CN113870906A - Anti-condensation temperature control method, system and circuit control board - Google Patents
Anti-condensation temperature control method, system and circuit control board Download PDFInfo
- Publication number
- CN113870906A CN113870906A CN202111183806.5A CN202111183806A CN113870906A CN 113870906 A CN113870906 A CN 113870906A CN 202111183806 A CN202111183806 A CN 202111183806A CN 113870906 A CN113870906 A CN 113870906A
- Authority
- CN
- China
- Prior art keywords
- temperature
- hard disk
- processing chip
- condensation
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1426—Reducing the influence of the temperature by cooling plates, e.g. fins
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D27/00—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
- G05D27/02—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/144—Reducing the influence of the temperature by detection, control, regulation of the temperature
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1446—Reducing contamination, e.g. by dust, debris
- G11B33/1453—Reducing contamination, e.g. by dust, debris by moisture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The embodiment of the invention provides an anti-condensation temperature control method, an anti-condensation temperature control system and a circuit control board, and relates to the field of electronic equipment protection. Firstly, a processing chip acquires the temperature of a hard disk and the ambient temperature of the hard disk; the processing chip determines a reference temperature according to the environment temperature of the hard disk; and finally, the processing chip adjusts the working power of the semiconductor refrigerating chip according to the temperature difference value between the temperature of the hard disk and the reference temperature. By the method, the temperature of the hard disk can be in the preset range, the temperature rise caused by the fact that heat generated in the hard disk operation process is not dissipated timely is avoided, the risk of condensation in the temperature control process is reduced, and the reliability of hard disk operation is improved.
Description
Technical Field
The invention relates to the field of electronic equipment protection, in particular to a condensation-prevention temperature control method, a condensation-prevention temperature control system and a circuit control board.
Background
For the electronic equipment such as the hard disk, the operation speed and the operation capacity of the electronic equipment are directly influenced by the temperature, the operation speed is slower when the temperature is higher, and the hard disk is damaged due to high temperature if the hard disk cannot be well radiated when the hard disk works for a long time. Therefore, in order that the temperature of the hard disk is not increased by heat generated during operation, it is necessary to perform heat dissipation and temperature control of the hard disk in an efficient manner.
At present, the methods for heat dissipation and temperature control of hard disks mainly include air cooling, water cooling, semiconductor refrigeration device refrigeration and the like. The air cooling mainly absorbs heat generated by equipment through the heat-conducting medium, and then the fan is used for forcibly refrigerating the heat-conducting medium, so that the heat is dissipated in the environment. One way of achieving water cooling is a water circulation radiator, but has high requirements on the installation environment and risks of water leakage.
Adopt the refrigerated mode of semiconductor refrigeration device to dispel the heat and control the temperature to the hard disk, this kind of mode has the radiating effect well and can not produce advantages such as noise and vibrations, but its strong refrigeration effect makes hard disk surface easily take place the condensation phenomenon, and the drop of water that the condensation produced can make the pin of the components and parts of constituteing the hard disk and take place the short circuit, the accident of making up.
Disclosure of Invention
The invention aims to provide an anti-condensation temperature control method, an anti-condensation temperature control system and a circuit control board, so as to overcome the defects of the prior art.
The technical scheme adopted by the embodiment of the invention is as follows:
in a first aspect, an anti-condensation temperature control method provided in an embodiment of the present invention is applied to an anti-condensation temperature control system, where the anti-condensation temperature control system includes a hard disk, a circuit control board, a semiconductor refrigeration sheet, a heat-conducting metal plate, and a thermistor, the semiconductor refrigeration sheet includes a cold surface and a hot surface, the heat-conducting metal plate is in contact with the cold surface of the semiconductor refrigeration sheet and the outer surface of the hard disk respectively through a heat-conducting medium, the thermistor is fixed on the heat-conducting metal plate, the circuit control board includes a processing chip and a temperature and humidity sensor, the processing chip is electrically connected to the temperature and humidity sensor, the thermistor, and the semiconductor refrigeration sheet respectively, and the method includes:
the processing chip acquires the temperature of the hard disk and the ambient temperature of the hard disk;
the processing chip determines a reference temperature according to the environment temperature of the hard disk, wherein the reference temperature is a critical temperature for representing the occurrence of condensation of the hard disk;
and the processing chip adjusts the working power of the semiconductor refrigerating sheet according to the temperature difference value between the temperature of the hard disk and the reference temperature so as to enable the temperature of the hard disk to be within a preset range and prevent the hard disk from generating condensation.
