CN201210279Y

CN201210279Y - Integration type heat radiating device for notebook type computer

Info

Publication number: CN201210279Y
Application number: CNU2008201164583U
Authority: CN
Inventors: 林国仁; 林贞祥; 许建财; 郑志鸿
Original assignee: ZHENTONG ENERGY TECHNOLOGY Co Ltd; Golden Sun News Techniques Co Ltd
Current assignee: ZHENTONG ENERGY TECHNOLOGY Co Ltd; Golden Sun News Techniques Co Ltd
Priority date: 2008-06-16
Filing date: 2008-06-16
Publication date: 2009-03-18
Anticipated expiration: 2018-06-16

Abstract

The utility model relates to an integration-typed heat-radiation device that is used for a notebook computer, which comprises a heat conducting seat, a heat radiation board, a first heat radiation module and a second heat radiation module; the heat radiation board is connected with the surface of the heat conducting seat, and the heat conducting coefficient of the heat radiation board is higher than that of the heat conducting seat; the first heat radiation module comprises a first heat pipe, and one section of the first heat pipe is connected with the heat conducting seat, and the other section extends in the direction that is away from the heat conducting seat; the second heat radiation module comprises a second heat pipe, a switching block and a third heat pipe; one section of the second heat pipe is connected with the heat conducting seat, and the other section is connected with the switching block; one section of the third heat pipe is connected with the switching block, and the other section extends in the direction that is away from the switching block. Through the heat radiation paths in different directions, the heat-radiation device can rapidly and largely educe the heat that is generated by the heat source.

Description

The integrated heat dissipation device that notebook computer is used

Technical field

The utility model relates to a kind of heat abstractor, refers to the integrated heat dissipation device that a kind of notebook computer is used especially.

Background technology

Along with the progress of science and technology and the development of technology, portable electronic products such as notebook computer are used in work or the life, not only can increase work efficiency, therefore can also increase the convenience of daily life, by popular employing the widely.Yet notebook computer is in order to provide the convenience of carrying, constantly be endowed miniaturization and light-weighted requirement aspect volume and the weight, but be constantly to be required to improve aspect computing and the execution speed, the thermal value that its central processing unit (CPU) is produced is more and more higher, in the past in order to solve this heat problem, mostly be to handle with the heat abstractor that aluminium extruded type heating radiator and fan are formed, but the heat abstractor of this kenel can not satisfy radiating requirements, and the utmost point treats that new technology is improved.

The heat abstractor that known notebook computer is used, mainly comprise copper heat-conducting seat and radiating module, a plane of this heat-conducting seat is in order to amplexiform with pyrotoxin, radiating module then comprises heat pipe, one section of this heat pipe is amplexiformed on heat-conducting seat, and another section then extends towards the direction away from heat-conducting seat, amplexiforms with the metal coverboard with notebook computer, so as to utilizing the metal coverboard that the heat that pyrotoxin produced is emitted to the notebook computer outside, and reach the effect of heat radiation.

Yet, the heat abstractor that known notebook computer is used, have following problems on reality is used: because it is only by single heat dissipation path, the heat that can pass out is quite limited, can not satisfy the radiating requirements of the central processing unit of present stage Portable notebook computer; In addition, its heat-conducting seat is a copper material, all is difficult for obtaining effectively to reduce and light-weighted effect aspect material cost and weight; Really remain to be improved.

The utility model content

In view of this, fundamental purpose of the present utility model be to provide a kind of can be fast and derive the integrated heat dissipation device that the notebook computer of heat is used in large quantities.

For achieving the above object, the integrated heat dissipation device that the utility model provides a kind of notebook computer to use, it comprises heat-conducting seat, heat sink, first radiating module and second radiating module; This heat sink amplexiforms on the surface of this heat-conducting seat, and the coefficient of heat conductivity of this heat sink is higher than the coefficient of heat conductivity of this heat-conducting seat; This first radiating module comprises first heat pipe, and one section of this first heat pipe is connected on this heat-conducting seat, and another section is then towards extending away from the direction of this heat-conducting seat; This second radiating module comprises second heat pipe, switching piece and the 3rd heat pipe, one section of this second heat pipe is connected in this heat-conducting seat, another section then is connected on this switching piece, and one section of the 3rd heat pipe is connected on this switching piece, and another section is then towards extending away from the direction of this switching piece.

As can be seen from the above technical solutions, the integrated heat dissipation device that notebook computer of the present utility model is used, by the heat dissipation path that on heat-conducting seat, is connected with multidirectional, the heat that pyrotoxin produced can be derived fast and in large quantities, and improve whole heat radiation function significantly; By heat-conducting seat is aluminium material, not only can save material cost and can reach light-weighted purpose.

