TW202010377A - server - Google Patents

Abstract

A server is used to be disposed on a cabinet. The server includes a case, a mother board, at least one storage module and a switch board. The case is used to be movably disposed on the cabinet. The case includes a base board, a first side board and a second side board. The first side board and the second side board stands on the base board. The mother board includes a circuit board, at least one central processing unit and at least one riser card. The circuit board is disposed on the base board. The at least one central processing unit and the at least one riser card are disposed on the circuit board. The at least one storage module is disposed on the base board. The at least one storage module includes a back board and a plurality of storage unit. The back board is disposed on the base board. The storage unit is electronically connected to the back board. The switch board is disposed on the base board.

Description

server

The invention relates to a server, especially a server with a high-density storage unit.

With the development of the Internet, the cloud services provided by the combination of servers and the Internet have been rapidly spreading all over the world in recent years, and the popularity of cloud services has led to a huge amount of data processed by servers at an alarming rate. growing up. Therefore, the server's requirements for storage space and read/write speed of the storage unit increase with the growth of data.

However, in addition to the storage unit, the server also needs to be equipped with components such as a motherboard, a heat dissipation module, and an expansion card in a limited space. Therefore, it is difficult to set the number of storage units in the server to break through the space limitation of the server. The density of the storage unit is difficult to increase.

The present invention is to provide a server to solve the problem that it is difficult for the number of storage units in a conventional server to break through the space limitation of the server, resulting in the difficulty of increasing the density of the storage unit.

The server disclosed in an embodiment of the present invention is used to be installed in a cabinet. The server includes a chassis, a motherboard, at least one storage module, and a service access switching board. The casing is movably arranged in the cabinet. The casing includes a bottom plate, a first side plate and a second side plate. The bottom plate has a first side, a second side, a third side, and a fourth side. The first side is opposite to the second side. The third side is opposite to the fourth side, and the third side and the fourth side are interposed between the first side and the second side. The first side plate and the second side plate stand on the first side and the second side, respectively. The main board is between the first side board and the second side board, and is closer to the first side board. The motherboard includes a circuit board, at least one central processing unit and at least one riser card. The circuit board is arranged on the bottom plate. At least one central processor and at least one adapter card are disposed on the circuit board. At least one adapter card is electrically connected to at least one central processor. At least one storage module is disposed on the bottom plate and is located between the second side plate and the circuit board. At least one storage module includes a backplane and multiple storage units. The back plate is arranged on the bottom plate. The storage unit is electrically connected to the backplane. The service access switch board is disposed on the bottom board and interposed between the circuit board and the second side board. At least one storage module is between the service access switching board and the third side. The backplane of at least one adapter card and at least one storage module is electrically connected to the service access switch version.

According to the server disclosed in the above embodiment, the service access switching board electrically connected to the adapter card and the backplane is between the circuit board and the second side board, and the storage module is located between the service access switching board and the second Between the three sides, the number of internal storage units of the server can break through the original space limitation. In this way, the density of the storage unit can be increased, so that the server has a larger storage space and faster read and write speed.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principles of the present invention, and provide a further explanation of the scope of the patent application of the present invention.

Please refer to Figure 1 and Figure 2. FIG. 1 is a perspective view of a server according to a first embodiment of the invention. Fig. 2 is an exploded view of the server of Fig. 1.

The height H of the server 10 of this embodiment is, for example, 2U. Generally speaking, the height H of the server 10 is in units of U, and 1U is equivalent to 1.75 inches, which is also equivalent to 44.45 mm. The server 10 includes a chassis 100, a motherboard 150, two storage modules 200, a service access switching board 250, an expansion network card 300, a power distribution board 350, a cable 400, a cable management frame 450 , A plurality of first electrical connectors 500, a plurality of second electrical connectors 550, and a plurality of calibration screws 600.

The casing 100 includes a bottom plate 101, a first side plate 102 and a second side plate 103. The bottom plate 101 has a first side S1, a second side S2, a third side S3, and a fourth side S4. The first side S1 is opposite to the second side S2. The third side S3 is opposite to the fourth side S4. The third side S3 and the fourth side S4 are interposed between the first side S1 and the second side S2. The first side plate 102 and the second side plate 103 stand on the first side S1 and the second side S2, respectively.

