上’承載架500可移動地配置在主機 板模組600的上方，而可抽換模組4〇〇包括多個硬碟41〇， 其陣列地配置在承載架500上。前面板15〇配置在承載架 500上且相對於後面板130。據此，使用者藉由將承載架 500拉出機箱1〇〇而對其中的硬碟41〇進行維修或更換等 裝配作業’藉此避免需將整個機箱100從機櫃2〇〇中拉出 所造成作業上的不便。惟本發明並未限定可抽換模組4〇〇 的種類及其在機箱1〇〇内的配置。在本發明另一未繪示的 實施例中，可抽換模組亦可為主機板模組或同時包含主機 板模組與硬碟在内的相關電子元件。另外，機架伺服器亦 可包括多個承載架’以使配置在機箱内的各個電子元件皆 能從開口處移出或移入機箱，而方便進行各自相關的裝配 作業。 基於上述，本發明中的機箱100藉由在側板140處設 置多個通風口 142 ’並將風扇300配置在侧板140與機櫃 200之間’因此風扇300所產生的氣流會經由通風口 ι42 而沿箸一第二軸向A2流入及流入機箱1〇〇β由於機箱1〇〇 201202898 100363.TW 34773twf.doc/n 的側板140長度大於前面板15〇與後面板13〇的長度。因 此，本實施例中沿第二轴向A2流動的氣流，其流經機箱 100的打程會比習知技術巾沿第-軸向A1流動的氣流較 短，使得本發明的機架伺服器10的冷卻效率能因而提升。 此外，本發明並未限制風扇3〇〇的數量，於本發明另 一未繪示的實施例中，風扇300亦可同時配置在機箱1〇〇 兩侧的侧板140與機櫃200之間，以藉由提高氣流流量而 φ 增進散熱效果。 ▲再加以詳述如下，圖3是圖2的機箱的局部放大圖。 «月同時參考圖2與圖3，在本實施例中，主機板模組6〇〇 包括多個散熱鰭片組61〇與多個記憶體模組620，其中記 憶體模組620陣列地配置在機箱1〇〇内而形成第一通道 622,而散熱鰭片組61〇的多個鰭片之間亦形成第二通道 612。值％主思的是，第一通道622與第二通道612皆平行 於第二轴向A2。換句話說，記憶體模組620與散熱鰭片組 鲁 610的鰭片，其配置方向皆垂直於側板14〇。類似地，位在 承載架500上的可抽換模組400中的多個硬碟41〇亦具有 類似的配置。詳細而言，任意其中兩個硬碟41〇之間存在 一第三通道412，且此第三通道412亦平行於第二軸向。 如此一來，從其中一側板140的通風口 142流入機箱1〇〇 的氣流能不受阻礙地經由與其同向的第一通道622、第二 通道612與第三通道412流至對面側板14〇的通風口 14^ 據此，在機箱100内流動的氣流便不會因機箱1〇〇内部構 件的配置而受到干擾，致使產生習知技術中氣流流動不良 201202898 100363.TW 34773twf.doc/n 而造成散熱效能不佳的情形。 另一方面，本發明並未限制機箱100内部電子元件間 的通道形式，凡是機箱100内的電子元件間形成平行於第 二軸向A2的通道，以利氣流流動者皆可適用於本發明。 再者，與習知機架伺服器的機箱内部配置相較之下， 由於本發明之上述配置，其所造成的氣流方向（第二轴向 A2)會與可抽換模組4〇〇的移動方向（第一軸向A1)垂 f。據此，本發明中的風扇3〇〇無須配置於機箱1〇〇内的 前面板150或後面板no處，進而使機箱的前面板15〇與 後面板130能具有多個輸入/輸出口 132與152，作為機箱 100内部的電子元件與外部裝置的聯繫之用，以增加機架 飼服器10的功能性。 同樣地，機架伺服器10還包括一電源供應模組700， 其配置在機箱1GG外。電源供應模組同時供電給風扇 3〇〇與機箱100内的電子模組，其例如是以12伏特的直流 電源直接對風扇300與機箱1〇〇内的電子模組進行供電。 在本實施例中，電子模組包括可抽換模組4〇〇與配置在底 板U0上的主機板模組600。此舉由於將電源供應模組7〇〇 供電所需之親線亦配置在機箱刚外，故而使機箱内 部的構件配置得以更加«，以贼習知技術中，機箱内 部同時配置過多的構件及相_線而干擾氣流流 箱的散熱效果不#。 综上所述’在本發明的上述實施例中，藉由風扇配置 在機箱的側板與機櫃之間，並同時使機箱的側板具有多個 201202898 100363.TW 34773twf.doc/n 通風口，以及機箱内部的電子元件排列方式達到具有一致 方向的搭配，而造就風扇的氣流能順利地從機箱^其中一 側板流向另-側板。如此’一方面能使氣流的流動行程縮 短而提高機箱内的散熱效率。另一方面能使機箱内部的配 置更加簡潔，以降低對機箱内部氣流流動的干擾。 此外，機箱的前、後面板亦因風扇及其規線移出機箱 外而得以具有更多的輸人/輸出口，間接地增加機架词服器 • 的對外聯繫功能。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何所屬技術領域t具有通常知識者，在不脫離 本發明之精神和範圍内，當可作些許之更動與潤飾，故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1是依照本發明一實施例的一種機架伺服器的示意 圖。 鲁 圖2是圖1的機架伺服器中機箱的示意圖。 圖3是圖2的機箱的局部放大圖。 【主要元件符號說明】 100 :機箱 120 :開口 132 ' 152 :輸入/輸出口 142 :通風口 10 :機架伺服器 110 :底板 130 :後面板 140 :側板 201202898 ιυυ^ο^.ι w 34773twf.doc/n 150 :前面板 210 :軌道 400 :可抽換模組 412 :第三通道 600 :主機板模組 612 :第二通道 622 :第一通道 A1 :第一轴向 200 :機櫃 300 :風扇 410 :硬碟 500 :承載架 610 :散熱鰭片組 620 :記憶體模組 700 :電源供應模組 A2 :第二軸向The server is the core computer that serves each computer in the network system. It can provide the functions of the disk and printing services required by the network users, and also allows the users to share the various environments in the network environment. Resources. The basic structure of the feeder is roughly the same as that of a general personal computer. It consists of a central processing unit (CPU), a memory (Memory), and a wheel/input (1/〇) device, and is connected by a bus (Bus). Connect it internally, through the Northbridge chip ft central processor and memory, and through the south bridge chip connection input and output S and the wing 〇 here take the rack 为 device as an example, the rack ship is a kind of appearance (4) System-standard design _ service||, gi combined cabinet system--use: Road equipment is a closed-frame structure, which is mostly flat two 3-phase drawers. For example, switches, routers, and hardware 'just like a phaser:) width is 4 inches, height, single ^ 2U5U, 7U several: paste, however, the rack server is often filled with electronics because of the small space Component; the device is greatly shrinking the feeding device is subject to the limitation of heat dissipation: f ' So for example, the prior art 201202898 1WJ0J.1W 34773twf.doc/n the operating frame server, its wind More in