Description of drawings

Fig. 1 is the three-dimensional exploded view of the utility model heat abstractor;

Fig. 2 is the combination stereogram of the utility model heat abstractor;

Fig. 3 is the compound section figure of the utility model heat abstractor;

Fig. 4 is applied to the combination synoptic diagram of notebook computer for the utility model heat abstractor;

Fig. 5 is the local amplification sectional view of the utility model heat abstractor among Fig. 4;

Fig. 6 is the compound section figure at another visual angle of the utility model heat abstractor among Fig. 4;

Fig. 7 is the combination synoptic diagram after the lid among Fig. 6 covers downwards.

Description of reference numerals

Heat-conducting seat 10 plate bodys 11

Adjutage 12 pilot holes 121

Groove 13 heat sinks 20

First radiating module, 30 first heat pipes 31

Radiating fin 32 intercommunicating pores 321

Endotherm section 311,411,431 heat release section 312,412,432

Second radiating module, 40 second heat pipes 41

Switching piece 42 through holes 421

The 3rd heat pipe 43 notebook computers 8

Main frame 81 circuit boards 811

Central processing unit 812 lids 82

Display 821 metal coverboards 822

Embodiment

Relevant detailed description of the present utility model and technology contents, conjunction with figs. is described as follows, however appended accompanying drawing only provides reference and explanation usefulness, is not to be used for the utility model is limited.

Please refer to Fig. 1, Fig. 2 and shown in Figure 3, be respectively three-dimensional exploded view, combination stereogram and the compound section figure of the utility model heat abstractor, the integrated heat dissipation device that the utility model provides a kind of notebook computer to use, it is used to wait for notebook computer and dispels the heat notebook computer 8 as shown in Figure 4.This integrated heat dissipation device mainly comprises heat-conducting seat 10, heat sink 20, first radiating module 30 and second radiating module 40.

Heat-conducting seat 10 is made with the high material of coefficient of heat conductivity such as aluminium, it has rectangle plate body 11, four corners at rectangle plate body 11 have protruded out adjutage 12 respectively, and on each adjutage 12, offer pilot hole 121 respectively, wear fixing for retaining element (not shown)s such as fastener or screws; Offer two grooves 13 that are parallel to each other in addition in the bottom of rectangle plate body 11.

Heat sink 20 amplexiforms on the upper surface of heat-conducting seat 10, and it is made with the high material of coefficient of heat conductivity such as copper, the coefficient of heat conductivity of this heat sink 20 is higher than the coefficient of heat conductivity of heat-conducting seat 10, and the area that periphery was enclosed to form of heat sink 20 is greater than the area of the upper surface of rectangle plate body 11, except amplexiforming the heat conduction as large tracts of land, can also enlarge the integral heat sink effect by heat sink 20 with heat-conducting seat 10.

First radiating module 30 comprises first heat pipe 31 and most radiating fins 32.This first heat pipe 31 is flat, the heat release section 312 that it has endotherm section 311 and extends from endotherm section 311, this endotherm section 311 is installed with in an aforesaid groove 13, and its bottom surface flushes with the bottom surface of heat-conducting

seat

10, and 312 courts of heat release section extend away from the direction of heat-conducting seat 10.Offer the intercommunicating pore 321 of mutual correspondence on these radiating fins 32 respectively, this intercommunicating pore 321 is in order to the aforesaid heat release section 312 of sheathed connection, with the heat dissipation apace that endotherm section 311 is derived.

Second radiating module 40 comprises second heat pipe 41, switching piece 42 and the 3rd heat pipe 43, this second heat pipe 41 and the 3rd heat pipe 43 all have endotherm section 411,431 and heat release section 412,432, wherein the heat release section 412 of second heat pipe 41 is towards extending away from the direction of heat-conducting seat 10, and the heat release section 432 of the 3rd heat pipe 43 then court is extended away from the direction of switching piece 42.The endotherm section 411 of second heat pipe 41 is flat, and it is located in aforesaid another groove 13, and the bottom surface of this endotherm section 411 flushes with the bottom surface of heat-conducting seat 10.This switching piece 42 is made with thermal conductivity good metal material, and its heat release section 412 that offers two through hole 421, the second heat pipes 41 that are parallel to each other is then cylindrical, and the through hole 421 of piece 42 belows of wherein transferring is for heat release section 412 cross-under.The endotherm section 431 of the 3rd heat pipe 43 is also cylindrical, and this endotherm section 431 wears the through hole 421 that is articulated in switching piece 42 tops, so that the 3rd heat pipe 43 can rotate with respect to switching piece 42; The heat release section 432 of the 3rd heat pipe 43 is flat, in order to amplexiform on the metal coverboard 822 of notebook computer 8 (as shown in Figure 4).