The main board 150 is interposed between the first side board 102 and the second side board 103 and is closer to the first side board 102. The motherboard 150 includes a circuit board 151, two central processing units 152, two riser cards 153, two first network interfaces 154, a shield 155 and a signal connection board 156. The circuit board 151 is disposed on the bottom plate 101. The two central processors 152 are disposed on the circuit board 151. The second riser card 153 is disposed on the circuit board 151. For example, the two riser cards 153 are electrically connected to the two CPUs 152 through two PCI-E slots with high-density X16 lane bandwidths, respectively. The two first network interfaces 154 are disposed on the circuit board 151. The mask 155 is provided on the circuit board 151. The signal connection board 156 is disposed on the circuit board 151. In this embodiment, the motherboard 150 includes two CPUs 152, but it is not limited to this. In other embodiments, the motherboard may only include a CPU. In addition, in this embodiment, the motherboard 150 includes two riser cards 153, but it is not limited to this. In other embodiments, the motherboard may also include only one riser card. Furthermore, in this embodiment, the motherboard 150 includes two first network interfaces 154, but it is not limited to this. In other embodiments, the motherboard may also only include a first network interface.

The two storage modules 200 are disposed on the bottom plate 101 and between the second side plate 103 and the main board 150. In other words, the two storage modules 200 and the motherboard 150 are arranged side by side between the first side plate 102 and the second side plate 103. A distance D is maintained between the two storage modules 200 to form a hard disk insertion space 203. In this embodiment, the server 10 includes two storage modules 200, but it is not limited thereto. In other embodiments, the server may include only one storage module.

Please refer to Figure 3 and Figure 4. 3 is an exploded view of the storage module of the server of FIG. 4 is a perspective schematic view of the storage device and the heat dissipation structure of the server of FIG. 1 turned 180 degrees. The two storage modules 200 each include a backplane 201 and a plurality of storage units 202. The second backboard 201 is disposed on the bottom plate 101. The storage units 202 are, for example, solid-state hard drives that conform to the Non-Volatile Memory Standard (NVMe), and are electrically connected to the backplane 201 in the same storage module 200. The number of the storage units 202 is, for example, sixteen, and the two storage modules 200 are each provided with eight storage units 202. The storage units 202 each include a housing 2020, a storage element 2021, and a heat dissipation structure 2022. In each storage unit 202, the storage element 2021 has a heat dissipation surface F1, a top surface F2, and an annular side surface F3. The heat dissipation surface F1 is located on the side of the storage element 2021 close to the bottom plate 101. The top surface F2 is opposite to the heat dissipation surface F1. The annular side surface F3 is connected to the heat dissipation surface F1 and the top surface F2. The housing 2020 only covers the top surface F2 and the annular side surface F3 of the storage element 2021 to expose the heat dissipation surface F1, and further forms a heat dissipation channel 2023 on the side of the storage element 2021 near the bottom plate 101. The heat dissipation structure 2022 is located in the heat dissipation channel 2023 and thermally contacts the heat dissipation surface F1 to dissipate the heat generated by the storage element 2021 from the heat dissipation channel 2023 outside the server 10.

The service access switching board 250 is disposed on the bottom board 101 and interposed between the circuit board 151 and the second side board 103. The two storage modules 200 are interposed between the service access switching board 250 and the third side S3. The two riser cards 153 and the backplane 201 of the two storage modules 200 are electrically connected to the service access switch board 250. In addition, the service access switching board 250, the motherboard 150, and the two backplanes 201 of the two storage modules 200 are all parallel to the bottom plate 101, for example, to reduce the impedance of the airflow passing through the two storage modules 200.

