CN2729903Y

CN2729903Y - Heat sink device

Info

Publication number: CN2729903Y
Application number: CN 200420014845
Authority: CN
Inventors: 刘德军
Original assignee: Mitac Precision Technology Shunde Ltd
Current assignee: Mitac Precision Technology Shunde Ltd
Priority date: 2004-01-16
Filing date: 2004-01-16
Publication date: 2005-09-28
Anticipated expiration: 2014-01-16

Abstract

The utility model discloses a heat sink device for an electronic chip, which comprises a heat radiation baseplate, a heat radiator and a heat conduction pipe, wherein, the heat radiation baseplate is coupled with the heat radiator into a whole, the heat conduction pipe is coupled with the heat radiation baseplate and the heat radiator simultaneously, wherein, the heat radiator comprises a heat radiation fan, an accommodation seat for accommodating the heat radiation fan, and a heat radiation fin. The middle part of the heat conduction pipe is coupled with the heat radiation baseplate, and both ends of the heat conduction pipe are respectively coupled with the heat radiator. The heat sink device has less heat resistance, strong heat radiation effect, the heat conduction pipe is used fully, and thus, the utility model can satisfy the heat radiation requirements of a high power electronic chip. Simultaneously, the utility model has simple structure and small volume, and thus, the utility model is consistent with the development trend of a light, thin and short electronic device.

Description

Heat abstractor

Technical field

The utility model relates to a kind of heat abstractor, particularly a kind of heat abstractor that is used to reduce the electronic chip surface temperature.

Background technology

Development along with electronics technology, the integrated level of some electronic chips (as the central processing unit of computer) strengthens, operating frequency also constantly increases, and therefore heat abstractor must be set to reduce the temperature of electronic chip on the surface of electronic chip, keeps its normal work.But we still will consider several factors when solving its heat dissipation problem, the fast development of the arithmetic speed of central processing unit, wanted the problem of emphasis consideration when the solution of its heat dissipation problem has just become the main frame design, especially more be rich in difficulty such as the design of notebook computer for the little computer of volume.Notebook computer is compact, therefore the heat abstractor in the notebook host has been proposed very high requirement.Heat abstractor with the central processing unit of notebook computer is that example illustrates below.

The heat abstractor of the central processing unit of present most of notebook computers is to connect a radiator by heat-radiating substrate, wherein dispose a radiator fan on the radiator, and the radiator fan air outlet is provided with radiating fin, and what have also is provided with heat pipe on heat-radiating substrate.Heat-radiating substrate is attached on the heating electronic chip, and heat conducts to radiator through heat pipe and disperses.In the heat conductive process, heat pipe and spreader surface can be to external radiation part heats, and still most of heat all is to pass through the radiating fin of radiator to external radiation, and radiator fan has increased air flows and quickened dispersing of heat.But this kind heat abstractor is because area of dissipation is certain, and the radiating effect of the single fan of employing is limited, so the heat radiation power of this device has certain limit.

Along with the quickening of central processing unit arithmetic speed, the heat of its generation is also just many more.The heat radiation power of existing heat abstractor can not satisfy the heat radiation requirement of central processing unit.Thereby just need the heat abstractor of bigger heat radiation power.In general, according to radiating principle, area of dissipation is big more, and radiating effect is good more; Thermal resistance is more little, and radiating effect is good more; Fan power is strong more, and cross-ventilation is strong more, and heat radiation is also just strong more.So can adopt bigger area of dissipation and more powerful radiator fan to strengthen radiating effect.Particularly when notebook computer adopts the central processing unit of the above power of 1.3G, the heat that central processing unit produces even can surpass 100W, if but follow the mentality of designing of heat abstractor in the past, so, the heat abstractor of the central processing unit of so big heating power, the area of dissipation of the heat abstractor that it is required is huge, and the quantity of radiating fin also will be huge; Simultaneously, the increase of radiating fin quantity and size, and the increase of the power of radiator fan all will cause the volume of the heat abstractor that makes up to increase.But for the notebook computer of element arrangements compactness, the increase of the volume of heat abstractor is not meet the short and small frivolous demand for development of notebook computer.So the quantity of the radiating fin by simple increase radiator and size or the power that increases single radiator fan all can not satisfy heat radiation far away and require.Therefore we must change mentality of designing, take all factors into consideration the caloric value of the tight space and the central processing unit of notebook computer, and it is moderate to design a kind of volume, and the heat abstractor that radiating efficiency is high satisfies the heat radiation requirement of the central processing unit of golf calorific value.

