CN210381769U

CN210381769U - Graphite alkene heat dissipation aluminum plate structure

Info

Publication number: CN210381769U
Application number: CN201921378561.XU
Authority: CN
Inventors: 廖少林; 廖羽君; 黄旭进
Original assignee: Shenzhen Tianhua Electronic Technology Co Ltd
Current assignee: Shenzhen Tianhua Electronic Technology Co Ltd
Priority date: 2019-08-23
Filing date: 2019-08-23
Publication date: 2020-04-21
Anticipated expiration: 2029-08-23

Abstract

The utility model discloses a graphite alkene heat dissipation aluminum plate structure, including heat dissipation aluminum plate, be equipped with the laminating groove on heat dissipation aluminum plate's the upper end lateral wall, fixedly connected with semiconductor refrigerating plant on heat dissipation aluminum plate's the lower extreme lateral wall, equidistant a plurality of heat radiation fins of fixedly connected with on semiconductor refrigerating plant's the lower extreme lateral wall, be equipped with fixed establishment on the heat dissipation aluminum plate. The utility model discloses heat dissipation aluminum plate is through laminating groove and heat conduction pad and heating element fully contact, and through setting up semiconductor refrigerating plant, heat radiation fins and graphite alkene coating, multiple radiating mode more is favorable to the heat dissipation, and the radiating effect is very good.

Description

Graphite alkene heat dissipation aluminum plate structure

Technical Field

The utility model relates to a heat dissipation aluminum plate structure technical field especially relates to a graphite alkene heat dissipation aluminum plate structure.

Background

The development of science and technology is changing day by day, electronic components inside electronic equipment tend to be more complex and precise nowadays, the difficulty of heat dissipation of internal components is improved along with the electronic components, the electrical characteristics among the components are also considered to avoid short circuit, and especially the problem of heat generation is related to the service life of the product and the energy required by the performance of the product; the graphene has excellent heat conduction characteristics, and the thermal radiation coefficient exceeds 0.95, so that the graphene can effectively improve the efficiency of the existing heat dissipation product.

The existing some heat dissipation aluminum plate structures are too simple, the contact between a heating element and the heat dissipation aluminum plate is insufficient, the heat dissipation mode is single, the heat dissipation effect is poor, and therefore the graphene heat dissipation aluminum plate structure is provided and used for solving the problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming that exists among the prior art, and the graphite alkene heat dissipation aluminum plate structure that proposes, its heat dissipation aluminum plate is through laminating groove and heat conduction pad and heating element fully contact, and through setting up semiconductor refrigerating plant, heat radiation fins and graphite alkene coating, multiple radiating mode more is favorable to the heat dissipation, and the radiating effect is very good.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a graphite alkene heat dissipation aluminum plate structure, includes heat dissipation aluminum plate, be equipped with the laminating groove on heat dissipation aluminum plate's the upper end lateral wall, fixedly connected with semiconductor refrigerating plant on heat dissipation aluminum plate's the lower extreme lateral wall, a plurality of heat radiation fins of equidistant fixedly connected with on semiconductor refrigerating plant's the lower extreme lateral wall, the last fixed establishment that is equipped with of heat dissipation aluminum plate.

Preferably, a heat conducting pad is fixedly connected to the inner wall of the fitting groove, and the thickness of the heat conducting pad is 1.5 mm.

Preferably, the heat dissipation fins are made of aluminum, and graphene coatings are coated on the side walls of the heat dissipation fins.

Preferably, the semiconductor refrigerating device is a semiconductor refrigerating sheet.

Preferably, the fixing mechanism comprises fixing blocks fixedly connected to the side walls of the two sides of the heat-radiating aluminum plate.

Preferably, two symmetrical mounting holes are respectively arranged on the side walls of the two fixing blocks in a penetrating manner.

The utility model discloses following beneficial effect has:

1. through set up the laminating groove on heat dissipation aluminum plate, set up the heat conduction pad on the laminating groove, during the use, heat dissipation aluminum plate has increased heating element and heat dissipation aluminum plate's area of contact through laminating groove and heat conduction pad and heating element abundant contact, is favorable to the heat dissipation, and the radiating effect is very good.

2. Through setting up semiconductor refrigerating plant, heat radiation fin and graphite alkene coating, semiconductor refrigerating plant can transfer the heat to the other end from one end to take away the heat on the heat radiation aluminum plate, and transmit to on the heat radiation fin, dispel the heat with compound heat exchange mode, graphite alkene coating is formed by the graphite alkene powder heat dissipation coating of coating on the heat radiation fin lateral wall, and graphite alkene has very good heat-conduction performance, is favorable to the heat dissipation, and the radiating effect is very good.

3. Through setting up fixed establishment, during the use, conveniently pass through the mounting hole with the bolt with heat dissipation aluminum plate fixed mounting good.

To sum up, the utility model discloses its heat dissipation aluminum plate is through laminating groove and heat conduction pad and heating element fully contact, and through setting up semiconductor refrigerating plant, heat radiation fins and graphite alkene coating, multiple radiating mode more is favorable to the heat dissipation, and the radiating effect is very good.

Drawings

Fig. 1 is a schematic structural diagram of a graphene heat dissipation aluminum plate structure provided by the present invention;

fig. 2 is a schematic top view of the graphene heat dissipation aluminum plate structure provided by the present invention;

fig. 3 is the utility model provides a heat radiation fin structure schematic diagram of graphite alkene heat dissipation aluminum plate structure.