In a possible implementation manner, the processing chip determines the reference temperature according to the ambient temperature of the hard disk:
the temperature and humidity sensor collects the ambient temperature of the hard disk;
the processing chip acquires the ambient temperature of the hard disk from the temperature and humidity sensor;
the processing chip takes the ambient temperature as the reference temperature.
In a possible implementation manner, the step of determining, by the processing chip, the reference temperature according to the ambient temperature of the hard disk further includes:
the temperature and humidity sensor collects the environmental humidity of the hard disk;
the processing chip acquires the environment humidity of the hard disk from the temperature and humidity sensor;
the processing chip determines the dew point temperature according to the environment temperature and the environment humidity of the hard disk;
and the processing chip takes the dew point temperature as the reference temperature.
In a possible implementation manner, the step of adjusting, by the processing chip, the working power of the semiconductor chilling plate according to the temperature difference between the temperature of the hard disk and the reference temperature includes:
the processing chip judges whether the temperature of the hard disk is greater than the reference temperature or not;
if the temperature of the hard disk is higher than the reference temperature, the processing chip adjusts the working power of the semiconductor refrigerating sheet according to the temperature difference;
and if the temperature of the hard disk is not greater than the reference temperature, the processing chip closes the semiconductor refrigeration sheet.
In a possible implementation manner, the step of adjusting, by the processing chip, the working power of the semiconductor chilling plate according to the temperature difference includes:
and if the temperature difference is larger than a preset value, the processing chip adjusts the working power of the semiconductor chilling plate to a preset first power.
In a possible implementation manner, the step of adjusting, by the processing chip, the operating power of the semiconductor chilling plate according to the temperature difference further includes:
if the temperature difference value is not larger than the preset value, the processing chip calculates a second power corresponding to the temperature difference value according to a preset function, and the preset function is formed by fitting according to the relation between the test temperature of the hard disk and the test power of the semiconductor refrigerating sheet;
and the processing chip adjusts the working power of the semiconductor chilling plate to the second power.
In one possible implementation, the preset function is a piecewise function.
After the step of adjusting the working power of the semiconductor refrigeration sheet by the processing chip according to the temperature difference between the temperature of the hard disk and the reference temperature, the method further comprises:
the processing chip acquires the temperature of the hard disk and the ambient temperature of the hard disk in each preset period, and determines the reference temperature in each preset period according to the ambient temperature of the hard disk in each preset period;
and the processing chip adjusts the working power of the semiconductor refrigeration piece in each preset period according to the temperature difference value between the temperature of the hard disk and the reference temperature in each preset period.
In a second aspect, an embodiment of the present invention provides a circuit control board, which is applied to an anti-condensation temperature control system, wherein the anti-condensation temperature control system further includes a hard disk, a semiconductor refrigeration sheet, a heat conduction metal plate and a thermistor, the semiconductor refrigeration sheet includes a cold surface and a hot surface, the heat conduction metal plate is respectively in contact with the cold surface of the semiconductor refrigeration sheet and the outer surface of the hard disk through a heat conduction medium, the thermistor is fixed on the heat conduction metal plate, the circuit control board includes a processing chip and a temperature and humidity sensor, and the processing chip is respectively electrically connected with the temperature and humidity sensor, the thermistor and the semiconductor refrigeration sheet;
the processing chip is used for acquiring the temperature of the hard disk and the ambient temperature of the hard disk;
the processing chip is further used for determining a reference temperature according to the environment temperature of the hard disk, wherein the reference temperature is a critical temperature for representing the occurrence of condensation on the hard disk;
the processing chip is further used for adjusting the working power of the semiconductor refrigerating sheet according to the temperature difference value between the temperature of the hard disk and the reference temperature, so that the temperature of the hard disk is in a preset range and condensation does not occur on the hard disk.
In a third aspect, an embodiment of the present invention provides an anti-condensation temperature control system, where the anti-condensation temperature control system includes a hard disk, a circuit control board, a semiconductor refrigeration sheet, a heat-conducting metal plate, and a thermistor, where the semiconductor refrigeration sheet includes a cold surface and a hot surface, the heat-conducting metal plate is in contact with the cold surface of the semiconductor refrigeration sheet and the outer surface of the hard disk through a heat-conducting medium, the thermistor is fixed on the heat-conducting metal plate, the circuit control board includes a processing chip and a temperature and humidity sensor, and the processing chip is electrically connected with the temperature and humidity sensor, the thermistor, and the semiconductor refrigeration sheet, respectively;
the processing chip is used for acquiring the temperature of the hard disk and the ambient temperature of the hard disk;
the processing chip is further used for determining a reference temperature according to the environment temperature of the hard disk, wherein the reference temperature is a critical temperature for representing the occurrence of condensation on the hard disk;
the processing chip is further used for adjusting the working power of the semiconductor refrigerating sheet according to the temperature difference value between the temperature of the hard disk and the reference temperature, so that the temperature of the hard disk is in a preset range and condensation does not occur on the hard disk.