the chassis __ flow side 岐 ^ board, so in general, the chassis is mostly long distance. - == The reason why the airflow in the chassis will be due to its flow == 'the front and rear panels of the chassis (4) are used as various types: with = therefore the chassis is used as the airflow through: with these input / output ports are limited to each other . In addition: :: The power supply is connected to the chassis via a twisted wire. These windings prevent airflow in the chassis (4). It will let the K-Case (10) flow 'and then reduce the machine: it will become: 2. Therefore, thinking about how to improve the effectiveness of the rack server has become a problem for the relevant personnel. SUMMARY OF THE INVENTION Rate. The present invention provides a rack-mounting device having a better heat dissipation effect. The invention provides a rack-mounted vehicle comprising a casing, at least a casing, at least a replaceable module, and at least fan. The machine phase is movably disposed in the cabinet, and the chassis has an opening and a plurality of ventilations: and the fan is disposed between the cabinet and the chassis, and the air fan generates airflow through the ventilation and the outflow chassis, and the airflow is in the chassis. The inner flow follows a second axial direction, wherein the first axial direction is substantially perpendicular to the second axial direction. Based on the above, in the above-described embodiments of the present invention, the rack server 201202898 100363.TW 34773twf.doc/n is configured with the chassis and its internals to form an appropriate flow airflow, and the basin includes a plurality of ventilations for setting the side panels of the chassis. π 1 and its screaming electrons; the pieces form a passage connecting these ventilations π. In this way, the fan can be placed beside the side panel outside the chassis, so that the rail flow generated by the fan flows into and out of the chassis through the vent, and the flow direction of the airflow in the chassis is perpendicular to the chassis due to its component configuration. The moving axis of the module is replaced to improve the heat dissipation performance of the chassis. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] FIG. 1 is a schematic view of a rack feeder according to an embodiment of the present invention. 2 is a schematic illustration of the chassis of the rack voucher of FIG. 1, with the cabinet omitted in FIG. 2 to clearly identify the internal component configuration of the chassis. Referring to FIG. 1 and FIG. 2 simultaneously, in the embodiment, the rack server 1 includes a plurality of cabinets 100, a cabinet 200, a plurality of fans 300, and a replaceable module 4A. The chassis 1 is movably disposed in the cabinet 2 by means of a track 210, and the removable module 400 is movably disposed in the chassis 1 and adapted to move along a first axis A1 Or remove the chassis 1〇〇. Since the arrangement of each chassis 1 in the cabinet 200 is the same, in the following description, one of the chassis 100 will be used as an illustration. Referring to FIG. 2 again, the chassis 1 includes a bottom plate 11 , a rear panel 13 立 standing on the periphery of the bottom plate Π 0 and a pair of side plates 14 平行 parallel to each other, wherein the rear panel 130 is connected between the pair of side plates 140 . Further, the bottom plate 11 201202898 iuwo ^.x w 34773 twf.doc/n forms an opening 120 ′ with the pair of side plates 140 ′ the rear panel i3 〇 is located on the opposite side of the opening 120. It is noted that the side panel 140 has a plurality of vents 142, and the fan 300 is disposed between the one side panel 140 and the cabinet 200 such that the airflow generated by the fan 300 flows into and out of the chassis 100 through the