CN106502350B - Laptop insulating radiation piece - Google Patents
Laptop insulating radiation piece Download PDFInfo
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- CN106502350B CN106502350B CN201610970090.6A CN201610970090A CN106502350B CN 106502350 B CN106502350 B CN 106502350B CN 201610970090 A CN201610970090 A CN 201610970090A CN 106502350 B CN106502350 B CN 106502350B
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- main surface
- laptop
- heat sink
- thin slice
- radiating module
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of laptop insulating radiation pieces, belong to the technical field of laptop accessory.The insulating radiation piece includes heat sink body made of synthetic resin, and heat sink body includes the first main surface for contacting with laptop, and the second main surface at least partly contacted with support；Radiating module made of metal is provided in first main surface, the radiating module extends to inside the heat sink body from first main surface.Heat sink body is internally provided with soaking thin slice made of metal, and the soaking thin slice is substantially parallel with the first main surface, and the soaking thin slice is contacted with the radiating module.Laptop insulating radiation piece of the invention not only has stable and reliable heat dissipation effect, but also is not necessarily to fan, and appearance is frivolous, small in size, carries convenient for travelling.
Description
Technical field
The present invention relates to the technical fields of laptop accessory, it is more particularly related to a kind of pen
Remember this computer insulating radiation piece.
Background technique
With the universal prevalence of laptop, trend is that the function of CPU is stronger and stronger, but the hair of its apparent size
Exhibition trend is more and more frivolous；And as the calculating speed of the electronic components such as CPU in it is getting faster, line density is increasingly
Greatly, so that heat caused by the components of laptop is also continuously increased, and since size is smaller and smaller, heat dissipation is proposed
Increasingly higher demands.In the prior art, the plastic heat radiation board bottom seat with fan is generallyd use to come to laptop
Rapid cooling is carried out, however noise, but also usual body may not only be brought using the plastic heat radiation plate with fan at work
Product is larger, not readily portable.
Summary of the invention
In order to solve above-mentioned technical problem in the prior art, the purpose of the present invention is to provide a kind of laptop use
Insulating radiation piece.
In order to solve to invent the technical problem and realize goal of the invention, the invention adopts the following technical scheme:
A kind of laptop insulating radiation piece is arranged on laptop bottom for supporting the notebook electricity
Brain simultaneously radiates to the laptop, it is characterised in that: including the heat sink body made of the first heat sink material, institute
Stating heat sink body includes the first main surface for contacting with laptop, and second at least partly contacted with support
Main surface；The radiating module made of the second heat sink material is provided in first main surface, the radiating module is described in
First main surface extends to inside the heat sink body.
Wherein, the thermal window that the radiating module corresponds to the laptop bottom is arranged, and the heat dissipation
The quantity at least two of module.
Wherein, the heat sink body is internally provided with the soaking thin slice made of the second heat sink material, and the soaking is thin
Piece is substantially parallel with first main surface, and the soaking thin slice is contacted with the radiating module.
Wherein, the area of the insulation thin slice is at least the 50% of first main surface area, more preferably at least described
The 70% of first main surface area, the 90~95% of more preferably described first main surface area.
Wherein, first main surface is oppositely arranged with second main surface, is provided with branch in second main surface
Support part, the support portion, which contacts with support and to be formed between second main surface and the support, can make air
The gap of flowing.
Wherein, the thermal coefficient of second heat sink material is greater than the thermal coefficient of first heat sink material, as excellent
Selection of land, the thermal coefficient of second heat sink material are 10 times or more of the thermal coefficient of first heat sink material.
Wherein, first heat sink material is synthetic resin, and second heat sink material is metal.Preferably, institute
Stating the first heat sink material is organic-silicon-modified resin, and second heat sink material is copper or copper alloy.
Compared with the immediate prior art, laptop of the present invention insulating radiation piece has beneficial below
Effect:
Laptop insulating radiation piece of the invention not only has stable and reliable heat dissipation effect, but also is not necessarily to wind
Fan, appearance is frivolous, small in size, carries convenient for travelling.
Detailed description of the invention
Fig. 1 is the thermal window schematic diagram of common laptop bottom.
Fig. 2 is the schematic diagram of the first main surface of laptop insulating radiation piece of the invention.
Fig. 3 is the cross-sectional structure schematic diagram of laptop insulating radiation piece of the invention.
