CN101610663A - Integrated heat sink for portable electronic product - Google Patents

Abstract

The invention relates to an integrated heat dissipation device of a portable electronic product, which comprises a heat conduction seat, a heat dissipation plate, a first heat dissipation module and a second heat dissipation module; the heat dissipation plate is attached to the surface of the heat conduction seat, and the heat conduction coefficient of the heat dissipation plate is higher than that of the heat conduction seat; the first heat dissipation module comprises a first heat pipe, one section of the first heat pipe is connected to the heat conducting seat, and the other section of the first heat pipe extends out in the direction far away from the heat conducting seat; the second heat dissipation module comprises a second heat pipe, a transfer block and a third heat pipe, one section of the second heat pipe is connected to the heat conduction seat, the other section of the second heat pipe is connected to the transfer block, one section of the third heat pipe is connected to the transfer block, and the other section of the third heat pipe extends out in the direction away from the transfer block. The integrated heat dissipation device of the portable electronic product of the invention can lead the heat generated by the heating source to be rapidly and massively led out by the multi-directional heat dissipation path.

Description

Integrated Cooling Device for Portable Electronic Products

technical field

The invention relates to a cooling device, in particular to an integrated cooling device for portable electronic products.

Background technique

With the advancement of technology and the development of technology, the use of portable electronic products in work or life can not only improve work efficiency, but also increase the convenience of daily life, so it has been widely adopted by the public. However, these portable electronic products are constantly required to be miniaturized and lightweight in terms of volume and weight in order to provide portability, but they are constantly required to improve in terms of computing and execution speed, which relatively makes them The heat generated by the central processing unit (CPU) is getting higher and higher. In the past, in order to solve this heat problem, most of them used a heat sink composed of an extruded aluminum radiator and a fan to deal with it. However, this type of heat sink has It cannot meet the heat dissipation requirements, and it is extremely waiting for new technologies to be improved.

Known heat dissipation devices for portable electronic products mainly include a copper heat conduction seat and a heat dissipation module. One plane of the heat conduction seat is used for attaching to a heat source, and the heat dissipation module includes a heat pipe. A section of the heat pipe is attached to a heat conduction On the seat, the other section extends away from the heat conduction seat to be attached to the metal shell of the electronic product, so that the metal shell can dissipate the heat generated by the heat source to the outside of the electronic product to achieve the effect of heat dissipation.

However, the known heat sinks for portable electronic products have the following problems in actual use: because they only use a single heat dissipation path, the heat that can be transmitted is quite limited, which cannot meet the needs of portable electronic products at this stage. The heat dissipation requirements of the central processing unit of electronic products; in addition, the heat conduction seat is made of copper, which is difficult to effectively reduce and lighten the material cost and weight; it really needs to be improved.

Contents of the invention

In view of this, the main purpose of the present invention is to provide an integrated heat dissipation device for portable electronic products that can quickly and massively dissipate heat.

To achieve the above purpose, the present invention provides an integrated heat dissipation device for portable electronic products, which includes a heat conduction base, a heat dissipation plate, a first heat dissipation module and a second heat dissipation module; the heat dissipation plate is attached to the surface of the heat conduction base , and the thermal conductivity of the heat dissipation plate is higher than that of the heat conduction base; the first heat dissipation module includes a first heat pipe, one section of the first heat pipe is connected to the heat conduction base, and the other section faces away from the heat conduction base The second heat dissipation module includes a second heat pipe, an adapter block and a third heat pipe. One section of the second heat pipe is connected to the heat conduction base, and the other section is connected to the adapter block. The third heat pipe One section is connected to the adapter block, and the other section extends away from the adapter block.

It can be seen from the above technical solutions that the integrated heat dissipation device for portable electronic products of the present invention can quickly and massively dissipate the heat generated by the heat source by connecting multi-directional heat dissipation paths on the heat conduction base. , so as to greatly improve the overall heat dissipation effect, and the heat conduction seat is made of aluminum, which not only saves material costs but also achieves the purpose of reducing weight.

Description of drawings

Fig. 1 is the three-dimensional exploded view of the heat dissipation device of the present invention;

Fig. 2 is a combined perspective view of the heat sink of the present invention;

Fig. 3 is a combined sectional view of the heat dissipation device of the present invention;

FIG. 4 is a combined schematic diagram of a heat dissipation device of the present invention applied to a notebook computer;

Fig. 5 is a partially enlarged cross-sectional view of the heat dissipation device of the present invention in Fig. 4;

Fig. 6 is a combined cross-sectional view of another viewing angle of the heat sink of the present invention in Fig. 4;

FIG. 7 is a schematic diagram of the assembly of the cover in FIG. 6 after it is closed downwards.

