CN2658940Y - Electron assembly radiation module - Google Patents
Electron assembly radiation module Download PDFInfo
- Publication number
- CN2658940Y CN2658940Y CN 200320103479 CN200320103479U CN2658940Y CN 2658940 Y CN2658940 Y CN 2658940Y CN 200320103479 CN200320103479 CN 200320103479 CN 200320103479 U CN200320103479 U CN 200320103479U CN 2658940 Y CN2658940 Y CN 2658940Y
- Authority
- CN
- China
- Prior art keywords
- electronic building
- building brick
- radiator
- conducting strip
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
This utility model relates to a radiating module for electronic components. A radiating module is used to lead the high temperature produced by electronic components such as MOS and CMOS arranged on circuit board to the casing of the circuit board and far away from the adjacent capacitance components, so as to greatly reduce impact on adjacent components.
Description
Technical field
The utility model relates to a kind of electronic building brick radiating module, particularly a kind of electronic assembly radiator that can produce high temperature and influence adjacent assemblies when operation that is applicable to.
Background technology
General near metal-oxide semiconductor (MOS) on the circuit board (MOS) or complementary metal oxide semiconductors (CMOS) electronic building bricks such as (CMOS), standing other for example electronic building brick of electric capacity that is equipped with, and the mode that is provided with is quite intensive, therefore, the high temperature that metal-oxide semiconductor (MOS) (MOS) or complementary metal oxide semiconductors (CMOS) (CMOS) are produced when operation, influence in useful life for assemblies such as contiguous electric capacity is very huge, especially, in case radiating effect is not good when the casing inside of ccontaining circuit board, or the ambient temperature of casing outside is when higher, and the assemblies such as electric capacity of adjacent metal oxide semiconductor (MOS) or complementary metal oxide semiconductors (CMOS) (CMOS) then are subject to its high temperature and damage.
Background technology
Main utility model purpose of the present utility model provides a kind of electronic building brick radiating module, by utilizing a radiating module, with metal-oxide semiconductor (MOS) (MOS) or the complementary metal oxide semiconductors (CMOS) electronic building bricks such as (CMOS) that is arranged on the circuit board, the high temperature that when operation, is produced, be directed to the casing place of mounting circuit boards, and, significantly reducing influence, and obviously possess following advantage for adjacent assemblies away from its adjacent assemblies (for example electric capacity):
1) the utility model effectively utilizes the redundant space that the connector combination top of board edge is had, and radiating module is set, and need not change circuit board, connector combination, reach original design of casing inside, and install easily;
2) radiating module of the present utility model runs through a heat pipe (heat pipe) formation by a radiator, and the other end of heat pipe also connects a conducting strip, therefore, only need the heat pipe of the different bending degrees of assembling, can cooperate the casing of different machines and real space and be provided with, so, but have the effect that elastification is produced;
3) the utility model for nearby electronic components (for example: the influence in useful life electric capacity) can reduce MOS or CMOS, especially, in case radiating effect is not good when the casing inside of ccontaining circuit board, or the ambient temperature of casing outside is when higher, and the utility model can avoid the assemblies such as electric capacity of contiguous MOS or CMOS to damage.
The utility model is achieved in that a kind of electronic building brick radiating module comprises a conducting strip, first radiator, reaches second radiator etc.; Wherein:
This conducting strip is arranged on the circuit board, and contacts with the electronic building brick surface of at least one desire heat radiation;
This first radiator is one to have the radiator of plurality of radiating fins, and runs through a heat pipe on the plurality of radiating fins, and an end of heat pipe is connected on this conducting strip;
This second radiator is one to have the radiator of plurality of radiating fins, and runs through a heat pipe on the plurality of radiating fins, and an end of heat pipe is connected on this conducting strip;
Two plurality of radiating fins are fixedly arranged on respectively on the wall of a casing;
By this, the high temperature that the electronic building brick of desire heat radiation can be produced when moving is directed to the casing place that power circuit board is installed, and carries out the larger area heat radiation, and away from contiguous capacitance component.
