CN100463148C - Heat radiator - Google Patents
Heat radiator Download PDFInfo
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- CN100463148C CN100463148C CNB2005101017763A CN200510101776A CN100463148C CN 100463148 C CN100463148 C CN 100463148C CN B2005101017763 A CNB2005101017763 A CN B2005101017763A CN 200510101776 A CN200510101776 A CN 200510101776A CN 100463148 C CN100463148 C CN 100463148C
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- heat
- sensing element
- temperature
- base circuit
- semiconductor cooler
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Abstract
This invention relates to dissipation device, which is to dissipate heat of electron parts and comprises one conductor, one semiconductor cooling device, one sensor and one temperature controller, wherein, the said conductor is to absorb the heat of electron; the said semiconductor cooling is to transfer heat to outside; the said sensor is to monitor heat electron temperature to feed back temperature data through sensor; the temperature controller is to control cooling status to control the electron part temperature.
Description
[technical field]
The present invention relates to a kind of heat abstractor, particularly a kind of device that is used for to heat-generating electronic elements heat radiation.
[background technology]
In computer system or server system, for heat-generating electronic elements, as central processing unit (Central Processing Unit, CPU) heat radiation is normally used a radiator and is carried out radiating and cooling, if existing C PU radiator by with the fin that CPU directly contacts heat being drawn, utilizes the fan blow air to flow through then and heat is taken away.But the fin of this cpu heat directly contacts with CPU, and the temperature difference of itself and air is little, thereby it is not fine causing radiating effect, if ambient temperature is too high, its radiating effect is will be more bad so, be easy to cause system speed slack-off, crash, burn consequence such as CPU.
Please refer to Fig. 1, Chinese patent application has disclosed a kind of semiconductor cpu heat 100 No. 03154197.6, it comprises heat carrier 140, semiconductor cooler 150 and thermal insulation board 160, described semiconductor cooler 150 is finished heat by the heat carrying work of heat carrier 140 to radiator 120, wherein heat carrier 140 surface remove with CPU130, semiconductor cooler 150 contact portions other exposed surface by thermal insulation board 160 coverings, wherein fan 110 blow air flow through radiator 120 and heat are taken away.
Though above-mentioned semiconductor cpu heat 100 has improved radiating efficiency, yet, its described thermal insulation board 160 can be in the alternating state that cold and hot temperature differs greatly when CPU130 works, so just be difficult to guarantee to remain excellent contact between thermal insulation board 160 and the heat carrier 140, if loose contact just is easy to cause the condensation phenomenon under low temperature condition.This semiconductor cpu heat 100 can make CPU130 always work in the lower state of temperature when work, might not be good more but temperature is low more to CPU130, and described semiconductor cooler 150 also is continual work when CPU130 works, and its life-span also can not get good assurance like this.
[summary of the invention]
In view of above content, be necessary to provide a kind of heat abstractor, make its refrigerating function that can effectively utilize semiconductor cooler, to reach the purpose of well dispelling the heat to heat-generating electronic elements.
A kind of heat abstractor, be used for dispelling the heat to a heat-generating electronic elements, it comprises a heat carrier and semiconductor refrigerator, described heat carrier is used for absorbing the heat of described heat-generating electronic elements, described semiconductor cooler is used for arriving the transfer of heat that described heat carrier absorbs extraneous, described heat abstractor also comprises a transducer and a temperature controller, described transducer is used for monitoring the temperature of described heat-generating electronic elements, temperature data by described sensor feedback, described temperature controller is controlled the refrigerating state of described semiconductor cooler, further control the temperature of described heat-generating electronic elements, described temperature controller comprises a power supply and basic circuit for the moment, described transducer links to each other with described time-base circuit, described semiconductor cooler links to each other with described power supply, to the power supply of described semiconductor cooler whether described time-base circuit receives the signal of described transducer, and correspondingly export the high-low level signal to control described power supply.
Compared to prior art, described semiconductor cooler is carried out the control of refrigerating state by described transducer and described temperature controller, make heat-generating electronic elements be operated in a preferable operating temperature range, so just can not cause heat-generating electronic elements too high or too low for temperature, thereby make the heat-generating electronic elements can operate as normal, also avoided simultaneously the generation of condensation phenomenon, can make the semiconductor cooler need not continual always work again, improve the useful life of semiconductor cooler, also saved electric energy to a certain extent.
