CN2618206Y - Radiating mould set of computer - Google Patents

Radiating mould set of computer Download PDF

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Publication number
CN2618206Y
CN2618206Y CN 03242602 CN03242602U CN2618206Y CN 2618206 Y CN2618206 Y CN 2618206Y CN 03242602 CN03242602 CN 03242602 CN 03242602 U CN03242602 U CN 03242602U CN 2618206 Y CN2618206 Y CN 2618206Y
Authority
CN
China
Prior art keywords
heat
computer
heat radiator
fan
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 03242602
Other languages
Chinese (zh)
Inventor
李光曜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chenming Mold Industrial Corp
Original Assignee
Chenming Mold Industrial Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chenming Mold Industrial Corp filed Critical Chenming Mold Industrial Corp
Priority to CN 03242602 priority Critical patent/CN2618206Y/en
Application granted granted Critical
Publication of CN2618206Y publication Critical patent/CN2618206Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a computer heat radiation module group, which is arranged between a central processing unit and power supply, comprising a first radiating fin, a second radiating fin, and a conduction part connecting the first radiating fin and the second radiating fin; wherein, the heat source of the central processing unit is transmitted to a fan by the first radiating fin and the conduction part and the heat source of the power supply is also transmitted to the fan by the second first radiating fin so that the heat sources produced by the central processing unit and the power supply are centralized and effectively removed.

Description

The computer to dissipate heat module
Technical field
The utility model relates to a kind of computer to dissipate heat module, particularly a kind of heat radiator, conducting piece and fan arrangement utilized, effectively the heat radiation module that the thermal source of central processing unit and power supply unit is discharged.
Background technology
On the whole the parts of topmost generation thermal source are gone up and are north bridge chips and this four samples element of the display chip on the display interface card on central processing unit, Winchester disk drive, the motherboard in the computer system, yet these parts all are mounted in again among the computer housing all.Though on the higher device of temperature, manufacturer often can add all that heat radiator helps its heat radiation at its thermal source place of distributing, even except heat radiator, also all also can be on heat radiator, add a same big small fan with heat radiator, utilize the caused air-flow of fan, will stay the discrete backing of heat band on the heat radiator rapidly, so as to reaching the effect that reduces chip temperature.But, such way only can allow the chip of the evolution of heat be unlikely to work under too high temperature at the distribute place of heat band from thermal source, and the heat that these parts sent but still can be stayed among the casing, does not have outside the real discharge casing.Though in the power supply unit in casing, one 8 * 8 centimeters fan is arranged, the heat that each parts sent in the casing can be discharged among the casing, add this louvre when design of casing and also can help heat radiation, but effect all is can be not very good usually, after all only by the fan on the power supply unit, add the louvre of casing itself, way does not reach the effect of " cross-ventilation ", the time that the temperature in the natural casing also will be used along with this computing machine and gradually rising.
In sum, the traditional heat-dissipating structure has following defective and still waits to improve:
(1) each element disposes radiating fin and fan respectively, causes the host shell inner space to dwindle, and unfavorable on the contrary thermal source is discharged.
(2) host shell inside is provided with many desk fans, causes sinuous flow easily, causes thermal source in the main case body-internal-circulation.
(3) fan running needs consumes energy, causes the burden of power supply unit relatively, and not only thermal source can increase, and also might influence the usefulness of operation.
The utility model content
So fundamental purpose of the present utility model is to solve above-mentioned defective, for avoiding the existence of this defective, the utility model can be integrated the thermal source that each heat radiator produces, and utilizes single fan that all thermals source are discharged.
For achieving the above object, the utility model is a kind of computer to dissipate heat module, be disposed between central processing unit and the power supply unit, this heat radiation module includes first heat radiator, second heat radiator and connects the conducting piece of aforementioned first and second heat radiator, by first heat radiator and conducting piece the thermal source of central processing unit is conducted to fan, and second heat radiator also conducts to fan with the thermal source of power supply unit, thereby the thermal source that central processing unit and power supply unit produced is effectively discharged.
Description of drawings
Fig. 1 is a profile schematic perspective view of the present utility model.
Fig. 2 is a STRUCTURE DECOMPOSITION synoptic diagram of the present utility model.
Fig. 3 is a back side of the present utility model cross-sectional schematic.
Fig. 4 is that heat source stream of the present utility model is to synoptic diagram.
Embodiment
Relevant detailed description of the present utility model and technology contents now are described as follows with regard to conjunction with figs.:
Please consult Fig. 1 simultaneously, Fig. 2, be profile solid of the present utility model and STRUCTURE DECOMPOSITION synoptic diagram, as shown in the figure: the utility model is a kind of computer to dissipate heat module, be disposed between central processing unit 40 and the power supply unit 50, this heat radiation module includes first heat radiator 10 of being located at central processing unit 40, one second heat radiator 20 and of being located at power supply unit 50 connects aforementioned first, two heat radiator 10,20 conducting piece 30, this is first years old, two heat radiator 10,20 are provided with the metal fins 11 that is parallel to each other, 21, by increasing area, reach the effect of heat radiation, this conducting piece 30 can be the metal fever conduit, its fundamental purpose is first, two heat radiator 10,20 thermals source that absorbed are concentrated, and with the thermal source discharge of a high rotating speed radial fan 60 with integration, this is first years old, two heat radiator 10,20 are provided with location division 12,22, can follow according to the difference of height of central processing unit 40, select different conducting pieces 30 with power supply unit 50.
During assembling, respectively first heat radiator 10 is fixedly arranged on central processing unit 40, second heat radiator 20 is installed on power supply unit 50, the opposite side of second heat radiator 20 is connected in fan 60, according to spacing and the high low head of power supply unit 50 with central processing unit 40, select suitable conducting piece 30 for use, because first, two heat radiator 10, be respectively equipped with location division 12 on 20,22, relative positioning portion 12 on the conducting piece 30,22 are provided with Fixed Division 31,32, can utilize conducting piece 30 sealed connections first, two heat radiator 10,20, the thermal source that central processing unit 40 and power supply unit 50 are produced focuses on.
Please consult Fig. 3, Fig. 4 simultaneously, be the back side of the present utility model analyse and observe and heat source stream to synoptic diagram, as shown in the figure: the area that the thermal source that central processing unit 40 is produced is increased by first heat radiator 10 earlier, reduce portion temperature, remainder then is passed to second heat radiator 20 by conducting piece 30; The thermal source that power supply unit 50 produces, conduct to second heat radiator 20 downwards and disperse part of heat energy, the thermal source that the unnecessary thermal source and first heat radiator 10 transmit is passed to the fan 60 of second heat radiator, 20 belows in the lump, utilizes high rotating speed radial fan 60, and the thermal source of concentrating is discharged.
In sum, principal feature of the present utility model is as described below:
(1) the utility model utilizes first heat radiator 10, second heat radiator 20 and conducting piece 30 to integrate the thermal source of central processing unit 40 and power supply unit 50 generations, with single fan 60 thermal source is discharged again.
(2) because the utility model only needs a desk fan 60 thermal source of the highest part of computer system temperature (central processing unit 40 and power supply unit 50) can be discharged, not only can significantly simplify the main frame inner space, also can avoid phase mutual interference between fan, cause sinuous flow.
(3) configuration of first and second heat radiator 10,20 of the present utility model can be adjusted by conducting piece 30, needn't be because of the type difference, and change the entire heat dissipation module.
Although the utility model is illustrated with reference to accompanying drawing and preferred embodiment,, above embodiment only is exemplary, for the person of ordinary skill of the art, the utility model can have various changes and variation.Various change of the present utility model, variation and equivalent are contained by the content of appending claims.

