CN2681344Y

CN2681344Y - Heat sink assembly

Info

Publication number: CN2681344Y
Application number: CN 200320128877
Authority: CN
Inventors: 陈俊吉; 吴宜强
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2003-12-26
Filing date: 2003-12-26
Publication date: 2005-02-23
Anticipated expiration: 2013-12-26

Abstract

The utility model relates to a heat sink assembly, comprising a radiator which is arranged on electronic elements, two heat pipes, a fan and a fixing support used to fix the fan. The radiator comprises a base and a plurality of heat radiating fins which are extended from the base. The evaporation portion of each heat pipe is arranged on the base of the radiator. While the condensation portion penetrated on the portion which is far away from the base on the heat radiating fin. The fixing support is conjointly penetrated on and sheathed with the condensation portion of the heat pipe to be fixed on the condensation portion of the heat pipe.

Description

The heat abstractor combination

[technical field]

The utility model is about a kind of heat abstractor combination, thereby is meant a kind of heat abstractor combination of using heat pipe and fan to have the high efficiency and heat radiation ability simultaneously especially.

[background technology]

Along with large scale integrated circuit continuous advancement in technology and extensive use, the development of information industry is advanced by leaps and bounds, computer is widely used in all trades and professions, especially the application of personal computer becomes basically universal, in order to adapt to the development trend that data processing amount constantly increases and the real-time requirement improves, inevitable requirement computer run speed improves constantly.As everyone knows, central processing unit is the core parts of computer system, the performance of the whole computer of good and bad directly decision of its performance, and therefore, the high-frequency high-speed processor is constantly released.But the high-frequency high-speed operation makes processor produce a large amount of heat, if these heats of untimely eliminating will cause the rising of processor self temperature, safety and performance to system cause very big influence, and heat dissipation problem has become the problem that must solve when each high speed processor of new generation is released at present.Common industry is all installed radiator and is dispelled the heat on chips such as central processing unit, increase heat-sinking capability with fan simultaneously.

At first, fan is directly to be screwed on the fin of radiator by the installing hole that screw passes four jiaos of fan housings.This locking mode very easily makes fin produce distortion, causes fan and radiator to break away from.For thin fin such as folded heat sink, more be easy to generate distortion, do not reach at all and fan is fixed and supported thereon.

Industry is fixed to fan on the radiator with a fixed mount for improving this fixed form.Fixed mount comprises the supporting part of a carrying fan and the sidewall that stretches out from supporting part.Offer through hole on the fixed mount sidewall, on the foot of radiator also correspondence offer screw, utilize fixtures such as screw that fixed mount is locked on the foot of radiator again.This kind fixed mount sidewall materials are more, and also quite inconvenience of its assembling.In addition, strengthen heat conduction, then can make the structure of entire heat dissipation device combination seem very complicated, too fat to move, even influence the layout of computer-internal, easily the element around the processor is caused interference if increase heat pipe.

[summary of the invention]

The purpose of this utility model is to provide a kind of heat abstractor combination, and it compactly with radiator, heat pipe and fan combination together.

The purpose of this utility model realizes by following technical proposal:

The combination of the utility model heat abstractor comprises radiator, two heat pipes, fan that places on the electronic component and the fixed mount that is used for fixing fan.Radiator comprises base and the some fin that extend from base.The evaporation part of each heat pipe is arranged on the foot of radiator, and the condensation part is located on the fin away from the part of base, and fixed mount is by combining on the condensation part that is fixed on heat pipe with wearing of heat pipe condensation part.

In the utility model, heat pipe wears with fixed mount and combines, and this just combination is fixed fixed mount self.This secure bond mode can greatly reduce the materials of fixed mount, and makes the layout of the entire heat dissipation device combination compact and reasonable that also seems.

Combination is further described to the utility model heat abstractor with reference to the accompanying drawings.

[description of drawings]

Fig. 1 is the three-dimensional exploded view of the utility model heat abstractor combination.

Fig. 2 is the three-dimensional combination figure of the utility model heat abstractor combination.

