CN2731922Y - Fan free electronic system having radiation modular - Google Patents
Fan free electronic system having radiation modular Download PDFInfo
- Publication number
- CN2731922Y CN2731922Y CN 200420084387 CN200420084387U CN2731922Y CN 2731922 Y CN2731922 Y CN 2731922Y CN 200420084387 CN200420084387 CN 200420084387 CN 200420084387 U CN200420084387 U CN 200420084387U CN 2731922 Y CN2731922 Y CN 2731922Y
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- electronic system
- heat carrier
- radiating module
- heat
- motherboard
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a fan free electronic system having radiation module, comprising a casing, a mainboard, at least one electronic component, and a radiation module. The electronic component is arranged on the first surface of the mainboard, and is electrically connected with one bus (the bus is a bus-bar, the bus-bar is called as the bus in the following)of the wiring board. The radiation module comprises a first heat conductor, a second heat conductor and a third heat conductor. The first heat conductor contacts the electronic components, and the first heat conductor is connected with the second heat conductor in heat conductivity by the third heat conductor. The radiation module can display excellent radiation effect in the electronic system without fans.
Description
Technical field
The utility model relates to a kind of electronic system and motherboard thereof, particularly relates to a kind of no fan electronic system and motherboard thereof with radiating module (module is a module, below all be called module).
Background technology
Nearly recent decades, the electronic technology speed of development is wondrous.Especially (IC) progressive on the process technique this makes the function fast rise of electronic component especially rapidly at integrated circuit (integrated circuit is an integrated circuit, below all be called integrated circuit), but cost descends fast.Though the processing speed and the function of integrated circuit significantly improve, caloric value is fast rise also, if can not effectively used heat be got rid of, electronic component just might lose efficacy.Add in recent years, the consumer is more and more high to light, thin, short, the little demand of electronic installation, has further increased the degree of difficulty of heat radiation.But the space that the electronic system after the miniaturization can be provided for dispelling the heat also reduces thereupon.And the consumer has also limited the use of fan for the requirement of low noise, also therefore carries out modularization, integration at heat radiation and do not have the design of fan day by day important.
See also shown in Figure 1ly, be existing known a kind of electronic system generalized section of not having fan.Existing known electronic system 100 comprises a casing 110, a motherboard 120, at least one electronic component 130 and a heating panel 140.Electronic component 130 is provided on the motherboard 120, and heating panel 140 then is configured on the electronic component 130.These electronic components 130 for example are CPU (CPU), memory body (memory), wafer set (chipset) or graphics processing unit (GPU) etc., and these electronic components 130 all can produce used heat when running.In order to remove the used heat that these electronic components 130 are produced, a heating panel 140 (material is copper or aluminium alloy) is placed on all electronic components 130, increase the area of dissipation of these electronic components 130 by heating panel 140.
Yet, the design of above-mentioned heating panel 140 has its intrinsic shortcoming, at first the height because of each electronic component 130 on the motherboard 120 differs, meaning is that some passive device 114 or other slot (not shown) are often higher with respect to the height of motherboard 120, so when design heating panel 140, in order to avoid passive device 114, the existing known frequent area of reduction heating panel 140 that needs is avoided structurally interfering with each other between passive device 114 and the heating panel 140, but also causes the radiating effect variation of the integral body of electronic system 100 because of the reduction of the area of heating panel 140.In addition, be subject to some non-heat radiation factors, for example electromagnetic interference, safety standard or appearance design etc., cause the perforate 112 that is formed on the casing 110 in order to heat radiation that restriction on its width is arranged, thereby reduce the inner space of casing 110 and the convection current ability of external environment, and then reduced the heat-sinking capability of electronic system 100.
This shows that above-mentioned existing no fan electronic system obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that no fan electronic system exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that above-mentioned existing no fan electronic system exists, the design people is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of creating a kind of no fan electronic system of new structure with radiating module, can improve general existing no fan electronic system, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the utility model that has practical value finally.
Summary of the invention
The purpose of this utility model is, overcome the defective that existing no fan electronic system exists, and a kind of new no fan electronic system with radiating module is provided, technical problem to be solved is to make its radiating module can be in no fan electronic system, the performance better heat radiating effect, thus be suitable for practicality more.
