CN105716455A - Heat radiating device and semiconductor refrigerating equipment - Google Patents
Heat radiating device and semiconductor refrigerating equipment Download PDFInfo
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- CN105716455A CN105716455A CN201410711507.8A CN201410711507A CN105716455A CN 105716455 A CN105716455 A CN 105716455A CN 201410711507 A CN201410711507 A CN 201410711507A CN 105716455 A CN105716455 A CN 105716455A
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- semiconductor refrigerating
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- radiator
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Abstract
The invention provides a heat radiating device and semiconductor refrigerating equipment. The heat radiating device comprises at least three heat radiators. Each heat radiator comprises a heat conductor, a plurality of heat pipes and a cooling fin set, wherein the heat pipes are connected to the heat conductor, and the cooling fin set is connected to the heat pipes. Each heat conductor is further connected with an auxiliary heat pipe. The auxiliary heat pipe of any heat radiator is further connected with at least one cooling fin set of the rest of the heat radiators. The heat of the hot end of a semiconductor refrigerating module is absorbed through the heat conductors, heat can be transferred to the cooling fin sets with the large heat radiation area through the heat pipes by means of the heat conductors, so that self-heat radiation is achieved, and no independent fan is needed for air cooling; and in addition, the cooling fin sets in the multiple heat radiators can be utilized by the heat conductors for heat radiation at the same time, so that the multiple cooling fin sets are in the heat radiating state all the time, the heat radiating capacity of the multiple cooling fin sets can be utilized sufficiently, in this way, the heat radiating capacity of the semiconductor refrigerating equipment can be improved, and the energy consumption of the semiconductor refrigerating equipment is reduced.
Description
Technical field
The present invention relates to refrigerating plant, particularly relate to a kind of heat abstractor and semiconductor refrigerating equipment.
Background technology
At present, refrigeration plant (such as refrigerator, refrigerator, wine cabinet) is electrical equipment conventional in people's daily life, is generally of refrigeration system in refrigeration plant, and generally refrigeration system is made up of compressor, condenser and vaporizer, it is possible to realize the refrigeration of relatively low temperature.But, along with the development of semiconductor refrigerating technology, adopt the refrigeration plant that semiconductor chilling plate carries out freezing to be also widely used.Storage space in casing is freezed by semiconductor refrigerating equipment of the prior art by the cold end released cold quantity of semiconductor refrigerating module, and meanwhile, the hot junction of semiconductor refrigerating module will discharge heat.In prior art, it is typically employed on the hot junction of semiconductor refrigerating module directly to arrange fan and carries out air-cooled, and in actual use, fan needs to be constantly in duty, causes that the energy consumption of semiconductor refrigerating equipment is higher.
Summary of the invention
The technical problem to be solved is: provide a kind of heat abstractor and semiconductor refrigerating equipment, it is achieved reduce the energy consumption of semiconductor refrigerating equipment.
Technical scheme provided by the invention is, a kind of heat abstractor, including at least three radiator, described radiator includes heat carrier, many heat pipes and groups of fins, and described heat pipe is connected on described heat carrier, and described groups of fins is connected on described heat pipe；Being also associated with auxiliary heat pipe on described heat carrier, the described auxiliary heat pipe in arbitrary described radiator is also connected with at least one the described groups of fins remained in described radiator.
The present invention also provides for a kind of semiconductor refrigerating equipment, including at least three semiconductor refrigerating module, also includes above-mentioned heat abstractor, and the heat carrier in described heat abstractor is connected to the hot junction of the described semiconductor refrigerating module of correspondence.
Heat abstractor provided by the invention and semiconductor refrigerating equipment, by adopting heat carrier to absorb the heat in semiconductor refrigerating module hot junction, heat carrier can transfer heat to carry out in the groups of fins that area of dissipation is bigger self-heating heat radiation by heat pipe, carry out air-cooled without adopting independent fan, realize improve the refrigeration performance of semiconductor refrigerating equipment, optimize the muting function of heat abstractor；Additionally, heat carrier can utilize the groups of fins in multiple radiator to dispel the heat simultaneously, multiple groups of fins is made to be in the state of heat radiation all the time, to make full use of the heat-sinking capability of multiple groups of fins, realize improving the heat-sinking capability of semiconductor refrigerating equipment, and reduce the energy consumption of semiconductor refrigerating equipment.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of heat abstractor embodiment of the present invention；
Fig. 2 is the structural representation of heat carrier in heat abstractor embodiment of the present invention.