[description of drawings]
The present invention is further illustrated in conjunction with embodiment below with reference to accompanying drawing.
Fig. 1 is the schematic diagram of existing a kind of heat abstractor.
Fig. 2 is the schematic diagram of the better embodiment of a kind of heat abstractor of the present invention.
Fig. 3 is the circuit theory diagrams of the better embodiment of a kind of heat abstractor of the present invention.
[embodiment]
Please common reference Fig. 2 and Fig. 3, heat abstractor 200 of the present invention is used for to a heat-generating electronic elements, as central processing unit 230 heat radiations, its better embodiment comprises a fan 210, a radiator 220, a heat carrier 240, semiconductor refrigerator 250, a transducer, reaches a temperature controller 280 (temperature controller 280 can be arranged on the utilized space of mainboard), and described transducer comprises one first sensing element 260 and one second sensing element 270.
Wherein, central processing unit 230 closely contacts (scribbling thermal grease usually between the two) with a side of heat carrier 240, the opposite side of heat carrier 240 closely contacts with a side of semiconductor cooler 250 heat absorptions, first sensing element 260 and second sensing element 270 all closely contact with heat carrier 240, present embodiment heat carrier 240 has one first recess 242 and one second recess 244, first sensing element 260 and second sensing element 270 lay respectively in first recess 242 and second recess 244, the one side installing radiator 220 of the heat release of described semiconductor cooler 250, installing fan 210 on the radiator 220.
Described heat carrier 240 is used for absorbing the heat of central processing unit 230, described semiconductor cooler 250 is used for arriving the transfer of heat that described heat carrier 240 absorbs extraneous, described first sensing element 260 and second sensing element 270 are used for monitoring the temperature of described central processing unit 230, described temperature controller 280 is connected with described first sensing element 260 and second sensing element 270, and control the refrigerating state of described semiconductor cooler 250 by the temperature data of described first sensing element 260 and second sensing element 270 feedback, further control the temperature of described central processing unit 230, the temperature of described central processing unit 230 is controlled in the preferable scope, described radiator 220 is used for that described semiconductor cooler 250 is transferred to extraneous heat and draws, and described fan 210 is used for that blow air flows through and the heat of drawing is taken away.
According to actual conditions, the preferable working range of every kind of heat-generating electronic elements is also different, present embodiment is that example is illustrated with preferable working range at 15～40 ℃ central processing unit 230, whether described first sensing element 260 is used for monitoring central processing unit 230 and is in more than 40 ℃, when central processing unit 230 is in more than 40 ℃, then described temperature controller 280 will be controlled described semiconductor cooler 250 and begin refrigeration, thereby make central processing unit 230 fast coolings.Whether described second sensing element 270 is used for monitoring central processing unit 230 and is in below 15 ℃, when central processing unit 230 is in below 15 ℃, then described temperature controller 280 will be controlled described semiconductor cooler 250 and stop refrigeration, thereby make central processing unit 230 stop cooling.Described temperature controller 280 is controlled described semiconductor cooler 250 by the feedback of first sensing element 260 and second sensing element 270, and described central processing unit 230 is operated in 15～40 ℃ the preferable working range.
In the present embodiment, described first sensing element 260 and second sensing element 270 are thermistor, described temperature controller 280 comprises a power Vcc (can directly utilize the power supply on the mainboard), for the moment a basic circuit U (selecting the NE555 time-base circuit here for use) and a field effect transistor Q, the two ends of described first sensing element 260 join with THOLD end and the described power Vcc of described time-base circuit U respectively, the two ends of second sensing element 270 join with TRIG end and the described power Vcc of described time-base circuit U respectively, the OUT end of described time-base circuit U joins with the grid of described field effect transistor Q, the earth terminal of the drain electrode of described field effect transistor Q and described semiconductor cooler 250 joins, the source ground of described field effect transistor Q, the power end of described semiconductor cooler 250 and described power Vcc are joined.
Wherein, the one first temperature adjustment rheostat RP1 that also connects between the THOLD end that described first sensing element 260 and described time-base circuit U join and the ground is used for adjusting ceiling temperature; The one second temperature adjustment rheostat RP2 that also connects between the TRIG end that described second sensing element 270 and described time-base circuit U join and the ground is used for adjusting lower limit temperature; The electric capacity of the dacron of also connecting between the CVOLT of described time-base circuit U end and the ground is used for reducing the high frequency noise jamming; The series circuit that also is connected one first resistance R 1 and one first light-emitting diode D1 between the grid of described power Vcc and described field effect transistor Q, also be connected the series circuit of one second resistance R 2 and one second light-emitting diode D2 between the grid of described field effect transistor Q and the ground, be used to refer to temperature variations.