The purpose of this utility model and to solve its technical problem be to adopt following technical scheme to realize.According to the no fan electronic system with radiating module that the utility model proposes, it comprises: a casing; One motherboard is provided within this casing, and has a bus, a first surface and a corresponding second surface; At least one electronic component is provided in this first surface of this motherboard, and electrically connects this bus; And a radiating module, comprising: one first heat carrier is provided on this first surface of this motherboard, and contacts this electronic component; One second heat carrier is provided within this casing, and between this second surface and this casing of this motherboard; And one the 3rd heat carrier, this first heat carrier is connected to this second heat carrier with thermal conductivity.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid no fan electronic system with radiating module, the normal line vector of this first surface of wherein said motherboard are to be provided within this casing to be same as gravity direction substantially.
Aforesaid no fan electronic system with radiating module, the normal line vector of this first surface of wherein said motherboard is to be provided within this casing perpendicular to gravity direction substantially.
Aforesaid no fan electronic system with radiating module, wherein said first heat carrier is to be tabular.
Aforesaid no fan electronic system with radiating module, wherein said second heat carrier is to be tabular.
Aforesaid no fan electronic system with radiating module, wherein said the 3rd heat carrier is to be tubulose.
Aforesaid no fan electronic system with radiating module, wherein said radiating module more comprises at least one metal column, and this second heat carrier is via this metal short column, and be connected to this second surface of this motherboard with thermal conductivity.
Aforesaid no fan electronic system with radiating module, wherein said metal column more comprises the earth terminal that this second heat carrier is connected to electrically this bus of this motherboard.
Aforesaid no fan electronic system with radiating module, wherein said radiating module more comprises one first heat conduction interlayer, it is configured between this first heat carrier and this electronic component.
Aforesaid no fan electronic system with radiating module, wherein said radiating module more comprises one second heat conduction interlayer, it is configured between the inwall of this second heat carrier and this casing.
The utility model compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, in order to reach aforementioned goal of the invention, major technique of the present utility model thes contents are as follows:
The utility model proposes a kind of no fan electronic system, comprise a casing, a motherboard, at least one electronic component and a radiating module with radiating module.This motherboard is provided within the casing, and has a bus, a first surface and a corresponding second surface.Electronic component is provided in the first surface of motherboard, and connecting bus electrically.Radiating module comprises one first heat carrier, one second heat carrier and one the 3rd heat carrier.First heat carrier is provided on the first surface of motherboard, and the electronic component on the contact motherboard, second heat carrier is provided in the casing, and between the second surface and casing of motherboard, the 3rd heat carrier then is connected to second heat carrier with thermal conductivity with first heat carrier.
According to the described electronic system with radiating module of preferred embodiment of the present utility model, the normal line vector of the first surface of above-mentioned wiring board for example is to be same as substantially or to be provided within the casing perpendicular to gravity direction.
Based on above-mentioned, the utility model contacts with the electronic component that sets in the circuit board because of adopting first heat carrier with radiating module, and utilize the 3rd heat carrier that first heat carrier is connected with thermal conductivity with second heat carrier, second heat carrier then can directly contact or near the casing of electronic system, so the used heat that electronic component is produced conducts to the casing of electronic system via radiating module, utilize casing to dispel the heat again, so these electronic components can have maximum area of dissipation.The design of final radiating module of the present utility model can be in the electronic system of no fan, the performance better heat radiating effect.
Via as can be known above-mentioned, the utility model is the no fan electronic system that has radiating module about a kind of, and it comprises a casing, a motherboard, at least one electronic component and a radiating module.Electronic component is provided in a first surface of motherboard, and a bus of connection line plate electrically.Radiating module comprises one first heat carrier, one second heat carrier and one the 3rd heat carrier.First heat carrier and electronic component contact, and the 3rd heat carrier is in order to be connected to second heat carrier with thermal conductivity with first heat carrier.This radiating module can be in no fan electronic system, the performance better heat radiating effect.
By technique scheme, the no fan electronic system that the utlity model has radiating module has following advantage at least:
1, the utility model mainly via the casing of second heat carrier of radiating module and electronic system contact or near dispelling the heat, not only can increase the area of dissipation of electronic component, also be not subjected to simultaneously the restriction of openings in enclosure on width, and with other non-heat radiation factors, for example electromagnetic interference standard, safety standard or appearance design etc. are reduced to minimum.
