DE102009000013A1 - Heat dissipation arrangement for memory - Google Patents

Abstract

The invention relates to a heat dissipation arrangement for storage, which comprises more than two storage devices (10), a heat sink (20) and a plurality of screw elements (30). Each storage device (10) comprises two cooling plates (11) and a storage module (12) held between the two cooling plates (11), wherein the two cooling plates (11) are formed in a corresponding structure and interconnected. On the cooling plates (11) of each storage device (10) a plurality of screw holes (111) are formed. The heat sink (20) consists of a plate-shaped base (21), a plurality of cooling bars (22) and a plurality of elongated grooves (23), the cooling bars (22) extending upwardly from the upper surface of the base (21), and the long grooves (23) extend through the base (21), each long groove (23) corresponding to a screw hole (111) of the storage device (10); the upper surface of the cooling plates (11) of the storage device (10) is in close contact with the lower surface of the base (21) of the heat sink (20). The screw members (30) are passed through the long grooves (23) of the heat sink (20) and screwed into the corresponding screw holes (111) of the memory device (10) to fix the heat sink (20). Thus, a Wärmeableitanordnung for memory modules (12) is realized.

Description

Technical area

The The invention relates to a heat dissipation arrangement for Memory, in particular a heat dissipation arrangement for Memory, with the heat derived from memory modules and in which the space between the left and right sides of the adjacent memory modules is not occupied.

State of the art

in the Trend of computer development count a strong Computing power and high speed to the essential Features. In computer-related technical areas include one high speed and high frequency are also crucial Features of product performance. The through the processor (Central Processing Unit, CPU) heat generated on the motherboard must by means of a device for heat dissipation be derived. With the increasing storage capacity the memory module and the corresponding high computing power of the CPU increases the heat generated by the memory module, causing the performance of the execution of the memory module impaired becomes; if the heat is not dissipated efficiently, will the function of the memory module fail.

To solve the above-mentioned problem with the heat generated by the memory module, air or water cooling devices for heat dissipation have been developed. For example, is from the Taiwanese utility model M323066 (Registration No. 096209265) discloses a modularized water cooling apparatus disposed on the motherboard by means of a bracket to a heat generating element (eg, a memory module), the water pump further comprising a water pump provided with a water outlet and a water inlet pipe a water cooling row provided with a water inlet and a water drainage line; In addition, connecting pipes for connecting the water pipes of the water pump and the water cooling row and for connecting the heat dissipation module are provided. Thus, the heat of the memory module can be derived.

The above-mentioned conventional water cooling device can solve the task of heat dissipation, but the entire water cooler is very clogged and takes away a lot of computer space, causing the arrangement of more electronic elements inside the computer.

To solve the space problem in the water cooling devices alternatively air cooling devices are used. From the Taiwanese utility model M321118 (Registration No. 095220519), there is known a memory module cooling apparatus in which a plurality of cooling plates are respectively positioned by a frame on the left and right sides of the memory modules. In this case, the base of the cooling plates is supported on the memory modules, and on the base there are a plurality of transversely extending lamellae, which are located away from the memory modules. Thus, the heat of the memory modules is lowered by the air cooling.

Usually are motherboards designed such that a total of four memory modules can be inserted into the motherboard. The distance between the memory modules is determined by the manufacturer. According to the above mentioned Taiwanese utility model extends a plurality of fins transverse to the cooling plates on the left and right sides of the memory modules. In the practical Application, the lamellae each have a certain extension distance on and thus occupy the space of the left and right adjacent Memory modules on the motherboard. Because of that usually only one or two memory modules on the motherboard can be arranged, and the user can not third or more insert three memory modules into the motherboard; in the event of a motherboard with a different dimension is even possible that only a single memory module can be plugged in. Therefore is the space problem also in the above mentioned conventional air cooling devices.

Object of the invention

Of the Invention is based on the object, a Wärmeableitanordnung for creating memory, with the heat of memory modules is derived and in which the space between the left and right Side of the adjacent memory modules is not occupied.