vents 142. In addition, in the embodiment, the rack server 10 further includes a front panel 150, a carrier 500 and a motherboard module 600. The motherboard module 600 is disposed on the bottom plate 11 ' the carrier 500 is movably The module 4 is disposed above the motherboard module 600, and the removable module 4 includes a plurality of hard disks 41, which are arranged in an array on the carrier 500. The front panel 15A is disposed on the carrier 500 and opposite to the rear panel 130. Accordingly, the user performs an assembly operation such as repairing or replacing the hard disk 41 其中 by pulling the carrier 500 out of the chassis 1 to thereby avoid the need to pull the entire chassis 100 out of the cabinet 2 Caused inconvenience in the work. However, the present invention does not limit the type of the replaceable module 4A and its configuration within the chassis. In another embodiment of the present invention, the replaceable module can also be a motherboard module or related electronic components including a motherboard module and a hard disk. In addition, the rack server can also include a plurality of carriers </ RTI> so that the various electronic components disposed within the chassis can be removed or moved into the chassis from the opening to facilitate respective associated assembly operations. Based on the above, the chassis 100 of the present invention is provided with a plurality of vents 142 ′ at the side panels 140 and the fan 300 is disposed between the side panels 140 and the cabinet 200. Therefore, the airflow generated by the fan 300 passes through the vents ι 42 . The length of the side plate 140 of the chassis 1 〇〇 201202898 100363.TW 34773 twf.doc/n is greater than the length of the front panel 15 〇 and the rear panel 13 箸 along the first axial direction A2 of the first one. Therefore, in the present embodiment, the airflow flowing along the second axial direction A2, the flow through the chassis 100 is shorter than the flow of the conventional technical towel flowing along the first-axis A1, so that the rack server of the present invention The cooling efficiency of 10 can be improved. In addition, the present invention does not limit the number of the fan 3〇〇. In another embodiment of the present invention, the fan 300 can also be disposed between the side plates 140 on both sides of the chassis 1 and the cabinet 200. In order to increase the air flow rate, φ enhances the heat dissipation effect. ▲More details are as follows. Fig. 3 is a partial enlarged view of the chassis of Fig. 2. Referring to FIG. 2 and FIG. 3 at the same time, in the embodiment, the motherboard module 6 includes a plurality of heat dissipation fin groups 61 and a plurality of memory modules 620, wherein the memory modules 620 are arranged in an array. A first channel 622 is formed in the chassis 1 and a second channel 612 is also formed between the plurality of fins of the heat dissipation fin group 61. The value % is that the first channel 622 and the second channel 612 are both parallel to the second axis A2. In other words, the fins of the memory module 620 and the heat dissipating fin set 610 are arranged perpendicular to the side plates 14A. Similarly, the plurality of hard disks 41 in the removable module 400 on the carrier 500 also have a similar configuration. In detail, there is a third passage 412 between any two of the hard disks 41, and the third passage 412 is also parallel to the second axial direction. As a result, the airflow flowing into the chassis 1 from the vent 142 of the one side plate 140 can flow unimpeded through the first channel 622, the second channel 612 and the third channel 412 in the same direction to the opposite side plate 14〇. According to this, the airflow flowing in the casing 100 is not disturbed