Please refer to Fig. 4 to shown in Figure 7, be respectively the utility model heat abstractor and be applied to the combination synoptic diagram of notebook computer, the local amplification sectional view of the utility model heat abstractor among Fig. 4, combination synoptic diagram after the compound section figure at another visual angle of the utility model heat abstractor and the lid among Fig. 6 cover downwards among Fig. 4, this heat abstractor can be applicable on the notebook computer 8, this notebook computer 8 has main frame 81 and lid 82, main frame 81 inside are equiped with circuit board 811, and the electronic package or the device of central processing unit 812 and other various difference in functionalitys be installed on circuit board 811, lid 82 then has display 821 and the involution metal coverboard 822 in display 821 outsides.During combination the endotherm section 411 of the endotherm section 311 of heat-conducting seat 10, first heat pipe 31, second heat pipe 41 is done to attach contact (as shown in Figure 5) corresponding to central processing unit 812, and utilize bolt or fastener to wear aforesaid pilot hole 121 and be fixed on the circuit board 811.Wherein the coefficient of heat conductivity of heat sink 20 is greater than the coefficient of heat conductivity of heat-conducting seat 10, and the area that the periphery of heat sink 20 surrounds is also greater than the area of the upper surface of the plate body 11 of heat-conducting seat 10, not only can avoid being provided with, can also borrow heat exchange pattern to come central processing unit 812 is carried out heat conduction, heat radiation the electronic package around the central processing unit 812; In addition, heat release section 312 and each radiating fin 32 by first heat pipe 31 just are installed with in the pre-set space of main frame 81, and utilize fan and the louvre that around each radiating fin 32, is provided with, come each radiating fin 32 and heat release section 312 are made quick heat radiating in the forced draft mode; In addition, amplexiform on the metal coverboard 822 of notebook computer 8 by the heat release section 432 of the 3rd heat pipe 43, and carry out heat conduction by switching piece 42 between the 3rd heat pipe 43 and second heat pipe 41, the heat that central processing unit 812 can be produced, be transmitted to apace on the metal coverboard 822 again from second heat pipe 41, switching piece 42 to the 3rd heat pipes 43, and utilize the big area of dissipation of metal coverboard 822 and reach the radiating effect of high effect.In addition, because the 3rd heat pipe 43 of the present utility model can rotate with respect to switching piece 42, therefore under the situation of inoperation notebook computer 8, lid 82 can be done stacked covering (as shown in Figure 7) with respect to main frame 81.

The above is preferred embodiment of the present utility model only, is not to be used to limit protection domain of the present utility model.

Claims

1, the integrated heat dissipation device used of a kind of notebook computer is characterized in that, comprising:

Heat-conducting seat;

Heat sink amplexiforms on the surface of this heat-conducting seat, and the coefficient of heat conductivity of this heat sink is higher than the coefficient of heat conductivity of this heat-conducting seat;

First radiating module comprises first heat pipe, and one section of this first heat pipe is connected on this heat-conducting seat, and another section is then towards extending away from the direction of this heat-conducting seat; And

Second radiating module comprises second heat pipe, switching piece and the 3rd heat pipe, and one section of this second heat pipe is connected in this heat-conducting seat, and another section then is connected on this switching piece; One section of the 3rd heat pipe is connected on this switching piece, and another section is then towards extending away from the direction of this switching piece.

2, the integrated heat dissipation device used of notebook computer as claimed in claim 1 is characterized in that described heat-conducting seat has the aluminium material plate body.

3, the integrated heat dissipation device used of notebook computer as claimed in claim 2 is characterized in that the area that periphery was enclosed to form of described heat sink is greater than the area of the upper surface of described plate body.

4, the integrated heat dissipation device used of notebook computer as claimed in claim 2 is characterized in that the bottom of described plate body offers groove, ccontaining described first heat pipe of this groove, and the bottom surface of described first heat pipe flushes with the bottom surface of described heat-conducting seat.

5, the integrated heat dissipation device used of notebook computer as claimed in claim 4, it is characterized in that, the bottom of described plate body offers another groove that is parallel to described groove, ccontaining described second heat pipe of this another groove, and the bottom surface of described second heat pipe flushes with the bottom surface of described heat-conducting seat.

6, the integrated heat dissipation device used of notebook computer as claimed in claim 2 is characterized in that the bottom of described plate body offers groove, ccontaining described second heat pipe of this groove, and the bottom surface of described second heat pipe flushes with the bottom surface of described heat-conducting seat.

7, the integrated heat dissipation device used of notebook computer as claimed in claim 1 is characterized in that described heat sink is the heat sink of copper material.

8, the integrated heat dissipation device used of notebook computer as claimed in claim 1 is characterized in that described switching piece offers through hole, and another section of described second heat pipe wears this through hole.

9, the integrated heat dissipation device used of notebook computer as claimed in claim 8 is characterized in that described switching piece offers another through hole that is parallel to described through hole, and one section of described the 3rd heat pipe wears this another through hole.

10, the integrated heat dissipation device used of notebook computer as claimed in claim 1 is characterized in that described switching piece offers through hole, and one section of described the 3rd heat pipe wears this through hole.

11, the integrated heat dissipation device used of notebook computer as claimed in claim 1, it is characterized in that, described first radiating module more comprises most radiating fins, offers the intercommunicating pore of mutual correspondence on this radiating fin, another section of described first heat pipe of this intercommunicating pore socket.