2, compared to existing known electronic system, the utility model is to adopt two paths to dispel the heat, so the used heat that can get rid of electronic component effectively and produced makes electronic component can Yin Wendu not too high and lost efficacy.Therefore, radiating module of the present utility model can be in the electronic system of no fan, the performance better heat radiating effect.
3, in addition, if the allocation position of electronic component on the motherboard changes, first heat carrier that needs only radiating module redesigns, and then can change as for second heat carrier and the 3rd heat carrier of radiating module.Thus, can reduce the cost of radiating module in redesign and making.
In sum, the no fan electronic system with radiating module of the utility model special construction, it has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it structurally or bigger improvement all arranged on the function, have large improvement technically, and produced handy and practical effect, and more existing no fan electronic system has the multinomial effect of enhancement, thereby being suitable for practicality more, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, below especially exemplified by going out a plurality of preferred embodiments, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is existing known a kind of generalized section of not having the electronic system of fan.
Fig. 2 A is the generalized section of no fan electronic system of a kind of tool suspension type motherboard of one first embodiment of the present utility model.
Fig. 2 B is the generalized section of no fan electronic system of a kind of tool yaw formula motherboard of one second embodiment of the present utility model.
Fig. 3 is the generalized section of no fan electronic system of a kind of tool vertical type motherboard of one the 3rd embodiment of the present utility model.
Fig. 4 is the heat transferred flow chart of Fig. 2 A, Fig. 2 B and Fig. 3.
100: electronic system 110: casing
112: perforate 114: passive device
120: motherboard 130: electronic component
140: heating panel 200,300,400: electronic system
210,310: casing 220: motherboard
220a: first surface 230: electronic component
220b: second surface 240: radiating module
240a: the first heat carrier 240b: second heat carrier
240c: the 3rd heat carrier 240d: metal column
240e: the first heat conduction interlayer 240f: the second heat conduction interlayer
G: gravity N: normal line vector
Embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to according to no its embodiment of fan electronic system, structure, feature and the effect thereof that the utility model proposes with radiating module, describe in detail as after.
See also shown in Fig. 2 A, be the generalized section of the no fan electronic system of a kind of tool suspension type motherboard of one first embodiment of the present utility model.As shown in the figure, electronic system 200 comprises a casing 210, a motherboard 220 and radiating module 240.Radiating module 240 mainly comprises one first heat carrier 240a, one second heat carrier 240b and one the 3rd heat carrier 240c.In addition, the first heat carrier 240a and the second heat conductor 240b for example are tabulars, and the second heat carrier 240b comprises at least one metal column 240d, it contacts with the second surface 220b of motherboard 220, and conductivity be connected to the earth terminal of the bus (not shown) of motherboard 220, and the material of the first heat carrier 240a and the second heat conductor 240b for example is copper or aluminium alloy.
Shown in Fig. 2 A, the 3rd heat carrier 240c is mainly as the usefulness of the thermal conductivity connection between the first heat carrier 240a and the second heat carrier 240b, and the material of the 3rd heat carrier 240c also for example is copper or aluminium alloy, and the 3rd heat carrier 240c can be connected with the second heat carrier 240b with the first heat carrier 240a with the mode of welding or contact.And, the 3rd heat carrier 240c for example is the heat pipe (Heatpipe) that is commonly called as, so the shape of the 3rd heat carrier 240c for example is a tubulose, its internal structure can be porous material, when heat pipe is that inner air is taken out when making, make it keep vacuum state, and inject a little liquid (as water) to the heat pipe, utilize the phase change of liquid to carry out heat biography when making its action.
Shown in Fig. 2 A, in the present embodiment, motherboard 220 has at least one electronic component 230, and is provided with a bus (not shown).These electronic components 230 for example are a microprocessor, a CPU (CPU), a memory body (memory), a graphics processing unit (GPU), a wafer set (chipset) or an Application Specific Integrated Circuit (ASIC).