The utility model can also realize like this that a kind of electronic building brick radiating module comprises a conducting strip, first radiator, reaches second radiator etc.; Wherein:
This conducting strip is arranged on the circuit board, and contacts with the electronic building brick surface of at least one desire heat radiation;
This first radiator is one to have the radiator of plurality of radiating fins, and runs through a heat pipe on the plurality of radiating fins, and an end of heat pipe is connected on this conducting strip;
This second radiator is one to have the radiator of plurality of radiating fins, and runs through a heat pipe on the plurality of radiating fins, and an end of heat pipe is connected on this conducting strip;
The front end face of two radiators is fixedly arranged on respectively on the wall of a casing;
By this, the high temperature that the electronic building brick of desire heat radiation can be produced when moving is directed to the casing place that power circuit board is installed, and carries out the larger area heat radiation, and away from contiguous capacitance component.
The utility model is elaborated with instantiation below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is a three-dimensional exploded view of the present utility model;
Fig. 2 is the schematic perspective view that the utility model is implemented state;
Fig. 3 is the part cross sectional plan view that the utility model is implemented state;
Fig. 4 is the part cross sectional plan view of the utility model second embodiment.
Description of reference numerals:
First radiator 10; Electronic building brick 41;
Front end face 10a; Connector combination 42;
Heat pipe 11; Capacitance component 43;
Radiating fin 15; Connector combination 44;
Second radiator 20; Connector combination 45;
Front end face 20a; Connector combination 46;
Heat pipe 22; Connector combination 47;
Radiating fin 26; Cover plate 60;
Conducting strip 30; Casing 70;
Circuit board 40.
Embodiment
See also Fig. 1 to Fig. 3, in preferred embodiment, radiating module of the present utility model comprises: a conducting strip 30, first radiator 10, and second radiator 20 etc.; Wherein:
This conducting strip 30 is arranged on the circuit board 40, and contacts with the surface of metal-oxide semiconductor (MOS) (MOS) or complementary metal oxide semiconductors (CMOS) plural electronic building bricks 41 such as (CMOS);
This first radiator 10 is one to have the radiator (heat sink) of plurality of radiating fins 15, and runs through a heat pipe (heat pipe) 11 on the plurality of radiating fins 15, and an end of heat pipe (heat pipe) 11 is connected on the conducting strip 30;
This second radiator 20 is one to have the radiator (heat sink) of plurality of radiating fins 26, and runs through a heat pipe (heat pipe) 22 on the plurality of radiating fins 26, and an end of heat pipe (heat pipe) 24 is connected on the conducting strip 30;
And two plurality of radiating fins 15,26 are fixedly arranged on respectively on the wall of a casing 70;
By this, can be via conducting strip 30 and first and second radiator 10,20, the high temperature that plural electronic building brick 41 is produced when moving is directed to casing 70 places that power circuit board 40 is installed, carry out the larger area heat radiation, and, significantly reducing of the influence of plural electronic building brick 41, and avoid complex capacitance assembly 43 to damage for adjacent assemblies away from contiguous complex capacitance assembly 43.
In addition, the intensive connector combination 42,44 that is provided with other dissimilar functions of the edge regular meeting of general circuit plate 40,45,46,47, and when circuit board 40 is placed in casing 70 inside, can cover each connectors combination 42,44 by a cover plate 60,45,46,47, therefore, radiating module of the present utility model only need assemble two heat pipes 11 of different bending degrees, 22, the available space of promptly visual reality is arranged at two radiators 10,20 at the diverse location place of casing 70 walls, make up 42 tops and be positioned at connector, or be positioned at connector combination 45,46 tops, or be positioned at connector combination 46,47 tops etc., the elastification production with the casing 70 that cooperates different machines; Wherein:
This connector combination 42 can be the combination of DSUB connector;
This connector combination 44 can be the combination of PS2 connector;
This connector combination 45 can be the combination of IEEE 1394 connectors and USB connector;
This connector combination 46 can be the combination of LAN connector and USB connector;
This connector combination 47 can be the combination of Audio connector; And being provided with in proper order and type of functionality of above-mentioned each connector combination 42,44,45,46,47, slightly different according to actual demand, and this cover plate 60 has the corresponding with it slotted eye of majority.