Specific embodiment
Laptop of the present invention is further explained with insulating radiation piece below with reference to specific embodiment
It states, to make more complete and clear explanation to technical solution of the present invention.
As shown in Figure 1, existing laptop usually offers the thermal window of multiple lattice-shapeds on bottom, these
If the fan abnormal work that would potentially result in built in laptop is discharged in the heat that thermal window gives out not in time, seriously
When even result in laptop cisco unity malfunction, thus in the prior art, the attached of a heat dissipation base can be configured
Accessory is reinforced radiating, and is usually made of synthetic resin, and the heat release hole with hollow out and has radiator fan, and institute
It states radiator fan and electric power is directly usually obtained by laptop by USB interface, but the usual volume of the accessory
It is larger, it is not readily portable, and noise may be brought due to the rotation of fan when working, influence using.For this purpose, the present invention provides
It is a kind of to be used for laptop insulating radiation piece, as shown in Figures 2 and 3, laptop insulating radiation of the invention
Piece, including the heat sink body 10 made of the first heat sink material, the heat sink body 10 include being used for and laptop
First main surface 11 of contact, and the second main surface 12 at least partly contacted with support (such as desktop etc.)；Described first
The radiating module 20 made of the second heat sink material is provided in main surface 11, and the radiating module 20 is main from described first
Surface extends to inside the heat sink body, and the radiating module 20 corresponds to the thermal window of the laptop bottom
Setting.The heat sink body 10 is internally provided with the soaking thin slice 30 made of the second heat sink material, the soaking thin slice with
First main surface is substantially parallel, and the soaking thin slice 30 is contacted with the radiating module 20, the insulation thin slice
Area is at least the 50% of first main surface area, and the 70% of more preferably at least described first main surface area.It is described equal
Hot thin slice 30 and radiating module 20 can be combined together by welding manner or the soaking thin slice and radiating module are one
Forming structure.First main surface 11 is oppositely arranged with second main surface 12, is arranged in second main surface 12
There is support portion 13.The support portion 13 contacts with support and to be formed between second main surface and the support
The gap that air can be made to flow.In the present invention, the preferably synthetic resin of the first heat sink material, preferably, selection
Thermal conductivity and the relatively good organic-silicon-modified resin of heat resistance, and second heat sink material need it is high using thermal coefficient
Metal, preferably copper or copper alloy.
In the present invention, the integrated formed structure that the radiating module and soaking thin slice can be made of copper, Huo Zhewei
Radiating module usually can be passed through the method for welding when for non-integral molding structure by non-integral molding structure made of copper
It is welded on the soaking thin slice.The thickness of the heat dissipation thin slice can be 0.1~2.0mm, preferably 0.2~1.0mm；
And the height (being equal to from the first main surface to the height between heat dissipation thin slice) of radiating module can be 0.5~5.0mm, preferably
0.5~2.0mm.As illustratively, above-mentioned radiating module and soaking thin slice are set in a mold, are then by Shooting Technique
Heat sink body of the present invention can be formed.As illustratively, the heat sink body uses organic silicon modified polyurethane
It is molded, the organic silicon modified polyurethane refers to the polyurethane that dimethyl silicone polymer is added in the raw material of preparation.
Preferably, the organic silicon modified polyurethane includes following components: the diphenylmethane diisocyanate of 50~55 parts by weight
Ester, the dimethyl silicone polymer of the bisphenol-A sealing end of 3.0~5.0 parts by weight, the polyester diol of 30.0~35.0 parts by weight, 5.0
The titanium dioxide of the 1,4-butanediol of~10.0 parts by weight and 10.0~15.0 parts by weight.When injection molding, melting temperature is
210~230 DEG C, plasticizing pressure is 0.2~1.0MPa, and mold temperature is 60 DEG C；After molding in the insulating box that temperature is 100 DEG C
Curing 12~24 hours.The thermal coefficient of the organic silicon modified polyurethane is 0.38~0.55W/mK, volume resistivity
> 1.0 × 1011, tensile strength > 25.0MPa.In order to improve the radiating module and soaking thin slice (copper) and heat sink body
Caking property between (organic silicon modified polyurethane).The copper passes through pre-preg and oxidation processes, the oxidation treatment liquid packet
Include hydrogen peroxide, silane coupling agent, citric acid, amino-containing organic sulfonic acid compound.The oxidation treatment liquid is by 50~100g/L
Hydrogen peroxide, the amino silane coupling agent of 8.0~12.0g/L, the citric acid of 10~30g/L, 10~20g/L it is amino-containing
Organic sulfonic acid compound and the water of surplus composition.Copper and injection molding can be improved after pre-preg and oxidation processes in the copper
The peel strength of the organic silicon modified polyurethane of formation, the in the present invention peel strength of the copper and organic silicon modified polyurethane
Greater than 2.5N/mm.
