CN112640598A - 电子装置及电路板组件 - Google Patents
电子装置及电路板组件 Download PDFInfo
- Publication number
- CN112640598A CN112640598A CN201880095925.5A CN201880095925A CN112640598A CN 112640598 A CN112640598 A CN 112640598A CN 201880095925 A CN201880095925 A CN 201880095925A CN 112640598 A CN112640598 A CN 112640598A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic device
- heat
- heat dissipation
- source chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 72
- 230000006870 function Effects 0.000 claims description 39
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 229910021389 graphene Inorganic materials 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910021392 nanocarbon Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 13
- 238000012545 processing Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 206010063385 Intellectualisation Diseases 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一种电子装置(100)，包括：中空状的本体(10)；电路板组件(30)，设置于所述本体(10)内；其中，所述电路板组件(30)包括：电路板支架(31)；电路板(32)，固定安装于所述电路板支架(31)的一侧；热源芯片(321)，安装于所述电路板(32)上并与所述电路板(32)电性连接；以及散热模组(33)，设置于所述热源芯片(321)的远离所述电路板(32)的一侧并与热源芯片导热连接。还提供一种电路板组件(30)。散热效果较好。
Description
PCT国内申请，说明书已公开。
Claims (20)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/114812 WO2020093364A1 (zh) | 2018-11-09 | 2018-11-09 | 电子装置及电路板组件 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112640598A true CN112640598A (zh) | 2021-04-09 |
Family
ID=70611456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880095925.5A Pending CN112640598A (zh) | 2018-11-09 | 2018-11-09 | 电子装置及电路板组件 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112640598A (zh) |
| WO (1) | WO2020093364A1 (zh) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203896662U (zh) * | 2014-06-27 | 2014-10-22 | 广东欧珀移动通信有限公司 | 一种移动终端复合式散热结构及手机 |
| CN106455419A (zh) * | 2016-09-05 | 2017-02-22 | 珠海格力电器股份有限公司 | 一种电子设备散热结构 |
| WO2017067202A1 (zh) * | 2015-10-22 | 2017-04-27 | 乐视控股（北京）有限公司 | 一种移动终端的散热装置和移动终端 |
| WO2018053871A1 (zh) * | 2016-09-26 | 2018-03-29 | 深圳市大疆创新科技有限公司 | 散热机构及具有该散热机构的电子调速器、电子装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104994712A (zh) * | 2015-07-14 | 2015-10-21 | 广东欧珀移动通信有限公司 | 移动终端以及对该移动终端散热的方法 |
| CN207118192U (zh) * | 2017-07-04 | 2018-03-16 | 惠州Tcl移动通信有限公司 | 移动电子设备 |
-
2018
- 2018-11-09 CN CN201880095925.5A patent/CN112640598A/zh active Pending
- 2018-11-09 WO PCT/CN2018/114812 patent/WO2020093364A1/zh active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203896662U (zh) * | 2014-06-27 | 2014-10-22 | 广东欧珀移动通信有限公司 | 一种移动终端复合式散热结构及手机 |
| WO2017067202A1 (zh) * | 2015-10-22 | 2017-04-27 | 乐视控股（北京）有限公司 | 一种移动终端的散热装置和移动终端 |
| CN106455419A (zh) * | 2016-09-05 | 2017-02-22 | 珠海格力电器股份有限公司 | 一种电子设备散热结构 |
| WO2018053871A1 (zh) * | 2016-09-26 | 2018-03-29 | 深圳市大疆创新科技有限公司 | 散热机构及具有该散热机构的电子调速器、电子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020093364A1 (zh) | 2020-05-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210409 |