CN203405764U - Fanless case for microcomputer board - Google Patents
Fanless case for microcomputer board Download PDFInfo
- Publication number
- CN203405764U CN203405764U CN201320471300.9U CN201320471300U CN203405764U CN 203405764 U CN203405764 U CN 203405764U CN 201320471300 U CN201320471300 U CN 201320471300U CN 203405764 U CN203405764 U CN 203405764U
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- Prior art keywords
- heat generating
- casing
- motherboard
- generating member
- spare part
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Abstract
A fanless case for a microcomputer board comprises a case body, and the case body comprises a front panel and a side board. A plurality of second heat generating part lead-out holes are formed in the front panel, the second heat generating part lead-out holes are located above second heat generating parts of an external mainboard, a first heat generating part contact part is arranged on the surface of the inner side of the case body, and the position of the first heat generating part contact part corresponds to the position of the first heat generating parts of the mainboard. The side board and the case body are fixedly arranged in a combined mode, a plurality of second heat generating part lead-in holes are formed in the side board, and all the second heat generating part lead-in holes are located in one side of second heat generating parts. The fanless case for the microcomputer board is provided with the first heat generating part contact part, the second heat generating part lead-in holes and the second heat generating part lead-out holes, and thus a good heat dissipating effect can be provided for the first heat generating parts and the second heat generating parts of the external mainboard. The heat dissipating effect can be improved, the size of the products can be shrunken, and the products can be more adaptable.
Description
Technical field
The utility model is relevant for a kind of computer housing, espespecially a kind of fan-free casing for NUC motherboard or Thin Mini-ITX motherboard.
Background technology
Refer to the schematic diagram that Figure 1 shows that active computer casing 1; this computer housing 1 is comprised of a casing ontology 10 and at least one fixing side plate 11 that can combine with these casing ontology 10 1 sides conventionally; in this casing ontology 10, there is accommodation space 12; thus; and this accommodation space 12 can be arranged for motherboard 2; this computer housing 1 can provide basic protection, the function such as dustproof to motherboard 2; in addition; other detail structure of this computer housing 1 all knows that by possessing in affiliated technical field the knowledgeable is known, and repeats no more in this conventionally.
This existing computer housing 1, though can reach basic protection, dustproof object, but therefore casing also must have the leakproofness of certain degree, derived thus the heat dissipation problem of motherboard 2, at present on the motherboard 2 of general personal computer, CPU(central processing unit, Central Processing Unit) be emphasize most and need one of spare part of heat radiation, be indebted to lasting micro and the progress of chip processing procedure, the power consumption of the IC products such as CPU (and heating) is though can constantly reduce, but because existing computer housing 1 also cannot provide directly and effective heat sink conception it, cause this CPU top conventionally still to need additionally to arrange for example fan 21 of an active heat abstractor, and as shown in Figure 1, so will cause the whole manufacturing cost increase of motherboard 2 and volume to become large, also be unfavorable for this computer housing 1 reduced volume simultaneously, in addition, today, motherboard 2 its dimensions (form factor) of personal computer were quite polynary, also be particular about all the more compact, the NUC(Next Unit Computing of the up-to-date release of Thin Mini-ITX and Intel Company wherein) be the motherboard 2 of two kinds of typical mini miniaturization specifications, due to this type of motherboard 2 compared with the motherboard 2(of stock size as ATX motherboard) little a lot, therefore except CPU, still there is the also significant of heating problem of other spare part, for example its hard disk adopting unconventional mechanical type hard disk, and be mSATA(Mini SATA, its connector specification is identical with Mini PCI-E) solid state hard disc (SSD of interface, Solid State Drive), in addition, the wireless network card that comprises Mini PCI-E interface is also can produce the spare part of high temperature while belonging to running, and circuit design (layout) standard due to the motherboard 2 of this type of miniaturization, described spare part and CPU can lay respectively at the upper of this motherboard 2 conventionally, lower surface, yet, existing computer housing 1 does not provide effective heat radiation countermeasure for these spare parts, for example, although this computer housing 1 may have louvre 13, but this louvre 13 arranges mainly for the heat radiation of CPU and fan 21, so the heat radiation for aforesaid solid state hard disc and wireless network card there is no essence help, therefore, motherboard 2 computer housing 1 as existing in collocation of this Thin Mini-ITX and NUC equal-specification is used, solid state hard disc on this motherboard 2 and wireless network card are by may be because cannot efficiently radiates heat and situation about damaging when machine or fault occurs, therefore, how above-mentioned disappearance is improved, be the technical difficulties place that this case designer institute wish solves.