In the figure: 1 heat dissipation aluminum plate, 2 laminating grooves, 3 semiconductor refrigerating plant, 4 heat dissipation fins, 5 heat conduction pads, 6 graphene coating, 7 fixed blocks, 8 mounting holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.

Referring to fig. 1-3, a graphite alkene heat dissipation aluminum plate structure, including heat dissipation aluminum plate 1, be equipped with laminating groove 2 on heat dissipation aluminum plate 1's the upper end lateral wall, fixedly connected with heat conduction pad 5 on laminating groove 2's the inner wall, heat conduction pad 5's thickness is 1.5 millimeters, through set up laminating groove 2 on heat dissipation aluminum plate 1, set up heat conduction pad 5 on laminating groove 2, heat conduction pad 5 fills the heat conduction material for the high performance clearance, it has good viscidity, flexibility, good compressibility and has good thermoconductivity, during the use, heat dissipation aluminum plate 1 fully contacts with heating element through laminating groove 2 and heat conduction pad 5, heating element and heat dissipation aluminum plate 1's area of contact has been increased, be favorable to the heat dissipation.

Wherein, the lower end side wall of the heat radiation aluminum plate 1 is fixedly connected with a semiconductor refrigerating device 3, the semiconductor refrigerating device 3 is a semiconductor refrigerating sheet, the semiconductor refrigerating sheet utilizes the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, the two ends of the couple can respectively absorb heat and emit heat, the purpose of refrigeration can be realized, the prior art is adopted, the upper end side wall of the semiconductor refrigerating device 3 is a cold end, the lower end side wall is a hot end, the hot end side wall of the semiconductor refrigerating device 3 is fixedly connected with a plurality of heat radiation fins 4 at equal intervals, the heat radiation fins 4 are made of aluminum, the side walls of the heat radiation fins 4 are coated with a graphene coating 6 (as shown in figure 3), and the semiconductor refrigerating device 3, the heat radiation fins 4 and the graphene coating 6 are arranged, so that the semiconductor refrigerating device 3 can transfer heat from one end to the other end, therefore, heat on the heat dissipation aluminum plate 1 is taken away and transferred to the heat dissipation fins 4, heat dissipation is achieved in a composite heat exchange mode, the graphene coating 6 is formed by graphene powder heat dissipation coating coated on the side walls of the heat dissipation fins 4, and the graphene has good heat conduction performance and is beneficial to heat dissipation.

Wherein, be equipped with fixed establishment on heat dissipation aluminum plate 1, fixed establishment includes fixed block 7 of fixed connection on heat dissipation aluminum plate 1's both sides lateral wall, runs through the mounting hole 8 that is equipped with two mutual symmetries on the lateral wall of two fixed blocks 7 respectively, through setting up fixed establishment, during the use, conveniently passes through mounting hole 8 with the bolt and will dispel the heat aluminum plate 1 fixed mounting good.

The utility model discloses in, during the use, the convenience is with 1 fixed mounting of heat dissipation aluminum plate with the bolt through mounting hole 8, heat dissipation aluminum plate 1 is through laminating groove 2 and heat conduction pad 5 and heating element fully contact, heating element and 1 area of contact of heat dissipation aluminum plate have been increased, be favorable to the heat dissipation, semiconductor refrigerating plant 3 can shift the heat to the other end from one end simultaneously, thereby take away the heat on the heat dissipation aluminum plate 1, and transmit to on heat radiation fins 4, dispel the heat with compound heat exchange mode, graphite alkene coating 6 is formed by the graphite alkene powder heat dissipation coating of coating on heat radiation fins 4 lateral walls, graphite alkene has very good heat conductivility, be favorable to the heat dissipation.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a graphite alkene heat dissipation aluminum plate structure, includes heat dissipation aluminum plate (1), its characterized in that, be equipped with laminating groove (2) on the upper end lateral wall of heat dissipation aluminum plate (1), fixedly connected with semiconductor refrigerating plant (3) on the lower extreme lateral wall of heat dissipation aluminum plate (1), equidistant a plurality of heat radiation fins (4) of fixedly connected with on the lower extreme lateral wall of semiconductor refrigerating plant (3), be equipped with fixed establishment on heat dissipation aluminum plate (1).

2. The graphene aluminum heat dissipation plate structure of claim 1, wherein a heat conducting pad (5) is fixedly connected to the inner wall of the fitting groove (2), and the thickness of the heat conducting pad (5) is 1.5 mm.

3. The graphene aluminum heat dissipation plate structure according to claim 1, wherein the heat dissipation fins (4) are made of aluminum, and the side walls of the heat dissipation fins (4) are coated with the graphene coating (6).

4. The graphene heat dissipation aluminum plate structure according to claim 1, wherein the semiconductor refrigeration device (3) is a semiconductor refrigeration sheet.

5. The graphene aluminum heat dissipation plate structure of claim 1, wherein the fixing mechanism comprises fixing blocks (7) fixedly connected to two side walls of the aluminum heat dissipation plate (1).

6. The graphene aluminum heat dissipation plate structure according to claim 5, wherein two symmetrical mounting holes (8) are respectively formed through the side walls of the two fixing blocks (7).