Detailed description of the invention
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
As Figure 1-Figure 2, the present embodiment heat abstractor includes at least three radiator, each radiator heat carrier 41, many heat pipes 42 and groups of fins 43, and described heat pipe 42 is connected on described heat carrier 41, and described groups of fins 43 is connected on described heat pipe 42.
Specifically, heat carrier 41 is attached to the hot junction of semiconductor refrigerating module, and groups of fins 43 is attached on the shell of semiconductor refrigerating equipment, the heat that the hot junction of semiconductor refrigerating module produces passes to heat pipe 42 by heat carrier 41, heat pipe 42 can quickly transfer heat in groups of fins 43, and groups of fins 43 can make the radiator of larger area as required, groups of fins 43 can utilize the heat that the area of dissipation opposite heat tube 42 that self is bigger transmits to carry out quick heat radiating, is directly dispelled the heat in the hot junction of quasiconductor refrigeration module from without by fan.Wherein, in order to utilize each groups of fins 43 to dispel the heat fully, heat carrier 41 being also associated with auxiliary heat pipe 44, the described auxiliary heat pipe 44 in arbitrary radiator is also connected with the described groups of fins 43 in all the other radiators.In actual use, when the heat that the work of each semiconductor refrigerating module produces is identical, each semiconductor refrigerating module is dispelled the heat by respective groups of fins 43, and when the heat dissipation capacity of some semiconductor refrigerating module is bigger, the heat carrier 41 being connected to this semiconductor refrigerating module heat is transferred heat in groups of fins corresponding to other semiconductor refrigerating modules 43 by auxiliary heat pipe 44, such that it is able to utilize whole groups of fins 43 to dispel the heat more efficiently；In the design process, each heat carrier 41 can pass through auxiliary heat pipe 44 and carry out thermally coupled with remaining groups of fins 43, for the heat-sinking capability of whole groups of fins 43, thus realizing natural cooling.
Further, heat carrier 41 being formed with multiple installing hole 410, described heat pipe 42 and described auxiliary heat pipe 44 are inserted in the described installing hole 410 of correspondence, and the contact area that heat pipe is inserted in installing hole 410 can to increase between heat carrier 41 improves heat conduction efficiency；And heat carrier 41 includes two reeded briquettings 411 of surface configuration, two described briquettings 411 are fixed together, two corresponding described grooves form described installing hole 410, adopt two briquettings 411 to form heat carrier 41, it is possible to be easy to the assembly and connection between heat pipe and heat carrier 41.
The present embodiment heat abstractor, by adopting heat carrier to absorb the heat in semiconductor refrigerating module hot junction, heat carrier can transfer heat to carry out in the groups of fins that area of dissipation is bigger self-heating heat radiation by heat pipe, carries out air-cooled without adopting independent fan；Additionally, heat carrier can utilize the groups of fins in multiple radiator to dispel the heat simultaneously, multiple groups of fins is made to be in the state of heat radiation all the time, to make full use of the heat-sinking capability of multiple groups of fins, realize improving the heat-sinking capability of semiconductor refrigerating equipment, and reduce the energy consumption of semiconductor refrigerating equipment.
The present invention also provides for a kind of semiconductor refrigerating equipment, including at least three semiconductor refrigerating module, also includes above-mentioned heat abstractor, and the heat carrier in described heat abstractor is connected to the hot junction of the described semiconductor refrigerating module of correspondence.
Last it is noted that above example is only in order to illustrate technical scheme, it is not intended to limit；Although the present invention being described in detail with reference to previous embodiment, it will be understood by those within the art that: the technical scheme described in foregoing embodiments still can be modified by it, or wherein portion of techniques feature is carried out equivalent replacement；And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (7)
1. a heat abstractor, it is characterised in that include at least three radiator, described radiator includes heat carrier, many heat pipes and groups of fins, and described heat pipe is connected on described heat carrier, and described groups of fins is connected on described heat pipe；Being also associated with auxiliary heat pipe on described heat carrier, the described auxiliary heat pipe in arbitrary described radiator is also connected with at least one the described groups of fins remained in described radiator.