Embodiment 1
Radiating module and soaking thin slice are integrally machined molding by copper, and the surface roughness of the copper is 0.5 μm hereinafter, first
Alkali cleaning oil removing is carried out to copper and pickling removes remaining oxide.Then the H of 50g/L2SO4With the mixing water of the hydrogen peroxide of 10g/L
Pre-preg 5 minutes under the conditions of 0~5 DEG C of temperature, are then washed in solution.After washing, it is in oxidation treatment solution temperature
Under conditions of 20 DEG C, carry out oxidation processes, the processing time is 1 minute, the group of oxidation treatment liquid as 100g/L hydrogen peroxide,
The 3- TSL 8330 of 12.0g/L, the citric acid of 20g/L, the amino naphthalenedisulfonic acid of 20g/L and the water of surplus.
After oxidation processes using washing under SEM visual field it can be observed that fine concaveconvex structure, treated radiating module and
Hot thin slice is in rufous.
Embodiment 2
Radiating module and soaking thin slice are integrally machined molding by copper, and the surface roughness of the copper is 0.5 μm hereinafter, first
Alkali cleaning oil removing is carried out to copper and pickling removes remaining oxide.Then the H of 50g/L2SO4With the mixing water of the hydrogen peroxide of 10g/L
Pre-preg 5 minutes under the conditions of 0~5 DEG C of temperature, are then washed in solution.After washing, it is in oxidation treatment solution temperature
Under conditions of 20 DEG C, carry out oxidation processes, the processing time is 5 minutes, the group of oxidation treatment liquid as 50g/L hydrogen peroxide,
The 3- TSL 8330 of 8.0g/L, the citric acid of 20g/L, the β-aminoethanesulfonic acid of 10g/L and the water of surplus.
After oxidation processes using washing under SEM visual field it can be observed that fine concaveconvex structure, treated radiating module and
Hot thin slice is in rufous.
Embodiment 3
Radiating module and soaking thin slice are integrally machined molding by copper, and the surface roughness of the copper is 0.5 μm hereinafter, first
Alkali cleaning oil removing is carried out to copper and pickling removes remaining oxide.Then the H of 50g/L2SO4With the mixing water of the hydrogen peroxide of 10g/L
Pre-preg 5 minutes under the conditions of 0~5 DEG C of temperature, are then washed in solution.After washing, it is in oxidation treatment solution temperature
Under conditions of 25 DEG C, carry out oxidation processes, the processing time is 3 minutes, the group of oxidation treatment liquid as 80g/L hydrogen peroxide,
N-2- (amino-ethyl) -3-amino propyl methyl diethoxy silane of 10.0g/L, the citric acid of 25g/L, 18g/L β-ammonia
The water of base ethanesulfonic acid and surplus.Fine concaveconvex structure is observed that under SEM visual field using washing after oxidation processes,
Treated radiating module and soaking thin slice are in rufous.
Embodiment 4
Radiating module and soaking thin slice are integrally machined molding by copper, and the surface roughness of the copper is 0.5 μm hereinafter, first
Alkali cleaning oil removing is carried out to copper and pickling removes remaining oxide.Then the H of 50g/L2SO4With the mixing water of the hydrogen peroxide of 10g/L
Pre-preg 5 minutes under the conditions of 0~5 DEG C of temperature, are then washed in solution.After washing, it is in oxidation treatment solution temperature
Under conditions of 25 DEG C, carry out oxidation processes, the processing time is 3 minutes, the group of oxidation treatment liquid as 80g/L hydrogen peroxide,
The 3-aminopropyltriethoxysilane of 10.0g/L, the citric acid of 25g/L, the β-aminoethanesulfonic acid of 18g/L and the water of surplus.
After oxidation processes using washing under SEM visual field it can be observed that fine concaveconvex structure, treated radiating module and
Hot thin slice is in rufous.
