CN108803838A - A kind of heat sink arrangement of reinforced notebook computer - Google Patents
A kind of heat sink arrangement of reinforced notebook computer Download PDFInfo
- Publication number
- CN108803838A CN108803838A CN201810437839.XA CN201810437839A CN108803838A CN 108803838 A CN108803838 A CN 108803838A CN 201810437839 A CN201810437839 A CN 201810437839A CN 108803838 A CN108803838 A CN 108803838A
- Authority
- CN
- China
- Prior art keywords
- heat
- radiator
- shell
- notebook computer
- reinforced notebook
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 3
- 150000002148 esters Chemical class 0.000 abstract description 5
- 239000004519 grease Substances 0.000 abstract description 3
- 239000012141 concentrate Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
Abstract
A kind of heat sink arrangement of reinforced notebook computer, including shell, radiator is equipped in the shell, the upper end of radiator is equipped with central processing unit, thermal grease conduction and heat conduction film are equipped between the central processing unit and radiator, the side of the radiator is also associated with heat-conducting copper pipe, and one end of heat-conducting copper pipe is connect with shell, and the shell upper end is additionally provided with printed board.The heat that central processor CPU generates when the device works, heat Quick uniform is dispersed on the shell of reinforced notebook computer by heat conduction ester, heat conduction film, radiator, heat-conducting copper pipe, increase reinforced notebook computer heat dissipation area simultaneously, make reinforced notebook computer without radiator fan and radiator window can normal reliable work.
Description
Technical field
The present invention relates to a kind of heat sink arrangements of reinforced notebook computer.
Background technology
When traditional notebook works, it is necessary to open radiator window in the bottom surface of notebook and side, form air duct, while also needing to make
Increase air mass flow with radiator fan to radiate.This design for opening radiator window+radiator fan, the degree of protection of notebook is low,
And radiator fan high-speed rotation, the dust in air is blown to the surface of radiator, is got deeper, after working long hours, is dissipated
Thermal effect is just decreased obviously, and radiator fan can also make a noise because of the abrasion of bearing.
Invention content
Its purpose of the invention, which is that, provides a kind of heat sink arrangement of reinforced notebook computer, by the radiator, reinforces
Notebook improves the degree of protection of notebook, and be not necessarily to radiator fan, improves the reliable operation of notebook without windowing
Property.
It adopts the technical scheme that achieve the above object, a kind of heat sink arrangement of reinforced notebook computer, including shell,
Radiator is equipped in the shell, the upper end of radiator is equipped with central processing unit, is set between the central processing unit and radiator
There are thermal grease conduction and heat conduction film, the side of the radiator to be also associated with heat-conducting copper pipe, one end of heat-conducting copper pipe is connect with shell,
The shell upper end is additionally provided with printed board.
Advantageous effect
The present invention has the following advantages compared with prior art.
1. by the heat sink arrangement, reinforced notebook computer improves the degree of protection of notebook without windowing；
2. being not necessarily to radiator fan, the functional reliability of notebook is improved.
Description of the drawings
Below in conjunction with attached drawing, the invention will be further described.
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the partial side view of the present invention；
Fig. 3 is the central processor section topology view of the present invention.
Specific implementation mode
The present apparatus includes shell 5, as shown in Figure 1-Figure 3, radiator 1 is equipped in the shell 5, the upper end of radiator 1 is set
There is central processing unit 6, thermal grease conduction 3 and heat conduction film 4, the radiator 1 are equipped between the central processing unit 6 and radiator 1
Side be also associated with heat-conducting copper pipe 2, one end of heat-conducting copper pipe 2 is connect with shell 5, and 5 upper end of the shell is additionally provided with printed board
7。
In the present invention, the heat that central processing unit 6 generates is directly conducted to reinforced notebook computer shell by the radiator 1,
Shell is radiated by air radiation；The heat that central processing unit 6 generates is dispersed to other the one of shell 5 by the heat-conducting copper pipe 2
Place, makes heat not concentrate on certain of shell 5；The thermal coefficient of the heat conduction ester 3 is high, can be by 6 surface of central processing unit
The loss-free conduction of heat to 1 surface of radiator；The heat conduction film 4 has certain thickness and elasticity, radiator 1 and center
When processor 6 is installed, central processing unit 6 is set to be in close contact with radiator 1 by squeezing, while convenient for disassembly and assembly.
The operation principle of the present invention is to apply the radiating surface of central processing unit 6 when reinforced notebook computer assembles and carry out heat conduction ester
3,1 surface mount heat conduction film 4 of radiator is installed by screw and is fixed, and surface and the radiator 1 of central processing unit 6 closely connect
It touches；When reinforced notebook computer works, central processing unit 6 will produce prodigious heat, and heat is conducted by heat conduction ester 3 to heat conduction film
4, the conduction of heat conduction film 4 to radiator 1, radiator 1 is conducted to heat-conducting copper pipe 2, then is conducted to the shell 5 of reinforced notebook computer, pole
The big heat dissipation area for increasing central processing unit 6, effectively reduces the temperature on 6 surface of central processing unit, reinforcing is made to take down notes
This reliably working, without radiator fan is arranged.
The structure feature of the present invention is 1）Using the high metal material aluminium of cooling system（Radiator）And copper（Conduction copper
Pipe）；2）The heat that central processing unit 6 generates conducts not existing together to reinforced notebook computer shell by radiator and heat-conducting copper pipe,
Heat does not concentrate on certain of shell；3）Using heat conduction ester and heat conduction film；4）Without radiator fan.