Explanation of reference signs

Thermal seat 10

Board body 11 extension arm 12

Positioning hole 121 groove 13

Radiator plate 20

The first cooling module 30

The first heat pipe 31 radiating fins 32

Connecting hole 321

Heat-absorbing section 311, 411, 431

Heat release section 312, 412, 432

The second cooling module 40

Second heat pipe 41 adapter block 42

Through hole 421 third heat pipe 43

Electronics 8

Host 81 Circuit Board 811

CPU 812 Cover 82

Display 821 Metal Shell 822

Detailed ways

The detailed description and technical content of the present invention are described below with accompanying drawings. However, the attached drawings are provided for reference and illustration only, and are not intended to limit the present invention.

Please refer to Fig. 1 to Fig. 3, which are respectively the three-dimensional exploded view, combined perspective view and combined cross-sectional view of the heat dissipation device of the present invention. The present invention provides an integrated heat dissipation device for portable electronic products, which is used for notebook type Computer and other electronic products 8 (as shown in FIG. 4 ) to dissipate heat. The integrated heat dissipation device mainly includes a heat conduction base 10 , a heat dissipation plate 20 , a first heat dissipation module 30 and a second heat dissipation module 40 .

The heat conduction seat 10 is made of a material with high thermal conductivity such as aluminum, and has a rectangular plate body 11. Extending arms 12 protrude from the four corners of the rectangular plate body 11, and each extending arm 12 is respectively provided with The positioning hole 121 is used for fastening elements (not shown in the figure) such as fasteners or screws to pass through and fix; in addition, two grooves 13 parallel to each other are opened on the bottom of the rectangular plate 11 .

The heat dissipation plate 20 is attached to the upper surface of the heat conduction seat 10, and it is made of a material with high thermal conductivity such as copper. The enclosed area is larger than the area of the upper surface of the rectangular plate body 11 , in addition to a large area of bonding with the heat conduction seat 10 for heat conduction, the heat dissipation plate 20 can also be used to expand the overall heat dissipation effect.

The first heat dissipation module 30 includes a first heat pipe 31 and a plurality of heat dissipation fins 32 . The first heat pipe 31 is flat and has a heat absorbing section 311 and a heat releasing section 312 extending from the heat absorbing section 311. The heat absorbing section 311 is accommodated in the aforementioned groove 13 and its bottom surface is in contact with the The bottom surface of the seat 10 is flush, and the heat dissipation section 312 extends away from the heat conducting seat 10 . Communication holes 321 corresponding to each other are formed on the heat dissipation fins 32 , and the communication holes 321 are used to sleeve and connect the aforementioned heat radiation section 312 so as to quickly dissipate the heat conducted by the heat absorption section 311 .

The second heat dissipation module 40 includes a second heat pipe 41, an adapter block 42, and a third heat pipe 43. Both the second heat pipe 41 and the third heat pipe 43 have heat absorbing sections 411, 431 and heat releasing sections 412, 432, wherein the second The heat release section 412 of the heat pipe 41 extends away from the heat conducting base 10 , and the heat release section 432 of the third heat pipe 43 extends away from the connecting block 42 . The heat absorbing section 411 of the second heat pipe 41 is flat and accommodated in the other groove 13 . The bottom surface of the heat absorbing section 411 is flush with the bottom surface of the heat conducting base 10 . The adapter block 42 is made of a metal material with good thermal conductivity, and has two through holes 421 parallel to each other, and the heat release section 412 of the second heat pipe 41 is cylindrical, wherein The through hole 421 is for passing through the heat dissipation section 412 . The heat-absorbing section 431 of the third heat pipe 43 is also cylindrical, and the heat-absorbing section 431 is pierced through the through hole 421 pivotally connected above the adapter block 42, so that the third heat pipe 43 can rotate relative to the adapter block 42; The heat radiation section 432 of the third heat pipe 43 is flat, and is used to attach to the metal shell 822 of the electronic product 8 (as shown in FIG. 4 ).

