CN106325444A - Fanless computer system and mainboard - Google Patents
Fanless computer system and mainboard Download PDFInfo
- Publication number
- CN106325444A CN106325444A CN201510376675.0A CN201510376675A CN106325444A CN 106325444 A CN106325444 A CN 106325444A CN 201510376675 A CN201510376675 A CN 201510376675A CN 106325444 A CN106325444 A CN 106325444A
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- Prior art keywords
- fan
- computer system
- heat conduction
- casing
- conduction medium
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Abstract
The invention relates to a fanless computer system and a mainboard. The fanless computer system comprises a mainboard module, an enclosure and a first heat conduction medium; the mainboard module comprises a mainboard and a central processing unit, wherein the mainboard comprises a body and a connector; the body is provided with a first surface and a second surface, which are opposite; the central processing unit and the connector are respectively arranged on the first surface and the second surface; the mainboard is fixed on the enclosure; furthermore, the first surface faces to the enclosure; and the first heat conduction medium is configured between the central processing unit and the enclosure. Thereby, heat generated by the central processing unit while operating can be conducted to the large-area enclosure through the first heat conduction medium, so that a good heat dissipation effect is realized; by means of the configuration, a fan does not need to be configured on the central processing unit; and thus, the fanless computer system disclosed by the invention does not have noise while operating.
Description
Technical field
The present invention relates to a kind of computer system and motherboard, and particularly to a kind of fan-free computer system and
It is applicable to the motherboard of fan-free computer system.
Background technology
The technology of current computer is maked rapid progress, on the market existing many dynamical CPU
(Central Processing Unit, CPU), chipset, display card disclosure satisfy that user is for being 3D
The demands such as drawing, complicated computing and object for appreciation 3D game.The temperature of computer operationally said elements can carry
Height, the radiating mode the most typically taked is to configure radiator on above-mentioned heater element to dispel the heat, and
These elements are able to maintain that in suitable operating temperature.
It is said that in general, traditional radiator includes fan, radiating fin, heat-conducting copper pipe, heat conduction copper sheet
Combine a monomer.In order to reach good radiating effect, the rotating speed of fan is often designed as along with sending out
The temperature of thermal element rises and improves.But, noise produced by fan, usual transfer speed size is just becoming
Ratio, the operating sound of these fans is exactly the noise source that computer system is main.When rotation speed of the fan is the highest,
Radiating efficiency is the best, and relative noise is the biggest.If wanting to allow fan maintain the slow-speed of revolution to reach low noise
Environment, relative radiating efficiency can be poor, possibly heater element cannot be allowed to maintain suitable temperature.
Summary of the invention
The present invention provides a kind of fan-free computer system, its noiselessness and can have great heat radiation effect concurrently.
The present invention provides a kind of motherboard, and it is applicable to above-mentioned fan-free computer system.
A kind of fan-free computer system of the present invention, leads including a mainboard module, a casing and one first
Thermal medium.Mainboard module includes a motherboard and a CPU, and wherein motherboard includes one
Body and a connector, body have relative one first with one second, CPU be connected
Device is separately positioned on first and second.Motherboard is fixed on casing, and first facing to casing.The
One heat conduction medium is arranged between CPU and casing.
In one embodiment of this invention, the first above-mentioned heat conduction medium include conducting strip, heat-conducting glue or
Heat pipe.
In one embodiment of this invention, above-mentioned fan-free computer system further includes one second heat conduction matchmaker
Being situated between, wherein motherboard further includes a power component, and power component is arranged in first, the second heat conduction medium
It is arranged between power component and casing or between power component and the first heat conduction medium.
In one embodiment of this invention, above-mentioned fan-free computer system further includes one second heat conduction matchmaker
Being situated between, wherein motherboard further includes a power component, and power component is arranged in second, the second heat conduction medium
Configuration is on the first face corresponding to the position of power component.
In one embodiment of this invention, the second above-mentioned heat conduction Media Exposure or do not contact casing.
In one embodiment of this invention, above-mentioned casing includes one first radiating fin, the first heat radiating fin
Sheet be formed at casing back in the surface of motherboard.