Comparative example 1
Radiating module and soaking thin slice are integrally machined molding by copper, and the surface roughness of the copper is 0.5 μm hereinafter, first
Alkali cleaning oil removing is carried out to copper and pickling removes remaining oxide.Then the H of 50g/L2SO4With the mixing water of the hydrogen peroxide of 10g/L
Pre-preg 5 minutes under the conditions of 0~5 DEG C of temperature, are then washed in solution.After washing, it is in oxidation treatment solution temperature
Under conditions of 20 DEG C, carry out oxidation processes, the processing time is 3 minutes, the group of oxidation treatment liquid as 80g/L hydrogen peroxide,
The 3-aminopropyltriethoxysilane of 10.0g/L, the citric acid of 25g/L, the sulfonic acid of 18g/L and the water of surplus.Oxidation processes
Afterwards using washing under SEM visual field it can be observed that fine concaveconvex structure, treated radiating module and soaking thin slice are in
Rufous.
Comparative example 2
Radiating module and soaking thin slice are integrally machined molding by copper, and the surface roughness of the copper is 0.5 μm hereinafter, first
Alkali cleaning oil removing is carried out to copper and pickling removes remaining oxide.Then the H of 50g/L2SO4With the mixing water of the hydrogen peroxide of 10g/L
Pre-preg 5 minutes under the conditions of 0~5 DEG C of temperature, are then washed in solution.After washing, it is in oxidation treatment solution temperature
Under conditions of 20 DEG C, carry out oxidation processes, the processing time is 3 minutes, the group of oxidation treatment liquid as 80g/L hydrogen peroxide,
The 3-aminopropyltriethoxysilane of 10.0g/L, the citric acid of 25g/L, the benzene sulfonic acid of 18g/L and the water of surplus.At oxidation
After reason using washing under SEM visual field it can be observed that fine concaveconvex structure, treated radiating module and soaking thin slice
In rufous.
Comparative example 3
Radiating module and soaking thin slice are integrally machined molding by copper, and the surface roughness of the copper is 0.5 μm hereinafter, first
Alkali cleaning oil removing is carried out to copper and pickling removes remaining oxide.Then the H of 50g/L2SO4With the mixing water of the hydrogen peroxide of 10g/L
Pre-preg 5 minutes under the conditions of 0~5 DEG C of temperature, are then washed in solution.After washing, it is in oxidation treatment solution temperature
Under conditions of 20 DEG C, carry out oxidation processes, the processing time is 3 minutes, the group of oxidation treatment liquid as 80g/L sodium chlorite,
The 3-aminopropyltriethoxysilane of 10.0g/L, the sodium hydroxide of 35g/L, the benzene sulfonic acid of 18g/L and the water of surplus.Oxidation
Fine concaveconvex structure is observed that under SEM visual field using washing after processing.
It is dissipated by Shooting Technique by organic silicon modified polyurethane and by what Examples 1 to 4 and comparative example 1~3 were handled
Thermal modules and soaking thin slice are combined together to obtain insulating radiation piece, and measure the removing between copper and organic silicon modified polyurethane
Intensity, and the peel strength after heat ageing processing.The heat ageing processing refers in 10~80 DEG C of cold cyclings 200
Secondary, the time of each cold cycling is 2 hours.The results are shown in Table 1.
Table 1
| Peel strength (N/mm) | Peel strength (N/mm) after aging process | |
| Embodiment 1 | 3.2 | 2.5 |
| Embodiment 2 | 3.5 | 2.6 |
| Embodiment 3 | 4.2 | 3.2 |
| Embodiment 4 | 4.1 | 3.5 |
| Comparative example 1 | 1.8 | 1.5 |
| Comparative example 2 | 1.6 | 1.2 |
| Comparative example 3 | 1.2 | 1.0 |
Embodiment 5
The organic silicon modified polyurethane that the present embodiment uses is in addition to two isocyanide of diphenyl methane containing 50~55 parts by weight
Acid esters, 3.0~5.0 parts by weight bisphenol-A sealing end dimethyl silicone polymer, 30.0~35.0 parts by weight polyester diol,
The 1,4-butanediol of 5.0~10.0 parts by weight other than the titanium dioxide of 10.0~15.0 parts by weight, also contains 2.0~3.0 weight
The terminal hydroxy group hydrogenated butadiene polymer of part.And the molecular weight of the terminal hydroxy group hydrogenated butadiene polymer be 3100, hydrogenation degree > 98%,
Hydroxy functionality 1.9, hydroxyl value 0.56mmol/g.By the organic silicon modified polyurethane and pass through embodiment 3 by Shooting Technique
The radiating module and soaking thin slice of~4 same treatments are combined together to obtain insulating radiation piece.Then measurement copper and the organosilicon
Peel strength between modified polyurethane, and the peel strength after heat ageing processing.The heat ageing processing refers to
10~80 DEG C cold cycling 200 times, time of each cold cycling is 2 hours.The results are shown in Table 2.