Summary of the invention
Because existing computer housing, because cannot directly providing heat radiation to CPU, cause CPU that fan need be set, cause cost increase and volume to become large, therefore the purpose of this utility model is to provide a kind of fan-free casing for minicomputer plate, the utility model is provided with this first heat generating member contact site, the second heat generating member entrance hole and the second heat generating member leadout hole, and its first heating spare part and second of external host plate good radiating effect of spare part that generates heat can be provided, and then make the utility model can reach improving radiating effect, dwindle the effect of small product size and increase product applicability.
For reaching the above object, the utility model provides a kind of fan-free casing for minicomputer plate, it comprises: a casing ontology, this casing ontology includes a front panel, this front panel is provided with a plurality of the second heat generating member leadout holes, this the second heat generating member leadout hole is positioned at the top of its second heating spare part of outside motherboard, this casing ontology inner surface is provided with one first heat generating member contact site again, and the position of its first heating spare part of the position of this first heat generating member contact site and this motherboard is corresponding; Side plate, this side plate combines and sets firmly with this casing ontology, and this side plate is provided with a plurality of the second heat generating member entrance holes, and respectively this second heat generating member entrance hole is positioned at a side of its second heating spare part of this motherboard.
A kind of fan-free casing for minicomputer plate, comprise: a casing ontology, in this casing ontology, be provided with an accommodation space, and make this accommodation space for outside motherboard setting, wherein on this motherboard, there is one first heating spare part and at least one the second heating spare part, this first heating spare part and the second heating spare part lay respectively at the upper of this motherboard, lower surface, this casing ontology includes a front panel and a backboard again, this front panel combines and sets firmly with casing ontology respectively with backboard, this front panel is provided with a plurality of the second heat generating member leadout holes, this the second heat generating member leadout hole is positioned at the top of its second heating spare part of this motherboard, this casing ontology inner surface is provided with a first heat generating member contact site being connected with this casing ontology again, and the position of this first heat generating member contact site is corresponding with the position of the first heating spare part of this motherboard, another this casing ontology outer surface is provided with radiating fin, side plate, this side plate is combined and sets firmly with this casing ontology by this casing ontology one side, this side plate is provided with a plurality of the second heat generating member entrance holes, respectively this second heat generating member entrance hole is positioned at a side of the second heating spare part of this motherboard, and respectively the position of this second heat generating member entrance hole is corresponding with this second generate heat position of spare part.
The described fan-free casing for minicomputer plate, this casing ontology is aluminium extruded type casing, and this side plate is aluminium sheet.
The described fan-free casing for minicomputer plate, this first heat generating member contact site and casing ontology are formed in one, and this first heat generating member contact site is projection.
The described fan-free casing for minicomputer plate, this motherboard is NUC motherboard or is Thin Mini-ITX motherboard.
The described fan-free casing for minicomputer plate, this first heating spare part is CPU, and this second heating spare part is the solid state hard disc of mSATA interface or is the wireless network card of Mini PCI-E interface.
The described fan-free casing for minicomputer plate, this respectively this second heat generating member leadout hole to be the mode of at least two parallel lines, be arranged side by side.
The described fan-free casing for minicomputer plate, this second heat generating member leadout hole is strip.
By the utility model, be provided with this first heat generating member contact site, the second heat generating member entrance hole and the second heat generating member leadout hole, and its first heating spare part of external host plate and the good radiating effect of the second heating spare part can be provided, and then make the utility model can reach improving radiating effect, dwindle the effect of small product size and increase product applicability.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of active computer casing;
Fig. 2 is decomposing schematic representation of the present utility model;
Fig. 2 A be another angle of the utility model decomposing schematic representation;
Fig. 3 is combination schematic diagram of the present utility model;
Fig. 4 is the schematic diagram that the utility model can directly dispel the heat for its CPU of motherboard;
Fig. 5 is the action schematic diagram that the utility model can effectively be assisted the solid state hard disc of its mSATA specification of motherboard or the heat radiation of the wireless network card of Mini PCI-E specification.
Description of reference numerals
Existing
1-computer housing; 10-casing ontology; 11-side plate; 12-accommodation space; 13-louvre; 2-motherboard; 21-fan;
The utility model
3-casing ontology; 31-accommodation space; 32-front panel; 321-power knob; 322-the second heat generating member leadout hole; 33-backboard; 331-expands hole hyte part; 34-the first heat generating member contact site; 35-radiating fin; 4-side plate; 41-the second heat generating member entrance hole; 42-hangs hole; 5-motherboard; 51-the first heating spare part; 52-the second heating spare part; 53-expands coupling assembling; A1-hot gas; A2-cold air.
Embodiment
Refer to shown in Fig. 2, Fig. 3, the utility model provides a kind of fan-free casing for minicomputer plate, and it comprises:
One casing ontology 3, in this casing ontology 3, be provided with an accommodation space 31, thus, shown in Fig. 4, and this accommodation space 31 can be arranged for outside motherboard 5, in the present embodiment, this motherboard 5 more specifically can be NUC(Next Unit Computing) motherboard or for Thin Mini-ITX motherboard, on this motherboard 5, there is one first heating spare part 51 and at least one the second heating spare part 52, wherein this first heating spare part 51 and the second heating spare part 52 lay respectively at the upper of this motherboard 5, lower surface, more specifically, this the first heating spare part 51 can be CPU, and this second heating spare part 52 can be the solid state hard disc of mSATA interface or is the wireless network card of Mini PCI-E interface, this casing ontology 3 includes a front panel 32 and a backboard 33 again, this front panel 32 combines and sets firmly with casing ontology 3 respectively with backboard 33, more specifically, this front panel 32 can lay respectively on relative position, these casing ontology 3 front and back with backboard 33, on this front panel 32, be conventionally provided with power knob 321, on this backboard 33, conventionally offer and expand hole hyte part 331, the hole that can include several geomeries in this expansion hole hyte part 331, shown in Fig. 4, wherein respectively the position of this hole and size can be respectively with these motherboard 5 its various expansion connectors that expand coupling assemblings 53 as USB slot, position and the size of HDMI slot or cable network slot are corresponding, the aforementioned general structure about front panel 32 and backboard 33 all knows that by possessing in affiliated technical field the knowledgeable is known conventionally, therefore no longer describe in detail, in addition, on this front panel 32, can further be provided with a plurality of the second heat generating member leadout holes 322, preferably, shown in Fig. 4, respectively this second heat generating member leadout hole 322 is arranged side by side to be the mode of at least two parallel lines, this the second heat generating member leadout hole 322 can be strip again, another this second heat generating member leadout hole 322 can be positioned at the top of these motherboard 5 its second heating spare parts 52, in addition, this casing ontology 3 can be aluminium extruded type casing, these casing ontology 3 inner surfaces are provided with a first heat generating member contact site 34 being connected with this casing ontology 3 again, in the present embodiment, this the first heat generating member contact site 34 is formed in one with casing ontology 3, this the first heat generating member contact site 34 can be projection again, and the position of this first heat generating member contact site 34 is corresponding with the position of these motherboard 5 its first heating spare parts 51, and as shown in Figure 4, separately, shown in Fig. 2 A, these casing ontology 3 outer surfaces can be provided with radiating fin 35,
Refer to Fig. 2, shown in Fig. 2 A and Fig. 4, by this casing ontology 3, it is aluminium extruded type casing, and the position of these casing ontology 3 its first heat generating member contact sites 34 is corresponding with the position of these motherboard 5 its first heating spare parts 51, these casing ontology 3 outer surfaces are provided with radiating fin 35 again, when this motherboard 5 is arranged at this casing ontology 3 its accommodation spaces 31 when interior, can make this motherboard 5 its first heating spare part 51(is CPU) directly touch mutually with these casing ontology 3 its first heat generating member contact sites 34, and make this CPU can be directly with heat exchange pattern, by this casing ontology 3 and radiating fin 35 thereof, dispel the heat with the formed contact area on a large scale of outside air, so, this CPU can be without additionally arranging as existing fan 21 again, and make the utility model can make casing and motherboard 5 not need to arrange fan 21, still can keep good radiating effect simultaneously, can reduce the manufacturing cost of this motherboard 5 and contribute to dwindle the volume of casing, in addition, refer to shown in Fig. 4, by the second heat generating member leadout hole 322 of these casing ontology 3 its front panels 32, be positioned at the top with motherboard 5 its second heating spare parts 52 again, these side plate 4 its second heat generating member entrance holes 41 are positioned at a side of this second heating spare part 52, and the position of this second heat generating member entrance hole 41 is corresponding with the position of this second heating spare part 52, shown in Fig. 5, and make this second heating spare part 52(, being the solid state hard disc of mSATA interface or the wireless network card of Mini PCI-E interface) the hot gas A1 that produces during running can discharge via this second heat generating member leadout hole 322, extraneous cold air A2 can be entered in this casing ontology 3 by this second heat generating member entrance hole 41 simultaneously, and can reach splendid radiating effect to this second heating spare part 52, make the utility model can be NUC motherboard or Thin Mini-ITX motherboard provides excellent Cooling Solution, and then make the utility model can reach improving radiating effect, dwindle the effect of small product size and increase product applicability.
To description of the present utility model, be illustrative above; and it is nonrestrictive; those skilled in the art is understood, and can carry out many modifications, variation or equivalence to it, but they all will fall in protection domain of the present utility model in claim in the spirit limiting and scope.
Claims (7)
1. for a fan-free casing for minicomputer plate, it is characterized in that, comprise:
One casing ontology, in this casing ontology, be provided with an accommodation space, and make this accommodation space for outside motherboard setting, wherein on this motherboard, there is one first heating spare part and at least one the second heating spare part, this first heating spare part and the second heating spare part lay respectively at the upper of this motherboard, lower surface, this casing ontology includes a front panel and a backboard again, this front panel combines and sets firmly with casing ontology respectively with backboard, this front panel is provided with a plurality of the second heat generating member leadout holes, this the second heat generating member leadout hole is positioned at the top of its second heating spare part of this motherboard, this casing ontology inner surface is provided with a first heat generating member contact site being connected with this casing ontology again, and the position of this first heat generating member contact site is corresponding with the position of the first heating spare part of this motherboard, another this casing ontology outer surface is provided with radiating fin,
Side plate, this side plate is combined and sets firmly with this casing ontology by this casing ontology one side, this side plate is provided with a plurality of the second heat generating member entrance holes, respectively this second heat generating member entrance hole is positioned at a side of the second heating spare part of this motherboard, and respectively the position of this second heat generating member entrance hole is corresponding with this second generate heat position of spare part.
2. the fan-free casing for minicomputer plate as claimed in claim 1, is characterized in that, this casing ontology is aluminium extruded type casing, and this side plate is aluminium sheet.
3. the fan-free casing for minicomputer plate as claimed in claim 2, is characterized in that, this first heat generating member contact site and casing ontology are formed in one, and this first heat generating member contact site is projection.
4. the fan-free casing for minicomputer plate as claimed in claim 3, is characterized in that, this motherboard is NUC motherboard or is Thin Mini-ITX motherboard.
5. the fan-free casing for minicomputer plate as claimed in claim 4, is characterized in that, this first heating spare part is CPU, and this second heating spare part is the solid state hard disc of mSATA interface or is the wireless network card of Mini PCI-E interface.
6. the fan-free casing for minicomputer plate as claimed in claim 4, is characterized in that, this respectively this second heat generating member leadout hole to be the mode of at least two parallel lines, be arranged side by side.
7. the fan-free casing for minicomputer plate as claimed in claim 4, is characterized in that, this second heat generating member leadout hole is strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320471300.9U CN203405764U (en) | 2013-08-02 | 2013-08-02 | Fanless case for microcomputer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320471300.9U CN203405764U (en) | 2013-08-02 | 2013-08-02 | Fanless case for microcomputer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203405764U true CN203405764U (en) | 2014-01-22 |
Family
ID=49941694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320471300.9U Expired - Fee Related CN203405764U (en) | 2013-08-02 | 2013-08-02 | Fanless case for microcomputer board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203405764U (en) |
-
2013
- 2013-08-02 CN CN201320471300.9U patent/CN203405764U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140122 Termination date: 20160802 |