DE202008010716U1 - cooling fin - Google Patents
cooling fin Download PDFInfo
- Publication number
- DE202008010716U1 DE202008010716U1 DE202008010716U DE202008010716U DE202008010716U1 DE 202008010716 U1 DE202008010716 U1 DE 202008010716U1 DE 202008010716 U DE202008010716 U DE 202008010716U DE 202008010716 U DE202008010716 U DE 202008010716U DE 202008010716 U1 DE202008010716 U1 DE 202008010716U1
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- main body
- reinforcing rib
- cooling fin
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2225/00—Reinforcing means
- F28F2225/06—Reinforcing means for fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Sustainable Development (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Technisches GebietTechnical area
Die Erfindung betrifft eine Kühlrippe, die mindestens eine Verstärkungsrippe aufweist, durch die die Festigkeit erhöht und die Kühlfläche vergrößert wird.The Invention relates to a cooling fin, the at least one reinforcing rib has, by which increases the strength and the cooling surface is increased.
Stand der TechnikState of the art
Die elektronischen Bauelemente der elektronischen Datenprodukte (wie Computer, Notebook usw.) können bei Betrieb eine wärme erzeugen. Mit der Erhöhung der Leistung steigt diese Betriebswärme.The electronic components of electronic data products (such as Computer, notebook, etc.) a heat during operation produce. With the increase the performance increases this operating heat.
Die Betriebswärme der Zentraleinheit des Computers kann zu einer Leistungsschwankung und sogar einem Brand der Zen traleinheit führen. Um einen Austritt der elektromagnetischen Wellen zu verhindern, ist das Computergehäuse üblicherweise geschlossen. Daher ist die Abführung der Betriebswärme ein Problem.The operating heat The CPU of the computer may experience a performance variation and even cause a fire of the central unit. To a withdrawal of the To prevent electromagnetic waves, the computer case is usually closed. Therefore, the exhaustion the operating heat a problem.
Um diese Betriebswärme abzuführen wird üblicherweise ein Kühlkörper verwendet, der eine Vielzahl von Kühlrippen enthält. Der Kühlkörper kann mit einem Kühlventilator kombiniert werden, um die Kühlwirkung zu erhöhen.Around this operating heat dissipate becomes common uses a heat sink, of a variety of cooling fins contains. The heat sink can with a cooling fan combined to the cooling effect to increase.
Die
Kühlrippen
Daher weist die herkömmliche Kühlrippe folgende Nachteile auf:
- 1. niedrigere Festigkeit,
- 2. leichte Verformbarkeit,
- 3. kleinere Kühlfläche,
- 4. schlechte Kühlwirkung.
- 1. lower strength,
- 2. easy deformability,
- 3. smaller cooling surface,
- 4. bad cooling effect.
Aus diesem Grund hat der Erfinder in Anbetracht der Nachteile herkömmlicher Lösungen, basierend auf langjähriger Erfahrung in diesem Bereich, nach langem Studium, zahl reichen Versuchen und unentwegten Verbesserungen die vorliegende Erfindung entwickelt.Out For this reason, in view of the disadvantages of the present inventor Solutions, based on longtime Experience in this field, after a long study, numerous attempts and unceasing improvements to the present invention.
Aufgabe der ErfindungObject of the invention
Der Erfindung liegt die Aufgabe zugrunde, eine Kühlrippe zu schaffen, die eine höhere Festigkeit aufweist.Of the Invention is the object of the invention to provide a cooling fin, the one higher Has strength.
Der Erfindung liegt eine weitere Aufgabe zugrunde, eine Kühlrippe zu schaffen, die eine größere Kühlfläche aufweist.Of the Invention is based on a further object, a cooling fin to create, which has a larger cooling surface.
Diese Aufgabe wird durch die erfindungsgemäße Kühlrippe gelöst, die aus einem Hauptkörper besteht, der mindestens eine Verstärkungsrippe ausformt, die durch eine Nut in einer Fläche und einen vorstehenden Streifen auf der gegenüberliegenden Fläche des Hauptkörpers gebildet ist.These The object is achieved by the inventive cooling rib, which consists of a main body, the at least one reinforcing rib formed by a groove in a surface and a protruding Strip on the opposite surface of the main body is formed.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Wege zur Ausführung der ErfindungWays to execute the invention
Im folgenden wird die Erfindung anhand der beigefügten Zeichnungen näher erläutert.in the Following, the invention will be explained in more detail with reference to the accompanying drawings.
Die
Wie
aus
Wie
aus den
Wie
aus den
Das
Kühlrohr
Wie
aus den
Daher
können
die vorstehenden Streifen
Nachfolgend werden die Vorteile der Erfindung beschrieben:
- 1. höhere Festigkeit
- 2. größere Kühlfläche
- 3. bessere Kühlwirkung.
- 1. higher strength
- 2. larger cooling area
- 3. better cooling effect.
Die vorstehende Beschreibung stellt nur die bevorzugten Ausführungsbeispiele der Erfindung dar und soll nicht als Definition der Grenzen und des Bereiches der Erfindung dienen. Alle gleichwertige Änderungen und Modifikationen gehören zum Schutzbereich dieser Erfindung.The The above description represents only the preferred embodiments of the invention and should not be used as a definition of boundaries and serve the scope of the invention. All equivalent changes and modifications are included to the scope of this invention.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202008010716U DE202008010716U1 (en) | 2008-08-07 | 2008-08-07 | cooling fin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202008010716U DE202008010716U1 (en) | 2008-08-07 | 2008-08-07 | cooling fin |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202008010716U1 true DE202008010716U1 (en) | 2008-10-16 |
Family
ID=39869373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202008010716U Expired - Lifetime DE202008010716U1 (en) | 2008-08-07 | 2008-08-07 | cooling fin |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE202008010716U1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2299488A1 (en) * | 2009-08-06 | 2011-03-23 | Cpumate Inc. | Heat-dissiping fin assembly with heat-conducting structure |
-
2008
- 2008-08-07 DE DE202008010716U patent/DE202008010716U1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2299488A1 (en) * | 2009-08-06 | 2011-03-23 | Cpumate Inc. | Heat-dissiping fin assembly with heat-conducting structure |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20081120 |
|
R150 | Term of protection extended to 6 years | ||
R150 | Term of protection extended to 6 years |
Effective date: 20111130 |
|
R157 | Lapse of ip right after 6 years | ||
R157 | Lapse of ip right after 6 years |
Effective date: 20150303 |