Compared with the prior art, the embodiment of the invention provides a method, a system and a circuit control board for preventing condensation and controlling temperature, wherein the method comprises the following steps: firstly, a processing chip acquires the temperature of a hard disk and the environmental temperature of the hard disk; determining a reference temperature according to the environment temperature of the hard disk; and finally, adjusting the working power of the semiconductor refrigerating sheet according to the temperature difference between the temperature of the hard disk and the reference temperature so that the temperature of the hard disk is in a preset range and the hard disk does not generate condensation. Compared with the prior art, the working power of the semiconductor refrigerating sheet is adjusted according to the temperature difference between the temperature of the hard disk and the reference temperature, so that the temperature of the hard disk is in a preset range, the temperature rise caused by the fact that heat generated by the hard disk in the operation process is not dissipated timely is avoided, the risk of condensation in the temperature control process is reduced, and the operation reliability of the hard disk is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic structural diagram of an anti-condensation temperature control system according to an embodiment of the present invention;
FIG. 2 is a flow chart of a method for controlling temperature and preventing condensation according to an embodiment of the present invention;
FIG. 3 is a flowchart illustrating a process chip determining a reference temperature according to an ambient temperature according to an embodiment of the present invention;
FIG. 4 is a flow chart illustrating another exemplary process chip for determining a reference temperature according to an ambient temperature according to an embodiment of the present invention;
fig. 5 is a flowchart illustrating a processing chip adjusting a working power of a semiconductor cooling chip according to an embodiment of the present invention.
Icon: 10-hard disk; 20-a circuit control board; 21-processing the chip; 22-a temperature and humidity sensor; 30-semiconductor refrigerating sheets; 40-a thermally conductive metal plate; 50-thermistor.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
In order to overcome the problems caused by the condensation phenomenon, embodiments of the present invention provide a method, an apparatus, and a system for controlling temperature of a hard disk, which can stabilize the temperature of the hard disk within a preset range, avoid temperature increase caused by non-timely dissipation of heat generated during operation, reduce the risk of condensation during temperature control, and improve the reliability of operation of the hard disk, which will be described in detail below.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an anti-condensation temperature control system according to an embodiment of the present invention, and in fig. 1, the anti-condensation temperature control system includes a hard disk 10, a circuit control board 20, a processing chip 21, a temperature and humidity sensor 22, a semiconductor cooling plate 30, a heat conducting metal plate 40, and a thermistor 50.
The heat conducting metal plate 40 is in contact with the outer surface of the hard disk 10 through a heat conducting medium, the semiconductor refrigeration sheet 30 is in contact with the heat conducting metal plate 40 through the heat conducting medium, and is used for dissipating heat generated during operation of the hard disk 10, and the heat conducting medium can be heat conducting gel, heat conducting silicone grease, a thin heat conducting silicone sheet and the like.
The processing chip 21 is mounted on the circuit control board 20, electrically connected to the semiconductor chilling plate 30, and configured to adjust the operating power of the semiconductor chilling plate 30.
The thermistor 50 is mounted on the heat conductive metal plate 40 through a heat conductive medium, and the heat conductive metal plate 40 on which the thermistor 50 is mounted is in contact with the outer surface of the hard disk 10 through the heat conductive medium, and the temperature of the hard disk 10 can be sensed through the thermistor 50.
The temperature and humidity sensor 22 is installed on the circuit control board 20, and is used for acquiring the temperature and humidity of the environment in the space where the hard disk 10 is located.
Referring to fig. 2, fig. 2 is a flowchart of an anti-condensation temperature control method according to an embodiment of the present invention, where the flowchart includes step S110, step S120, and step S130.
Step S110, the processing chip obtains the temperature of the hard disk and the ambient temperature of the hard disk.