Please refer to FIG. 4 to FIG. 7, which are respectively a schematic diagram of the application of the heat dissipation device of the present invention to a notebook computer, a partially enlarged cross-sectional view of the heat dissipation device of the present invention in FIG. 4, and a combination of another viewing angle of the heat dissipation device of the present invention in FIG. 4 The cross-sectional view and the schematic diagram of the combination of the cover in FIG. 6 after the cover is closed downwards. The heat dissipation device can be applied to a portable electronic product 8. The electronic product 8 in this embodiment is a notebook computer, but it is not used in this type. state is limited. This electronic product 8 has a main frame 81 and a cover body 82. A circuit board 811 is installed inside the main frame 81, and a central processing unit 812 and other electronic components or devices with various functions are installed on the circuit board 811. The cover body 82 It then has a display 821 and a metal shell 822 sealed around the display 821 . When assembling, attach the heat conducting seat 10, the heat absorbing section 311 of the first heat pipe 31, and the heat absorbing section 411 of the second heat pipe 41 to the central processing unit 812 (as shown in FIG. 5 ), and use bolts or fasteners The aforementioned positioning hole 121 is passed through to be fixed on the circuit board 811 . Wherein the thermal conductivity of the heat dissipation plate 20 is greater than the thermal conductivity of the heat conduction base 10, and the area surrounded by the periphery of the heat dissipation plate 20 is also greater than the area of the upper surface of the plate body 11 of the heat conduction base 10, which can not only protect the electronics around the central processing unit 812 The components are set aside, and the central processing unit 812 can be heat-conducted and dissipated by means of heat conduction; in addition, the heat-radiating section 312 of the first heat pipe 31 and the heat-dissipating fins 32 are just accommodated at the preset position of the host computer 81. In the space, and utilize the fan that is arranged around each heat dissipation fin 32 and heat dissipation hole, carry out fast heat dissipation to each heat dissipation fin 32 and heat release section 312 with forced airflow mode; The section 432 is attached to the metal shell plate 822 of the electronic product 8, and the heat conduction between the third heat pipe 43 and the second heat pipe 41 is carried out through the adapter block 42, so that the heat generated by the central processing unit 812 can be transferred from the second heat pipe 41. The transfer block 42 to the third heat pipe 43 is quickly conducted to the metal shell plate 822, and the large heat dissipation area of the metal shell plate 822 is used to achieve a high-efficiency heat dissipation effect. In addition, since the third heat pipe 43 of the present invention can rotate relative to the adapter block 42, the cover body 82 can be stacked and closed relative to the main unit 81 (as shown in FIG. 7 ) without operating the electronic product 8. Show).

Claims (11)

1, a kind of integrated heat radiator of portable electronic product is characterized in that, comprising:

Heat-conducting seat;

Heating panel amplexiforms on the surface of this heat-conducting seat, and the conductive coefficient of this heating panel is higher than the conductive coefficient of this heat-conducting seat;

First radiating module comprises first heat pipe, and one section of this first heat pipe is connected on this heat-conducting seat, and another section is then towards extending away from the direction of this heat-conducting seat; And

Second radiating module comprises second heat pipe, switching piece and the 3rd heat pipe, and one section of this second heat pipe is connected in this heat-conducting seat, and another section then is connected on this switching piece; One section of the 3rd heat pipe is connected on this switching piece, and another section is then towards extending away from the direction of this switching piece.

2, the integrated heat radiator of portable electronic product according to claim 1 is characterized in that, described heat-conducting seat has the aluminium material plate body.

3, the integrated heat radiator of portable electronic product according to claim 2 is characterized in that, the area that periphery was enclosed to form of described heating panel is greater than the area of the upper surface of described plate body.

4, the integrated heat radiator of portable electronic product according to claim 2 is characterized in that, the bottom of described plate body offers groove, ccontaining described first heat pipe of this groove, and the bottom surface of the bottom surface of described first heat pipe and described heat-conducting seat is flat.

5, the integrated heat radiator of portable electronic product according to claim 4, it is characterized in that, the bottom of described plate body offers another groove that is parallel to described groove, ccontaining described second heat pipe of this another groove, and the bottom surface of described second heat pipe flushes with the bottom surface of described heat-conducting seat.

6, the integrated heat radiator of portable electronic product according to claim 2 is characterized in that, the bottom of described plate body offers groove, ccontaining described second heat pipe of this groove, and the bottom surface of described second heat pipe flushes with the bottom surface of described heat-conducting seat.

7, the integrated heat radiator of portable electronic product according to claim 1 is characterized in that, described heating panel is the heating panel of copper material.

8, the integrated heat radiator of portable electronic product according to claim 1 is characterized in that, described switching piece offers through hole, and another section of described second heat pipe wears this through hole.

9, the integrated heat radiator of portable electronic product according to claim 8, it is characterized in that, described switching piece offers that for described the 3rd heat pipe one section wears and another through hole of rotary oscillation, and this another through hole is parallel to described through hole.

10, the integrated heat radiator of portable electronic product according to claim 1 is characterized in that, described switching piece offers that for described the 3rd heat pipe one section wears and the through hole of rotary oscillation.

11, the integrated heat radiator of portable electronic product according to claim 1, it is characterized in that, described first radiating module also comprises most radiating fins, offers the intercommunicating pore of mutual correspondence on this radiating fin, another section of described first heat pipe of this intercommunicating pore socket.

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