CN1953642A - Circuit board with through hole type heat radiation - Google Patents
Circuit board with through hole type heat radiation Download PDFInfo
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- CN1953642A CN1953642A CN 200510114248 CN200510114248A CN1953642A CN 1953642 A CN1953642 A CN 1953642A CN 200510114248 CN200510114248 CN 200510114248 CN 200510114248 A CN200510114248 A CN 200510114248A CN 1953642 A CN1953642 A CN 1953642A
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- Prior art keywords
- circuit board
- chip
- heat radiation
- hole type
- type heat
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Abstract
The invention relates to a circuit board with through heat emission. Wherein, it comprises that a circuit board, with opposite first surface and second surface; the first surface has one chip; at least one through hole is near the chip; the diameter of through hole is larger than 125mill; a heat emitter at the first surface at the chip; an auxiliary heat emitter at the second surface; and a thermal conductor at the through hole to connect the heat emitter and the auxiliary heat emitter, to transmit the heat of chip to the auxiliary heat emitter; the surrounding of chip has through hole, to connect the heat emitter and auxiliary heat emitter via thermal conductor; and the thermal conductor can be conductive post or heat tube made from aluminum and copper, to connect two side heat emitters via shortest distance, to improve the heat emission effect.
Description
Technical field
The present invention relates to a kind of circuit board that is applied to electronic installation, particularly relate to a kind of circuit board with through-hole type heat radiation.
Background technology
Circuit board is all unavoidably arranged on any electronic installation, be equiped with main electronic component on it, be topmost core parts wherein with chip, with the PC is example, have CPU (CPU) and south bridge on the motherboard, (chip is wafer to important chip such as north bridge, below all be called chip), early stage computer, because of the CPU arithmetic speed higher, for avoiding its running back overheated, Gu Qishang has additional radiator, and radiator utilizes the metal of high heat transfer rate to constitute, and have many radiating fins, the bottom directly be contacted with on the CPU, and with conduction pattern with heat absorption, dispel the heat by radiating fin by the mode of convection current again, for further forcing to increase its thermal convection, the efficient of heat exchange has additional fan again and makes its forced convertion on radiator.
Along with science and technology is maked rapid progress, the arithmetic speed of chips such as CPU is more and more higher, it is more that the heat that is produced makes the temperature rising thereupon, be not only CPU at present, connect south bridge, north bridge chips on the motherboard, or even the drawing chip on the display card etc., arithmetic speed is equally also more and more faster, makes it be cooled to the scope of normal working temperature so all need to be equiped with radiator.
Yet, chip arithmetic speed increasing degree is more and more faster, the angle that can catch up with above this basic hot-fluid of radiator far away, by contrast, the heat-sinking capability of radiator enjoys test, and all the other north bridges on CPU or the motherboard, South Bridge chip are because the space between motherboard and the casing is bigger, than being easier to design the radiator relatively large, that heat-sinking capability is stronger, but for as interface cards such as display cards, it is so lucky just not have, the space is limited between interface card and interface card, and makes the hot-air accumulation be difficult for leaving easily, lowers radiating effect greatly.And at present casing slowly tends to the appearance of miniaturization or even mini system, makes the radiator of the chip on the motherboard face identical test equally.
Yet, because chip area is little, even if radiator is big again, the heat energy that can transmit also is limited, and in response to this situation, preceding case proposes a kind of mode of utilizing heat pipe, the heat energy of radiator transferred to be positioned at that circuit board is tossed about or another auxiliary radiator at a distance, just utilize heat pipe that the mode that thermal source transfers to another radiator is improved radiating efficiency, but because the heat pipe transmission range is quite long, being still of improving on the practice is limited.
This shows that above-mentioned existing circuit board obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that circuit board exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of circuit board of new structure, just become the current industry utmost point to need improved target with through-hole type heat radiation.
Because the defective that above-mentioned existing circuit board exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of circuit board of new structure with through-hole type heat radiation, can improve general existing circuit board, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective that existing circuit board exists, and a kind of circuit board with through-hole type heat radiation of new structure is provided, technical problem to be solved is to make it utilize the perforation that runs through on the circuit board to have additional the mode of heat conducting element with beeline, heat energy is transferred to the additional cooler of tossing about, improve radiating effect greatly, thereby be suitable for practicality more.
The object of the invention to solve the technical problems also realizes by the following technical solutions.Circuit board according to the present invention's proposition with through-hole type heat radiation, it comprises: a circuit board, have a relative first surface and a second surface, and this first surface has a chip, and be adjacent to this chip and have at least one perforation, and the diameter of this perforation is greater than 125 mils; One radiator is installed in the first surface of this circuit board, and is positioned at this chip place, in order to the heat energy that this chip produced is dispelled the heat; One additional cooler is installed in the second surface of this circuit board; And a heat conducting element, be installed in the perforation of this circuit board, and be communicated with this radiator and this additional cooler, and the heat energy that this chip produced can be transferred to this additional cooler.
The object of the invention to solve the technical problems also adopts following technical measures further to realize.
Aforesaid circuit board with through-hole type heat radiation, wherein said perforation is to be two, is symmetrical in this chip setting respectively.
Aforesaid circuit board with through-hole type heat radiation, wherein said perforation is to be four, is symmetrical in this chip setting respectively.
Aforesaid circuit board with through-hole type heat radiation, wherein circuit board more comprises the fixing hole of at least one.
Aforesaid circuit board with through-hole type heat radiation, it more comprises the fixture corresponding to this fixing hole, in order to this radiator and additional cooler are fixed in this circuit board.
Aforesaid circuit board with through-hole type heat radiation, it more comprises a hold-doun nut, is installed on this heating column, in order to this radiator and additional cooler are fixed in this circuit board.
Aforesaid circuit board with through-hole type heat radiation, wherein said radiator and this additional cooler all have a plurality of radiating fins.
Aforesaid circuit board with through-hole type heat radiation, wherein said heat conducting element is to be a heating column, and the diameter that cooperates the aperture of this perforation and this heating column is greater than 125 mils.
Aforesaid circuit board with through-hole type heat radiation, wherein said heating column is constituted by metal material.
Aforesaid circuit board with through-hole type heat radiation, wherein said heat conducting element is to be a heat pipe.
The execution mode of heat conducting element can be the heating column of the metal formation of high thermal conductivity coefficients such as aluminium, copper, cooperates the perforation diameter greater than 125 mils (Mil) heat energy to be transmitted.As heat conducting element is the enforcement aspect of heat pipe, and then perforation not necessarily needs to limit the effect that can reach the raising heat radiation.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, the circuit board of the present invention with through-hole type heat radiation has following advantage at least:
The disclosed circuit board of the present invention with through-hole type heat radiation, comprise circuit board, radiator, additional cooler, heat conducting element, has chip on the circuit board and at least one is adjacent to the perforation of chip, radiator, additional cooler are installed in the both side surface of circuit board with respect to chip respectively, and utilize heat conducting element to be installed in perforation and connect radiator and additional cooler, directly heat energy is transferred to additional cooler from radiator with beeline, significantly improve radiating effect.
In sum, the circuit board with through-hole type heat radiation of special construction of the present invention, it has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it all has bigger improvement on product structure or function, have large improvement technically, and produced handy and practical effect, and more existing circuit board has the multinomial effect of enhancement, thereby being suitable for practicality more, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the exploded view of first embodiment that has the circuit board of through-hole type heat radiation for the present invention.
Fig. 2 is the constitutional diagram of first embodiment that has the circuit board of through-hole type heat radiation for the present invention.
Fig. 3 is the lateral plan of first embodiment that has the circuit board of through-hole type heat radiation for the present invention.
Fig. 4 is the exploded view of second embodiment that has the circuit board of through-hole type heat radiation for the present invention.
Fig. 5 is the constitutional diagram of second embodiment that has the circuit board of through-hole type heat radiation for the present invention.
Fig. 6 is the lateral plan of second embodiment that has the circuit board of through-hole type heat radiation for the present invention.
10: circuit board
101,102: perforation
103,104: fixing hole
11: first surface
12: second surface
13: chip
20: radiator
21: radiating fin
30: additional cooler
31: radiator
41,42: heating column
43,44: fixture
51～54: hold-doun nut
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of circuit board, structure, feature and the effect thereof that foundation the present invention proposes with through-hole type heat radiation, describe in detail as after.
The disclosed circuit board according to the present invention with through-hole type heat radiation, utilize the perforation on the circuit board, directly heat conducting element is installed in perforation, and can heat energy be conducted to additional cooler by radiator with beeline, the heat conducting element foundation is the most common person generally, can be metals such as aluminium that high heat passes coefficient, copper, and the mode of heat pipe, below set forth with two embodiment respectively.
See also Fig. 1, shown in Figure 2, be first embodiment that has the circuit board of through-hole type heat radiation for the present invention, comprise circuit board 10, radiator 20, additional cooler 30 and heating column 41,42, circuit board 10 comprises relative both side surface one first surface 11 and second surface 12, wherein first surface 11 is equiped with chip 13, and be adjacent to chip 13 places and be provided with perforation 101,102, two holes and be set to good can the heat transfer more equably, below describe in detail to be symmetrical in chip 13.
And have a plurality of radiating fins 21 on the radiator 20, illustrate among the figure and only be signal, be not in order to the aspect of restriction radiator 20 with its radiating fin 21, identical additional cooler 30 also comprises a plurality of radiating fins 31, same, illustrating among the figure is signal only, is not in order to the aspect of restriction additional cooler 30 with its radiating fin 31.Radiator 20 is installed in the first surface 11 of circuit board 10, and be positioned at chip 13 places, the bottom is contacted with on the chip 13, additional cooler 30 then is installed in the second surface 12 of circuit board 10, and heating column 41,42 passes heats ink 20, perforation 101,102 and the additional cooler 30 that arrives, the bottom again by hold-doun nut 51,52 in addition in conjunction with and heating column 41,42 is fixed in the position that this contact is communicated with.And as shown in the figure, more comprise the fixing hole 103,104 that runs through on the circuit board 10, it is fixing to cooperate fixture 43,44 and hold- doun nut 53,54 to be assisted.Certainly, the position in four holes such as perforation 101,102 and fixing hole 103,104 is good with four symmetrical corners that are positioned at chip 13.
Please cooperate consult shown in Figure 3, installing back radiator 20 directly fits on the chip 13, and the heat energy can absorb chip 13 running the time, a part of heat energy is left by the radiating fin 21 of the top mode by thermal convection, another partly also can conduct to the additional cooler 30 that the below is positioned at second surface 12 by heating column 41,42 contacts, and is auxiliary by its radiating fin 31 heat radiations.Because be by heat conducting mode, so the diameter of heating column 41,42 needs more than 125 mils (Mil), if public edition fan location hole with the general circuit plate, it is of a size of 118 ± 2 mils (Mil), the aperture is too small to be difficult to present concrete heat and to pass effect, so relative, the aperture of perforation 101,102 then need be more than 125 mils (Mil).And heating column 41,42 except as illustrate among the figure into uniformly cylindric, also can be various variation patterns such as vertebra shape, flat column, round platform, further to increase the contact area of heating column 41,42 and radiator 20, additional cooler 30, and additional cooler 30 can be contacted with the second surface 12 of circuit board 10, because of its main thermal source is to transmit with heat exchange pattern by heating column 41,42, but not pass through the mode of circuit board 10.
On the other hand, two perforations 101,102 that illustrated in figure cooperate two heating columns 41,42 and two location holes 103,104 cooperate two fixtures 43,44, also all holes all can be designed to greater than the above perforation of 125 mils (Mil), and the installing of cooperation heating column, pass effect to reach optimal heat, certainly, at least only having a perforation cooperates single heating column to act on.And fixed form also illustrates in figure to be utilized the hold- doun nut 51,52,53,54, also can adopt variety of ways such as riveted, joint, bonding or tight fit.
And the second embodiment of the present invention, see also Fig. 4, Fig. 5, shown in Figure 6, it makes up substantially, principle, concern roughly the same, do not repeat tired stating at this, only be that the mode that heating column changes with heat pipe 60 is replaced, has perforation 101 on the same circuit board 10,102 heating tubes 60 pass and connect radiator 20 and additional cooler 30, because of heat pipe 60 be difficult to as the heating column of first embodiment as fixing usefulness, so need designs fix hole 103,104 cooperate fixture 43,44, same, fixture 43,44 can lock for screw, riveted, engage, variety of ways such as bonding or tight fit, and quantity is not defined as two yet, the perforation 101 that identical heating tube 60 passes, 102 only need at least one just can, only need can transfer to the heat energy of radiator 20 additional cooler 30 and get final product.Because heat pipe 60 heat-conducting modes basically and non-thermal conductivity, so among second embodiment, the aperture of perforation 101,102 need not be limited greater than 125 mils (Mil).Be different from known employing and walk around the mode of circuit board, it is also poor that not only cost height, and heat passes effect, and the mode that the present invention utilizes heat pipe directly to pass circuit board can significantly improve heat and pass effect.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
1, a kind of circuit board with through-hole type heat radiation is characterized in that it comprises:
One circuit board has a relative first surface and a second surface, and this first surface has a chip, and is adjacent to this chip and has at least one perforation, and the diameter of this perforation is greater than 125 mils;
One radiator is installed in the first surface of this circuit board, and is positioned at this chip place, in order to the heat energy that this chip produced is dispelled the heat;
One additional cooler is installed in the second surface of this circuit board; And
One heat conducting element is installed in the perforation of this circuit board, and is communicated with this radiator and this additional cooler, and the heat energy that this chip produced can be transferred to this additional cooler.
2, the circuit board with through-hole type heat radiation according to claim 1 is characterized in that wherein said perforation is to be two, is symmetrical in this chip setting respectively.
3, the circuit board with through-hole type heat radiation according to claim 1 is characterized in that wherein said perforation is to be four, is symmetrical in this chip setting respectively.
4, the circuit board with through-hole type heat radiation according to claim 1 is characterized in that wherein circuit board more comprises at least one fixing hole.
5, the circuit board with through-hole type heat radiation according to claim 4 is characterized in that it more comprises the fixture corresponding to this fixing hole, in order to this radiator and additional cooler are fixed in this circuit board.
6, the circuit board with through-hole type heat radiation according to claim 1 is characterized in that it more comprises a hold-doun nut, is installed on this heating column, in order to this radiator and additional cooler are fixed in this circuit board.
7, the circuit board with through-hole type heat radiation according to claim 1 is characterized in that wherein said radiator and this additional cooler all have a plurality of radiating fins.
8, the circuit board with through-hole type heat radiation according to claim 1 is characterized in that wherein said heat conducting element is to be a heating column, and the diameter that cooperates the aperture of this perforation and this heating column is greater than 125 mils.
9, the circuit board with through-hole type heat radiation according to claim 8 is characterized in that wherein said heating column is constituted by metal material.
10, the circuit board with through-hole type heat radiation according to claim 1 is characterized in that wherein said heat conducting element is to be a heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510114248 CN1953642A (en) | 2005-10-21 | 2005-10-21 | Circuit board with through hole type heat radiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510114248 CN1953642A (en) | 2005-10-21 | 2005-10-21 | Circuit board with through hole type heat radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1953642A true CN1953642A (en) | 2007-04-25 |
Family
ID=38059674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510114248 Pending CN1953642A (en) | 2005-10-21 | 2005-10-21 | Circuit board with through hole type heat radiation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1953642A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107124849A (en) * | 2016-02-24 | 2017-09-01 | 讯凯国际股份有限公司 | Water-cooling system |
| CN109716877A (en) * | 2016-09-22 | 2019-05-03 | 罗伯特·博世有限公司 | Electronic building brick, in particular for hybrid electric vehicle or the (PCC) power of the electronics of electric vehicle |
| CN114023656A (en) * | 2022-01-06 | 2022-02-08 | 浙江里阳半导体有限公司 | Method and apparatus for manufacturing semiconductor device |
-
2005
- 2005-10-21 CN CN 200510114248 patent/CN1953642A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107124849A (en) * | 2016-02-24 | 2017-09-01 | 讯凯国际股份有限公司 | Water-cooling system |
| CN109716877A (en) * | 2016-09-22 | 2019-05-03 | 罗伯特·博世有限公司 | Electronic building brick, in particular for hybrid electric vehicle or the (PCC) power of the electronics of electric vehicle |
| US11051432B2 (en) | 2016-09-22 | 2021-06-29 | Robert Bosch Gmbh | Electronic module, in particular an electronic power module for hybrid vehicles or electric vehicles |
| CN114023656A (en) * | 2022-01-06 | 2022-02-08 | 浙江里阳半导体有限公司 | Method and apparatus for manufacturing semiconductor device |
| CN114023656B (en) * | 2022-01-06 | 2022-06-03 | 浙江里阳半导体有限公司 | Method and apparatus for manufacturing semiconductor device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20070425 |