In the embodiment of the present invention, as a specific implementation manner, the processing chip 21 may obtain the temperature of the hard disk 10 through the thermistor 50 electrically connected to the processing chip 21. The thermistor 50 is in contact with the outer surface of the hard disk 10 through a heat conducting medium, the resistance value of the thermistor changes along with the temperature change of the hard disk 10, the processing chip 21 determines the temperature of the hard disk 10 according to the acquired resistance value of the thermistor 50, and the thermistor 50 can be a negative temperature coefficient thermistor, the resistance value of which decreases along with the increase of the temperature, or a positive temperature coefficient thermistor, the resistance value of which increases along with the increase of the temperature.
As another specific implementation manner, the thermistor 50 electrically connected to the processing chip 21 may be replaced by a temperature sensor, and the temperature sensor is in contact with the outer surface of the hard disk 10 through a heat conducting medium to directly sense the temperature of the hard disk 10.
In the embodiment of the present invention, the environmental temperature of the hard disk 10 may be the temperature of the environment in the space where the hard disk 10 is located. As a specific embodiment, the processing chip 21 may obtain the ambient temperature of the hard disk 10 through a temperature/humidity sensor 22 electrically connected to the processing chip.
Specifically, the processing chip 21 obtains the temperature of the circuit control board 20 collected by the temperature and humidity sensor 22, generally, the temperature of the circuit control board 20 is higher than the temperature of the environment in the space where the hard disk 10 is located, the difference between the temperatures is relatively stable, a test temperature difference can be obtained by setting a test experiment, and the processing chip 21 subtracts the test temperature difference from the temperature of the circuit control board 20 collected by the temperature and humidity sensor 22 to obtain the environment temperature of the hard disk 10.
And step S120, the processing chip determines a reference temperature according to the environment temperature of the hard disk, wherein the reference temperature is a critical temperature for representing the occurrence of condensation of the hard disk.
In the embodiment of the present invention, when the temperature of the hard disk 10 is less than or equal to the reference temperature, the risk of the hard disk 10 being exposed to condensation is extremely high.
And step S130, the processing chip adjusts the working power of the semiconductor refrigerating sheet according to the temperature difference value between the temperature of the hard disk and the reference temperature so that the temperature of the hard disk is in a preset range and the hard disk does not generate condensation.
In the embodiment of the present invention, the preset range refers to a safe temperature range in which the hard disk 10 operates, and the preset range sets that the semiconductor chilling plate 30 has different chilling effects when operating at different working powers according to the reference temperature, so that the working power is increased, the chilling effect is enhanced, the working power is reduced, the chilling effect is weakened, and the working power of the semiconductor chilling plate 30 can be realized by adjusting the input voltage or the input current thereof.
The method provided by the embodiment of the invention has the advantages that the processing chip 21 enables the temperature of the hard disk 10 to be in the preset range by adjusting the refrigerating effect of the semiconductor refrigerating sheet 30, the hard disk is operated at the lowest temperature, meanwhile, the temperature of the hard disk 10 is not smaller than or equal to the reference temperature, and condensation is avoided.
Referring to fig. 3, fig. 3 is a flowchart illustrating a process chip determining a reference temperature according to an environmental temperature according to an embodiment of the present invention, where step S120 includes the following sub-steps:
step S120-10, a temperature and humidity sensor collects the environment temperature of the hard disk;
the substep S120-11 is that the processing chip acquires the environment temperature of the hard disk from the temperature and humidity sensor;
in sub-step S120-12, the processing chip takes the ambient temperature as a reference temperature.
In the embodiment of the present invention, due to the refrigeration effect of the semiconductor refrigeration sheet 30, when the temperature of the hard disk 10 is reduced to the temperature of the environment in the space where the hard disk 10 is located, there is a great risk of occurrence of condensation, so that the hard disk 10 cannot reliably operate, the environment temperature in the space where the hard disk 10 is located can be used as the reference temperature, and the processing chip 21 adjusts the working power of the semiconductor refrigeration sheet 30 according to the environment temperature, so that the temperature of the hard disk 10 cannot be reduced below the environment temperature, and the occurrence of condensation is avoided.
Based on fig. 2, another specific implementation manner of the processing chip determining the reference temperature according to the ambient temperature is further provided in the embodiment of the present invention, referring to fig. 4, fig. 4 is a flowchart of another processing chip determining the reference temperature according to the ambient temperature provided in the embodiment of the present invention, and step S120 further includes the following sub-steps:
step S120-20, a temperature and humidity sensor collects the environment humidity of the hard disk;
the substep S120-21 is that the processing chip acquires the environment humidity of the hard disk from the temperature and humidity sensor;
the substep S120-22, the processing chip determines the dew point temperature according to the environment temperature and the environment humidity of the hard disk;
and in the substep S120-23, the processing chip takes the dew point temperature as a reference temperature.