2. heat abstractor according to claim 1, it is characterised in that described groups of fins includes multi-disc radiating fin, described radiating fin is provided with air vent, and multiple described air vents form air channel.
3. heat abstractor according to claim 2, it is characterised in that described radiator includes two groups of fins, and described heat carrier is between two described groups of fins.
4. heat abstractor according to claim 1, it is characterised in that be connected to many described auxiliary heat pipe on described heat carrier；Many described auxiliary heat pipe in radiator described in connect with remaining described groups of fins corresponding in described radiator.
5. heat abstractor according to claim 1, it is characterised in that be formed on described heat carrier in the described installing hole that multiple installing hole, described heat pipe and described auxiliary heat pipe are inserted in correspondence.
6. heat abstractor according to claim 5, it is characterised in that described heat carrier includes two reeded briquettings of surface configuration, and two described briquettings are fixed together, two corresponding described grooves form described installing hole.
7. a semiconductor refrigerating equipment, including at least three semiconductor refrigerating module, it is characterised in that also including the arbitrary described heat abstractor of claim 1-6, the heat carrier in described heat abstractor is connected to the hot junction of the described semiconductor refrigerating module of correspondence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410711507.8A CN105716455A (en) | 2014-12-01 | 2014-12-01 | Heat radiating device and semiconductor refrigerating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410711507.8A CN105716455A (en) | 2014-12-01 | 2014-12-01 | Heat radiating device and semiconductor refrigerating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105716455A true CN105716455A (en) | 2016-06-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410711507.8A Pending CN105716455A (en) | 2014-12-01 | 2014-12-01 | Heat radiating device and semiconductor refrigerating equipment |
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| Country | Link |
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| CN (1) | CN105716455A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109269199A (en) * | 2018-11-02 | 2019-01-25 | 南京工业大学 | A kind of fresh food low temperature show stand device based on semiconductor refrigerating suitable for supermarket and food market |
Citations (6)
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|---|---|---|---|---|
| CN2500014Y (en) * | 2001-07-17 | 2002-07-10 | 鞍山荣信电力电子股份有限公司 | Self cooling type thyrister cut-in and cut-off capacitor device |
| CN2618206Y (en) * | 2003-03-26 | 2004-05-26 | 晟铭电子科技股份有限公司 | Radiating mould set of computer |
| CN1851910A (en) * | 2005-04-22 | 2006-10-25 | 富准精密工业(深圳)有限公司 | Heat-pipe radiating apparatus |
| US7296617B2 (en) * | 2004-09-15 | 2007-11-20 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat sink |
| KR101449293B1 (en) * | 2013-06-03 | 2014-10-08 | 현대자동차주식회사 | Cooling and heating cup holder |
| CN204286181U (en) * | 2014-12-01 | 2015-04-22 | 青岛海尔特种电冰柜有限公司 | Heat abstractor and semiconductor refrigerating equipment |
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2014
- 2014-12-01 CN CN201410711507.8A patent/CN105716455A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2500014Y (en) * | 2001-07-17 | 2002-07-10 | 鞍山荣信电力电子股份有限公司 | Self cooling type thyrister cut-in and cut-off capacitor device |
| CN2618206Y (en) * | 2003-03-26 | 2004-05-26 | 晟铭电子科技股份有限公司 | Radiating mould set of computer |
| US7296617B2 (en) * | 2004-09-15 | 2007-11-20 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat sink |
| CN1851910A (en) * | 2005-04-22 | 2006-10-25 | 富准精密工业(深圳)有限公司 | Heat-pipe radiating apparatus |
| KR101449293B1 (en) * | 2013-06-03 | 2014-10-08 | 현대자동차주식회사 | Cooling and heating cup holder |
| CN204286181U (en) * | 2014-12-01 | 2015-04-22 | 青岛海尔特种电冰柜有限公司 | Heat abstractor and semiconductor refrigerating equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109269199A (en) * | 2018-11-02 | 2019-01-25 | 南京工业大学 | A kind of fresh food low temperature show stand device based on semiconductor refrigerating suitable for supermarket and food market |
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Application publication date: 20160629 |