In one embodiment of this invention, above-mentioned fan-free computer system further includes a cabinet, motherboard
Module and casing are configured in cabinet, and casing is fixed on cabinet, and cabinet includes one second radiating fin.
In one embodiment of this invention, above-mentioned fan-free computer system is a desktop computer or
Notebook computer.
A kind of motherboard of the present invention, it is adaptable to a fan-free computer system, motherboard include a body,
One CPU slot and a connector.Body have relative one first with one second.In
Central Processing Unit slot position is at first.Adapter position is at second.
In one embodiment of this invention, above-mentioned motherboard further includes a power component, is arranged in first
Face or second.
Based on above-mentioned, the motherboard of the fan-free computer system of the present invention is by by CPU slot
(namely CPU slot is with adapter respectively to be arranged in one side contrary with adapter on body
It is arranged in first and the second face of body), and allow CPU be mounted in first in the face of casing
On face, and the first heat conduction medium is arranged between CPU and casing.Consequently, it is possible to it is central
Processing unit produced heat when computing can be conducted to large-area by the first heat conduction medium
In casing, and reach good radiating effect.This configuration can make to need not configuration in CPU
Fan, therefore, the problem that the fan-free computer system of the present invention does not operationally have noise.Additionally,
In general computer system, fan occupies certain height and volume, the fan-free computer system of the present invention
System saves the design of fan and overall volume can be made to reduce, and concedes more space and use to user.
For the features described above of the present invention and advantage can be become apparent, special embodiment below, and coordinate
Institute's accompanying drawings is described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of fan-free computer system according to one embodiment of the invention.
Fig. 2 is the partial exploded view of the fan-free computer system of Fig. 1.
Fig. 3 is the decomposing schematic representation of a kind of fan-free computer system according to another embodiment of the present invention.
Fig. 4 is the decomposing schematic representation of a kind of fan-free computer system according to another embodiment of the present invention.
Fig. 5 is the decomposing schematic representation of a kind of fan-free computer system according to another embodiment of the present invention.
Wherein, description of reference numerals is as follows:
100,100a, 100b, 100c: fan-free computer system
110: mainboard module
111: motherboard
112: body
113: the first
114: the second
115: CPU slot
116: adapter
117,117b, 117c: power component
118: CPU
120: casing
122: the first radiating fins
130: the first heat conduction media
140, the 140a, 140b, 140c: second heat conduction medium
150: cabinet
152: the second radiating fins
Detailed description of the invention
Fig. 1 is the schematic diagram of a kind of fan-free computer system according to one embodiment of the invention.Fig. 2 is
The partial exploded view of the fan-free computer system of Fig. 1.Refer to Fig. 1 and Fig. 2, Fig. 2 hides
Cabinet 150 and only illustrate the element that is positioned at cabinet 150, and these elements are separated, to become apparent from
Ground represents the relative position relation of each element.In the present embodiment, fan-free computer system 100 is with one
As a example by laptop, but in other embodiments, fan-free computer system 100 can also be a notebook
Computer, the kind of fan-free computer system 100 is not limited thereto system.
The fan-free computer system 100 of the present embodiment include mainboard module 110, casing 120 and
One first heat conduction medium 130.In detail, during mainboard module 110 includes a motherboard 111 and
Central Processing Unit 118.Motherboard 111 includes body 112, CPU slot 115,
Adapter 116 and a power component 117, body 112 has one first relative face 113 and one second
Face 114.First face 113 of the body 112 of motherboard 111 towards casing 120, motherboard 111
Second face 114 of body 112 is away from casing 120.CPU slot 115 is arranged on first
113, CPU 118 may be installed on CPU slot 115, and is fixed on main frame
First face 113 of the main body 112 of plate 111.
Adapter 116 and power component 117 are arranged in the second face 114.In the present embodiment, adapter
116 as a example by USB (universal serial bus) (USB) adapter but it also may be the adapter of other interface, such as
It is PCI-E adapter, IDE connector, SATA connector or e-SATA adapter etc., connects
The kind of device 116 is not limited thereto system.Additionally, in the present embodiment, power component 117 is south bridge
Chip or north bridge chips.Although it addition, not showing other element in the example shown.But motherboard 111
Main body 112 the second face 114 on can be configured with capacity cell and inductance element etc..It is to say,
In the mainboard module 110 of the present embodiment, CPU 118 is joined respectively with other electron component
Put on the different two sides of the body 112 of motherboard 111.
In the present embodiment, the first heat conduction medium 130 is arranged in CPU 118 and casing 120
Between.First heat conduction medium 130 is as a example by conducting strip, but in other embodiments, and the first heat conduction medium
130 can also be heat-conducting glue or heat pipe, and the kind of the first heat conduction medium 130 is not limited thereto system.
Though additionally, do not show on the section of Fig. 1 with Fig. 2, with general existing motherboard and casing
Fixed form identical, the motherboard 111 of the present embodiment is also to be locked in casing 120, certain main frame
Plate 111 is fixed on the mode of casing 120 and is not limited thereto system.
Compared to general mainboard module CPU, power component, adapter and electric capacity unit
Part is all arranged in second of the body of motherboard with inductance element etc., and is being easier to the central authorities of heating
Processing unit dispels the heat with configuration fan on power component.The fan-free computer system 100 of the present embodiment is led to
Cross the body 112 that the CPU 118 operationally easily heated up is arranged in motherboard 111
On first face 113, the first face 113 is towards large-area casing 120, and the first heat conduction medium 130 points
Jie Chu CPU 118 and casing 120.Consequently, it is possible to CPU 118 is in computing
Time produced heat can be conducted in large-area casing 120 by the first heat conduction medium 130,
And reach good radiating effect.This configuration can make to need not in CPU 118 configure fan,
Therefore, the problem not having noise during operation, and the design saving fan can make overall volume reduce, and
Concede more space to use to user.
Additionally, due to mainboard module 110 also has other element on the second face 114 of main body 112
(e.g. power component 117) operationally can send high temperature, in the present embodiment, fan-free computer
System 100 further includes one second heat conduction medium 140.Second heat conduction medium 140 is arranged in the first face 113
On corresponding to the position of power component 117.In other words, the second heat conduction medium 140 projects to body 112
The scope in the first face 113 can cover at least one of power component 117 and project to body 112
The simultaneously scope of 113, and by power component 117 operationally produced heat by motherboard 111
Reach the second heat conduction medium 140.In the present embodiment, the second heat conduction medium 140 is radiating fin, tool
There is bigger surface area to help cooling, but the kind of the second heat conduction medium 140 is not limited thereto system.
It addition, as it is shown in figure 1, in the present embodiment, the second heat conduction medium 140 can contact casing 120, because of
This, the heat being passed to the second heat conduction medium 140 can be dispersed to casing 120 again.Certainly, exist
In other embodiments, the second heat conduction medium 140 can also be not contact casing 120.
Additionally, for more effectively improving heat radiation efficiency, in the present embodiment, casing 120 includes one
One radiating fin 122, the first radiating fin 122 be formed at casing 120 back in motherboard 111
Surface.It is to say, casing 120 is by the first heat radiation being formed on the surface away from motherboard 111
Fin 122, increases the surface area of casing 120, and can be disperseed by heat more quickly.Certainly,
In other embodiments, casing 120 can also be the general casing not having the first radiating fin 122.
In the present embodiment, fan-free computer system 100 further includes a cabinet 150, mainboard module 110
It is configured in cabinet 150 with casing 120, and casing 120 is by the way of e.g. locking or engaging
Being fixed on cabinet 150, therefore, the heat being passed to casing 120 can be with redispersion to cabinet 150.
Owing to the volume of cabinet 150 is big with surface area, from CPU 118 with power component 117 in fortune
During row, produced heat can be transferred to large-area casing 120 and machine by the way of conduction rapidly
Case 150 and effectively lowered the temperature.In the present embodiment, the cabinet 150 of fan-free computer system 100 wraps
Include one second radiating fin 152, and more area of dissipation is provided.Certainly, in other embodiments,
Cabinet 150 can also be the general cabinet not having the second radiating fin 152.
It is noted that be the most only schematically to show one of which the first radiating fin
122 and second form of radiating fin 152, the first radiating fin 122 and the second radiating fin 152
Shape, quantity and allocation position are not limited thereto system.
Fig. 3 is the decomposing schematic representation of a kind of fan-free computer system according to another embodiment of the present invention.
It should be noted that, in the following embodiments, the element same or like with the embodiment of Fig. 1 is with same
The numbering of sample represents.Additionally, the most only illustrate mainboard module, casing the 120, first heat conduction matchmaker
Jie 130 and the second heat conduction medium 140a, and conceal cabinet 150.
Refer to Fig. 3, fan-free computer system 100a of the present embodiment and the fan-free computer system of Fig. 1
The Main Differences of 100 is, in the present embodiment, the allocation position of the second heat conduction medium 140a be from
On first face 113, the position corresponding to power component 117 extends to the first heat conduction medium 130.Therefore,
Power component 117 operationally produced heat reaches the second heat conduction medium 140a by body 112
Afterwards, casing 120 can be transferred to again through the first heat conduction medium 130.In the present embodiment, second lead
Thermal medium 140a is as a example by heat pipe, but the kind of the second heat conduction medium 140a is not limited thereto system.
Fig. 4 is the decomposing schematic representation of a kind of fan-free computer system according to another embodiment of the present invention.
Refer to Fig. 4, fan-free computer system 100b of the present embodiment and the fan-free computer system 100 of Fig. 1
Main Differences be, in the present embodiment, power component 117b is arranged in the first face 113, and second
Heat conduction medium 140b is arranged between power component 117b and casing 120.In the present embodiment, second
The opposing sides of heat conduction medium 140b can directly contact power component 117b and casing 120.Therefore, from
The heat that CPU 118 and power component 117b are sent is respectively through the first heat conduction medium 130
It is transferred to casing 120 with the second heat conduction medium 140b.Second heat conduction medium 140b is conducting strip, but the
The kind of two heat conduction medium 140b is not limited system.
In the present embodiment, fan-free computer system 100b is by easily becoming in high temperature when running
Central Processing Unit 118 is arranged in the first face 113 together with power component 117b, and towards casing 120,
Heat produced by CPU 118 and power component 117b can require no body 112 and
Directly it is transferred to casing 120 by the first heat conduction medium 130 and the second heat conduction medium 140b, and effectively
Heat is disperseed to reach effect of cooling.
Fig. 5 is the decomposing schematic representation of a kind of fan-free computer system according to another embodiment of the present invention.
Refer to Fig. 5, fan-free computer system 100c of the present embodiment and fan-free computer system 100b of Fig. 4
Main Differences be, in the present embodiment, the second heat conduction medium 140c is arranged in power component 117c
And between the first heat conduction medium 130.In detail, the second heat conduction medium 140c as a example by heat pipe,
Two heat conduction medium 140c extend to first from the position corresponding to power component 117c on the first face 113
Heat conduction medium 130, therefore, power component 117c operationally produced heat reaches the second heat conduction matchmaker
After Jie 140c, casing 120 can be transferred to again through the first heat conduction medium 130, and effectively achieve scattered
The effect of heat.
In sum, the motherboard of the fan-free computer system of the present invention is by by CPU slot
(namely CPU slot is with adapter respectively to be arranged in one side contrary with adapter on body
It is arranged in first and the second face of body), and allow CPU be mounted in first in the face of casing
On face, and the first heat conduction medium is arranged between CPU and casing.Consequently, it is possible to it is central
Processing unit produced heat when computing can be conducted to large-area by the first heat conduction medium
In casing, and reach good radiating effect.This configuration can make to need not configuration in CPU
Fan, therefore, the problem that the fan-free computer system of the present invention does not operationally have noise.Additionally,
In general computer system, fan occupies certain height and volume, the fan-free computer system of the present invention
System saves the design of fan and overall volume can be made to reduce, and concedes more space and use to user.
Although the present invention is disclosed above with embodiment, so it is not limited to the present invention, any affiliated
Technical field has usually intellectual, without departing from the spirit and scope of the present invention, a little when making
Change and retouching, therefore protection scope of the present invention when depending on appending claims defined in the range of
Accurate.
Claims (10)
1. a fan-free computer system, it is characterised in that including:
One mainboard module, including a motherboard and a CPU, wherein this motherboard includes one
Body and a connector, this body have relative one first with one second, this CPU
It is separately positioned on this first and this second with this adapter；
One casing, this motherboard is fixed on this casing, and this is first facing to this casing；And
One first heat conduction medium, is arranged between this CPU and this casing.
2. fan-free computer system as claimed in claim 1, it is characterised in that this first heat conduction medium
Including conducting strip, heat-conducting glue or heat pipe.
3. fan-free computer system as claimed in claim 1, it is characterised in that this fan-free computer system
System also includes:
One second heat conduction medium, wherein this motherboard also includes a power component, and this power component is arranged in
This first, this second heat conduction medium is arranged between this power component and this casing or this power component
And between this first heat conduction medium.
4. fan-free computer system as claimed in claim 1, it is characterised in that this fan-free computer system
System also includes:
One second heat conduction medium, wherein this motherboard also includes a power component, and this power component is arranged in
This second, this second heat conduction medium is arranged in the position on this first corresponding to this power component.
5. fan-free computer system as claimed in claim 4, it is characterised in that this second heat conduction medium
Contact or do not contact this casing, or this second heat conduction medium extends to this first heat conduction medium.
6. fan-free computer system as claimed in claim 1, it is characterised in that this casing includes one the
One radiating fin, this first radiating fin be formed at this casing back in the surface of this motherboard.
7. fan-free computer system as claimed in claim 1, it is characterised in that this fan-free computer system
System also includes:
One cabinet, this mainboard module and this casing are configured in this cabinet, and this casing is fixed on this machine
Case, this cabinet includes one second radiating fin.
8. fan-free computer system as claimed in claim 1, it is characterised in that this fan-free computer system
System is a desktop computer or a notebook computer.
9. a motherboard, it is adaptable to a fan-free computer system, it is characterised in that this motherboard includes:
One body, have relative one first with one second；
One CPU slot, position is at this first；And
A connector, position is at this second.
10. motherboard as claimed in claim 9, it is characterised in that this motherboard also includes:
One power component, is arranged in this first or this second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510376675.0A CN106325444A (en) | 2015-07-01 | 2015-07-01 | Fanless computer system and mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510376675.0A CN106325444A (en) | 2015-07-01 | 2015-07-01 | Fanless computer system and mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106325444A true CN106325444A (en) | 2017-01-11 |
Family
ID=57726663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510376675.0A Pending CN106325444A (en) | 2015-07-01 | 2015-07-01 | Fanless computer system and mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106325444A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770310A (en) * | 2018-06-28 | 2018-11-06 | 安徽捷泰智能科技有限公司 | A kind of heat radiating type driving floor combination mechanism |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2731922Y (en) * | 2004-08-11 | 2005-10-05 | 威盛电子股份有限公司 | Fan free electronic system having radiation modular |
| CN201726637U (en) * | 2010-06-08 | 2011-01-26 | 瑞祺电通股份有限公司 | Fanless radiation structure of electronic equipment |
| CN201917860U (en) * | 2010-05-20 | 2011-08-03 | 广州智慧星科技有限公司 | Computer mainboard allowing heat dissipation by passive heat dissipating mode |
| US20120147554A1 (en) * | 2010-12-09 | 2012-06-14 | Hon Hai Precision Industry Co., Ltd. | Motherboard system having heat dissipating device |
-
2015
- 2015-07-01 CN CN201510376675.0A patent/CN106325444A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2731922Y (en) * | 2004-08-11 | 2005-10-05 | 威盛电子股份有限公司 | Fan free electronic system having radiation modular |
| CN201917860U (en) * | 2010-05-20 | 2011-08-03 | 广州智慧星科技有限公司 | Computer mainboard allowing heat dissipation by passive heat dissipating mode |
| CN201726637U (en) * | 2010-06-08 | 2011-01-26 | 瑞祺电通股份有限公司 | Fanless radiation structure of electronic equipment |
| US20120147554A1 (en) * | 2010-12-09 | 2012-06-14 | Hon Hai Precision Industry Co., Ltd. | Motherboard system having heat dissipating device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770310A (en) * | 2018-06-28 | 2018-11-06 | 安徽捷泰智能科技有限公司 | A kind of heat radiating type driving floor combination mechanism |
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Application publication date: 20170111 |
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