CN211860646U - 一种高效散热的多层线路板 - Google Patents
一种高效散热的多层线路板 Download PDFInfo
- Publication number
- CN211860646U CN211860646U CN201922348173.3U CN201922348173U CN211860646U CN 211860646 U CN211860646 U CN 211860646U CN 201922348173 U CN201922348173 U CN 201922348173U CN 211860646 U CN211860646 U CN 211860646U
- Authority
- CN
- China
- Prior art keywords
- base plate
- circuit board
- substrate
- multilayer circuit
- middle level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 48
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 11
- 239000010439 graphite Substances 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922348173.3U CN211860646U (zh) | 2019-12-24 | 2019-12-24 | 一种高效散热的多层线路板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922348173.3U CN211860646U (zh) | 2019-12-24 | 2019-12-24 | 一种高效散热的多层线路板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211860646U true CN211860646U (zh) | 2020-11-03 |
Family
ID=73216657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922348173.3U Active CN211860646U (zh) | 2019-12-24 | 2019-12-24 | 一种高效散热的多层线路板 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211860646U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112601428A (zh) * | 2020-12-24 | 2021-04-02 | 北京机电工程研究所 | 一种电驱动与电控制集成装置 |
-
2019
- 2019-12-24 CN CN201922348173.3U patent/CN211860646U/zh active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112601428A (zh) * | 2020-12-24 | 2021-04-02 | 北京机电工程研究所 | 一种电驱动与电控制集成装置 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Multilayer circuit board with high efficiency heat dissipation Effective date of registration: 20220402 Granted publication date: 20201103 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2022420000097 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230410 Granted publication date: 20201103 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2022420000097 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high-efficiency multi-layer circuit board for heat dissipation Effective date of registration: 20230414 Granted publication date: 20201103 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2023420000161 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20201103 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2023420000161 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A multi-layer circuit board with efficient heat dissipation Granted publication date: 20201103 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2024980013795 |