The above object is achieved by a heat dissipation arrangement according to the invention for storage, comprising more than two storage devices, which are arranged at a certain distance next to each other, wherein each storage device comprises two mutually mating connected cooling plates and held between the two cooling plates storage module, wherein formed on the heat sink screw holes are; a heat sink mounted over the storage devices and consisting of a base, a plurality of cooling bars extending from the upper surface of the base, and a plurality of elongated grooves passing through the base, each elongate groove being the screw hole of the storage device corresponds, and the upper surface of the cooling plates is in close contact with the lower surface of the base of the heat sink; and a plurality of screw members each passing through the long grooves of the heat sink and bolted in the corresponding screw holes of the memory devices.

• 1. erfindungsgemäß ist ein Kühlstäbe aufweisender Kühlkörper über mehr als zwei nebeneinander angeordneten Speichervorrichtungen montiert, so dass der Platz über den Speichervorrichtungen genutzt wird, und die Wärme der Speichermodule durch Luftkühlung abgeleitet wird; im Vergleich zum Stand der Technik wird der Zwischenraum zwischen der linken und der rechten Seite je zwei benachbarter Speichermodule nicht belegt, so dass die Erfindung für Hauptplatinen mit unterschiedlichen Maßen geeignet ist, und je nach Bedarf des Benutzers vier Speichermodule in die Hauptplatine einsteckbar sind; und
• 2. am Kühlkörper sind Langnuten ausgebildet, so dass der Kühlkörper verschoben werden kann, damit er sich leicht auf die Schraublöcher der Speichervorrichtungen richtet; somit ist die Erfindung für Hauptplatinen mit unterschiedlichen Maßen geeignet.

The invention has the following advantages:

• 1. According to the invention, a heat sink having Kühlkörper mounted over more than two juxtaposed storage devices, so that the space is used on the storage devices, and the heat of the memory modules is derived by air cooling; in comparison to the prior art, the space between the left and right sides of each two adjacent memory modules is not occupied, so that the invention is suitable for motherboards with different dimensions, and four memory modules can be plugged into the motherboard as required by the user; and
• 2. Long grooves are formed on the heat sink, so that the heat sink can be displaced to easily face the screw holes of the memory devices; Thus, the invention is suitable for motherboards with different dimensions.

Short description of the drawing

1 shows an exploded view of a heat dissipation arrangement according to the invention in a perspective view.

2 shows a perspective view of a mounted on a motherboard according to the invention Wärmeableitanordnung in the assembled state;

3 shows an exploded view of a mounted on a motherboard according to the invention Wärmeableitanordnung in a perspective view according to another embodiment; and

four shows a perspective view of mounted radiators according to the invention in the assembled state.

Ways of execution the invention

in the Following are objects, features and advantages of the present invention with reference to the detailed description of preferred embodiments and the accompanying drawings become. However, the invention should not be limited to the description and the accompanying drawings are limited.

How out 1 As can be seen, the memory heat dissipation arrangement according to the invention comprises more than two memory devices 10 , a heat sink 20 and a plurality of screw members 30 ,

Every storage device 10 includes two cooling plates 11 and one between the two cooling plates 11 held memory module 12 , The two cooling plates 11 can be formed in a corresponding structure and connected together by snapping; Alternatively, one of the two cooling plates 11 large and the other small and connected by bolting together. In the present invention, the connection of the two cooling plates is not limited. According to the invention, the two cooling plates 11 the memory chips 121 the memory modules 12 hold on and lean against them, so that through the memory modules 12 generated heat to the cooling plates 11 can be transferred. On the upper surface of the cooling plates 11 every storage device 10 are several screw holes 111 formed, which are designed as threaded holes.

The heat sink 20 is made of thermally conductive metal and consists of a plate-shaped base 21 , a plurality of cooling bars 22 and a plurality of long grooves 23 , The cooling bars 22 extend from the top surface of the base 21 up; it can have two long grooves 23 are provided, which are arranged at a certain distance from each other and go through the upper and lower surfaces of the base.

Every screw element 30 can be designed as a bolt, the number of screw elements 30 the number of screw holes 111 the storage devices 10 corresponds, with each screw 30 a threaded part 31 having.

The assembly is based on two storage devices 10 For example, as shown in FIG 1 and 2 shown. The memory modules 12 the storage devices 10 are arranged at a certain distance next to each other and are each by means of a contact (gold finger) 122 in an electrical connector 61 a motherboard 60 a computer plugged in, leaving the memory modules 12 with the motherboard 60 be electrically connected.