[embodiment]

See also Fig. 1 and Fig. 2, the combination of the utility model heat abstractor comprises a radiator 10, two heat pipes 20, a fan 30 and is used for fixing the fixed mount 40 of fan 30.

Radiator 10 comprises base 12 on be used for being sticked electronic component such as the central processing unit (figure does not show) and the some fin 16 that are crossed on the base 12 and are parallel to each other and are provided with at interval.Base 12 offers two parallel grooves 122 towards a side of fin 16.Offer the through hole 162 at two intervals on the fin 16.

Heat pipe 20 comprises the evaporation part 22 and the condensation part 26 of parallel interval.Evaporation part 22 is arranged in the groove 122 on radiator 10 bases 12, to absorb the heat on the base 12 and to be delivered to condensation part 26.26 of condensation parts be located in the through hole 162 of fin 16 and with transfer of heat to the part of fin 16 away from base 12.

Offer through hole 32 on the fan 30.

Fixed mount 40 is located on the radiator 10, it comprise in order to carrying fan 30 thereon supporting part 42 and from the vertically extending fixed part 46 of supporting part 42 relative both side ends.Supporting part 42 is positioned at and the relative side of radiator 10 bases 12, and its central authorities offer big opening 422, and this opening 422 communicates 16 air-flows of fan 30 and fin.Supporting part 42 4 corners offer the assembly hole 426 corresponding to fan 30 through holes 32 respectively, and through hole 32 backs that fixtures such as screw pass fan 30 combine and fan 30 can be fixed on the fixed mount 40 with assembly hole 426.Fixed part 46 abuts on the fin 16 in radiator 10 outsides abreast, but and offers and condensation part 26 heating tube 20 corresponding with through hole 162 on the fin 16 and be arranged in wherein notch 462.

Fixed part 46 ends of fixed mount 40 offer the prong 466 that links to each other with notch 462 in the utility model.During assembling, the condensation part 26 of heat pipe 20 can be passed the through hole 162 on the fin 16 earlier, fixed mount 40 is pressed towards radiator 10, the heat pipe that fixed mount 40 will have been combined with fin 16 by means of the importing effect of prong 466 places in notch 462 again, thereby makes fixed mount 40 fixing.Certainly, also can not offer prong 466 on the fixed part 46.During assembling, earlier fixed mount 40 is placed on the fin 16, the condensation part 26 of heat pipe is passed the notch 462 of fixed mount 40 1 sides respectively, passes the through hole 162 on the fin 16 again, passes the notch 462 of fixed mount 40 opposite sides at last.No matter be any assembling mode, they all have a common feature, promptly are: fixed mount 40 is realized the fixing of self by itself and combining of heat pipe.This secure bond mode can greatly reduce the materials of fixed mount 40, and makes the layout of the entire heat dissipation device combination compact and reasonable that also seems.

Claims

1. heat abstractor combination in order to auxiliary heat-generating electronic elements heat radiation, comprises placing on the electronic component and comprising base and the radiator of some fin, two heat pipes, a fan and be used for fixing the fixed mount of fan; The evaporation part of each heat pipe is arranged on the foot of radiator, and the condensation part is located on the fin away from the part of base, and it is characterized in that: fixed mount is by combining on the condensation part that is fixed on heat pipe with wearing of heat pipe condensation part.

2. heat abstractor combination according to claim 1 is characterized in that: fixed mount comprises that being used to carry fan supporting part thereon reaches from the vertically extending fixed part of the relative both side ends of supporting part.

3. heat abstractor according to claim 2 combination, it is characterized in that: supporting part central authorities are provided with an opening, form air-flow by described opening between fan and radiator and communicate.

4. heat abstractor combination according to claim 3, it is characterized in that: supporting part is positioned at a side relative with foot of radiator.

5. heat abstractor combination according to claim 2, it is characterized in that: fixed part abuts on the fin in the radiator outside abreast.

6. heat abstractor combination according to claim 5, it is characterized in that: offer through hole on the fin, offer notch on the fixed part, the condensation part of heat pipe is located in described notch and the through hole.

7. heat abstractor combination according to claim 1, it is characterized in that: base is provided with two parallel grooves, and the evaporation part of heat pipe is arranged in the described groove.