TWI590745B - Heat dissipation device and method for controlling the same - Google Patents

Description

Thermal module and method for controlling the same

The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for dissipating heat from a heat-generating electronic component.

With the continuous improvement of the power of heat-generating electronic components such as central processing units (CPUs), the problem of heat dissipation has received more and more attention. This is especially true in computers, in order to efficiently remove the heat generated by the system in a limited space. The industry mainly uses a heat dissipation module consisting of a heat absorbing plate, a heat pipe, a heat sink fin and a fan, and mounts it on the CPU, so that the heat absorbing plate is in good contact with the CPU to absorb the heat generated by the CPU. The heat conduction path of the method is: the heat generated by the CPU is transmitted to the heat dissipation fins through the heat absorbing plate and the heat pipe, and the air flow generated by the fan takes away the heat transferred to the heat dissipation fins.

In order to achieve high efficiency heat transfer, the fan on the heat dissipation module will be adjusted according to the actual power and temperature of the processor. The existing technology is to control the fan by measuring the temperature outside the module or the heat pipe thermometer on the module. The rotation of the traditional control method is that when the temperature of the heat dissipation module rises, the fan speed increases correspondingly to achieve the effect of cooling. However, in the actual process, because the maximum conduction heat of the heat pipe is insufficient, the heat pipe is partially dried and the temperature of the heating end is not uniform. At this time, the increase of the fan speed does not necessarily reduce the thermal resistance of the heat dissipation module, resulting in the processor performance being no longer possible. Lifting up, while the fan is running faster, the power consumption is increased and the noise is relatively large.

In view of this, it is necessary to provide a heat dissipation module that can be automatically and optimally controlled to the optimum performance and a method of controlling the heat dissipation module.

A heat dissipation module includes a heat absorbing plate, a heat pipe, a fin group and a fan for thermally connecting with the heat generating component, the heat pipe comprising an evaporation end connected to the heat absorbing plate and a condensation end connected to the fin group, the heat pipe The evaporation end is provided with at least two temperature sensors, the fan provides a cooling airflow to the fin set, and the heat dissipation module further includes a function management component, the at least two temperature sensors continuously measuring the The temperature at the evaporation end of the heat pipe transfers the measured temperature to the function management component, which adjusts the fan speed and/or the heating element based on the measured temperature.

A method for controlling a heat dissipation module, the heat dissipation module comprising a heat absorbing plate, a fin group, a heat pipe, a fan and a function management component for thermally connecting to the heat generating component, the heat pipe comprising an evaporation end connected to the heat absorbing plate and a condensation end connected to the fin set, the evaporation end of the heat pipe is provided with at least two temperature sensors, the fan provides a cooling airflow to the fin set, and a plurality of critical temperatures are set in the function management component, and the use temperature The sensor measures the temperature at different points of the evaporation end of the heat pipe, compares the measured temperature with the critical temperature, and adjusts the rotational speed of the fan and/or the operating state of the heating element according to the result of the comparison.

Compared with the prior art, the heat dissipation module is provided with at least two temperature sensors on the evaporation end of the heat pipe, and includes a function management component, which is compared with the critical temperature according to different temperatures at different evaporation ends of the heat pipe. Adjusting the speed of the fan and/or the working state of the heating element, the cooling module is automatically controlled to the optimal performance, while balancing the power consumption of the fan and reducing the noise of the fan rotation

10‧‧‧ Thermal Module

11‧‧‧Fan

12‧‧‧Fin set

13‧‧‧heat pipe

14‧‧‧heat absorbing plate

15‧‧‧Shrap

16‧‧‧Function Management Components

17‧‧‧Processor

111‧‧‧Shell

112‧‧‧fan wheel

113‧‧‧ fan leaves

1111‧‧‧air outlet

121‧‧‧Fins

122‧‧‧ flow path

123‧‧‧Perforation

131‧‧‧Evaporation end

132‧‧‧condensing end

133‧‧‧temperature sensor

151‧‧‧Combination Department

152‧‧‧First lock

153‧‧‧Second lock

154‧‧‧Assembly holes

155‧‧‧ screws

156‧‧‧Accessories

FIG. 1 is an assembled view of a heat dissipation module according to an embodiment of the invention.