Summary of the invention

The utility model has been taken all factors into consideration the volume and the heat radiation power of heat abstractor, a kind of heat abstractor of surface temperature of the electronic chip that can reduce working at high speed has been proposed, particularly a kind of heat abstractor that can satisfy the high-power central processing unit of notebook computer.

Implement heat abstractor of the present utility model and comprise heat-radiating substrate, radiator and heat pipe, this heat-radiating substrate and radiator are coupled to one, and heat pipe is coupled on heat-radiating substrate and the radiator simultaneously, wherein said radiator comprises the holding seat and the radiating fin of radiator fan, ccontaining radiator fan, the middle part of described heat pipe is coupled on the heat-radiating substrate, and the two ends of heat pipe couple with radiator respectively.

Owing to adopted technique scheme, compared with prior art, the utility model is owing to the middle part of heat pipe is coupled on the heat-radiating substrate, and the two ends of heat pipe are coupled on the radiator respectively, so made full use of the thermal conducting function of heat pipe, improve heat conducting efficient, and can reduce the quantity of heat pipe accordingly, reduced the cost of entire heat dissipation device.

Figure of description

The isometric front view of first embodiment of Fig. 1 heat abstractor of the present utility model.

The reverse side stereogram of first embodiment of Fig. 2 heat abstractor of the present utility model.

The three-dimensional exploded view of first embodiment of Fig. 3 heat abstractor of the present utility model.

The isometric front view of second embodiment of Fig. 4 heat abstractor of the present utility model.

The reverse side stereogram of second embodiment of Fig. 5 heat abstractor of the present utility model.

Embodiment

Below in conjunction with drawings and Examples the utility model is further described.

Be the stereogram of first embodiment of heat abstractor of the present utility model as shown in Figure 1 and Figure 2.Heat abstractor 10 comprises two radiators 110,120, heat-radiating substrate 140 and heat pipe 130, wherein two radiators 110,120 are coupled in the both sides of heat-radiating substrate 140 respectively, and the middle part of heat pipe 130 is coupled on the heat-radiating substrate 140, and its two ends are coupled in respectively on two radiators 110,120.And heat-radiating substrate 140 is provided with heat radiation copper billet 142, conducts to heat pipe 130 so that heat is more effective from the heating electronic chip.

Fig. 3 is the three-dimensional exploded view of the heat abstractor of first embodiment of the present utility model, the clearer internal structure that reflects heat abstractor 10 of this figure.Wherein two radiators 110 and 120 structure are just the same, are that example illustrates with radiator 110.Wherein radiator fan 111 is contained in the holding seat 112, this radiator fan 111 is generally air intake up and down, the fan of side air-out, and be provided with radiating fin 115 at air outlet 114 places of this radiator fan 111, this radiating fin 115 attaches mutually with an end of heat pipe 130, and lid 116 is to cover on the holding seat 112 that overlays on radiator 110 (lid of the holding seat of radiator 120 does not show among the figure); Be coupled with heat radiation copper billet 142 on the heat-radiating substrate 140, and a side of heat radiation copper billet 142 and the middle part of heat pipe 130 closely attach, in order to increase the conduction efficiency of heat from the heating electronic chip to the heat radiation copper billet, can on heat radiation copper billet 142, attach heat conductive pad 144 (such as hot interface material paper), thereby heat conducts to heat radiation copper billet 142 fast by heat conductive pad 144, and heat reaches heat pipe 130 by heat radiation rapidly behind the copper billet 142, it is little that heat pipe has thermal resistance, the fast advantage of conducting heat, so heat conducts on the radiator 110 and 120 at heat pipe 130 two ends soon, increase cross-ventilation by radiator fan 111 and 121, heat distributes rapidly by radiating fin 115 and 125.

In the present embodiment, the middle part of heat pipe is defined as evaporation ends, and two ends are defined as condensation end, heat is as follows through the transmission of heat pipe: heat conducts to the evaporation ends of heat pipe 130 and makes liquid coolant (not icon) convert gaseous of being heated of heat pipe 130 inside, then the gaseous state cooling fluid is back to the condensation end of heat pipe 130 along heat pipe 130 tube walls, cooling fluid changes liquid release heat again in this process, this heat transmits to the external world by radiator 110,120 again, thereby finishes the process of exchange heat.

