CN108807314A - A kind of semiconductor refrigeration radiating device for central processing unit (CPU) chip - Google Patents
A kind of semiconductor refrigeration radiating device for central processing unit (CPU) chip Download PDFInfo
- Publication number
- CN108807314A CN108807314A CN201810853960.0A CN201810853960A CN108807314A CN 108807314 A CN108807314 A CN 108807314A CN 201810853960 A CN201810853960 A CN 201810853960A CN 108807314 A CN108807314 A CN 108807314A
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- China
- Prior art keywords
- cpu
- buffer stopper
- chip
- temperature
- temperature sensor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 62
- 238000005057 refrigeration Methods 0.000 title claims abstract description 33
- 238000012545 processing Methods 0.000 title claims abstract description 21
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 9
- 229910002027 silica gel Inorganic materials 0.000 claims description 9
- 235000012149 noodles Nutrition 0.000 claims description 6
- 230000005494 condensation Effects 0.000 abstract description 11
- 238000009833 condensation Methods 0.000 abstract description 11
- 230000003139 buffering effect Effects 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The present invention relates to a kind of semiconductor refrigeration radiating devices for central processing unit (CPU) chip, belong to heat dissipation of integrated circuit chip technical field.Semiconductor refrigeration radiating device of the present invention includes buffer stopper, semiconductor chilling plate, radiator, cooling fan, buffer stopper temperature sensor, environment temperature sensor and temperature controller.The present invention freezes to CPU by buffering block indirection, refrigerating speed of the semiconductor chilling plate to cpu chip is reduced using the thermal inertia of buffer stopper, and it is consistent with environment temperature to control buffering deblocking temperature, it can prevent CPU near zones from moisture condensation dew condensation phenomenon occur, it is too fast to solve active computer CPU semiconductor refrigeration radiating device refrigerating speeds, easily cause CPU condensation and dewfalls and caused by pin short circuit accident.
Description
Technical field
The present invention relates to a kind of semiconductor refrigeration radiating device for central processing unit (CPU) chip, belong to integrated electricity
Road chip cooling technical field.
Background technology
With the fast development of computer technology and ic manufacturing technology, central processing unit (CPU) CPU's is integrated
Degree, performance and clock frequency are continuously improved.Since the number of transistors in CPU sharply increases, keep the operating current of CPU also continuous
Increase, causes the heat that CPU unit volumes are shed more and more high.If CPU persistently works at high temperature, CPU core can be caused
Interior portion short circuit or open circuit, last thoroughly damage CPU.And temperature is higher, the speed for thoroughly destroying CPU is faster, CPU's
Service life is shorter.Experimental data shows that internal temperature is more than 80 DEG C, meeting if surface temperature is more than 50 DEG C when CPU is worked normally
The permanent damage caused by " electron transfer " phenomenon makes CPU.
To avoid accumulation of heat from causing temperature is excessively high to damage CPU, generally use is air-cooled, water cooling, heat pipe and semiconductor system
The heat dissipation technologys such as cold reduce the operating temperature of CPU.Structure such as Fig. 1 institutes used by semiconductor refrigeration radiating method therein
Show, the structure have mechanical, noiseless, shockproof, efficient, small without spin, long lifespan, it is at low cost, installation simply and
Outstanding advantages of reliable operation, but in use, since the strong refrigeration effect of semiconductor cooling device is easy to keep CPU fast
Speed refrigeration, makes cpu chip temperature be less than environment temperature, to condensation and dewfall phenomenon occur in cpu chip side, CPU is caused to draw
Short circuit occurs between foot and causes computer damage accident.
Invention content
The purpose of the present invention is to propose to a kind of semiconductor refrigeration radiating device for central processing unit (CPU) chip,
Increase buffer stopper between cpu chip and semiconductor cooling device, is freezed to CPU by buffering block indirection, utilize buffer stopper
Thermal inertia reduce the refrigerating speed of semiconductor refrigeration radiating device, and it is consistent with environment temperature to control buffering deblocking temperature, with
Overcome active computer CPU semiconductor refrigeration radiating device refrigerating speeds too fast, easily cause CPU condensation and dewfalls and caused by pin
Short circuit accident.
Semiconductor refrigeration radiating device proposed by the present invention for central processing unit (CPU) chip, including semiconductor system
Cold, radiator and cooling fan；Characterized by further comprising buffer stopper, buffer stopper temperature sensor, environment temperature sensors
And temperature controller；The underrun heat conductive silica gel of the buffer stopper is bonded on central processing unit (CPU) chip, described
The huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate is connected by the top surface of heat conductive silica gel and buffer stopper, and the bottom of the radiator passes through heat conductive silica gel
It is connect with the hot face of semiconductor chilling plate, the cooling fan is fixed by screw and radiator, the buffer stopper temperature sensing
Device is fixed in the screw hole of buffer stopper side, and it is attached that the environment temperature sensor is fixed on central processing unit (CPU) chip
Closely, the output end of buffer stopper temperature sensor and environment temperature sensor is connected with the input terminal of temperature controller respectively, institute
The input terminal of the current output terminal and semiconductor chilling plate of stating temperature controller is linked.