Should be noted that, this conducting strip 30 further can in the surperficial contact position of metal-oxide semiconductor (MOS) (MOS) or complementary metal oxide semiconductors (CMOS) plural electronic building bricks 41 such as (CMOS), be provided with a heat conduction adhesive plaster (figure does not show), or coating heat conduction viscose, so that conducting strip 30 can be attached on the surface of plural electronic building brick 41 fully, and increase set and thermal contact conductance effect.
The front end face that should be noted that this two plurality of radiating fins 15,26 can be provided with heat conduction adhesive plaster (figure does not show), or coating heat conduction viscose, two plurality of radiating fins 15,26 can be attached on casing 70 walls fully, and increase set and thermal contact conductance effect.
See also Fig. 4, in a second embodiment, radiating module of the present utility model comprises: a conducting strip 30, first radiator 10, and second radiator 20 etc.; Wherein:
This conducting strip 30 is arranged on the circuit board 40, and contacts with the surface of metal-oxide semiconductor (MOS) (MOS) or complementary metal oxide semiconductors (CMOS) plural electronic building bricks 41 such as (CMOS);
This first radiator 10 is one to have the radiator (heat sink) of plurality of radiating fins 15, and runs through a heat pipe (heat pipe) 11 on the plurality of radiating fins 15, and an end of heat pipe (heat pipe) 11 is connected on this conducting strip 30;
This second radiator 20 is one to have the radiator (heat sink) of plurality of radiating fins 26, and runs through a heat pipe (heat pipe) 22 on the plurality of radiating fins 26, and an end of heat pipe (heat pipe) 24 is connected on this conducting strip 30;
And the front end face 10a of two radiators 10,20,20a are fixedly arranged on respectively on the wall of a casing 70;
By this, can be via conducting strip 30 and first and second radiator 10,20 high temperature that plural electronic building brick 41 time is produced in operation, be directed to casing 70 places of power circuit board 40 by dress, carry out the larger area heat radiation, this is to promote according to preferable enforcement example of the present utility model, and follows the suitable person who extends according to spirit of the present utility model, so must be included in the scope of the present utility model.
Should be noted that the front end face 10a of this two radiator 10,20,20a can be provided with heat conduction adhesive plaster (figure does not show), or coating heat conduction viscose, makes two radiators 10,20 front end face 10a, 20a can be attached on casing 70 walls fully, and increases set and thermal contact conductance effect.
Above said content and accompanying drawing only be preferable enforcement example of the present utility model, and all those skilled in the art make various variations and modification according to spirit of the present utility model, must be included in the protection range of the present utility model.
Claims (14)
1. an electronic building brick radiating module comprises a conducting strip, first radiator, reaches second radiator; It is characterized in that:
This conducting strip is arranged on the circuit board, and contacts with the electronic building brick surface of at least one desire heat radiation;
This first radiator is one to have the radiator of plurality of radiating fins, and runs through a heat pipe on the plurality of radiating fins, and an end of heat pipe is connected on this conducting strip;
This second radiator is one to have the radiator of plurality of radiating fins, and runs through a heat pipe on the plurality of radiating fins, and an end of heat pipe is connected on this conducting strip;
Two plurality of radiating fins are fixedly arranged on respectively on the wall of a casing.
2. electronic building brick radiating module as claimed in claim 1, wherein, the electronic building brick of this desire heat radiation is metal-oxide semiconductor (MOS) (MOS) or complementary metal oxide semiconductors (CMOS) (CMOS).