2 is a perspective view of another angle of the heat dissipation module shown in FIG. 1.

3 is an exploded perspective view of the heat dissipation module shown in FIG. 1.

4 is a functional module combination diagram of the heat dissipation module shown in FIG. 1.

FIG. 5 is a graph showing the relationship between the thermal resistance of the heat dissipation module and the fan speed shown in FIG. 1.

FIG. 6 is a schematic diagram of the operation of the function management component in the heat dissipation module shown in FIG. 4.

As shown in FIG. 1 to FIG. 4 , a heat dissipation module 10 includes a fan 11 , a fin set 12 , a heat pipe 13 , a heat absorbing plate 14 , and a pair of heat dissipation modules 10 . The heat dissipation module is coupled to the elastic piece 15 on the circuit board and a function management component 16.

The fan 11 includes a casing 111. The casing 111 is provided with a fan wheel 112 and a blade 113. One side of the casing 111 forms an air outlet 1111 for the airflow generated by the fan 11 to pass.

The fin set 12 is disposed at the air outlet 1111 of the fan 11. The fin group 12 includes a plurality of fins 121 arranged in parallel, and a flow channel 122 for airflow is formed between the two adjacent fins 121, and a hole 123 of the same size is formed at the same position in the middle of each fin 121. The through hole 123 has a rectangular shape and is sized to match the size of the heat pipe 13 for receiving and connecting the heat pipe 13.

The heat pipe 13 has a flat curved shape and is generally made of a metal having good thermal conductivity, and includes an evaporation end 131 and a condensation end 132. The evaporation end 131 is attached to the heat absorbing plate 14 and is fixed by the pair of elastic pieces 15. The evaporation end 131 of the heat pipe 13 is provided with at least two temperature sensors 133. In this embodiment, the temperature sensor is provided. The number of 133 is 3. The temperature sensor 133 continuously measures the temperature of the evaporation end 131 of the heat pipe 13 and transmits it to the function management component 16 in time. The condensation end 132 of the heat pipe 13 and the evaporation end 131 are bent perpendicular to each other, and the condensation end 132 is connected to the fin group 12 through the perforation of the fin group 12.

The heat absorbing plate 14 has a flat shape, and has a short cross section at a corner. The lower surface of the heat absorbing plate 14 is closely attached to the heat-generating electronic component such as the processor 17, and the middle portion of the upper surface and the evaporation end 131 of the heat pipe 13 are adhered to each other. The pair of elastic pieces 15 are in contact with the heat absorbing plate 14 portion. The pair of elastic pieces 15 are symmetric and have a flat curved structure. Each of the elastic pieces 15 includes a joint portion 151, a first lock portion 152 and a second lock portion 153. The joint portion 151 is longitudinally linear and is in contact with the heat absorbing plate 14, the first lock portion 152 and the second lock portion. The joint portions 153 are respectively formed by extending from opposite ends of the joint portion 151 at an oblique angle. A circular fitting hole 154 is provided at the end of the first latching portion 152 and the second latching portion 153, and is fixedly coupled by a screw 155 and a fitting 156 during assembly.

Referring to FIG. 4 , when the heat dissipation module 10 is assembled, the fin set 12 is disposed at the air outlet 1111 of the fan 11 , and the condensation end 132 of the heat pipe 13 is bent to extend through the through hole of the fin set 12 . 123 is connected to the fin group 12, the evaporation end 131 is placed in the middle of the heat absorbing plate 14, and is fixed by the pair of elastic pieces 15, and the middle portion of the lower surface of the heat absorbing plate 14 is matched with the processor 17. The heat absorbing plate 14 is fixed on the circuit board by the assembly hole 154, the screw 155 and the fitting 156 of the locking portion of the pair of elastic pieces 15, and the function management component 16 is mounted on a circuit board (not shown). And the processor 17 and the fan 11 are associated with each other to adjust the performance of the heat dissipation module 10.