The expansion network card 300 is, for example, a network card conforming to the Open Compute Project (OCP) specification, and is installed on the circuit board 151. The side of the expansion network card 300 near the third side S3 has two second network interfaces 301. The data transmission rate of the second network interface 301 is greater than the data transmission rate of the second network interface 154. For example, the data transmission rate of the two first network interfaces 154 is, for example, 10 Gbps. The data transmission rate of the second network interface 301 is, for example, 25 Gbps. In this embodiment, the side of the expansion network card 300 near the third side S3 has two second network interfaces 301, but it is not limited to this. In other embodiments, the expansion network card near the third side One side may also only have a second network interface.

Please refer to Figure 1 and Figure 5. 5 is a perspective view of the signal connection board, power distribution board, cable, cable management frame, first electrical connector, second electrical connector, and calibration screw of the server of FIG. 1. The power distribution board 350 is detachably connected to the bottom plate 101. The cable 400 is electrically connected to the signal connection board 156 and the power distribution board 350. The cable management frame 450 is movably disposed on the power distribution board 350. The cable 400 is installed on the cable management frame 450. In this embodiment, the server 10 includes a cable 400, but it is not limited thereto. In other embodiments, the server may also include multiple cables.

These first electrical connectors 500 are disposed on the signal connection board 156. These second electrical connectors 550 are provided on the distribution board 350. The cable 400 is electrically connected to the first electrical connectors 500 and the second electrical connectors 550, so that the signal connection board 156 and the power distribution board 350 can transmit signals to each other.

The calibration screws 600 each include a locking screw 601 and an elastic element 602. In each calibration screw 600, a locking screw 601 is locked to the power distribution board 350. The elastic element 602 is, for example, a spring, and is sleeved on the locking screw 601. The opposite sides of the elastic element 602 are respectively connected to the locking screw 601 and the power distribution board 350 to correct the relative positions of the cabinet 100 and the power distribution board 350 by the elastic force of the elastic element 602.

Please refer to Figure 1 and Figure 6. FIG. 6 is a partially enlarged view of a schematic cross-sectional view of the server of FIG. 1. When a cooling fan (not shown) guides a cooling airflow A from the server 10, the two storage modules 200 and the motherboard 150 are arranged side by side between the first side plate 102 and the second side plate 103, so that the two storage The heat dissipation path of the module 200 and the heat dissipation path of the motherboard 150 are independent of each other.

The arrangement relationship of the service access switch board 250, the motherboard 150 and the second backplane 201 parallel to the bottom plate 101 enables the heat dissipation airflow A to be more smoothly guided to the heat dissipation channels in the second storage module 200 in a horizontal manner 2023, thereby improving the heat convection efficiency in each heat dissipation channel 2023.

On the other hand, for each storage unit 202, when the radiating airflow A flows through the radiating channel 2023, it can directly radiate the heat dissipation structure 2022 that thermally contacts the heat dissipation surface F1 without interference from the housing 2020. In this way, the heat dissipation structure 2022 can more effectively remove the heat generated by the storage unit 202 to prevent the heat from accumulating in the storage unit 202 and causing the storage unit 202 to be damaged.

Please refer to Figure 7 and Figure 8. 7 is a perspective view of the server of FIG. 1 installed in a cabinet. 8 is a perspective view when the server of FIG. 1 is installed in a cabinet and is in a plug-in position. The server 10 is used to be installed in a cabinet 20. The two opposite sides of the cabinet 20 have two slide grooves 21 respectively. The first side plate 102 and the second side plate 103 are respectively slidably disposed in the two slide grooves 21 of the cabinet 20. Generally speaking, before pulling the server 10 out of the cabinet 20 to the insertion and removal position of the pluggable storage unit 202 (as shown in FIG. 7), the cable 400 must be unplugged before the server 10 can be freely placed in the cabinet Slide in 20. However, in the server 10 of this embodiment, since the power distribution board 350 can be detachably connected to the bottom plate 101, and the cable management frame 450 can be movably disposed on the power distribution board 350, the storage unit 202 can be hot-swapped by the user. In other words, the user can perform the insertion and removal of each storage unit 202 in the hard disk insertion and removal space 203 of the server 10 without removing the cable 400, and the insertion and removal of each storage unit 202 will not affect other The operation of components. When the server 10 is to be retracted into the cabinet 20, the calibration screws 600 can help the user smoothly engage the signal connection board 156 and the power distribution board 350.