In the embodiment of the present invention, the environmental humidity of the hard disk 10 is the humidity of the environment in the space where the hard disk 10 is located. The dew point temperature may be used as a critical parameter for condensation, and the manner of determining the dew point temperature according to the ambient temperature and the ambient humidity may be: and importing the environmental temperature and the environmental humidity data of the hard disk 10 into a preset dew point calculation model, and outputting the dew point temperature. It is also possible to use the formula Td ═ b/[ a/log (e/6.11) -1 according to the preset formula]，e＝f×Es，Es＝E0×10[a×t/(b+t)]The dew point temperature is calculated. Td is the dew point temperature of the environment in the space where the hard disk 10 is located; e represents the water vapour pressure of the air in the space in which the hard disk 10 is located, and may be in hpa; a. b is a preset parameter; t is the ambient temperature of the hard disk 10; f is the ambient humidity of the hard disk 10, which may be expressed in percentage; es represents the saturated water vapor pressure of the air in the space where the hard disk 10 is located, and the unit of Es can be hpa; e0Which represents the saturated water vapor pressure in hpa at a temperature of 0 c of the environment in the space in which the hard disk 10 is located.
As a specific implementation, the base of the logarithmic function log in the above formula may be 10; at t>At 0 ℃, a may have a value of 7.5 and b may have a value of 237.3; e0The value of (d) may be 6.11.
In the embodiment of the present invention, when the temperature of the hard disk 10 is lowered to the dew point temperature of the environment in the space where the hard disk 10 is located under the action of the semiconductor cooling plate 30, the risk of occurrence of condensation is extremely high, and the hard disk 10 cannot reliably operate, so that the dew point temperature of the environment in the space where the hard disk 10 is located can be used as a reference temperature, and the operating power of the semiconductor cooling plate 30 is adjusted according to the dew point temperature, so that the hard disk 10 operates at the temperature as low as possible, and condensation does not occur at the same time.
Referring to fig. 5, fig. 5 is a flowchart illustrating a process chip adjusting the working power of a semiconductor chilling plate according to an embodiment of the present invention, where step 130 further includes the following sub-steps:
the substep S130-10, the processing chip judges whether the temperature of the hard disk is greater than the reference temperature;
in the embodiment of the invention, the reference temperature is an important parameter for judging the risk of the condensation of the hard disk 10, the processing chip 21 determines the next operation by judging the relationship between the temperature of the hard disk 10 and the reference temperature, if the temperature of the hard disk 10 is greater than the reference temperature, the step S130-11 is executed, and if the temperature of the hard disk 10 is not greater than the reference temperature, the step S130-12 is executed.
The substep S130-11 is that the processing chip adjusts the working power of the semiconductor refrigerating sheet according to the temperature difference value between the temperature of the hard disk and the reference temperature;
in the embodiment of the present invention, when the temperature of the hard disk 10 is greater than the reference temperature, the hard disk 10 does not have the risk of condensation, and at this time, the temperature of the hard disk 10 needs to be controlled, so as to avoid the temperature from being too high, which affects the operation speed and the operation capability thereof, the processing chip 21 calculates the temperature difference between the temperature of the hard disk 10 and the reference temperature, and adjusts the input voltage or the input current of the semiconductor chilling plate 30 according to the temperature difference, thereby adjusting the working power of the semiconductor chilling plate 30, so that the semiconductor chilling plate generates the corresponding chilling effect to cool and dissipate heat of the hard disk 10.
The embodiment of the present invention provides a specific implementation manner of steps 130 to 11, which at least includes the following two cases:
the first condition is as follows: if the temperature difference is larger than the preset value, the processing chip adjusts the working power of the semiconductor chilling plate to be the preset first power.
Case two: if the temperature difference is not larger than the preset value, the processing chip calculates second power corresponding to the temperature difference according to a preset function, the preset function is formed by fitting according to the relation between the test temperature of the hard disk and the test power of the semiconductor chilling plate, and the processing chip adjusts the working power of the semiconductor chilling plate to the second power.