Shown in Fig. 2 A, in the present embodiment, radiating module 240 more can comprise one first heat conduction interlayer 240e and one second heat conduction interlayer 240f, wherein the first heat conduction interlayer 240e disposes between the first heat carrier 240a and electronic component 230, and the second heat conduction interlayer 240f then disposes between the second heat carrier 240b and casing 210.Because the surface of each element (for example casing 210, electronic component 230, the first heat carrier 240a and the second heat carrier 240b) of electronic system 200 is not level and smooth fully, but has roughness (roughness), so having the sightless space of naked eyes (void), the place of the surperficial joint of each element exists, these spaces can pass heat causes obstruction, this obstruction to be called contact heat resistance (contact resistance).Therefore, the main function of heat conduction interlayer 240e and 240f is to reduce effectively contact heat resistance, and its material for example is the polymolecular material.
Please consult Fig. 2 A again, the no fan electronic system 200 of first embodiment, via experimental measurements, its maximum temperature approximately uses the no fan electronic system of existing known heating panel (for example made by aluminium alloy) to hang down 33 ℃.
See also shown in Fig. 2 B, be the generalized section of the no fan electronic system of a kind of tool yaw formula motherboard of one second embodiment of the present utility model.As shown in the figure, member that this electronic system 300 is had and configuration are all identical with the described embodiment of Fig. 2 A, both differences are in the radiating module 240 of the embodiment that is illustrated in Fig. 2 A, it is the first half that is provided in electronic system 200, makes that the normal line vector N of first surface 220a of motherboard 220 is identical in fact with gravity g direction.Yet, the radiating module 240 of the embodiment that Fig. 2 B is illustrated, it is the Lower Half that is provided in electronic system 300, makes the normal line vector N of first surface 220a of motherboard 220 with opposite shown in Fig. 2 A.
Please consult Fig. 2 B again, the no fan electronic system 300 of second embodiment, via experimental measurements, its maximum temperature approximately uses the no fan electronic system of existing known heating panel (for example made by aluminium alloy) to hang down 25 ℃.
See also shown in Figure 3ly, be the generalized section of the no fan electronic system of a kind of tool vertical type motherboard of one the 3rd embodiment of the present utility model.Please consult Fig. 2 A and Fig. 3 simultaneously, member that this electronic system 400 is had and configuration are all identical with the described embodiment of Fig. 2 A, both differences are in the radiating module 240 of the embodiment that is illustrated in Fig. 2 A, it is the first half that is provided in electronic system 200, makes that the normal line vector N of first surface 220a of motherboard 220 is identical in fact with gravity g direction.Yet the radiating module 240 of the embodiment that Fig. 3 illustrated is to be provided on the sidewall of electronic system, and the normal line vector N of the first surface 220a of motherboard 220 and gravity g direction are orthogonal in fact.
It should be noted that, as Fig. 2 A, Fig. 2 B and shown in Figure 3, the first heat carrier 240a is except can be a monolithic piece, it also can be made of the original a plurality of fin (not shown) of individual configuration on these electronic components 230, and contacts with one or more the 3rd heat carrier 240c respectively.Shown in Fig. 2 A, when electronic system 200 is during for the desktop electronic installation, the exterior bottom wall of the casing 210 of electronic system 200 can have a plurality of foot pad (not shown), and it directly contacts desktop or ground in order to avoid casing.In like manner, the exterior bottom wall of the casing 310 of Fig. 3 also can have a plurality of foot pad (not shown).
See also shown in Figure 4ly, it is the heat transferred flow chart of the electronic system of Fig. 2 A, Fig. 2 B and Fig. 3.The used heat that these electronic components 230 are produced is mainly via two path to the second heat carrier 240b.At first, first kind of path is that heat energy is passed to the first heat carrier 240a via the first heat conduction interlayer 240e, again via thermal energy transfer to the second heat carrier 240b of the 3rd heat carrier 240c with the first heat carrier 240a.In addition, second path is the interior metal circuit that heat energy is passed to motherboard 220 earlier, reaches the second heat carrier 240b via metal column 240d again.And, being passed to the heat energy of the second heat carrier 240b via two paths, it is passed to casing 210 and 310 via the second heat conduction interlayer 240f, and the heat energy that is passed to casing 210 and 310 at last is then by free convection and radiation and reach external environment.