Semiconductor refrigeration radiating device proposed by the present invention for central processing unit (CPU) chip, its advantage is that, lead to
It crosses buffering block indirection to freeze to CPU, the refrigerating speed of semiconductor refrigeration radiating device is reduced using the thermal inertia of buffer stopper, and
Control buffering deblocking temperature is consistent with environment temperature, therefore the semiconductor refrigeration radiating device of the present invention, overcomes active computer
CPU semiconductor refrigeration radiating device refrigerating speeds are too fast, easily cause CPU condensation and dewfalls and caused by pin short circuit accident.
Description of the drawings
Fig. 1 is that have computer CPU semiconductor refrigeration radiating apparatus structure schematic diagram.
Fig. 2 is that the semiconductor refrigeration radiating apparatus structure proposed by the present invention for central processing unit (CPU) chip is illustrated
Figure.
In Fig. 1 and Fig. 2,1 is central processor core, and 2 be semiconductor chilling plate, and 3 be radiator, and 4 be cooling fan, 5
It is buffer stopper, 6 be buffer stopper temperature sensor, and 7 be environment temperature sensor, and 8 be temperature controller.
Specific implementation mode
Semiconductor refrigeration radiating device proposed by the present invention for central processing unit (CPU) chip, structure such as Fig. 2
It is shown, including semiconductor chilling plate 2, radiator 3 and cooling fan 4, buffer stopper 5, buffer stopper temperature sensor 6, environment temperature
Sensor 7 and temperature controller 8.The underrun heat conductive silica gel of buffer stopper 5 is bonded on central processing unit (CPU) chip 1,
The huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 2 is connect by heat conductive silica gel with the top surface of buffer stopper 5, and the bottom of radiator 3 passes through heat conductive silica gel
It is connect with the hot face of semiconductor chilling plate 2, cooling fan 4 is fixed by screw and radiator 3, and buffer stopper temperature sensor 6 is solid
It is scheduled on (not shown) in the screw hole of 5 side of buffer stopper, environment temperature sensor 7 is fixed on central processing unit (CPU) chip
Near 1, the output end of buffer stopper temperature sensor 6 and environment temperature sensor 7 is connected with the input terminal of temperature controller 8 respectively
It connects, the input terminal of the current output terminal and semiconductor chilling plate 2 of temperature controller 8 is linked.
In semiconductor refrigeration radiating device proposed by the present invention for central processing unit (CPU) chip, buffer stopper 5 is used
It is isolated cpu chip 1 and semiconductor chilling plate 2, the heat that direct calculation in absorption machine cpu chip 1 generates, and self heat turned
Pass the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 2.Buffer stopper 5 is made of the good copper product of thermal conductivity, under the action of temperature controller 8 keep with
The identical temperature of ambient enviroment.Since buffer stopper 5 has certain volume and quality, buffer stopper 5 used with larger heat
Property.When semiconductor chilling plate 2 freezes rapidly, the temperature of buffer stopper 5 will not be rapid with the decline of the temperature of semiconductor chilling plate 2
Variation, therefore cpu chip 1 will not be freezed rapidly and generate condensation and dewfall phenomenon.
Semiconductor chilling plate 2 in above-mentioned semiconductor refrigeration radiating device is for freezing to buffer stopper 5.Work as temperature controller
When 8 output DC powered semiconductor chilling plate work, the heat of huyashi-chuuka (cold chinese-style noodles) and buffer stopper 5 will be shifted to hot face, in huyashi-chuuka (cold chinese-style noodles)
It generates heat absorption, generate exothermic phenomenon in hot face, buffer stopper 5 is made to freeze.
Radiator 3 in above-mentioned semiconductor refrigeration radiating device, the heat for absorbing 2 hot face of semiconductor chilling plate.
Cooling fan 4 in above-mentioned semiconductor refrigeration radiating device makes heat dissipation for surrounding air to be blowed to radiator 3
The heat of device 3 is dispersed into surrounding air.
Buffer stopper temperature sensor 6 in above-mentioned semiconductor refrigeration radiating device, for monitoring the temperature inside buffer stopper 5
Degree.
Environment temperature sensor 7 in above-mentioned semiconductor refrigeration radiating device, for monitoring the environment near cpu chip 1
Temperature.
Temperature controller 8 in above-mentioned semiconductor refrigeration radiating device, the temperature for controlling buffer stopper 5.Temperature controller 8 connects respectively
The temperature signal that buffer stopper temperature sensor 6 and environment temperature sensor 7 export is received, and to the temperature of buffer stopper 5 and environment temperature
Degree is compared；When the temperature of buffer stopper 5 is higher than environment temperature, the output control electric current of temperature controller 8 drives semiconductor chilling plate
2 refrigeration；When the temperature of buffer stopper 5 is less than environment temperature, temperature controller 8 cuts off output current, and semiconductor chilling plate 2 stops work
Make.