Table 2
| Peel strength (N/mm) | Peel strength (N/mm) after aging process | |
| With embodiment 3 | 4.2 | 3.9 |
| With embodiment 4 | 4.0 | 3.8 |
For the ordinary skill in the art, specific embodiment is only exemplarily described the present invention,
Obviously the present invention specific implementation is not subject to the restrictions described above, as long as use the inventive concept and technical scheme of the present invention into
The improvement of capable various unsubstantialities, or not improved the conception and technical scheme of the invention are directly applied to other occasions
, it is within the scope of the present invention.
Claims (3)
1. a kind of laptop insulating radiation piece is arranged on laptop bottom for supporting the laptop
And radiate to the laptop, it is characterised in that: including the heat sink body made of organic-silicon-modified resin, institute
Stating heat sink body includes the first main surface for contacting with laptop, and second at least partly contacted with support
Main surface；It is provided with the radiating module being made of copper in first main surface, the radiating module is from first main surface
It extends to inside the heat sink body；The thermal window that the radiating module corresponds to the laptop bottom is arranged；
The heat sink body is internally provided with the soaking thin slice being made of copper, and the soaking thin slice and first main surface are put down substantially
Row, and the soaking thin slice is contacted with the radiating module；The area of the soaking thin slice is at least first main surface
The 50% of area.
2. laptop according to claim 1 insulating radiation piece, it is characterised in that: first main surface and institute
It states the second main surface to be oppositely arranged, support portion is provided in second main surface, the support portion contacts and makes with support
Obtain the gap for being formed between second main surface and the support and air being made to flow.
3. laptop according to claim 1 insulating radiation piece, it is characterised in that: the organic-silicon-modified resin
For organic silicon modified polyurethane；And the copper passes through pre-preg and oxidation processes, and the oxidation treatment liquid is by 50~100g/
The hydrogen peroxide of L, the silane coupling agent of 8.0~12.0g/L, the citric acid of 10~30g/L, 10~20g/L it is amino-containing organic
Sulfoacid compound and the water of surplus composition；The time of oxidation processes is 1.0~10 minutes；The copper with it is described organic-silicon-modified
The peel strength of polyurethane is greater than 2.5N/mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610970090.6A CN106502350B (en) | 2016-11-04 | 2016-11-04 | Laptop insulating radiation piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610970090.6A CN106502350B (en) | 2016-11-04 | 2016-11-04 | Laptop insulating radiation piece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106502350A CN106502350A (en) | 2017-03-15 |
| CN106502350B true CN106502350B (en) | 2019-03-08 |
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ID=58321976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610970090.6A Active CN106502350B (en) | 2016-11-04 | 2016-11-04 | Laptop insulating radiation piece |
Country Status (1)
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| CN (1) | CN106502350B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201210279Y (en) * | 2008-06-16 | 2009-03-18 | 鈤新科技股份有限公司 | Integration type heat radiating device for notebook type computer |
| JP2011228647A (en) * | 2010-03-30 | 2011-11-10 | Dainippon Printing Co Ltd | Heat radiation sheet and manufacturing method of the same |
| CN204143338U (en) * | 2014-09-05 | 2015-02-04 | 沈绍骁 | Heat radiation backing plate |
-
2016
- 2016-11-04 CN CN201610970090.6A patent/CN106502350B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201210279Y (en) * | 2008-06-16 | 2009-03-18 | 鈤新科技股份有限公司 | Integration type heat radiating device for notebook type computer |
| JP2011228647A (en) * | 2010-03-30 | 2011-11-10 | Dainippon Printing Co Ltd | Heat radiation sheet and manufacturing method of the same |
| CN204143338U (en) * | 2014-09-05 | 2015-02-04 | 沈绍骁 | Heat radiation backing plate |
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| Publication number | Publication date |
|---|---|
| CN106502350A (en) | 2017-03-15 |
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