In sum, the utility model mainly via the casing of second heat carrier of radiating module and electronic system contact or near dispelling the heat, not only can increase the area of dissipation of electronic component, also be not subjected to simultaneously the restriction of openings in enclosure on width, and with other non-heat radiation factors, for example electromagnetic interference standard, safety standard or appearance design etc. are reduced to minimum.Compared to existing known electronic system, the utility model is to adopt two paths to dispel the heat, so the used heat that can get rid of electronic component effectively and produced makes electronic component can Yin Wendu not too high and lost efficacy.Therefore, radiating module of the present utility model can be in the electronic system of no fan, the performance better heat radiating effect.In addition, if the allocation position of electronic component on the motherboard changes, first heat carrier that needs only radiating module redesigns, and then can change as for second heat carrier and the 3rd heat carrier of radiating module.Thus, can reduce the cost of radiating module in redesign and making.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art, in the scope that does not break away from technical solutions of the utility model, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solutions of the utility model content, foundation technical spirit of the present utility model is to above any simple modification that embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (10)
1, a kind of no fan electronic system with radiating module is characterized in that it comprises:
One casing;
One motherboard is provided within this casing, and has a bus, a first surface and a corresponding second surface;
At least one electronic component is provided in this first surface of this motherboard, and electrically connects this bus; And
One radiating module comprises:
One first heat carrier is provided on this first surface of this motherboard, and contacts this electronic component;
One second heat carrier is provided within this casing, and between this second surface and this casing of this motherboard; And
One the 3rd heat carrier is connected to this second heat carrier with thermal conductivity with this first heat carrier.
2, the no fan electronic system with radiating module according to claim 1, the normal line vector that it is characterized in that this first surface of wherein said motherboard is to be provided within this casing to be same as gravity direction substantially.
3, the no fan electronic system with radiating module according to claim 1, the normal line vector that it is characterized in that this first surface of wherein said motherboard is to be provided within this casing perpendicular to gravity direction substantially.
4, the no fan electronic system with radiating module according to claim 1 is characterized in that wherein said first heat carrier is to be tabular.
5, the no fan electronic system with radiating module according to claim 1 is characterized in that wherein said second heat carrier is to be tabular.
6, the no fan electronic system with radiating module according to claim 1 is characterized in that wherein said the 3rd heat carrier is to be tubulose.
7, the no fan electronic system with radiating module according to claim 1, it is characterized in that wherein said radiating module more comprises at least one metal column, and this second heat carrier is via this metal short column, and is connected to this second surface of this motherboard with thermal conductivity.
8, the no fan electronic system with radiating module according to claim 7 is characterized in that wherein said metal column more comprises the earth terminal that this second heat carrier is connected to electrically this bus of this motherboard.
9, the no fan electronic system with radiating module according to claim 1 is characterized in that wherein said radiating module more comprises one first heat conduction interlayer, and it is configured between this first heat carrier and this electronic component.
10, the no fan electronic system with radiating module according to claim 1 is characterized in that wherein said radiating module more comprises one second heat conduction interlayer, and it is configured between the inwall of this second heat carrier and this casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420084387 CN2731922Y (en) | 2004-08-11 | 2004-08-11 | Fan free electronic system having radiation modular |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420084387 CN2731922Y (en) | 2004-08-11 | 2004-08-11 | Fan free electronic system having radiation modular |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2731922Y true CN2731922Y (en) | 2005-10-05 |
Family
ID=35052234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420084387 Expired - Lifetime CN2731922Y (en) | 2004-08-11 | 2004-08-11 | Fan free electronic system having radiation modular |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2731922Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104981134A (en) * | 2015-07-14 | 2015-10-14 | 广东欧珀移动通信有限公司 | Electronic device |
| CN106325444A (en) * | 2015-07-01 | 2017-01-11 | 技嘉科技股份有限公司 | Fanless computer system and mainboard |
| CN111434199A (en) * | 2017-12-07 | 2020-07-17 | 西门子交通有限公司 | Fanless cooling system |
-
2004
- 2004-08-11 CN CN 200420084387 patent/CN2731922Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106325444A (en) * | 2015-07-01 | 2017-01-11 | 技嘉科技股份有限公司 | Fanless computer system and mainboard |
| CN104981134A (en) * | 2015-07-14 | 2015-10-14 | 广东欧珀移动通信有限公司 | Electronic device |
| CN111434199A (en) * | 2017-12-07 | 2020-07-17 | 西门子交通有限公司 | Fanless cooling system |
| US11678463B2 (en) | 2017-12-07 | 2023-06-13 | Siemens Mobility GmbH | Fanless cooling system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20140811 Granted publication date: 20051005 |