In the embodiment of the present invention, the preset value represents an upper limit of a temperature difference between the temperature of the hard disk 10 and the reference temperature, and as a specific implementation, the preset value may be 10 ℃. When the temperature difference is greater than the preset value, it indicates that the temperature of the hard disk 10 is too high and needs to be rapidly cooled, and when the semiconductor refrigeration sheet 30 operates at the preset first power, the semiconductor refrigeration sheet has a strong refrigeration effect and can rapidly dissipate and dissipate heat generated by the hard disk 10. When the temperature difference is not greater than the preset value, the second power corresponding to the temperature difference is calculated through the preset function, when the semiconductor refrigeration piece 30 operates at the calculated second power, the refrigeration effect of the semiconductor refrigeration piece is adaptive to the heat generation condition of the current hard disk 10, so that the temperature of the hard disk 10 is within the preset range, the phenomenon that the temperature of the hard disk 10 is too high due to insufficient refrigeration effect of the semiconductor refrigeration piece 30 is avoided, the phenomenon that the temperature of the hard disk 10 is lower than the reference temperature due to too strong refrigeration effect of the semiconductor refrigeration piece 30 is avoided, and condensation occurs.
In the embodiment of the present invention, a test experiment may be set to perform statistical analysis on the test temperature of the hard disk 10 and the test power of the semiconductor chilling plate 30, and a first power and a preset function may be determined according to a result of the statistical analysis, where the preset function is fit by a relationship between the test temperature of the hard disk 10 and the test power of the semiconductor chilling plate 30, and may be a piecewise function, a linear function, an exponential function, and the like.
To more clearly illustrate the specific process of the processing chip 21 adjusting the operating power of the semiconductor chilling plate 30 according to the temperature difference, the embodiment of the present invention takes the preset function as the piecewise function, and changes the operating power of the semiconductor chilling plate 30 by adjusting the input voltage thereof, for example.
Specifically, the preset value may be 10 ℃, and when the temperature difference is greater than 10 ℃, the processing chip 21 adjusts the input voltage of the semiconductor chilling plate 30 to be the first voltage U1Wherein the first voltage U1Can be preset to 15 volts; when the temperature difference is not greater than 10 ℃, the processing chip 21 calculates the second voltage U according to the preset function2And adjusting the input voltage of the semiconductor chilling plate 30 to the second voltage U2. The expression of the preset function is as follows:
wherein the second voltage U2May be in volts and deltat is the temperature difference between the temperature of the hard disk 10 and a reference temperature.
The processing chip 21 makes a specific feedback control by judging the range of the Δ T value, and adjusts the input voltage of the semiconductor chilling plate 30, for example, when the Δ T is 9 ℃ and is not greater than 10 ℃, the processing chip 21 adjusts the input voltage of the semiconductor chilling plate 30 to 10 volts according to the preset function; when the delta T is 15 ℃, the delta T is more than 10 ℃, and the processing chip 21 directly adjusts the input voltage of the semiconductor chilling plate 30 to 15 volts.
And in the substep S130-12, the processing chip closes the semiconductor refrigerating sheet.
In the embodiment of the present invention, when the temperature of the hard disk 10 is less than or equal to the reference temperature, the risk of condensation occurring on the hard disk 10 is extremely high, and at this time, if the semiconductor chilling plate 30 is continuously in the operating state, only the condensation phenomenon will be accelerated, and the processing chip 21 must immediately reduce the input voltage or the input current of the semiconductor chilling plate 30 to 0, so that the semiconductor chilling plate 30 stops working, and the cooling and heat dissipation processing on the hard disk 10 is not continuously performed.
In the embodiment of the present invention, when the hard disk 10 is in different operating states, the amount of heat generated by the hard disk is also different, and in order to stabilize the temperature of the hard disk 10 within the preset range, the processing chip 21 may periodically adjust the operating power of the semiconductor cooling plate 30, which includes the following specific steps:
first, the processing chip 21 obtains the temperature of the hard disk 10 and the ambient temperature of the hard disk 10 in each preset period, and determines the reference temperature in each preset period according to the ambient temperature of the hard disk 10 in each preset period.
Next, the processing chip 21 adjusts the working power of the semiconductor chilling plate 30 in each preset period according to the temperature difference between the temperature of the hard disk 10 in each preset period and the reference temperature.
In the embodiment of the present invention, the size of the preset period may be set by a user as required.