3. electronic building brick radiating module as claimed in claim 1, wherein, the contact position, electronic building brick surface of this conducting strip and desire heat radiation is provided with a heat conduction adhesive plaster.
4. electronic building brick radiating module as claimed in claim 1, wherein, contact position, the electronic building brick surface coating heat conduction viscose of this conducting strip and desire heat radiation.
5. electronic building brick radiating module as claimed in claim 1, wherein, the front end face of this two plurality of radiating fins is provided with the heat conduction adhesive plaster, and is attached on the casing wall.
6. electronic building brick radiating module as claimed in claim 1, wherein, the front end face of this two plurality of radiating fins coating heat conduction viscose, and be attached on the casing wall.
7. electronic building brick radiating module as claimed in claim 1, wherein, the intensive combination of DSUB connector, the combination of PS2 connector, IEEE 1394 and USB connector combination, LAN and the USB connector of being provided with in the edge of this circuit board makes up, reaches the combination of Audio connector; Circuit board is placed in casing when inner, covers each connector combination by a cover plate, has on the cover plate a plurality ofly to make up corresponding slotted eye with each connector.
8. an electronic building brick radiating module comprises a conducting strip, first radiator, reaches second radiator etc.; It is characterized in that:
This conducting strip is arranged on the circuit board, and contacts with the electronic building brick surface of at least one desire heat radiation;
This first radiator is one to have the radiator of plurality of radiating fins, and runs through a heat pipe on the plurality of radiating fins, and an end of heat pipe is connected on this conducting strip;
This second radiator is one to have the radiator of plurality of radiating fins, and runs through a heat pipe on the plurality of radiating fins, and an end of heat pipe is connected on this conducting strip;
And the front end face of two radiators is fixedly arranged on respectively on the wall of a casing.
9. electronic building brick radiating module as claimed in claim 8, wherein, the electronic building brick of this desire heat radiation is metal-oxide semiconductor (MOS) (MOS) or complementary metal oxide semiconductors (CMOS) (CMOS).
10. electronic building brick radiating module as claimed in claim 8, wherein, the contact position, electronic building brick surface of this conducting strip and desire heat radiation is provided with a heat conduction adhesive plaster.
11. electronic building brick radiating module as claimed in claim 8, wherein, contact position, the electronic building brick surface coating heat conduction viscose of this conducting strip and desire heat radiation.
12. electronic building brick radiating module as claimed in claim 8, wherein, the front end face of this two radiator is provided with the heat conduction adhesive plaster, and is attached on the casing wall.
13. electronic building brick radiating module as claimed in claim 8, wherein, the front end face of this two radiator coating heat conduction viscose, and be attached on the casing wall.
14. electronic building brick radiating module as claimed in claim 8, wherein, the intensive combination of DSUB connector, the combination of PS2 connector, IEEE 1394 and USB connector combination, LAN and the USB connector of being provided with in the edge of this circuit board makes up, reaches the combination of Audio connector; Circuit board is placed in casing when inner, covers each connector combination by a cover plate, has on the cover plate a plurality ofly to make up corresponding slotted eye with each connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320103479 CN2658940Y (en) | 2003-11-17 | 2003-11-17 | Electron assembly radiation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320103479 CN2658940Y (en) | 2003-11-17 | 2003-11-17 | Electron assembly radiation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2658940Y true CN2658940Y (en) | 2004-11-24 |