According to the server of the above embodiment, the service access switch board that is electrically connected to the adapter card and the backplane is between the circuit board and the second side board, and the storage module is located between the service access switch board and the third side In between, the number of internal storage units in the server can break through the original space limitation. In this way, the density of the storage unit can be increased, so that the server has a larger storage space and faster read and write speed.

Then, because the housing only covers the top surface and the annular side surface of the storage element, and the exposed heat dissipation surface is outside, the heat dissipation structure can directly dissipate the heat dissipation structure that is in thermal contact with the heat dissipation surface without interference of the housing. The heat dissipation efficiency can be effectively improved.

Next, since the two storage modules and the main board are arranged side by side between the first side board and the second side board, the heat dissipation path of the two storage modules and the main board are independent of each other, and the two storage modules are upgraded together And the heat dissipation efficiency of the circuit board.

Then, because the service access switch board, the motherboard and the two backplanes are parallel to the bottom plate, the cooling airflow can be more smoothly guided to the cooling channels in the two storage modules in a horizontal manner, thereby improving the cooling channels Internal convection efficiency.

Then, since the power distribution board can be detachably connected to the bottom plate, the cable management frame can be movably disposed on the power distribution board, and the cable is electrically connected to the first electrical connector disposed on the signal connection board and the second electrical connector disposed on the power distribution board , So that the server can slide freely in the casing without removing the cable, thereby improving the efficiency of the user replacing the storage unit and the maintenance personnel to repair the server.

Then, by setting the first network interface and the second network interface with different data transmission rates, the flexibility of the user in selecting the network interface and the user's demand for high performance of the network interface can be taken into consideration.

Although the present invention is disclosed as above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar arts can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be subject to the scope defined in the patent application scope attached to this specification.

10‧‧‧Server 100‧‧‧Chassis 101‧‧‧Bottom plate 102‧‧‧First side board 103‧‧‧Second side board 150‧‧‧Main board 151‧‧‧Circuit board 152‧‧‧ CPU 153‧‧‧Adapter card 154‧‧‧First network interface 155‧‧‧Mask 156‧‧‧Signal connection board 200‧‧‧Storage module 201‧‧‧Backboard 202‧‧‧Storage unit 2020‧ ‧‧Case 2021‧‧‧storage element 2022‧‧‧heat dissipation structure 2023‧‧‧heat dissipation channel 203‧‧‧hard disk insertion space 250‧‧‧service access switch board 300‧‧‧expansion network card 301‧‧ ‧Second network interface 350‧‧‧Distribution board 400‧‧‧Cable 450‧‧‧Wire management frame 500‧‧‧First electrical connector 550‧‧‧Second electrical connector 600‧‧‧Screw 601 ‧‧‧Locking screw 602‧‧‧Elastic element 20‧‧‧Cabinet 21‧‧‧Chute F1‧‧‧Cooling surface F2‧‧‧Top surface F3‧‧‧Annular side S1‧‧‧First side S2‧ ‧‧Second side S3‧‧‧ Third side S4‧‧‧ Fourth side A‧‧‧Air flow D‧‧‧Distance H‧‧‧ Height

FIG. 1 is a perspective view of a server according to a first embodiment of the invention. Fig. 2 is an exploded view of the server of Fig. 1. 3 is an exploded view of the storage module of the server of FIG. 4 is a perspective schematic view of the storage device and the heat dissipation structure of the server of FIG. 1 turned 180 degrees. 5 is a perspective view of the signal connection board, power distribution board, cable, cable management frame, first electrical connector, second electrical connector, and calibration screw of the server of FIG. 1. FIG. 6 is a partially enlarged view of a schematic cross-sectional view of the server of FIG. 1. 7 is a perspective view of the server of FIG. 1 installed in a cabinet. 8 is a perspective view when the server of FIG. 1 is installed in a cabinet and is in a plug-in position.