The embodiment of the invention provides an anti-condensation temperature control method, an anti-condensation temperature control system and a circuit control board, wherein the anti-condensation temperature control system comprises a hard disk, the circuit control board, a semiconductor refrigeration piece, a heat conduction metal plate and a thermistor, the semiconductor refrigeration piece comprises a cold surface and a hot surface, the heat conduction metal plate is respectively contacted with the cold surface of the semiconductor refrigeration piece and the outer surface of the hard disk through a heat conduction medium, the thermistor is fixed on the heat conduction metal plate, the circuit control board comprises a processing chip and a temperature and humidity sensor, and the processing chip is respectively and electrically connected with the temperature and humidity sensor, the thermistor and the semiconductor refrigeration piece, and the method comprises the following steps: firstly, a processing chip acquires the temperature of a hard disk and the environmental temperature of the hard disk; the processing chip determines a reference temperature according to the environment temperature of the hard disk; and finally, the processing chip adjusts the working power of the semiconductor refrigerating sheet according to the temperature difference value between the temperature of the hard disk and the reference temperature so that the temperature of the hard disk is in a preset range and the hard disk does not generate condensation. Compared with the prior art, the working power of the semiconductor refrigerating sheet is adjusted according to the temperature of the hard disk and the reference temperature, so that the temperature of the hard disk is in a preset range, the temperature rise caused by the fact that heat generated by the hard disk in the operation process is not dissipated timely is avoided, the risk of condensation in the temperature control process is reduced, and the operation reliability of the hard disk is improved.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. The utility model provides a prevent condensation temperature control method, its characterized in that is applied to a prevent condensation temperature control system, prevent condensation temperature control system includes hard disk, circuit control panel, semiconductor refrigeration piece, heat conduction metal sheet and thermistor, the semiconductor refrigeration piece includes cold side and hot side, heat conduction metal sheet pass through heat-conducting medium respectively with the cold side of semiconductor refrigeration piece with the surface contact of hard disk, thermistor fixes on the heat conduction metal sheet, circuit control panel is including handling chip and temperature and humidity sensor, it respectively with temperature and humidity sensor to handle the chip, thermistor with the semiconductor refrigeration piece electricity is connected, the method includes:
the processing chip acquires the temperature of the hard disk and the ambient temperature of the hard disk;
the processing chip determines a reference temperature according to the environment temperature of the hard disk, wherein the reference temperature is a critical temperature for representing the occurrence of condensation of the hard disk;
and the processing chip adjusts the working power of the semiconductor refrigerating sheet according to the temperature difference value between the temperature of the hard disk and the reference temperature so as to enable the temperature of the hard disk to be within a preset range and prevent the hard disk from generating condensation.
2. The anti-condensation temperature control method according to claim 1, wherein the step of determining the reference temperature by the processing chip according to the environment temperature of the hard disk comprises the following steps:
the temperature and humidity sensor collects the ambient temperature of the hard disk;
the processing chip acquires the ambient temperature of the hard disk from the temperature and humidity sensor;
the processing chip takes the ambient temperature as the reference temperature.
3. The anti-condensation temperature control method according to claim 1, wherein the step of determining the reference temperature by the processing chip according to the ambient temperature of the hard disk further comprises:
the temperature and humidity sensor collects the environmental humidity of the hard disk;
the processing chip acquires the environment humidity of the hard disk from the temperature and humidity sensor;
the processing chip determines the dew point temperature according to the environment temperature and the environment humidity of the hard disk;
and the processing chip takes the dew point temperature as the reference temperature.
4. The anti-condensation temperature control method according to claim 1, wherein the step of adjusting the working power of the semiconductor chilling plate by the processing chip according to the temperature difference between the temperature of the hard disk and the reference temperature comprises:
the processing chip judges whether the temperature of the hard disk is greater than the reference temperature or not;
if the temperature of the hard disk is higher than the reference temperature, the processing chip adjusts the working power of the semiconductor refrigerating sheet according to the temperature difference;
and if the temperature of the hard disk is not greater than the reference temperature, the processing chip closes the semiconductor refrigeration sheet.
5. The anti-condensation temperature control method according to claim 4, wherein the step of adjusting the working power of the semiconductor chilling plate by the processing chip according to the temperature difference comprises the following steps:
and if the temperature difference is larger than a preset value, the processing chip adjusts the working power of the semiconductor chilling plate to a preset first power.
6. The anti-condensation temperature control method according to claim 5, wherein the step of adjusting the working power of the semiconductor chilling plate by the processing chip according to the temperature difference further comprises:
if the temperature difference value is not larger than the preset value, the processing chip calculates a second power corresponding to the temperature difference value according to a preset function, and the preset function is formed by fitting according to the relation between the test temperature of the hard disk and the test power of the semiconductor refrigerating sheet;
and the processing chip adjusts the working power of the semiconductor chilling plate to the second power.