One embodiment of semiconductor refrigeration radiating device proposed by the present invention for central processing unit (CPU) chip
In, buffer stopper 5 is 40 × 40 × 40mm made of the good copper product of thermal conductivity3Cubic block, semiconductor chilling plate 2 use model
The semiconductor device of TEC1-12715T125, radiator 3 use aluminum profile heat radiator, and buffer stopper temperature sensor 6 is using warm
Quick Resistance probe, environment temperature sensor 7 use thermistor, temperature controller 8 to use maximum output current for the temperature controller of 15A.
The operation principle of the semiconductor refrigeration radiating device for central processing unit (CPU) chip of the present invention is：
When computer CPU chip 1 is started to work, the temperature of cpu chip 1 gradually rises, and cpu chip 1 is by heat transfer
To buffer stopper 5；Temperature controller 8 monitors the environment temperature near buffer stopper 5 and cpu chip 1 in real time, when the temperature of buffer stopper 5 is higher than
When environment temperature, the output control electric current of temperature controller 8, driving semiconductor chilling plate 2 freezes to buffer stopper 5；When the temperature of buffer stopper 5
When less than environment temperature, temperature controller 8 cuts off output current, and semiconductor chilling plate 2 is stopped.Since buffer stopper 5 is always in ring
The heat of cpu chip 1 is absorbed at a temperature of border, therefore the external skin temperatures of cpu chip 1 are also identical as environment temperature always, in air
Steam will not nearby region condensation and dewfall, thus prevent short circuit accident caused by 1 condensation and dewfall of cpu chip.
The semiconductor refrigeration radiating device for central processing unit (CPU) chip of the present invention, by buffering block indirection pair
CPU freezes, and the refrigerating speed of semiconductor refrigeration radiating device is reduced using the thermal inertia of buffer stopper, and control buffering deblocking temperature
It is consistent with environment temperature, it can prevent the moisture condensation of CPU near zones from condensing, active computer CPU semiconductor refrigeratings is overcome to dissipate
Thermal refrigerating speed is too fast, easily cause CPU condensation and dewfalls and caused by pin short circuit accident.
Claims (1)
1. a kind of semiconductor refrigeration radiating device for central processing unit (CPU) chip, including semiconductor chilling plate, heat dissipation
Device and cooling fan；Characterized by further comprising the controls of buffer stopper, buffer stopper temperature sensor, environment temperature sensor and temperature
Device；The underrun heat conductive silica gel of the buffer stopper is bonded on central processing unit (CPU) chip, the semiconductor refrigerating
The huyashi-chuuka (cold chinese-style noodles) of piece is connected by the top surface of heat conductive silica gel and buffer stopper, and the bottom of the radiator passes through heat conductive silica gel and semiconductor system
Cold hot face connection, the cooling fan are fixed by screw and radiator, and the buffer stopper temperature sensor is fixed on slow
It rushes in the screw hole of block side, the environment temperature sensor is fixed near central processing unit (CPU) chip, buffer stopper temperature
The output end of degree sensor and environment temperature sensor is connected with the input terminal of temperature controller respectively, the temperature controller
Current output terminal and the input terminal of semiconductor chilling plate be linked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810853960.0A CN108807314A (en) | 2018-07-30 | 2018-07-30 | A kind of semiconductor refrigeration radiating device for central processing unit (CPU) chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810853960.0A CN108807314A (en) | 2018-07-30 | 2018-07-30 | A kind of semiconductor refrigeration radiating device for central processing unit (CPU) chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108807314A true CN108807314A (en) | 2018-11-13 |
Family
ID=64078673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810853960.0A Pending CN108807314A (en) | 2018-07-30 | 2018-07-30 | A kind of semiconductor refrigeration radiating device for central processing unit (CPU) chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108807314A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110132369A (en) * | 2019-06-13 | 2019-08-16 | 青岛伊克斯达智能装备有限公司 | It is a kind of for detecting the device of waste and old rubber thermal cracking processes solid product material position |
| CN111162057A (en) * | 2020-01-06 | 2020-05-15 | 珠海格力电器股份有限公司 | Semiconductor power device and power processing assembly for semiconductor power device |
| CN113407017A (en) * | 2021-06-18 | 2021-09-17 | 北京市九州风神科技股份有限公司 | Control method of semiconductor heat sink, semiconductor heat sink and storage medium |
| CN113870906A (en) * | 2021-10-11 | 2021-12-31 | 重庆紫光华山智安科技有限公司 | Anti-condensation temperature control method, system and circuit control board |
| CN114326851A (en) * | 2021-11-17 | 2022-04-12 | 苏州浪潮智能科技有限公司 | Edge intelligent temperature control method and system based on TEC |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114326851A (en) * | 2021-11-17 | 2022-04-12 | 苏州浪潮智能科技有限公司 | Edge intelligent temperature control method and system based on TEC |
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