In operation, the heat absorbing plate 14 is in thermal contact with the processor 17 and rapidly absorbs the heat generated therefrom, and transfers the heat to the evaporation end 131 of the heat pipe 13 in thermal contact with the heat absorbing plate 14, and the heat is transmitted by the heat pipe 13. To the fin group 12, finally, the airflow generated by the fan 11 and the fin group 12 exchange heat, and the heat is finally dissipated into the environment for the purpose of fast and effective heat dissipation.

Referring to FIG. 5 again, the figure shows the relationship between the thermal resistance R of the heat dissipation module 10 and the rotation speed of the fan 11, and Qin indicates the heat generation power of the processor 17. When the heat generation power of the processor 17 is low, the thermal resistance of the heat dissipation module 10 decreases as the rotation speed of the fan 11 increases, as shown in the figure, Qin=35W corresponds to a curve relationship. As the power of the processor 17 increases, the thermal resistance of the heat dissipation module 10 will first decrease and then increase with respect to the rotational speed of the fan 11, as shown in FIG. 5 as a corresponding relationship between Qin=40W and Qin=45W. Normally, the operating power of the processor 17 is greater than 40 W. At this time, the thermal resistance of the heat dissipation module 10 corresponds to the rotational speed of the fan 11 as a relationship of decreasing first and then rising.

Referring to FIG. 6 at the same time, during operation, the three temperature sensors 133 continuously measure the temperatures S1, S2, and S3 at three different positions of the evaporation end 131 of the heat pipe 13, and continuously transmit the temperatures of the three places. To the function management component 16, the function management component 16 continuously adjusts the rotational speed of the fan 11 and the operating state of the processor 17 according to the temperature of the temperature sensor 133.

Specifically, a first critical temperature T1 is set in the function management component 16. When the three temperatures S1, S2, or S3 are greater than T1, the heat generation effect of the processor 17 is greater than the heat dissipation effect, and the function management component 16 controls the The fan 11 speed increases.

The three temperature sensors 133 continuously measure, and as the power of the processor 17 changes, there may be local burn-drying in the heat pipe 13. If it occurs, there will be temperature unevenness in the evaporation end 131. A first difference temperature N1 is set in the function management component 16. When the difference between S1 and S2 is greater than N1, the heat of the heat dissipation module 10 is determined according to the relationship between the thermal resistance R of the heat dissipation module 10 and the rotation speed of the fan 11. The resistance R has passed the lowest point. At this time, the increase of the rotation speed of the fan 11 will increase the thermal resistance of the heat dissipation module 10, resulting in a decrease in the heat dissipation effect. At this time, the function management component 16 compares the difference between S1 and S2. The comparison of the first difference temperature N1 determines that the rotation speed of the fan 11 is lowered to reduce the thermal resistance of the heat dissipation module 10; when the temperatures of S1 and S2 are both greater than T1 and the difference between S1 and S2 is greater than N1, It is understood that the thermal resistance of the heat dissipation module 10 is greater than the lowest thermal resistance in the curve and the temperature unevenness of the heat pipe 13 has occurred. The function management component 16 will reduce the rotation speed of the fan 11 to reduce the heat of the heat dissipation module 10. Resistor; if the measured S1, S2 difference is not greater than N1, the power state of processor 17 is maintained.

Preferably, the function management component 16 can also set a second difference temperature N2. The second difference temperature N2 is set according to the heat dissipation module when the temperature difference between S2 and S3 is greater than N2. 10 thermal resistance and fan 11 speed relationship curve, thermal resistance R is greater than the lowest point thermal resistance in the figure, that is, the thermal resistance R of the thermal module 10 has not yet fallen to the lowest thermal resistance range, the fan 11 speed continues to decrease The thermal resistance of the heat dissipation module 10 is reduced.

The function management component 16 further sets a second critical temperature T2. The second critical temperature T2 is set according to the thermal resistance of the heat dissipation module 10 and the rotational speed of the fan 11 when the temperature of S1, S2 or S3 is greater than T2. Relationship curve, the thermal resistance R is slightly smaller than the lowest point thermal resistance in the figure, that is, the thermal resistance of the heat dissipation module 10 has been reduced to a reasonable range, at this time, the rotation speed of the fan 11 is relatively reasonable, even if the rotation speed of the fan 11 is further increased, the relative heat pipe 13 is relatively The temperature is still too large, and the heat dissipation performance of the heat dissipation module still cannot meet the heat dissipation requirement, so the function management component 16 is forced to reduce the power of the processor 17, so that the processor 17 is cut to low power to achieve the heat generation effect and the heat dissipation effect. balance.