The heat sink 20 is over the two storage devices 10 mounted, the upper surface of the cooling plates 11 the storage devices 10 attach to the bottom surface of the base 21 of the heat sink 20 supported by the memory modules 12 generated heat through the cooling plates 11 to the heat sink 20 transferred to. At the same time, each long groove corresponds 23 of the heat sink 20 a screw bloch 111 the storage device 10 ,

The screw element 30 goes with his threaded part 31 through the long groove 23 of the heat sink 20 through and then in the screw hole 111 the storage device 10 screwed, causing the heat sink 20 over the two storage devices 10 is attached.

How out 3 apparent, is the motherboard 60 According to this embodiment designed such that four storage devices 10 into the motherboard 60 are pluggable, leaving the heat sink 20 with four storage devices 10 can be in contact. On the threaded part 31 of the screw 30 can each have a spring element 41 and a washer 42 be placed, wherein the spring element 41 a compression spring and with its two ends in each case against the screw 30 and the washer 42 so presses that washer 42 with the upper surface of the base 21 of the heat sink 20 comes in close contact. Alternatively, two washers 42 at the two ends of the spring element 41 be placed so that the two ends of the spring element 41 the two washers 42 so apply that to a washer 42 with the upper surface of the base 21 of the heat sink 20 comes in close contact, so that when gradually tightening the threaded part 31 of the screw 30 in the screw hole 111 the storage device 10 the spring element 41 is pressed to the washer 42 to the heat sink 20 to push and thus the heat sink 20 stable to attach.

It is worth noting that the storage devices 10 in a motherboard 60 can be inserted in different dimensions, wherein the distance of the electrical connector 61 on every motherboard 60 is different. Due to the design of the long groove 23 is possible that the long groove 23 slightly on the screw hole 111 the storage device 10 straightened, leaving the screw 30 exactly in the screw hole 111 can be tightened to the heat sink 20 to position. With the help of long grooves 23 is the heat sink 20 so position adjustable.

How out four can be seen, furthermore, at least one cooler 50 over the cooling bars 22 of the heat sink 20 be screwed. This will be the screw 52 through the at the four corners of the radiator 50 arranged through holes 51 guided and in the gaps between the cooling bars 22 of the heat sink 20 screwed. Using the cooling rods 22 can the cooler 50 be easily tightened.

• 1. erfindungsgemäß ist ein Kühlstäbe 22 aufweisender Kühlkörper 20 über mehr als zwei nebeneinander angeordneten Speichervorrichtungen 10 montiert, so dass der Platz über den Speichervorrichtungen 20 genutzt wird, und die Wärme der Speichermodule 12 durch Luftkühlung abgeleitet wird; im Vergleich zum Stand der Technik wird der Abstand zwischen der linken und der rechten Seite je zwei benachbarter Speichermodule 12 nicht belegt, so dass die Erfindung für Hauptplatinen 60 mit unterschiedlichen Maßen geeignet ist, und je nach Bedarf des Benutzers vier Speichermodule 12 in die Hauptplatine 60 einsteckbar sind;
• 2. am Kühlkörper 20 sind Langnuten 23 ausgebildet, sodass der Kühlkörper 20 verschoben werden kann, damit er sich leicht auf die Schraublöcher 111 der Speichervorrichtungen 10 richtet; somit ist die Erfindung für Hauptplatinen mit unterschiedlichen Maßen geeignet; und
• 3. bei herkömmlichen Kühlkörpern sind gewöhnlich Lamellen angeordnet, über denen ein Kühler sich schwer festschrauben lässt; im Unterschied dazu sind erfindungsgemäß am Kühlkörper 20 Kühlstäbe 22 angeordnet, mittels derer der Kühler 50 sich leicht am Kühlkörper 20 festschrauben lässt.