Because the preferable working range of the central processing unit 230 of present embodiment between 15～40 ℃, need be adjusted the bound temperature (promptly 40 ℃ and 15 ℃) that first sensing element 260 and second sensing element 270 are monitored.At first adjust 40 ℃ of ceiling temperatures, first sensing element 260 is placed 40 ℃ of environment (detecting with thermometer), back (first sensing element 260 reaches heat balance with environment) after one minute, adjust the first temperature adjustment rheostat RP1 till the first light-emitting diode D1 is just luminous, the repeatedly accent several times more.Adjust 15 ℃ of lower limit temperatures then, second sensing element 270 is placed 15 ℃ of environment, after one minute, adjust the second temperature adjustment rheostat RP2 till the second light-emitting diode D2 is just luminous, also to adjust repeatedly several times, promptly can be used to after the bound temperature is all adjusted to central processing unit 230 heat radiations.
When described central processing unit 230 is worked, when central processing unit 230 temperature rise to 40 ℃ of ceiling temperatures, then the OUT of time-base circuit U end is with output low level, the first light-emitting diode D1 is luminous, described field effect transistor Q will be in the saturation region this moment, and described semiconductor cooler 250 will begin refrigeration so that central processing unit 230 coolings.When central processing unit 230 temperature drop to 15 ℃ of lower limit temperatures, then the OUT of time-base circuit U end will be exported high level, the second light-emitting diode D2 is luminous, described field effect transistor Q will be in cut-off region this moment, and described semiconductor cooler 250 will stop refrigeration so that central processing unit 230 no longer continues cooling.
Described temperature controller 280 by described first sensing element 260 and second sensing element, 270 better controlled the operating state of described semiconductor cooler 250, and the temperature that makes described central processing unit 230 is controlled in the preferable scope (15～40 ℃), central processing unit 230 neither can cause the slack-off or deadlock of system speed because temperature is too high like this, can be because of the low excessively condensation that causes of temperature yet, semiconductor cooler 250 can be not in running order always simultaneously, thereby improved its useful life, also saved electric energy to a certain extent.
Claims (11)
1. heat abstractor, be used for dispelling the heat to a heat-generating electronic elements, it comprises a heat carrier and semiconductor refrigerator, described heat carrier is used for absorbing the heat of described heat-generating electronic elements, described semiconductor cooler is used for arriving the transfer of heat that described heat carrier absorbs extraneous, it is characterized in that: described heat abstractor also comprises a transducer and a temperature controller, described transducer is used for monitoring the temperature of described heat-generating electronic elements, temperature data by described sensor feedback, described temperature controller is controlled the refrigerating state of described semiconductor cooler, further control the temperature of described heat-generating electronic elements, described temperature controller comprises a power supply and basic circuit for the moment, described transducer links to each other with described time-base circuit, described semiconductor cooler links to each other with described power supply, to the power supply of described semiconductor cooler whether described time-base circuit receives the signal of described transducer, and correspondingly export the high-low level signal to control described power supply.
2. heat abstractor as claimed in claim 1, it is characterized in that: described heat abstractor also comprises a radiator and a fan, described radiator is used for that described semiconductor cooler is transferred to extraneous heat and draws, and described fan is used for that blow air flows through and the heat of drawing is taken away.
3. heat abstractor as claimed in claim 1, it is characterized in that: described transducer comprises one first sensing element and one second sensing element, and described first sensing element and second sensing element are used for monitoring ceiling temperature and the lower limit temperature that needs the described heat-generating electronic elements temperature range of control respectively.
4. heat abstractor as claimed in claim 3 is characterized in that: described heat carrier has one first recess and one second recess, and described first sensing element and second sensing element lay respectively in described first recess and second recess.
5. as claim 3 or 4 described heat abstractors, it is characterized in that: described first sensing element and second sensing element are thermistor.
6. heat abstractor as claimed in claim 3, it is characterized in that: described temperature controller also comprises a field effect transistor, the two ends of described first sensing element and second sensing element join with described time-base circuit and described power supply respectively, the grid of described time-base circuit and described field effect transistor joins, the drain electrode of described field effect transistor and the earth terminal of described semiconductor cooler join, the source ground of described field effect transistor, the power end of described semiconductor cooler and described power supply join.