In this embodiment, when the difference between S1 and S2 satisfies the condition that the difference between the first difference temperature N1 or S2 and S3 satisfies the second difference temperature N2, the thermal resistance of the heat dissipation module 10 is greater than the lowest value in the curve. The thermal resistance is, and N1 is less than N2; the critical temperature T1 is less than the critical temperature T2. S3 is an auxiliary measuring point, which can make more precise range judgment and adjustment according to the same principle, so that the heat dissipation module can automatically control to the best performance. In this embodiment, the meaning of the at least two temperature sensors is that the number of the heat pipe evaporation end temperature sensors may include S1, S2/including S2, S3/ including S1, S2, S3, and the functional flow chart may be A module including N1 difference temperature determination/a module including N2 difference temperature determination/a module including N1 and N2 difference temperature determination. In actual work, the at least two temperature measurement points may be multiple, and the set critical temperature may also be multiple, and the setting judgment and adjustment may be performed according to specific conditions.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

Claims (6)

A heat dissipation module includes a heat absorbing plate, a heat pipe, a fin group and a fan for thermally connecting with the heat generating component, the heat pipe comprising an evaporation end connected to the heat absorbing plate and a condensation end connected to the fin group, the heat pipe The evaporation end is provided with at least two temperature sensors, the fan provides a cooling airflow to the fin set, wherein the heat dissipation module further comprises a function management component, the at least two temperature sensors continuously measuring the heat pipe evaporation The temperature of the terminal is transmitted to the function management component, and the function management component adjusts the fan speed or the heating element according to the measured temperature, so that the heat dissipation module automatically controls to the optimal performance, and the function management component sets a number of correlations. The critical temperature is used to compare with the temperature measured by the temperature sensor. The function management component sets a first critical temperature T1, and the temperature measured by the at least two temperature sensors is S1, S2, when S1 or S2 is greater than At T1, the fan speed increases, the function management component sets a first difference temperature N1, and when the difference between S1 and S2 is greater than N1, the fan speed decreases. For example, in the heat dissipation module of claim 1, wherein the function management component further sets a second difference temperature N2 and a third temperature sensor, and the temperature measured by the third temperature sensor is S3, when When the difference between S2 and S3 is greater than N2, the fan speed decreases. For example, in the heat dissipation module of claim 2, the function management component sets a second critical temperature T2, and when S1, S2 or S3 is greater than T2, the power of the heating element is reduced. A method for controlling a heat dissipation module, the heat dissipation module comprising a heat absorbing plate, a fin group, a heat pipe, a fan and a function management component for thermally connecting to the heat generating component, the heat pipe comprising an evaporation end connected to the heat absorbing plate and a condensation end connected to the fin set, the evaporation end of the heat pipe being provided with at least two temperature sensors, the fan providing a cooling airflow to the fin set, the method comprising the steps of: setting in the function management component a plurality of critical temperatures; measuring a temperature at a different end of the evaporation end of the heat pipe using a temperature sensor; and comparing the measured temperature with a critical temperature, and adjusting a rotational speed of the fan or an operating state of the heating element according to a result of the comparison, The function management component sets a first critical temperature T1, the temperature measured by the at least two temperature sensors is S1, S2, and when S1 or S2 is greater than T1, the fan speed increases, and the function management component sets a first difference temperature. N1, when the difference between S1 and S2 is greater than N1, the fan speed decreases. The method for controlling a heat dissipation module according to claim 4, wherein the function management component further sets a second difference temperature N2 and a third temperature sensor, wherein the third temperature sensor measures The temperature is S3, and when the difference between S2 and S3 is greater than N2, the fan speed decreases. The method of controlling a heat dissipation module according to claim 5, wherein the function management component sets a second critical temperature T2, and when S1, S2 or S3 is greater than T2, reduces the power of the heat generating component.