10‧‧‧Server

100‧‧‧Chassis

150‧‧‧Motherboard

154‧‧‧The first network interface

200‧‧‧storage module

203‧‧‧ Hard disk insertion space

250‧‧‧Service Access Switchboard

301‧‧‧Second network interface

350‧‧‧Distribution board

400‧‧‧Cable

450‧‧‧Wire management frame

500‧‧‧First electric connector

550‧‧‧Second electric connector

600‧‧‧calibration screw

D‧‧‧Distance

H‧‧‧ Height

Claims (10)

A server for installing in a cabinet, the server includes: a casing for movably installed in the cabinet, the casing includes a bottom plate, a first side plate and a second side plate, the bottom plate has A first side, a second side, a third side and a fourth side, the first side is opposite the second side, the third side is opposite the fourth side, the third side and the fourth side are interposed Between the first side and the second side, the first side plate and the second side plate stand on the first side and the second side, respectively; a motherboard, the motherboard interposed between the first side plate and the Between the second side boards and closer to the first side board, the motherboard includes a circuit board, at least one central processor and at least one riser card, the circuit board is disposed on the bottom board, the at least one central processor and the At least one adapter card is disposed on the circuit board, the at least one adapter card is electrically connected to the at least one central processor; at least one storage module, the at least one storage module is disposed on the bottom plate, and is located on the second side plate And the motherboard, the at least one storage module includes a backplane and a plurality of storage units, the backplane is disposed on the backplane, the storage units are electrically connected to the backplane; and a service access switch board, The service access switching board is disposed on the bottom plate and is between the circuit board and the second side board, the at least one storage module is located between the service access switching board and the third side, the at least one The adapter card and the backplane of the at least one storage module are electrically connected to the service access switchboard. The server as described in item 1 of the patent application scope, wherein the number of the at least one storage module is two, and a distance between the two storage modules is maintained to form a hard disk insertion and removal space. The server as described in item 1 of the patent application scope, wherein the storage units each include a housing, a storage element, and a heat dissipation structure, and in each of the storage units, the storage element has a heat dissipation side near the bottom plate The housing covers the storage element and exposes the heat dissipation surface, and a heat dissipation channel is formed on the side of the storage element close to the bottom plate. The heat dissipation structure is located in the heat dissipation channel and is in thermal contact with the heat dissipation surface. The server as described in item 1 of the patent application scope, wherein the service access switch board, the motherboard, and the backplane of the at least one storage module are all parallel to the backplane. The server as described in item 1 of the patent application scope, wherein the motherboard further includes at least one first network interface, the at least one first network interface is disposed on the circuit board, and the server further includes at least one expansion network A road card, the at least one expansion network card is disposed on the circuit board, and the side of the at least one expansion network card near the third side has at least one second network interface, and the at least one second network interface The data transmission rate is greater than the data transmission rate of the at least one first network interface. The server as described in item 1 of the patent application scope further includes a power distribution board and a cable, the power distribution board can be detachably connected to the bottom board, and the cable is electrically connected to the main board and the power distribution board. The server as described in item 6 of the patent application scope further includes a cable management frame, the cable management frame can be movably arranged on the power distribution board, and the cable is arranged on the cable management frame. The server as described in item 7 of the patent application scope further includes a plurality of first electrical connectors and a plurality of second electrical connectors, the first electrical connectors are disposed on the motherboard, and the second electrical connections The device is disposed on the power distribution board, and the cable is electrically connected to the first electrical connector and the second electrical connector, so that the motherboard and the power distribution board can transmit signals to each other. The server as described in item 6 of the patent application scope further includes a plurality of calibration screws, each of which includes a locking screw and an elastic element, and in each of the calibration screws, the locking screw is locked to the A power distribution board, the elastic element is sleeved on the locking screw, and opposite sides of the elastic element are respectively connected to the locking screw and the power distribution board to correct the chassis and the power distribution board by the elastic force of the elastic element Relative position. The server as described in item 2 of the patent application scope, wherein the height of the server is 1U, the number of the at least one storage module is two, the number of the storage units is sixteen, the two storage modules each include Eight storage units.

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