by the configuration of the internal components of the casing 1 , resulting in a poor flow of air in the prior art 201202898 100363.TW 34773twf.doc/n Causes poor heat dissipation. On the other hand, the present invention does not limit the form of the channel between the electronic components inside the chassis 100. Any channel between the electronic components in the chassis 100 that is parallel to the second axis A2 is suitable for the present invention. Moreover, compared with the internal configuration of the chassis of the conventional rack server, due to the above configuration of the present invention, the direction of the airflow (the second axis A2) and the replaceable module 4 are The moving direction (first axis A1) is vertical f. Accordingly, the fan 3〇〇 in the present invention does not need to be disposed in the front panel 150 or the rear panel no in the chassis 1 , so that the front panel 15 〇 and the rear panel 130 of the chassis can have multiple input/output ports 132 . And 152, as a connection between the electronic components inside the chassis 100 and an external device, to increase the functionality of the rack feeder 10. Similarly, the rack server 10 further includes a power supply module 700 disposed outside the chassis 1GG. The power supply module simultaneously supplies power to the fan 3 〇〇 and the electronic module in the chassis 100, for example, the 12 volt DC power supply directly supplies power to the fan 300 and the electronic module in the chassis 1 . In this embodiment, the electronic module includes a replaceable module 4A and a motherboard module 600 disposed on the bottom plate U0. Since the line required for power supply of the power supply module 7〇〇 is also disposed outside the chassis, the internal components of the chassis can be further configured. In the thief-known technology, too many components are disposed in the chassis at the same time. The phase_line interferes with the heat dissipation effect of the airflow flow box. In summary, in the above embodiment of the present invention, the fan is disposed between the side panel of the chassis and the cabinet, and at the same time, the side panel of the chassis has a plurality of 201202898 100363.TW 34773twf.doc/n vents, and the chassis The internal electronic components are arranged in a uniform orientation, and the airflow of the fan can smoothly flow from the side of the chassis to the other side panel. In this way, on the one hand, the flow stroke of the airflow can be shortened to improve the heat dissipation efficiency in the chassis. On the other hand, the internal configuration of the chassis can be more simplified to reduce the interference of airflow inside the chassis. In addition, the front and rear panels of the chassis are also equipped with more input/output ports due to the fan and its rules being removed from the chassis, which indirectly increases the external contact function of the rack word processor. The present invention has been disclosed in the above embodiments, but it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of a rack server in accordance with an embodiment of the present invention. Lutu 2 is a schematic diagram of the chassis in the rack server of Fig. 1. 3 is a partial enlarged view of the chassis of FIG. 2. [Main component symbol description] 100: Chassis 120: opening 132' 152: input/output port 142: vent 10: rack server 110: bottom plate 130: rear panel 140: side plate 201202898 ιυυ^ο^.ι w 34773twf. Doc/n 150: front panel 210: track 400: replaceable module 412: third channel 600: motherboard module 612: second channel 622: first channel A1: first axis 200: cabinet 300: fan 410: hard disk 500: carrier 610: heat sink fin group 620: memory module 700: power supply module A2: second axial direction
1010