Claims (7)

1. a computer to dissipate heat module is disposed between central processing unit and the power supply unit,
It is characterized in that described heat radiation module comprises:
One is located at first heat radiator (10) of described central processing unit (40);
One is located at second heat radiator (20) of described power supply unit (50), described
Second heat radiator (20) also is connected to fan (60); And
One connects the conducting piece (30) of described first and second heat radiator (10,20).
2. computer to dissipate heat module according to claim 1 is characterized in that, described conducting piece (30) is arranged in first and second heat radiator (10,20).
3. computer to dissipate heat module according to claim 1 is characterized in that, described first and second heat radiator (10,20) is provided with location division (12,22).
4. computer to dissipate heat module according to claim 3 is characterized in that, the corresponding location division of described conducting piece (30) (12,22) is provided with Fixed Division (31,32) relatively.
5. computer to dissipate heat module according to claim 1 is characterized in that, described conducting piece (30) can be heat pipe.
6. computer to dissipate heat module according to claim 1 is characterized in that, described first and second heat radiator (10,20) is provided with the fin (11,21) that is parallel to each other.
7. computer to dissipate heat module according to claim 1 is characterized in that, described fan (60) can be high rotating speed radial fan.
CN 03242602 2003-03-26 2003-03-26 Radiating mould set of computer Expired - Fee Related CN2618206Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03242602 CN2618206Y (en) 2003-03-26 2003-03-26 Radiating mould set of computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03242602 CN2618206Y (en) 2003-03-26 2003-03-26 Radiating mould set of computer

Publications (1)

Publication Number Publication Date
CN2618206Y true CN2618206Y (en) 2004-05-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 03242602 Expired - Fee Related CN2618206Y (en) 2003-03-26 2003-03-26 Radiating mould set of computer

Country Status (1)

Country Link
CN (1) CN2618206Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105716455A (en) * 2014-12-01 2016-06-29 青岛海尔特种电冰柜有限公司 Heat radiating device and semiconductor refrigerating equipment
CN106922103A (en) * 2015-12-24 2017-07-04 联想(北京)有限公司 Heat abstractor and electronic equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105716455A (en) * 2014-12-01 2016-06-29 青岛海尔特种电冰柜有限公司 Heat radiating device and semiconductor refrigerating equipment
CN106922103A (en) * 2015-12-24 2017-07-04 联想(北京)有限公司 Heat abstractor and electronic equipment
CN106922103B (en) * 2015-12-24 2019-10-29 联想(北京)有限公司 Radiator and electronic equipment

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GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee