CN201489433U - Heat sink for on-board computer - Google Patents
Heat sink for on-board computer Download PDFInfo
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- CN201489433U CN201489433U CN 200920133917 CN200920133917U CN201489433U CN 201489433 U CN201489433 U CN 201489433U CN 200920133917 CN200920133917 CN 200920133917 CN 200920133917 U CN200920133917 U CN 200920133917U CN 201489433 U CN201489433 U CN 201489433U
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- mounted computer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract
The utility model relates to a heat sink for an on-board computer, which is used for dissipating heat for a heating device on a main board of the on-board computer. The heat sink for an on-board computer comprises a heat sink and a fan installed on the heat sink, wherein a plurality of radiating fins are arranged on one side of the heat sink, and a concave part used for being in contact with the heating device is arranged on the other side of the heat sink. The heat sink for the on-board computer can perform special heat dissipation to the main heating device for the computer and enable the system to operate within the relatively reasonable temperature range, thereby ensuring the normal and stable running of the whole system and guaranteeing the safety and the stability of the system.
Description
Technical field
The utility model relates to the heat radiation field of computer, more particularly, relates to a kind of heat abstractor of vehicle-mounted computer.
Background technology
The parts of computing machine use integrated circuit in a large number.As everyone knows, high temperature is the formidable enemy of integrated circuit.High temperature not only can cause system's operation unstable, and shorten serviceable life, even some parts is burnt.Along with the enhancing of PC computing power, the continuous lifting of dominant frequency, power consumption and heat dissipation problem become does not day by day allow the problem of avoiding.The heat that causes high temperature is not from outside the computing machine, but computer-internal, or perhaps IC interior.In general, the thermal source in the PC mainly comes from CPU, mainboard (south bridge, north bridge and power circuit part), video card and miscellaneous part such as hard disk, CD-ROM drive etc., and the electric energy that consumes during their work has quite a few and is converted into heat.The working temperature that guarantees each component of computer remains in the reasonable range, must carry out radiating treatment to it.The effect of heating radiator is exactly with these heat absorption, diffuse in the cabinet then or cabinet outside, most heating radiators are by contacting with the heat generating components surface, absorb heat, by the whole bag of tricks heat transferred is arrived at a distance again, in the air in the cabinet, cabinet passes to these hot-airs outside the cabinet then, finishes the heat radiation of computing machine.
In thermodynamics, heat radiation is exactly a heat transferred.From microcosmic, after molecule is subjected to the outside energy impact in the zone, be passed to the low regional molecule of energy by the high regional molecule of energy, Here it is, and heat is transmitted, and the transfer mode of heat mainly contains three kinds of modes: heat conduction, thermal convection and heat radiation.
Heat conduction: material itself or when material contacted with material, the transmission of energy just was called as heat conduction, this is the most general a kind of thermaltransmission mode, particle and the energy higher particle direct contact-impact lower by energy transmit energy.Heat conducting fundamental formular is " Q=K * A * Δ T/ Δ L ".Wherein Q is represented as heat, the heat that just heat conduction produced or conducted; K is the heat-conduction coefficient of material, the area (or contact area of two articles) that the A representative is conducted heat in the formula, the temperature difference that Δ T represents two ends; Δ L then is the distance at two ends.Therefore, we just can find from formula, and big or small same heat-conduction coefficient, the hot heat transfer area of heat transferred are directly proportional, and same distance is inversely proportional to.Heat transfer coefficient is high more, area of heat transfer is big more, and the distance of transmission is short more, and so heat conducting energy is just high more, and also with regard to the easy more heat of taking away, for example: the mode that the direct contact zones of CPU radiating fin base and CPU are walked heat just belongs to heat conduction.
Thermal convection: convection current refers to fluid (gas or liquid) and contacts the thermaltransmission mode that causes fluid from solid surface the torrid zone to be walked with solid surface.Specifically be applied to reality, thermal convection has two kinds of different situations, that is: natural convection and forced convertion again.Natural convection refers to fluid motion, and the origin cause of formation is a temperature difference, and the fluid density that temperature is high is lower, so light weight, will move upward relatively.On the contrary, the fluid that temperature is low, therefore the density height moves downward, and this heat transmission is because after fluid is heated, exist in other words after the temperature difference, has produced the power of hot transmission; Forced convertion then is that fluid is subjected to external pressure to drive (as the air flow of fan drive), and where driving force is to, and where fluid just moves to, but so this thermal convection is more efficient and directive property." pressure thermal convection " radiating mode of the gas flow of radiator fan drive more commonly in the cooling system of computer housing.The formula of thermal convection is " Q=H * A * Δ T ".Q still represents heat in the formula, the heat that thermal convection is just taken away; H is a coefficient of heat convection value, and A then represents effective contact area of thermal convection; Δ T represents the temperature difference between solid surface and the regional fluid.Therefore in the conductive heat transfer, the same coefficient of heat convection of the quantity of heat transferred, effective contact area and temperature difference are proportional; High more, the effective contact area of the coefficient of heat convection is big more, temperature difference is high more, and the heat that can take away is also just many more.
Heat radiation: heat radiation be a kind of can be under situation without any medium, do not need contact, the transfer mode of heat interchange just can take place, that is to say, heat radiation is exactly to reach with the form of ripple the purpose of heat interchange in fact, daily modal be exactly solar radiation.
These three kinds of radiating modes do not isolate, and in daily heat transferred, these three kinds of radiating modes all are to take place simultaneously, concur.In fact, any heating radiator also all can use above three kinds of thermaltransmission modes simultaneously, just stresses different.With the CPU heat radiation is example, and heat is constantly come out by CPU work, and by being delivered to heat radiator with cooling fin fin base that its core closely contact in the mode of conducting, then, the heat of arrival heat radiator blows by other modes such as fan heat is seen off.The entire heat dissipation process comprises four processes: the firstth, and CPU is that thermal source produces the survivor; The secondth, heat radiator is the conductor of heat; The 3rd is fan, and being increases heat conduction and point to heat conducting media; The 4th is exactly air, and this is the final flow direction of heat interchange.
From the radiating mode of above heating radiator as can be known, not only with contact area, the distance dependent of heat radiator, also relevant with the pyroconductivity of radiator material, it is determined by radiator material the radiating efficiency of heating radiator.The heat radiator material is meant the employed concrete material of heat radiator.Every kind of its heat conductivility of material is different, arranges from high to low by heat conductivility, and be respectively silver, copper, aluminium, steel.Can be too expensive if but make heat radiator with silver; The thermal conductivity of copper is good, but price is more expensive, and difficulty of processing is higher, weight excessive (a lot of fine copper heating radiators have all surpassed the quantitative limitation of CPU counterweight), and thermal capacity is less, and oxidation easily; And fine aluminium is too soft, can not directly use; The heat conductivility of steel is too poor, and is not good as the heat radiator radiating effect.
Present radiating mode mainly contains wind-cooling heat dissipating, liquid cooling heat radiation, heat pipe heat radiation, semiconductor refrigerating, chemical refrigeration etc.
Wind-cooling heat dissipating is modal radiating mode, comparatively speaking, also is cheap mode.Wind-cooling heat dissipating just is to use fan belt to walk the heat that heating radiator absorbs from saying in fact.Advantages such as it is relatively low to have price, easy for installation.But environment is relied on than higher, for example temperature raises and during overclocking its heat dispersion will be greatly affected.
Liquid cooling heat radiation is a heat of taking away heating radiator by liquid forced circulation under the drive of pump, compares with air-cooled, have peace and quiet, cooling stable, environment is relied on little or the like advantage.The price of liquid cooling is higher relatively, and installation also bothers relatively.The method that as far as possible instructs to specifications when installing is simultaneously installed and could be obtained best radiating effect.For the consideration of cost and ease for use, the liquid cooling heat radiation adopts water as heat-conducting liquid usually, so liquid cooling heat radiator also usually is called as water-filled radiator.
Heat pipe belongs to a kind of heat transfer element, it has made full use of the Rapid Thermal hereditary property of heat-conduction principle and refrigeration filling, transmit heat by the evaporation of liquid in the Totally enclosed vacuum pipe with condensing, but the heat transfer area with high thermal conductivity, good isothermal, cold and hot both sides can change series of advantages such as remotely transferring, temperature controllable arbitrarily, and by the heat interchanger that heat pipe is formed have heat transfer efficiency height, compact conformation, advantages such as little are decreased in the fluid resistance.But production technology is relatively complicated, and cost is also than higher
Semiconductor refrigerating is exactly to utilize a kind of special semiconductor chilling plate to produce the temperature difference when energising to freeze, as long as the heat of temperature end can effectively dissipate, then low-temperature end just constantly is cooled.All produce the temperature difference on each semiconductor grain, a cooling piece is in series by tens such particles, thereby forms a temperature difference on two surfaces of cooling piece.Utilize this temperature difference phenomenon, cooperate air-cooled/water-cooled that temperature end is lowered the temperature, can obtain outstanding radiating effect.Semiconductor refrigerating has that cryogenic temperature is low, the reliability advantages of higher, it is subzero below 10 ℃ that the huyashi-chuuka (cold chinese-style noodles) temperature can reach, but cost is too high, and may Yin Wendu lowly excessively cause the CPU dewfall to cause short circuit, and the technology of present semiconductor chilling plate is also immature, and is practical inadequately.
So-called chemical refrigeration just is to use some ultralow temperature chemical substances, utilizes them to absorb a large amount of heats when melting and reduces temperature.This respect is to use dry ice and liquid nitrogen comparatively common.Such as using dry ice temperature can be reduced to subzero below 20 ℃, also have some overclocking fans to utilize liquid nitrogen that cpu temperature is dropped to subzero (in theory) below 100 ℃, certainly too short with the duration owing to costing an arm and a leg, this method is more common in laboratory or extreme overclocking fan.
According to above analysis the mode of suitable vehicle-mounted computer be wind-cooling heat dissipating, but the heat radiation to vehicle-mounted computer does not have a good selection at present, be subjected to the restriction of automobile mobility and interior space, the heat radiator of general computer radiator is also inapplicable concerning vehicle-mounted computer, if therefore wanting vehicle-mounted computer has a good radiating effect, the heating radiator of a suitable vehicle-mounted computer special use of exploitation is those skilled in the art's problem demanding prompt solutions.
The utility model content
The technical problems to be solved in the utility model is, heat abstractor at above-mentioned existing vehicle-mounted computer, be subjected to the restriction of automobile mobility and interior space, the shortcoming that the heat radiator of general computer radiator can not be suitable for, a kind of heat abstractor of vehicle-mounted computer is provided, at the vehicle-mounted computer design, can carry out efficiently radiates heat to the main heater members of vehicle-mounted computer.
The technical scheme that its technical matters that solves the utility model adopts is: the heat abstractor that a kind of vehicle-mounted computer is provided, be used for the heater members on the vehicle-mounted computer mainboard is dispelled the heat, comprise: heating radiator and be installed on fan on the heating radiator, one side of described heating radiator is provided with the several piece heat radiator, and opposite side is provided with and is used for and the contacted depressed part of described heater members.
In the heat abstractor of vehicle-mounted computer described in the utility model, described heating radiator comprises the base plate suitable with computer main board, and described heat radiator is installed on a side of base plate, and described depressed part is arranged at the opposite side of base plate.
In the heat abstractor of vehicle-mounted computer described in the utility model, described depressed part is provided with the groove that is respectively applied for CPU, north bridge chips, South Bridge chip and the clock chip of setting in the heater members.
In the heat abstractor of vehicle-mounted computer described in the utility model, described groove is used for being coated with the thermal grease layer on the surface of contact of contact heating device.
In the heat abstractor of vehicle-mounted computer described in the utility model, the middle part of described heating radiator is provided with mounting groove, and described fan is installed in the mounting groove, and described several piece heat radiator is provided with around this mounting groove.
In the heat abstractor of vehicle-mounted computer described in the utility model, the bottom of described mounting groove is provided with several fan hole, and described fan hole is a through hole, connects the base plate of heating radiator.
In the heat abstractor of vehicle-mounted computer described in the utility model, described heat radiator is flakey.
In the heat abstractor of vehicle-mounted computer described in the utility model, the heat radiation scale of described heat radiator for adopting aluminium alloy to make.
In the heat abstractor of vehicle-mounted computer described in the utility model, the size and the arragement direction of described heat radiator are inconsistent, to form the flow direction of air-flow.
In the heat abstractor of vehicle-mounted computer described in the utility model, the heat abstractor of described vehicle-mounted computer also comprises the fan radome, and the fan radome is installed on the described fan.
The beneficial effect of the heat abstractor of vehicle-mounted computer of the present utility model: at first, adopt aluminum alloy materials, good heat dissipation effect is convenient to processing, low price; Secondly, heating radiator has and mainboard area of dissipation of a size, area of dissipation is big, when the main heater members to vehicle-mounted computer dispels the heat effectively, other heater members of mainboard is also had good thermolysis; Once more, adopt the forced convertion mode of fan, form the convection current of cold and hot air, adopt the heat radiator of unique scale design at a lateral root of the mainboard dorsad of heating radiator according to its air flow direction, have that area of dissipation is big, the advantage of rapid heat dissipation; In sum, the utility model can carry out special heat radiation to the main heater members of computer, make system works within a relatively reasonable temperature range, thereby guarantee that total system can normally stable operation, safety and stability that can safeguards system.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the structural representation that the main heater members of vehicle-mounted computer is installed on mainboard;
Fig. 2 is the front view of Fig. 1;
Fig. 3 is the perspective exploded view of the heat abstractor of vehicle-mounted computer of the present utility model;
Fig. 4 is the combination synoptic diagram of Fig. 3;
Fig. 5 is the front view of Fig. 4
Fig. 6 is the side view of Fig. 4;
Fig. 7 is the heat abstractor of vehicle-mounted computer shown in Figure 3 and the scheme of installation of mainboard.
Embodiment
Fig. 1 is the synoptic diagram that the main heater members of vehicle-mounted computer is installed on mainboard, and Fig. 2 is that the master of Fig. 1 looks detailed structure figure; The mainboard 1 of the vehicle-mounted computer of Figure 1 and Figure 2 is for the special-purpose mainboard of vehicle-mounted computer exploitation, mainly is made up of CPU 11, north bridge chips 12, South Bridge chip 13, clock chip 14, peripheral interface circuit and other power supply apparatus etc.
As shown in Figure 3, the heat abstractor 10 of vehicle-mounted computer of the present utility model, be used for the heater members on the mainboard 1 of vehicle-mounted computer is dispelled the heat, want to mainly contain which heater members in the analysis computer operational process on the mainboard 1 for this reason, design the concrete structure of the heat abstractor 10 of described vehicle-mounted computer with this:
Consult Fig. 1 and Fig. 2, at present the thermal source of the maximum of the mainboard 1 of vehicle-mounted computer comes from CPU 11, and along with the increase of the powerful and dominant frequency of its function, its power is constantly increase also.It is relevant with the structure of CPU 11 to trace it to its cause.The most basic composition unit is a metal-oxide-semiconductor among the CPU 11, and the technology of present CPU 11 generally is divided into CMOS (adopting the MOSFET pipe) and bi-CMOS (adopting the bi-polar pipe).Be to be to make transistor on the raw material with silicon in the manufacture process of CPU 11, being covered with silicon dioxide is insulation course, cloth plain conductor on insulation course then, and independently transistor connects into the working cell.CPU 11 for the manufacturing of CMOS technology, electric current can produce energy consumption from source electrode to passing through of drain electrode, and for bi-CMOS technology, energy consumption occurs in the process that electric current passes through double PN junction, though once pass through such, the energy consumption that produces is very little, at present CPU 11 inside integrated several easily ten million and even more than one hundred million transistors, make total energy consumption reach a suitable height, and from transistorized principle of work we can know, when frequency high more, transistorized work is frequent more, electric current number of times by a gate circuit in the same clock period also can increase thereupon, and frequency that Here it is is high more, the reason that the thermal value of CPU 11 is also big more.Come out from CPU 11 inside and these energy consumptions finally convert heat to, make CPU 11 " heating ".And the reason that CPU 11 can crash even burn in high temperature, as everyone knows, on the very high plain conductor of chip internal strength of current, the certain momentum of metallic atom is given in the mobile meeting of electronics, under normal situation, metallic atom can not rely on this momentum to leave its original position, but after temperature raises, metallic atom can possess big momentum owing to heat energy, the momentum that this part momentum and electronics flow and given, be enough to make metallic atom to break away from gravitation between metallic atom, along with electric current flows everywhere, electron transfer phenomenon that we often mentioned that Here it is.CPU 11 inside are to rely on 0,1 two kinds of level signals operate and communicate by letter, when too much metallic atom during in CPU 11 internal flows, the current signal of CPU 11 inside will be interfered, because CPU 11 inside itself possess perfect mechanism for correcting errors, can sacrifice a part of performance in beginning fashion and get rid of these interference, if temperature continues to raise or CPU 11 continues to be in hot environment work, such interference will continue to increase, the mechanism for correcting errors of CPU 11 inside is unable to cope with, thereby caused CPU 11 to quit work system in case of system halt.And if CPU 11 inside are under the hot environment for a long time, will form cavity or hillock because of electron transfer causes the core-wire road surfaces.This is an irreversible permanent injury, even it is individual process slowly.When running up to certain the time, also can form the short circuit of core internal circuit, so chip rejection.Such process is the ageing process of our usual said electronic component just.The reason that CPU 11 burns is explained simpler relatively, because the high integration of CPU 11, element that it is inner or communication line all are minimum (having arrived nanoscale now), when temperature be elevated to manufactured materials itself the scope that can not bear, tiny element also can burn naturally thereupon.Other main radiating element yes South Bridge chip 13 and north bridge chips 12 on the mainboard 1, because South Bridge chip 13 is computer and extraneous communication interface, therefore its working load has just been well imagined, and north bridge chips 12 is mainly being born the task of screen and Flame Image Process, its heating is only second to CPU 11, and the power supply apparatus heating on the mainboard 1 also can not be ignored certainly.
Thereby, shown in Fig. 3-6, the heat abstractor 10 of vehicle-mounted computer of the present utility model, comprise heating radiator 2, described heating radiator 2 comprises base plate 22 and is located at several piece heat radiator 23 on the base plate 22, the base plate 22 of described heating radiator 2 is big or small consistent with mainboard 1, and heating radiator 2 overlaps together fully with mainboard 1.And, the heat abstractor 10 of vehicle-mounted computer of the present utility model is fixed on the dead astern of cabinet (not shown), can be used as simultaneously the bonnet design of cabinet again, when vehicle-mounted computer is fixed on automobile console position, when winning expensive real estate for vehicle-mounted computer design, make the heating radiator and the external world have one to contact completely, help heat radiation.
Analyze according to the mode of taking away heat from heating radiator, if be dispersed into the heat that thermal source such as CPU11 produce in the air naturally by heat radiator 23, the effect of its heat radiation is directly proportional with heat radiator 23 sizes, because be the nature distribute heat, effect is had a greatly reduced quality certainly, usually be used in those equipment that space is not required, perhaps be used to the little parts heat radiation of thermal value, the heat that heat radiator 23 sends is taken away by heat dissipation equipments such as fans mandatoryly, be characterized in the radiating efficiency height, and equipment volume is little.At above consideration; the utility model comprises the fan 3 that is installed on the heating radiator 2; the middle part of described heating radiator 2 is provided with mounting groove 24; described fan 3 is installed in the mounting groove 24; add a fan 3 at the middle part of heating radiator 2; allow the air of total system form convection current; thereby reach the purpose of quick heat radiating; in addition; the heat abstractor of described vehicle-mounted computer also can further comprise fan radome (not shown); the fan radome is installed on the described fan 3, and the cabling of miscellaneous part or barrier hinder the rotation of fan in the time of can preventing to install, and plays the purpose of protection fan 3.
Further, described several piece heat radiator 23 is provided with around this mounting groove 24, and the bottom of described mounting groove 24 is provided with several fan hole 25, and fan hole 25 is a through hole, connects the base plate 22 of heating radiator 2; Specifically, in order to enlarge area of dissipation, the air flow direction of one lateral root of the mainboard dorsad 1 of heating radiator 2 during according to computer work adopts several heat radiator 23 that are unique scales design to accelerate distributing of heat, the size and the arragement direction of heat radiator 23 are inconsistent, adopt the forced convertion mode of fan 3, form the convection current of cold and hot air, it is big to have area of dissipation, the advantage of rapid heat dissipation, in addition, the heat radiator 23 of described heating radiator 2 adopts aluminum alloy material, it not only can provide enough hardness, and cheap, in light weight, and have good performance of heat dissipation and easy machining characteristics.
Consult Fig. 4 and Fig. 7, in order to guarantee that heater members main on the mainboard 1 can touch heating radiator 2 fully, heating radiator 2 adopts concavo-convex setting with the surface of contact of mainboard 1, in the position that processes the main radiating element on the mainboard 1 on the heat radiator 23, and coat thermal grease in the contact site, guarantee that heating radiator 2 contacts fully with mainboard 1 main radiating element, reach a better heat radiating effect.Thereby, the base plate 22 of described heating radiator 2 dorsad heat radiator 23 a side be provided be used for described mainboard 1 on the contacted depressed part of heater members, described depressed part is CPU groove 26, the north bridge chips groove 27 that is used to set north bridge chips 12, the South Bridge chip groove 28 that is used to set South Bridge chip 13 that is respectively applied for the CPU 11 that sets in the heater members, the clock chip groove 29 that is used to set clock chip 14, and above-mentioned groove is used for being coated with the thermal grease layer on the surface of contact of contact heating device.
The heat abstractor of vehicle-mounted computer of the present utility model has following advantage: at first, adopt aluminum alloy materials, good heat dissipation effect is convenient to processing, low price; Secondly, heating radiator 2 has and mainboard 1 area of dissipation of a size, area of dissipation is big, when the main heater members of vehicle-mounted computer is dispelled the heat effectively, mainboard 1 other heater members is also had good thermolysis; Once more, adopt the forced convertion mode of fan 3, form the convection current of cold and hot air, adopt the heat radiator 23 of unique scale design at a lateral root of the mainboard dorsad 1 of heating radiator 2 according to its air flow direction, have that area of dissipation is big, the advantage of rapid heat dissipation.In sum, the utility model carries out special heat radiation at the main heater members of computer, makes system works within a relatively reasonable temperature range, thereby guarantees that total system can normally stable operation, safety and stability that can safeguards system.
The above; it only is the preferable embodiment of the utility model; but protection domain of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement all should be encompassed within the protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with the protection domain of claim.
Claims (10)
1. the heat abstractor of a vehicle-mounted computer, be used for the heater members on the vehicle-mounted computer mainboard is dispelled the heat, comprise: heating radiator (2) and be installed on fan (3) on the heating radiator (2), it is characterized in that, one side of described heating radiator (2) is provided with several piece heat radiator (23), and opposite side is provided with and is used for and the contacted depressed part of described heater members.
2. the heat abstractor of vehicle-mounted computer according to claim 1, it is characterized in that, described heating radiator (2) comprises the base plate suitable with computer main board (22), and described heat radiator (23) is installed on a side of base plate (22), and described depressed part is arranged at the opposite side of base plate (22).
3. the heat abstractor of vehicle-mounted computer according to claim 1 and 2 is characterized in that, described depressed part is provided with the groove that is respectively applied for CPU (11), north bridge chips (12), South Bridge chip (13) and the clock chip (14) of setting in the heater members.
4. the heat abstractor of vehicle-mounted computer according to claim 3 is characterized in that, described groove is used for being coated with the thermal grease layer on the surface of contact of contact heating device.
5. the heat abstractor of vehicle-mounted computer according to claim 1, it is characterized in that, the middle part of described heating radiator (2) is provided with mounting groove (24), and described fan (3) is installed in the mounting groove (24), and described several piece heat radiator (23) is provided with around this mounting groove (24).
6. the heat abstractor of vehicle-mounted computer according to claim 5 is characterized in that, the bottom of described mounting groove (24) is provided with several fan hole (25), and described fan hole (25) is a through hole, connects the base plate (22) of heating radiator (2).
7. the heat abstractor of vehicle-mounted computer according to claim 1 is characterized in that, described heat radiator (23) is flakey.
8. according to the heat abstractor of claim 1 or 7 described vehicle-mounted computers, it is characterized in that the heat radiation scale of described heat radiator (23) for adopting aluminium alloy to make.
9. the heat abstractor of vehicle-mounted computer according to claim 1 is characterized in that, the size and the arragement direction of described heat radiator (23) are inconsistent.
10. the heat abstractor of vehicle-mounted computer according to claim 1 is characterized in that, the heat abstractor of described vehicle-mounted computer also comprises the fan radome, and the fan radome is installed on the described fan (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920133917 CN201489433U (en) | 2009-07-15 | 2009-07-15 | Heat sink for on-board computer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200920133917 CN201489433U (en) | 2009-07-15 | 2009-07-15 | Heat sink for on-board computer |
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| CN201489433U true CN201489433U (en) | 2010-05-26 |
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| CN 200920133917 Expired - Fee Related CN201489433U (en) | 2009-07-15 | 2009-07-15 | Heat sink for on-board computer |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102184003A (en) * | 2011-05-23 | 2011-09-14 | 哈尔滨海铭科技有限公司 | On-board computer integral heat-dissipation structure based on 2DIN ( Deutsches Institut fur Normung) |
| CN104684356A (en) * | 2014-12-26 | 2015-06-03 | 广东威创视讯科技股份有限公司 | Heat radiation structure and LED (light emitting diode) splicing display screen |
| CN104780743A (en) * | 2013-03-06 | 2015-07-15 | 华为技术有限公司 | Radio frequency zoom-out module and communication device |
| CN106211704A (en) * | 2015-05-08 | 2016-12-07 | 技嘉科技股份有限公司 | Knockdown radiating module |
| CN107517570A (en) * | 2017-09-04 | 2017-12-26 | 国网浙江杭州市余杭区供电公司 | A kind of heat dissipating method of heat abstractor for communication equipment |
| CN107957754A (en) * | 2017-12-13 | 2018-04-24 | 金华芒果信息技术有限公司 | There is the computer cabinet of lineation storage |
| EP4145967A4 (en) * | 2020-04-29 | 2024-07-03 | Kmw Inc | Heat dissipation device and antenna assembly using same |
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2009
- 2009-07-15 CN CN 200920133917 patent/CN201489433U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102184003A (en) * | 2011-05-23 | 2011-09-14 | 哈尔滨海铭科技有限公司 | On-board computer integral heat-dissipation structure based on 2DIN ( Deutsches Institut fur Normung) |
| CN104780743A (en) * | 2013-03-06 | 2015-07-15 | 华为技术有限公司 | Radio frequency zoom-out module and communication device |
| CN104780743B (en) * | 2013-03-06 | 2018-04-20 | 华为技术有限公司 | Radio frequency remoto module and communication equipment |
| US10219406B2 (en) | 2013-03-06 | 2019-02-26 | Huawei Technologies Co., Ltd. | Radio remote unit and communications device |
| US10757832B2 (en) | 2013-03-06 | 2020-08-25 | Huawei Technologies Co., Ltd. | Radio remote unit and communications device |
| CN104684356A (en) * | 2014-12-26 | 2015-06-03 | 广东威创视讯科技股份有限公司 | Heat radiation structure and LED (light emitting diode) splicing display screen |
| CN104684356B (en) * | 2014-12-26 | 2018-12-11 | 广东威创视讯科技股份有限公司 | A kind of radiator structure and LED mosaic display screen |
| CN106211704A (en) * | 2015-05-08 | 2016-12-07 | 技嘉科技股份有限公司 | Knockdown radiating module |
| CN107517570A (en) * | 2017-09-04 | 2017-12-26 | 国网浙江杭州市余杭区供电公司 | A kind of heat dissipating method of heat abstractor for communication equipment |
| CN107957754A (en) * | 2017-12-13 | 2018-04-24 | 金华芒果信息技术有限公司 | There is the computer cabinet of lineation storage |
| EP4145967A4 (en) * | 2020-04-29 | 2024-07-03 | Kmw Inc | Heat dissipation device and antenna assembly using same |
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| C14 | Grant of patent or utility model | ||
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Granted publication date: 20100526 Termination date: 20180715 |