7. heat abstractor as claimed in claim 6, it is characterized in that: the one second temperature adjustment rheostat of also connecting between the end that the one first temperature adjustment rheostat of also connecting between the end that described first sensing element and described time-base circuit join and the ground, described second sensing element and described time-base circuit join and the ground.
8. heat abstractor as claimed in claim 1 is characterized in that: described time-base circuit is the NE555 time-base circuit.
9. heat abstractor as claimed in claim 8 is characterized in that: the electric capacity of the dacron of also connecting between described time-base circuit and the ground.
10. heat abstractor as claimed in claim 6, it is characterized in that: also be connected the series circuit of one first resistance and one first light-emitting diode between the grid of described power supply and described field effect transistor, also be connected the series circuit of one second resistance and one second light-emitting diode between the grid of described field effect transistor and the ground.
11. heat abstractor as claimed in claim 1, it is characterized in that: described temperature controller also comprises an electric switch, first end of the output of described time-base circuit and described electric switch joins, second end of described electric switch and the earth terminal of described semiconductor cooler join, the 3rd end ground connection of described electric switch, the power end of described semiconductor cooler and described power supply join, when the output output low level of described time-base circuit or high level, described electric switch is in conducting and cut-off state respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101017763A CN100463148C (en) | 2005-11-25 | 2005-11-25 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101017763A CN100463148C (en) | 2005-11-25 | 2005-11-25 | Heat radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1971889A CN1971889A (en) | 2007-05-30 |
| CN100463148C true CN100463148C (en) | 2009-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101017763A Expired - Fee Related CN100463148C (en) | 2005-11-25 | 2005-11-25 | Heat radiator |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101276795B (en) * | 2008-04-21 | 2010-04-07 | 日月光半导体制造股份有限公司 | Semiconductor encapsulation construction |
| EP2175484A1 (en) * | 2008-10-07 | 2010-04-14 | Koninklijke Philips Electronics N.V. | Power semiconductor device adaptive cooling assembly |
| JP5192469B2 (en) * | 2009-09-30 | 2013-05-08 | 株式会社日立製作所 | Electronic equipment cooling structure |
| CN102176377A (en) * | 2011-01-31 | 2011-09-07 | 李纯廉 | Method for controlling temperature of electrolytic capacitor and temperature-controllable electrolytic capacitor using same |
| CN105667422B (en) * | 2016-01-07 | 2019-01-25 | 广州广汽比亚迪新能源客车有限公司 | Auto idle speed abnormal dither adjustment device and automobile based on semiconductor chilling plate |
| CN108807314A (en) * | 2018-07-30 | 2018-11-13 | 紫光股份有限公司 | A kind of semiconductor refrigeration radiating device for central processing unit (CPU) chip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076219A (en) * | 2000-08-29 | 2002-03-15 | Morix Co Ltd | Device and method for controlling cpu temperature |
| CN2505982Y (en) * | 2001-11-28 | 2002-08-14 | 西安威尔电子有限责任公司 | IC chip operating temperature range controlling and protecting equipment |
| US6748746B2 (en) * | 2001-07-18 | 2004-06-15 | Fujitsu Quantum Devices Limited | Device and method for controlling temperature of semiconductor module |
| JP2004266145A (en) * | 2003-03-03 | 2004-09-24 | Okano Electric Wire Co Ltd | Cooling device |
-
2005
- 2005-11-25 CN CNB2005101017763A patent/CN100463148C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076219A (en) * | 2000-08-29 | 2002-03-15 | Morix Co Ltd | Device and method for controlling cpu temperature |
| US6748746B2 (en) * | 2001-07-18 | 2004-06-15 | Fujitsu Quantum Devices Limited | Device and method for controlling temperature of semiconductor module |
| CN2505982Y (en) * | 2001-11-28 | 2002-08-14 | 西安威尔电子有限责任公司 | IC chip operating temperature range controlling and protecting equipment |
| JP2004266145A (en) * | 2003-03-03 | 2004-09-24 | Okano Electric Wire Co Ltd | Cooling device |
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| CN1971889A (en) | 2007-05-30 |
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Granted publication date: 20090218 Termination date: 20101125 |