With prior art heat pipe 130 1 ends are arranged on the heat-radiating substrate 140, and being arranged on the structure of radiator 110,120, the other end compares, heat abstractor of the present utility model makes full use of single heat conduction pipe 130 and forms two condensation ends, thereby improved the radiating efficiency of heat pipe 130, can reduce simultaneously the usage quantity of heat pipe, have the advantage of saving cost, simplifying assembling.

Fig. 4 and Fig. 5 are the stereograms of second embodiment of heat abstractor of the present utility model.The heat abstractor of this embodiment can provide heat radiation for two heating electronic chips simultaneously.Wherein heat abstractor 20 is following improvement of being done on the basis of the heat abstractor 10 of first embodiment: be provided with heat radiation connecting plate 250 between two

radiators

210 and 220, and with couple mutually with two

radiators

210 and 220 respectively, and fin shape as shown in Figure 4 is arranged in the side of this heat radiation connecting plate 250, simultaneously, as shown in Figure 5, the another side at heat radiation connecting plate 250 is provided with heat conductive pad 252 (such as hot interface material paper); And the side of the heat-radiating substrate 240 of heat abstractor 20 can be set to fin shape side 242 as shown in Figure 4, can alleviate the overall weight of heat abstractor like this, and has effectively increased area of dissipation.In use, heat radiation copper billet 244 is attached to the surface of a heating electronic chip, central processing unit such as notebook computer, and heat conductive pad 252 can be attached to the surface of another heating electronic chip, is distributed in the electronic chip of the height heating of central processing unit annex such as the south bridge of notebook computer, north bridge etc.Like this, just realized that heat abstractor is that two heating electronic chips dispel the heat simultaneously.

Certainly, implement heat abstractor of the present utility model and can also be set to a plurality of radiators according to the heating size of electronic chip, the heat pipe that couples thereon also can adopt several heat pipes according to reality, also can at a plurality of heating elements polylith heat radiation connecting plate be set between any two and provide heat radiation etc. for a plurality of heating electronic chips simultaneously according to actual needs.

Compared with prior art, the utlity model has following advantage:

1. the middle part owing to heat pipe is coupled on the heat-radiating substrate, and the two ends of heat pipe are coupled in respectively heat radiation On the device, so take full advantage of the thermal conducting function of heat pipe, improved heat conducting efficient, but and phase The quantity of the minimizing heat pipe of answering reduces the cost of whole heat abstractor.

2. heat abstractor volume of the present utility model is little and thin, and the branch of a plurality of radiator and heat-radiating substrate Cloth can be according to the distribution of the element around the electronic chip of required heat radiation and difference, so can take full advantage of Heat-dissipating space, further the internal body of meeting spatial compactness is to the space requirement of heat abstractor proposition;

3. because heat abstractor of the present utility model has adopted a plurality of radiators, this has just increased radiating surface greatly Long-pending, simultaneously, many heat pipes that arrange on the heat-radiating substrate can conduct to heat diffusing rapidly from radiating block Hot device, thermal resistance is little, and heat-sinking capability is stronger, can satisfy the heat radiation requirement of powerful electronic chip.

Claims

1. heat abstractor, comprise heat-radiating substrate, radiator and heat pipe, this heat-radiating substrate and radiator are coupled to one, and heat pipe is coupled on heat-radiating substrate and the radiator simultaneously, wherein said radiator comprises the holding seat and the radiating fin of radiator fan, ccontaining radiator fan, it is characterized in that: the middle part of described heat pipe is coupled on the heat-radiating substrate, and the two ends of heat pipe couple with radiator respectively.

2. heat abstractor as claimed in claim 1 is characterized in that: described heat-radiating substrate is provided with the heat radiation copper billet, and the middle part of this heat radiation copper billet and heat pipe closely attaches.

3. heat abstractor as claimed in claim 1 is characterized in that: described radiating fin is arranged on the air outlet of radiator fan, and this radiating fin attaches mutually with an end of heat pipe.

4. as claim 1 or 2 or 3 described heat abstractors, it is characterized in that: the lateral edge of described heat-radiating substrate can be set to the fin shape.

5. as claim 1 or 2 or 3 described heat abstractors, it is characterized in that: described radiator is provided with a plurality of, and is provided with the heat radiation connecting plate between adjacent two, and this heat radiation connecting plate couples mutually with this two radiator.

6. heat abstractor as claimed in claim 5 is characterized in that: a side of described heat radiation connecting plate is set to the fin shape, and the bottom surface is provided with heat conductive pad.