Claims (1)
1. a kind of heat sink arrangement of reinforced notebook computer, including shell (5), which is characterized in that be equipped with heat dissipation in the shell (5)
The upper end of device (1), radiator (1) is equipped with central processing unit (6), is equipped with and leads between the central processing unit (6) and radiator (1)
The side of hot fat (3) and heat conduction film (4), the radiator (1) is also associated with heat-conducting copper pipe (2), one end of heat-conducting copper pipe (2)
It is connect with shell (5), shell (5) upper end is additionally provided with printed board (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810437839.XA CN108803838A (en) | 2018-05-09 | 2018-05-09 | A kind of heat sink arrangement of reinforced notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810437839.XA CN108803838A (en) | 2018-05-09 | 2018-05-09 | A kind of heat sink arrangement of reinforced notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108803838A true CN108803838A (en) | 2018-11-13 |
Family
ID=64092140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810437839.XA Withdrawn CN108803838A (en) | 2018-05-09 | 2018-05-09 | A kind of heat sink arrangement of reinforced notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108803838A (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1285537A (en) * | 1999-06-01 | 2001-02-28 | 昭和铝株式会社 | CPU heat-sink for personal computer |
| CN2501100Y (en) * | 2001-10-17 | 2002-07-17 | 刘震宇 | Radiator for CPU |
| CN1410860A (en) * | 2001-09-25 | 2003-04-16 | 纬创资通股份有限公司 | Heat dissipating module of notebook computer |
| CN2917202Y (en) * | 2006-04-13 | 2007-06-27 | 陈世明 | Thin film anti-seepage filler structure formed by coating heat transfer medium against the heat source on radiator base |
| CN101206514A (en) * | 2006-12-22 | 2008-06-25 | 联想(北京)有限公司 | Reinforcement type notebook computer and cooling system thereof |
| CN202735939U (en) * | 2012-06-28 | 2013-02-13 | 原民民 | Computer CPU (central processing unit) heat radiator |
| CN202870721U (en) * | 2012-11-22 | 2013-04-10 | 王立平 | Cooling circulation system of central processing unit (CPU) of notebook computer |
| CN204203883U (en) * | 2014-11-13 | 2015-03-11 | 华为技术有限公司 | Heating radiator |
| CN104834363A (en) * | 2015-04-30 | 2015-08-12 | 天津徊达科技有限公司 | Computer CPU (central processing unit) radiating case |
| CN104932638A (en) * | 2015-05-20 | 2015-09-23 | 铜陵宏正网络科技有限公司 | CPU (central processing unit) efficient heat radiator |
| CN105120631A (en) * | 2015-08-13 | 2015-12-02 | 深圳市国创珈伟石墨烯科技有限公司 | CPU cooling device with graphene thermal silicone grease cooling layer |
| CN206193668U (en) * | 2016-11-04 | 2017-05-24 | 深圳市斯贝达电子有限公司 | High -efficient heat abstractor of CPU module |
| CN208207719U (en) * | 2018-05-09 | 2018-12-07 | 江西中船航海仪器有限公司 | A kind of novel radiating device |
-
2018
- 2018-05-09 CN CN201810437839.XA patent/CN108803838A/en not_active Withdrawn
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1285537A (en) * | 1999-06-01 | 2001-02-28 | 昭和铝株式会社 | CPU heat-sink for personal computer |
| CN1410860A (en) * | 2001-09-25 | 2003-04-16 | 纬创资通股份有限公司 | Heat dissipating module of notebook computer |
| CN2501100Y (en) * | 2001-10-17 | 2002-07-17 | 刘震宇 | Radiator for CPU |
| CN2917202Y (en) * | 2006-04-13 | 2007-06-27 | 陈世明 | Thin film anti-seepage filler structure formed by coating heat transfer medium against the heat source on radiator base |
| CN101206514A (en) * | 2006-12-22 | 2008-06-25 | 联想(北京)有限公司 | Reinforcement type notebook computer and cooling system thereof |
| CN202735939U (en) * | 2012-06-28 | 2013-02-13 | 原民民 | Computer CPU (central processing unit) heat radiator |
| CN202870721U (en) * | 2012-11-22 | 2013-04-10 | 王立平 | Cooling circulation system of central processing unit (CPU) of notebook computer |
| CN204203883U (en) * | 2014-11-13 | 2015-03-11 | 华为技术有限公司 | Heating radiator |
| CN104834363A (en) * | 2015-04-30 | 2015-08-12 | 天津徊达科技有限公司 | Computer CPU (central processing unit) radiating case |
| CN104932638A (en) * | 2015-05-20 | 2015-09-23 | 铜陵宏正网络科技有限公司 | CPU (central processing unit) efficient heat radiator |
| CN105120631A (en) * | 2015-08-13 | 2015-12-02 | 深圳市国创珈伟石墨烯科技有限公司 | CPU cooling device with graphene thermal silicone grease cooling layer |
| CN206193668U (en) * | 2016-11-04 | 2017-05-24 | 深圳市斯贝达电子有限公司 | High -efficient heat abstractor of CPU module |
| CN208207719U (en) * | 2018-05-09 | 2018-12-07 | 江西中船航海仪器有限公司 | A kind of novel radiating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181113 |
|
| WW01 | Invention patent application withdrawn after publication |