Family
ID=34340566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320103479 Expired - Fee Related CN2658940Y (en) | 2003-11-17 | 2003-11-17 | Electron assembly radiation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2658940Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008043206A1 (en) * | 2006-10-10 | 2008-04-17 | Jen-Shyan Chen | A semiconductor light-emitting module |
| US7880817B2 (en) | 2005-08-24 | 2011-02-01 | Sharp Kabushiki Kaisha | Receiver apparatus for outputting digital video and audio signals and receiver system incorporating the receiver apparatus |
| US7907218B2 (en) | 2005-11-07 | 2011-03-15 | Sharp Kabushiki Kaisha | Receiver apparatus and receiver system |
| US7932957B2 (en) | 2005-09-09 | 2011-04-26 | Sharp Kabushiki Kaisha | Receiver apparatus and receiver system |
| CN102122570A (en) * | 2010-12-31 | 2011-07-13 | 无锡富洪科技有限公司 | Super capacitor module |
| CN102548335A (en) * | 2010-12-09 | 2012-07-04 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| WO2018053871A1 (en) * | 2016-09-26 | 2018-03-29 | 深圳市大疆创新科技有限公司 | Heat dissipation mechanism, electronic governor provided with heat dissipation mechanism, and electronic device |
-
2003
- 2003-11-17 CN CN 200320103479 patent/CN2658940Y/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7880817B2 (en) | 2005-08-24 | 2011-02-01 | Sharp Kabushiki Kaisha | Receiver apparatus for outputting digital video and audio signals and receiver system incorporating the receiver apparatus |
| US7932957B2 (en) | 2005-09-09 | 2011-04-26 | Sharp Kabushiki Kaisha | Receiver apparatus and receiver system |
| US7907218B2 (en) | 2005-11-07 | 2011-03-15 | Sharp Kabushiki Kaisha | Receiver apparatus and receiver system |
| WO2008043206A1 (en) * | 2006-10-10 | 2008-04-17 | Jen-Shyan Chen | A semiconductor light-emitting module |
| EA013884B1 (en) * | 2006-10-10 | 2010-08-30 | Необульб Текнолоджиз Инк. | A semiconductor light-emitting module with heat isolation |
| US8193553B2 (en) | 2006-10-10 | 2012-06-05 | Neobulb Technologies, Inc. | Semiconductor high-power light-emitting module with heat isolation |
| CN102548335A (en) * | 2010-12-09 | 2012-07-04 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN102122570A (en) * | 2010-12-31 | 2011-07-13 | 无锡富洪科技有限公司 | Super capacitor module |
| WO2018053871A1 (en) * | 2016-09-26 | 2018-03-29 | 深圳市大疆创新科技有限公司 | Heat dissipation mechanism, electronic governor provided with heat dissipation mechanism, and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1783461A (en) | Flip chip ball grid array package assemblies and electronic devices with heat dissipation capability | |
| CN1832677A (en) | Electronic structure with water-proof and radiation structure | |
| CN102938971A (en) | Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof | |
| CN2658940Y (en) | Electron assembly radiation module | |
| CN1713808A (en) | Power component cooling device | |
| CN1896752A (en) | Antenna coupling tester | |
| CN1257442C (en) | Heat readiation system | |
| CN1897802A (en) | Electronic device with water-proof and heat radiation structure | |
| CN2659096Y (en) | Radiating module of electronic subassembly | |
| CN2781446Y (en) | Non-fan industrial computer structure with combined aluminium fin heat sink shell | |
| CN2658941Y (en) | Electron assembly radiation module | |
| CN2826919Y (en) | Thin type contact structure of heat radiation module | |
| CN1856239A (en) | Printing circuit board | |
| CN2671119Y (en) | Radiator | |
| CN1314111C (en) | Functional module with built-in radiating fin | |
| CN1681113A (en) | Hot-piping radiator | |
| CN2807478Y (en) | Radiation structure of micro computer | |
| CN101067756A (en) | Computer electric source | |
| CN2572599Y (en) | Water-proof and radiation structure for electronic device | |
| CN2888696Y (en) | Socket connector | |
| CN2731922Y (en) | Fan free electronic system having radiation modular | |
| CN1681112A (en) | Hot-piping radiator | |
| CN1819162A (en) | Chip-style radiating module and radiating method thereof | |
| CN2896608Y (en) | Socket connector | |
| CN2874614Y (en) | CPU radiator fixing structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |