JP2009164615A - Memory heat-dissipating structure - Google Patents

Memory heat-dissipating structure Download PDF

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JP2009164615A
JP2009164615A JP2009000649A JP2009000649A JP2009164615A JP 2009164615 A JP2009164615 A JP 2009164615A JP 2009000649 A JP2009000649 A JP 2009000649A JP 2009000649 A JP2009000649 A JP 2009000649A JP 2009164615 A JP2009164615 A JP 2009164615A
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memory
heat
radiator
heat dissipation
dissipation structure
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Jui-Nan Lin
林瑞男
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Walton Advanced Engineering Inc
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a memory heat-dissipating structure being capable of dissipating the heat of a memory module and not shortening the distance between the left-right sides of the adjacent memory modules. <P>SOLUTION: The memory heat-dissipating structure is composed of two or more of memory elements, a radiator 20 and a plurality of screw elements 30. Each memory element includes two mutually assembled heat-dissipating sheets and a memory module 12 held between the two sheets. Screw holes are formed to the heat-dissipating sheets for each memory element, and the radiator contains base sections, heat-dissipating column bodies extended from a plurality of the base sections and long tanks penetrating a plurality of the base sections. The screw holes corresponding to each memory element are formed to each long tank, and the upper end faces of the heat-dissipating sheets for each memory element are brought into contact with the bottom end faces of the base sections of the radiator. The screw elements penetrate the long tanks for the radiator respectively, and screwed to the screwing holes for the corresponding memory elements and fixed to the radiator. According to the structure, the heat dissipation of the memory modules are achieved. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、メモリ放熱構造に関し、特に、メモリモジュールを放熱する目的を達成でき、隣り合うメモリモジュールの左右両側の距離を縮小しないメモリ放熱構造に関する。 The present invention relates to a memory heat dissipation structure, and more particularly to a memory heat dissipation structure that can achieve the purpose of dissipating memory modules and does not reduce the distance between the left and right sides of adjacent memory modules.

コンピュータ科技は、演算機能の強化やより速い方向へ発展され、また、コンピュータの関係領域も、高速や高周波数の方向へ向って発展し、それとともに、メインボート上のチッププロセッサ［ＣＰＵ］は、放熱装置により放熱され、メモリモジュールも、記憶容量が大きくなり、また、チッププロセッサの演算により、高速で演算する状態になり、そのため、メモリモジュールからの熱源により、温度が持続的に高くなって、その実行効率に悪影響を与え、また、熱エネルギーが、有効に排出されないと、メモリモジュールの機能が故障になる恐れがある。 Computer technology has been developed in the direction of enhanced computing functions and faster speeds, and related areas of computers have also been developed in the direction of high speeds and high frequencies. At the same time, the chip processor [CPU] on the main boat is Heat is dissipated by the heat dissipating device, the memory module also has a large storage capacity, and it is in a state of high-speed operation by the calculation of the chip processor, so the temperature is continuously increased by the heat source from the memory module, If the execution efficiency is adversely affected and the heat energy is not effectively discharged, the function of the memory module may be damaged.

上記メモリモジュールによる熱源問題を解消するため、業者によれば、空冷式放熱装置や水冷式放熱装置を利用して、メモリモジュールの熱源を排除し、例えば、台湾実用新案Ｍ３２３０６６号［出願番号：０９６２０９２６５］に、モジュール化された水冷放熱装置が掲示され、それによれば、メインボートに固定された発熱素子［例えば、メモリモジュール］において、固定フレームに、出入水管を有する水ポンプや、出入水管、水ポンプや出入水管に連通された各水管、或いは、放熱モジュールに接続される連通管を接続することにより、メモリモジュールを放熱する目的が達成される。     In order to eliminate the heat source problem caused by the memory module, according to a contractor, the heat source of the memory module is eliminated by using an air-cooled heat radiating device or a water-cooled heat radiating device, for example, Taiwan Utility Model No. M323066 [Application No. 096209265. ], A modularized water-cooling heat dissipation device is posted. According to this, in a heating element [for example, a memory module] fixed to a main boat, a water pump having an inlet / outlet pipe on a fixed frame, an inlet / outlet pipe, The purpose of radiating heat from the memory module is achieved by connecting each water pipe connected to the pump and the water inlet / outlet pipe or a communication pipe connected to the heat radiating module.

上記によれば、放熱の目的が達成されるが、全体として、体積が大きいという欠点があり、コンピュータ内の空間が大きく占用されて、内部に他の電子素子を配置することが困難になる。 According to the above, the purpose of heat dissipation is achieved, but there is a drawback that the overall volume is large, and the space in the computer is greatly occupied, making it difficult to arrange other electronic elements inside.

水冷式放熱装置が、内部空間を大きく占用する欠点を解消するため、ある業者が、上記空冷式放熱装置を利用し、例えば、台湾実用新案Ｍ３２１１１８［出願番号：０９５２２０５１９］に掲示されたメモリモジュールの放熱装置は、メモリモジュールの左右両側において、枠に固定された複数の放熱シートを固定し、また、放熱シートの基座が、メモリモジュールに接することにより、基座から起立してメモリモジュールに離れた横方向に伸びる複数のフィンが設けられ、これにより、空冷式で、メモリモジュールの放熱目的が実現される。 In order to eliminate the disadvantage that the water-cooled heat radiating device occupies the internal space, a contractor uses the air-cooled heat radiating device described above. For example, the memory module disclosed in the Taiwan utility model M321118 The heat dissipating device fixes a plurality of heat dissipating sheets fixed to the frame on both the left and right sides of the memory module, and the base of the heat dissipating sheet comes into contact with the memory module to stand up from the base and separate from the memory module. In addition, a plurality of fins extending in the lateral direction are provided, and thereby, the purpose of heat dissipation of the memory module is realized by air cooling.

しかしながら、一般として、メインボートの設計は、合計四つのメモリモジュールが挿設可能であり、その隣り合う距離は、上記メインボートメーカにより、所定の距離規格があり、上記考案によれば、メモリモジュールの左右両側にある放熱シートの横方向に、複数のフィンが伸び、実用上では、フィンは、所定の延伸距離を有するため、メインボート上において、左右に隣り合うメモリモジュールの空間が占用される。そのため、上記考案の放熱装置の設計は、一般として、メインボートに、一つや二つのメモリモジュールだけが挿設可能で、三つ目以上のメモリモジュールを挿設不可になり、また、異なる規格であるメインボートを利用する場合、一つだけのメモリモジュールを挿設可能であり、上記の放熱装置によれば、放熱の目的を達成できても、空間を大きく占用する欠点がある。     However, in general, the design of the main boat is such that a total of four memory modules can be inserted, and the adjacent distance is determined by the main boat manufacturer according to a predetermined distance standard. A plurality of fins extend in the lateral direction of the heat dissipating sheet on both the left and right sides, and in practice, since the fins have a predetermined extension distance, the space of the memory modules adjacent to the left and right is occupied on the main boat. . For this reason, the design of the heat dissipation device of the above device generally allows only one or two memory modules to be inserted into the main boat, making it impossible to insert the third or more memory modules. When a certain main boat is used, only one memory module can be inserted. According to the above heat dissipation device, there is a drawback that a large space is occupied even if the purpose of heat dissipation can be achieved.

本発明者は、上記欠点を解消するため、慎重に研究し、また、学理を活用して、有効に上記欠点を解消でき、設計が合理である本発明を提案する。     The present inventor proposes the present invention in which the above-mentioned drawbacks are solved by careful research, and the above-mentioned drawbacks can be effectively eliminated by utilizing science, and the design is rational.

本発明の目的は、メモリモジュールを放熱でき、隣り合うメモリモジュールの左右両側の距離を縮小しないメモリ放熱構造を提供する。 An object of the present invention is to provide a memory heat dissipation structure that can dissipate heat from a memory module and does not reduce the distance between the left and right sides of adjacent memory modules.

本発明は、上記の目的を達成するため、メモリ放熱構造を提供し、間を置いて並列に設置され、各メモリ素子に、二つの互いに組立てられた放熱シートと上記二つのシートに挟まれるメモリモジュールとが備えられ、各メモリ素子の放熱シートに、螺着孔が設けられる二つ以上のメモリ素子と、上記らのメモリ素子に実装され、基部と複数の上記基部の上端面から伸びる放熱柱体及び複数の上記基部に貫穿される長尺槽が備えられ、各長尺槽が、各メモリ素子の螺着孔に対応し、各メモリ素子の放熱シートの上端面が、上記放熱器の基部の底端面に接する放熱器と、それぞれに上記放熱器の長尺槽に貫設されて、対応するメモリ素子の螺着孔に螺着される複数の螺着素子と、が含有される。 In order to achieve the above-mentioned object, the present invention provides a memory heat dissipation structure, and is arranged in parallel with a gap between each other. Each memory element has two heat dissipating sheets assembled together and a memory sandwiched between the two sheets. Two or more memory elements provided with screw holes in the heat dissipation sheet of each memory element, and a heat dissipation column mounted on the memory element and extending from the upper end surface of the base and the plurality of bases A long tank penetrating the body and the plurality of bases, each long tank corresponds to a screw hole of each memory element, and the upper end surface of the heat dissipation sheet of each memory element is the base of the radiator And a plurality of screwing elements that are respectively inserted through the long tanks of the heatsink and screwed into the screwing holes of the corresponding memory elements.

本発明によれば、次の利点が得られ、二つ以上の並列に設置されたメモリ素子の上方に、放熱柱体を有する放熱器が実装され、メモリ素子の上方空間を利用して、メモリモジュールに対して、空冷式で放熱する目的を達成でき、従来と比べると、本発明は、隣り合うメモリモジュールの左右両側の距離を縮小することなく、異なる規格であるメインボートにでき、そして、ユーザの需要に応じて、四つのメモリモジュールを挿設することができる。 According to the present invention, the following advantages can be obtained, and a heat radiator having a heat radiating column is mounted above two or more memory elements installed in parallel. The module can achieve the purpose of radiating heat by air cooling, compared to the conventional, the present invention can be a main boat that is a different standard without reducing the distance between the left and right sides of adjacent memory modules, and Four memory modules can be inserted according to user demand.

また、放熱器に、長尺槽が設計されることにより、放熱器には、調整変位の機能が実現され、簡単にメモリ素子の螺着孔に合わせ、そのため、本発明は、異なる規格であるメインボートにも適用できる。 In addition, by designing a long tank for the radiator, the radiator is provided with a function of adjustment displacement, and can easily be adjusted to the screw hole of the memory element, so that the present invention is a different standard. Applicable to main boats.

以下、図面を参照しながら、本発明の特徴や技術内容について、詳しく説明するが、それらの図面等は、参考や説明のためであり、本発明は、それによって制限されることが無い。 Hereinafter, the features and technical contents of the present invention will be described in detail with reference to the drawings. However, the drawings and the like are for reference and explanation, and the present invention is not limited thereby.

図１を参照しながら、本発明は、二つ以上のメモリ素子１０と放熱器２０及び複数の螺着素子３０が備えられるメモリ放熱構造を提供する。 Referring to FIG. 1, the present invention provides a memory heat dissipation structure including two or more memory elements 10, a radiator 20, and a plurality of screw elements 30.

各メモリ素子１０は、二つの互に組立てられる放熱シート１１と二つの放熱シート１１の間に位置するメモリモジュール１２が備えられる。二つの放熱シート１１は、対応する構造からなり、互いに係合されることによりなり、或いは、一大一小の設計で、螺着により互いに組立てられることによりなってよく、本発明は、それによって制限されることなく、また、本発明において、二つの放熱シート１１で、メモリモジュール１２のメモリチップ１２１を接するように挟み持つことにより、発生された熱源が、放熱シート１１に伝達される。その中、各メモリ素子１０の放熱シート１１の上端面に、複数のねじ孔である螺着孔１１１が形成される。 Each memory element 10 includes two heat dissipating sheets 11 assembled together and a memory module 12 positioned between the two heat dissipating sheets 11. The two heat-dissipating sheets 11 may have corresponding structures and may be engaged with each other, or may be assembled together by screwing in one big or one small design. Without being limited, in the present invention, the generated heat source is transmitted to the heat dissipation sheet 11 by holding the memory chip 121 of the memory module 12 in contact with the two heat dissipation sheets 11. Among them, screw holes 111 which are a plurality of screw holes are formed on the upper end surface of the heat dissipation sheet 11 of each memory element 10.

放熱器２０は、放熱効果を発揮できる金属部品からなり、板体状の基部２１と複数の放熱柱体２２及び複数の長尺槽２３からなり、各放熱柱体２２は、基部２１の上端面から上へ伸びるように形成され、長尺槽２３は、基部２１の上底端面に貫通するように間隔設置され、二つがある。 The radiator 20 is made of a metal part capable of exhibiting a heat dissipation effect, and includes a plate-like base portion 21, a plurality of heat radiating column bodies 22, and a plurality of long tanks 23. The long tank 23 is provided so as to penetrate the upper bottom end surface of the base portion 21 and has two types.

各螺着素子３０は、ボルトであり、その数は、メモリ素子１０の螺着孔１１１の数に対応し、各螺着素子３０には、ねじ部３１がある。 Each screwing element 30 is a bolt, the number of which corresponds to the number of screwing holes 111 of the memory element 10, and each screwing element 30 has a threaded portion 31.

組立てる時、図１と２のように、二つのメモリ素子１０を例とすれば、各メモリ素子１０のメモリモジュール１２が、一つのコンピュータ装置に対応するメインボート６０の一つの電気コネクタ６１に挿設され、並列に間隔設置された各メモリモジュール１２のゴールドフィンガー１２２が、対応する電気コネクタ６１に挿設されることにより、各メモリモジュール１２が、メインボート６０と、電気的に接続される。 When assembling, as shown in FIGS. 1 and 2, taking two memory devices 10 as an example, the memory module 12 of each memory device 10 is inserted into one electrical connector 61 of the main boat 60 corresponding to one computer device. The memory modules 12 are electrically connected to the main boat 60 by inserting the gold fingers 122 of the memory modules 12 that are installed and spaced apart in parallel into the corresponding electrical connectors 61.

放熱器２０は、上記二つのメモリ素子１０に実装され、各メモリ素子１０の放熱シート１１が有する上端面が、放熱器２０の基部２１の底端面に接し、これにより、メモリモジュール１２により生成された熱源が、放熱シート１１を介して、放熱器２０に伝達され、同時に、放熱器２０の各長尺槽２３が、各メモリ素子１０の螺着孔１１１に対応する。 The heat radiator 20 is mounted on the two memory elements 10, and the upper end surface of the heat dissipating sheet 11 of each memory element 10 is in contact with the bottom end surface of the base 21 of the heat dissipator 20, thereby being generated by the memory module 12. The heat source is transmitted to the heat radiator 20 via the heat radiating sheet 11, and at the same time, each long tank 23 of the heat radiator 20 corresponds to the screw hole 111 of each memory element 10.

螺着素子３０は、それぞれ、放熱器２０の長尺槽２３に貫設されて、対応するメモリ素子１０の螺着孔１１１に螺着され、各螺着素子３０のねじ部３１が、対応する長尺槽２３に貫設されることにより、螺着孔１１１に螺着され、これにより、放熱器２０が、二つのメモリ素子１０に固定される。 The screwing elements 30 are respectively inserted into the long tanks 23 of the radiator 20 and screwed into the screwing holes 111 of the corresponding memory elements 10. The screw portions 31 of the screwing elements 30 correspond to the screwing elements 30. By being provided in the long tank 23, it is screwed into the screw hole 111, whereby the radiator 20 is fixed to the two memory elements 10.

また、図３のように、本実施例において、メインボート６０の設計によれば、四つのメモリ素子１０が挿設可能である。本発明に係る放熱器２０は、四つのメモリ素子１０に接触できる。また、各螺着素子３０のねじ部３１は、弾性素子４１とワッシャ４２が嵌設され、弾性素子４１が、圧縮スプリングであり、各弾性素子４１の両端が、螺着素子３０やワッシャ４２に抵当して、ワッシャ４２が、放熱器２０の基部２１の上端面に接触するようになり、また、弾性素子４１の両端に、それぞれ、二つのワッシャ４２を嵌設し、弾性素子４１の両端で、弾性的に二つのワッシャ４２に抵当して、その一つのワッシャ４２が、放熱器２０の基部２１の上端面に接触でき、螺着素子３０のねじ部３１が、メモリ素子１０の螺着孔１１１に螺着されることにより、弾性素子４１を圧縮してワッシャ４２を
放熱器２０に抵当させ、これにより、より安定に放熱器２０に固定される。 Further, as shown in FIG. 3, according to the present embodiment, according to the design of the main boat 60, four memory elements 10 can be inserted. The heat radiator 20 according to the present invention can contact the four memory elements 10. The threaded portion 31 of each screw element 30 has an elastic element 41 and a washer 42 fitted therein, the elastic element 41 is a compression spring, and both ends of each elastic element 41 are connected to the screw element 30 and the washer 42. At the same time, the washer 42 comes into contact with the upper end surface of the base portion 21 of the radiator 20, and two washers 42 are fitted on both ends of the elastic element 41, respectively. The two washers 42 are elastically brought into contact with each other so that the one washer 42 can come into contact with the upper end surface of the base 21 of the radiator 20, and the screw portion 31 of the screw element 30 is connected to the screw hole of the memory element 10. By being screwed to 111, the elastic element 41 is compressed and the washer 42 is brought into contact with the radiator 20, thereby being more stably fixed to the radiator 20.

また、メモリ素子１０は、異なる規格であるメインボート６０に挿設可能で、各メインボート６０上の電気コネクタ６１の距離が異なるため、本発明は、長尺槽２３の設計により、簡単にメモリ素子１０の螺着孔１１１に合わせることができ、そのため、螺着素子３０が、より確実に螺着孔１１１にロックされて放熱器２０が定位され、即ち、長尺槽２３により、放熱器２０を変位させて調整することができる。     Further, since the memory element 10 can be inserted into the main boats 60 having different standards and the distances of the electrical connectors 61 on the main boats 60 are different, the memory device 10 can be easily stored by the design of the long tank 23. The screw 10 can be aligned with the screw hole 111 of the element 10. Therefore, the screw element 30 is more securely locked to the screw hole 111 and the radiator 20 is positioned. Can be adjusted by displacing.

また、図４のように、放熱器２０の放熱柱体２２は、少なくとも、一つの放熱ファン５０がロックされて、ロック素子５２が、放熱ファン５０の四辺端にある貫通孔５１に貫設されることにより、上記放熱器２０の放熱柱体２２の間に、隙間があるように、固定され、放熱柱体２２の設計によれば、簡単に放熱ファン５０をロックする目的が実弁される。 Further, as shown in FIG. 4, at least one heat radiating fan 50 is locked in the heat radiating column body 22 of the radiator 20, and a lock element 52 is provided through the through holes 51 at the four side ends of the heat radiating fan 50. Thus, the heat radiating body 20 is fixed so that there is a gap between the heat radiating column bodies 22, and according to the design of the heat radiating column body 22, the purpose of easily locking the heat radiating fan 50 is realized. .

以上の説明のように、本発明によれば、二つ以上の並排に設置されたメモリ素子１０の上方に、放熱柱体２２を有する放熱器２０を実装することにより、メモリ素子１０の上方空間を利用して、空冷式で、メモリモジュール１２を放熱する目的が達成され、従来と比べると、本発明は、隣り合うメモリモジュール１２の左右両側の距離を縮小しなくても、任意の異なる規格であるメインボート６０に適用でき、そのため、ユーザの需要に応じて、四つのメモリモジュール１２が挿設可能である。 As described above, according to the present invention, by mounting the heat radiator 20 having the heat radiating column body 22 above the memory elements 10 installed in two or more parallel drains, the upper space of the memory element 10 can be obtained. The purpose of radiating the memory module 12 by using the air cooling method is achieved, and compared with the conventional case, the present invention can be applied to any different standard without reducing the distance between the left and right sides of the adjacent memory modules 12. Therefore, the four memory modules 12 can be inserted according to the user's demand.

また、放熱器２０は、長尺槽２３の設計により、変位調整の機能が実現され、簡単に、メモリ素子１０の螺着孔１１１に合わせることができ、そのため、本発明は、異なる規格であるメインボート６０に適用できる。 Further, the radiator 20 has a function of adjusting the displacement by the design of the long tank 23, and can be easily adjusted to the screw hole 111 of the memory element 10. Therefore, the present invention is a different standard. Applicable to the main boat 60.

また、放熱器２０は、複数の放熱柱体２２が設けられるため、ファン５０が、簡単に、放熱器２０にロックされ、従来のフィン放熱と比べると、従来において、放熱ファンをフィンの上方にロックすることが容易ではない欠点を解消できる。 Moreover, since the heat radiator 20 is provided with a plurality of heat radiating pillars 22, the fan 50 is easily locked to the heat radiator 20, and compared with the conventional fin heat radiation, the heat radiation fan is conventionally located above the fin. The disadvantage that it is not easy to lock can be solved.

以上は、ただ、本発明のより良い実施例であり、本発明は、それによって制限されることが無く、本発明に係わる特許請求の範囲や明細書の内容に基づいて行った等価の変更や修正は、全てが、本発明の特許請求の範囲内に含まれる。 The above is merely a better embodiment of the present invention, and the present invention is not limited thereby. All modifications are within the scope of the claims of the present invention.

本発明の立体分解図Three-dimensional exploded view of the present invention 本発明がメインボートに組立てられる時の立体組立て図3D assembly diagram when the present invention is assembled to the main boat 本発明の他の実施例がメインボートに組立てられる時の立体分解図Three-dimensional exploded view when another embodiment of the present invention is assembled to a main boat 本発明に放熱ファンが組立てられる時の立体組立て図Three-dimensional assembly diagram when the heat dissipation fan is assembled in the present invention

１０ メモリ装置
１１ 放熱シート
１１１ 螺着孔
１２ メモリモジュール
１２１ メモリチップ
１２２ ゴールドフィンガー
２０ 放熱器
２１ 基部
２２ 放熱柱体
２３ 長尺槽
３０ 螺着素子
３１ ねじ部
４１ 弾性素子
４２ ワッシャ
５０ 放熱ファン
５１ 貫通孔
５２ ロック素子
６０ メインボート
６１ 電気コネクタ DESCRIPTION OF SYMBOLS 10 Memory apparatus 11 Heat radiation sheet 111 Screw hole 12 Memory module 121 Memory chip 122 Gold finger 20 Radiator 21 Base 22 Radiation column 23 Long tank 30 Screw element 31 Screw part 41 Elastic element 42 Washer 50 Heat radiation fan 51 Through-hole 52 Locking element 60 Main boat 61 Electrical connector

Claims (10)

間を置いて並列に設置され、各メモリ素子に、二つの互いに組立てられた放熱シートと上記二つのシートに挟まれるメモリモジュールとが備えられ、各メモリ素子の放熱シートに、螺着孔が設けられる二つ以上のメモリ素子と、
上記らのメモリ素子に実装され、基部と複数の上記基部の上端面から伸びる放熱柱体及び複数の上記基部に貫穿される長尺槽が備えられ、各長尺槽が、各メモリ素子の螺着孔に対応し、各メモリ素子の放熱シートの上端面が、上記放熱器の基部の底端面に接する放熱器と、
それぞれに上記放熱器の長尺槽に貫設されて、対応するメモリ素子の螺着孔に螺着される複数の螺着素子と、
が含有される、
ことを特徴とするメモリ放熱構造。 The memory elements are provided in parallel with each other, and each memory element is provided with two heat dissipating sheets assembled together and a memory module sandwiched between the two sheets, and the heat dissipating sheet of each memory element is provided with a screw hole. Two or more memory elements,
And a heat radiating column extending from the upper end surface of the base and the plurality of bases, and a long tank penetrating through the plurality of bases. Each long tank is screwed into each memory element. Corresponding to the hole, a heatsink in which the top surface of the heatsink sheet of each memory element is in contact with the bottom end surface of the base of the heatsink,
A plurality of screwing elements each inserted through the long tank of the radiator and screwed into a screwing hole of a corresponding memory element;
Contains,
A memory heat dissipation structure characterized by that. 各メモリ素子のメモリモジュールは、メインボート上の電気コネクタに挿設されるものであることを特徴とする請求項１に記載のメモリ放熱構造。 The memory heat dissipation structure according to claim 1, wherein the memory module of each memory element is inserted into an electrical connector on the main boat. 各螺着素子は、ねじ部を有し、各ねじ部が、対応する長尺槽に貫設されて上記螺着孔に螺着されることを特徴とする請求項２に記載のメモリ放熱構造。 3. The memory heat dissipation structure according to claim 2, wherein each screw element has a screw portion, and each screw portion is inserted into a corresponding long tank and screwed into the screw hole. . 各ねじ部に、弾性素子とワッシャが嵌設され、上記弾性素子の両端が、上記螺着素子と上記ワッシャに抵当して、上記ワッシャが、上記放熱器の基部の上端面に接することを特徴とする請求項３に記載のメモリ放熱構造。 An elastic element and a washer are fitted in each threaded portion, both ends of the elastic element abut against the screwed element and the washer, and the washer contacts the upper end surface of the base of the radiator. The memory heat dissipation structure according to claim 3. 各螺着素子は、ボルトであり、上記弾性素子は、圧縮スプリングであることを特徴とする請求項４に記載のメモリ放熱構造。 5. The memory heat dissipation structure according to claim 4, wherein each screwing element is a bolt, and the elastic element is a compression spring. 各ねじ部に、弾性素子と二つのワッシャが嵌設され、上記弾性素子の両端が、弾性に、上記二つのワッシャに抵当して、その一つの上記ワッシャが、上記放熱器の基部の上端面に接することを特徴とする請求項３に記載のメモリ放熱構造。 An elastic element and two washers are fitted to each screw part, and both ends of the elastic element elastically contact the two washers, and the one washer is an upper end surface of the base of the radiator. The memory heat dissipation structure according to claim 3, wherein the memory heat dissipation structure is in contact with the memory. 各螺着素子は、ボルトで、上記弾性素子は、圧縮スプリングであることを特徴とする請求項６に記載のメモリ放熱構造。 7. The memory heat dissipation structure according to claim 6, wherein each screwing element is a bolt, and the elastic element is a compression spring. 上記放熱器の放熱柱体に、少なくとも一つの放熱ファンがロックされることを特徴とする請求項３に記載のメモリ放熱構造。 4. The memory heat radiation structure according to claim 3, wherein at least one heat radiation fan is locked to the heat radiation column of the heat radiator. 上記放熱ファンは、ロック素子が、上記放熱ファンの貫通孔に嵌設されることにより、上記放熱器の放熱柱体の間にある隙間にロックされることを特徴とする請求項８に記載のメモリ放熱構造。 9. The heat radiating fan according to claim 8, wherein the lock element is locked in a gap between the heat radiating columns of the heat radiator by fitting a locking element into a through hole of the heat radiating fan. Memory heat dissipation structure. 四つのメモリ素子が備えられることを特徴とする請求項３に記載のメモリ放熱構造。 The memory heat dissipation structure according to claim 3, wherein four memory elements are provided.
JP2009000649A 2008-01-09 2009-01-06 Memory heat-dissipating structure Pending JP2009164615A (en)

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