The invention has the following advantages:

• 1. According to the invention is a cooling rods 22 having heat sink 20 over more than two juxtaposed storage devices 10 mounted so that the space above the storage devices 20 is used, and the heat of the memory modules 12 is derived by air cooling; in comparison to the prior art, the distance between the left and the right side of each two adjacent memory modules 12 not occupied, so the invention for motherboards 60 with different dimensions, and four memory modules as needed by the user 12 into the motherboard 60 can be inserted;
• 2. on the heat sink 20 are long grooves 23 designed so that the heat sink 20 can be moved so that it is easy on the screw holes 111 the storage devices 10 directed; Thus, the invention is suitable for motherboards with different dimensions; and
• 3. Conventional heatsinks usually lamellas are arranged, over which a cooler can be difficult to screw; In contrast, according to the invention on the heat sink 20 cooling bars 22 arranged, by means of which the radiator 50 easily on the heat sink 20 screw tight.

10

storage device

11

heatsink

111

screw

12

memory module

121

memory chip

122

Contact (gold finger)

20

heatsink

21

Base

22

Ice stick

23

long groove

30

screw

31

threaded part

41

spring element

42

washer

50

cooler

51

Through Hole

52

screw

60

motherboard

61

electrical Interconnects

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - TW 323066 [0003]
• - TW 321118 [0005]

Claims (10)

Heat dissipation arrangement for memory, comprising: - more than two memory devices ( 10 ), which are arranged at a certain distance next to each other, each storage device ( 10 ) two correspondingly interconnected cooling plates ( 11 ) and one between the two cooling plates ( 11 ) held memory module ( 12 ), wherein at the cooling plates ( 11 ) of each storage device ( 10 ) several screw holes ( 111 ) are formed; A heat sink ( 20 ), which is above the storage devices ( 10 ) is mounted and from a plate-shaped base ( 21 ), a plurality of cooling bars ( 22 ) and a plurality of long grooves ( 23 ), wherein the cooling rods ( 22 ) from the upper surface of the base ( 21 ) and the long grooves ( 23 ) through the base ( 21 ), each long groove ( 23 ) a screw hole ( 111 ) of the storage device ( 10 ), and the upper surface of the cooling plates ( 11 ) of the storage device ( 10 ) with the lower surface of the base ( 21 ) of the heat sink ( 20 ) is in close contact; and - a plurality of screw elements ( 30 ) caused by the long grooves ( 23 ) of the heat sink ( 20 ) and in the corresponding screw holes ( 111 ) of the storage device ( 10 ) are screwed. Heat dissipation arrangement according to claim 1, characterized in that the memory modules ( 12 ) of the storage devices ( 10 ) in an electrical connector ( 61 ) of a motherboard ( 60 ) are inserted. Heat dissipation arrangement according to claim 1 or 2, characterized in that each screw element ( 30 ) a threaded part ( 31 ), which by the corresponding long groove ( 23 ) and then in the screw hole ( 111 ) is screwed. Heat dissipation arrangement according to claim 3, characterized in that on each threaded part ( 31 ) each have a spring element ( 41 ) and a washer ( 42 ), wherein the spring element ( 41 ) with its two ends in each case against the screw ( 30 ) and the washer ( 42 ) so that the washer ( 42 ) with the upper surface of the base ( 21 ) of the heat sink ( 20 ) comes into close contact. Heat dissipation arrangement according to claim 4, characterized in that each screw element ( 30 ) is a bolt, and the spring element ( 41 ) is a compression spring. Heat dissipation arrangement according to claim 3, characterized in that on each threaded part ( 31 ) each have a spring element ( 41 ) and two washers ( 42 ), wherein the spring element ( 41 ) with its two ends in each case against the two washers ( 42 ) so resiliently applied that the one washer ( 42 ) with the upper surface of the base ( 21 ) of the heat sink ( 20 ) comes into close contact. Heat dissipation arrangement according to claim 6, characterized in that each screw element ( 30 ) is a bolt, and the spring element ( 41 ) is a compression spring. Heat dissipation arrangement according to claim 3, characterized in that on the cooling rods ( 22 ) of the heat sink ( 20 ) at least one cooler ( 50 ) is screwed tight. Heat dissipation arrangement according to claim 8, characterized in that the screw elements ( 30 ) through the through holes ( 51 ) of the radiator ( 50 ) to the radiator ( 50 ) in the gaps between the cooling bars ( 22 ) of the heat sink ( 20 ). Heat dissipation arrangement according to claim 3, characterized in that four memory devices ( 10 ) are provided.