7. The method according to claim 6, wherein the predetermined function is a piecewise function.
8. The anti-condensation temperature control method according to claim 1, wherein after the step of adjusting the working power of the semiconductor chilling plate by the processing chip according to the temperature difference between the temperature of the hard disk and the reference temperature, the method comprises the following steps:
the processing chip acquires the temperature of the hard disk and the ambient temperature of the hard disk in each preset period, and determines the reference temperature in each preset period according to the ambient temperature of the hard disk in each preset period;
and the processing chip adjusts the working power of the semiconductor refrigeration piece in each preset period according to the temperature difference value between the temperature of the hard disk and the reference temperature in each preset period.
9. A circuit control panel is characterized by being applied to an anti-condensation temperature control system, wherein the anti-condensation temperature control system further comprises a hard disk, a semiconductor refrigeration sheet, a heat conduction metal plate and a thermistor, the semiconductor refrigeration sheet comprises a cold surface and a hot surface, the heat conduction metal plate is respectively contacted with the cold surface of the semiconductor refrigeration sheet and the outer surface of the hard disk through a heat conduction medium, the thermistor is fixed on the heat conduction metal plate, the circuit control panel comprises a processing chip and a temperature and humidity sensor, and the processing chip is respectively electrically connected with the temperature and humidity sensor, the thermistor and the semiconductor refrigeration sheet;
the processing chip is used for acquiring the temperature of the hard disk and the ambient temperature of the hard disk;
the processing chip is further used for determining a reference temperature according to the environment temperature of the hard disk, wherein the reference temperature is a critical temperature for representing the occurrence of condensation on the hard disk;
the processing chip is further used for adjusting the working power of the semiconductor refrigerating sheet according to the temperature difference value between the temperature of the hard disk and the reference temperature, so that the temperature of the hard disk is in a preset range and condensation does not occur on the hard disk.
10. The condensation-prevention temperature control system is characterized by comprising a hard disk, a circuit control board, a semiconductor refrigeration piece, a heat conduction metal plate and a thermistor, wherein the semiconductor refrigeration piece comprises a cold surface and a hot surface;
the processing chip is used for acquiring the temperature of the hard disk and the ambient temperature of the hard disk;
the processing chip is further used for determining a reference temperature according to the environment temperature of the hard disk, wherein the reference temperature is a critical temperature for representing the occurrence of condensation on the hard disk;
the processing chip is further used for adjusting the working power of the semiconductor refrigerating sheet according to the temperature difference value between the temperature of the hard disk and the reference temperature, so that the temperature of the hard disk is in a preset range and condensation does not occur on the hard disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111183806.5A CN113870906B (en) | 2021-10-11 | 2021-10-11 | Anti-condensation temperature control method, system and circuit control board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111183806.5A CN113870906B (en) | 2021-10-11 | 2021-10-11 | Anti-condensation temperature control method, system and circuit control board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113870906A true CN113870906A (en) | 2021-12-31 |
| CN113870906B CN113870906B (en) | 2023-04-07 |
Family
ID=78998497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111183806.5A Active CN113870906B (en) | 2021-10-11 | 2021-10-11 | Anti-condensation temperature control method, system and circuit control board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113870906B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115111741A (en) * | 2022-06-02 | 2022-09-27 | 青岛海尔空调器有限总公司 | Storage air conditioner control device and method and storage air conditioner |
| CN115111742A (en) * | 2022-06-02 | 2022-09-27 | 青岛海尔空调器有限总公司 | Storage air conditioner control device and method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2532524Y (en) * | 2002-03-04 | 2003-01-22 | 方宋玉 | Refrigerator for CPU |
| CN201975384U (en) * | 2011-03-11 | 2011-09-14 | 安徽省黔奇电子有限公司 | Anti-condensation semiconductor refrigeration CPU (Central Processing Unit) temperature controller |
| CN105188317A (en) * | 2015-09-07 | 2015-12-23 | 上海交通大学 | Active thermoelectric cooling system for electronic device in severe working conditions |
| CN108807314A (en) * | 2018-07-30 | 2018-11-13 | 紫光股份有限公司 | A kind of semiconductor refrigeration radiating device for central processing unit (CPU) chip |
| CN113467545A (en) * | 2021-07-26 | 2021-10-01 | 联想(北京)有限公司 | Control method and electronic device |
-
2021
- 2021-10-11 CN CN202111183806.5A patent/CN113870906B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2532524Y (en) * | 2002-03-04 | 2003-01-22 | 方宋玉 | Refrigerator for CPU |
| CN201975384U (en) * | 2011-03-11 | 2011-09-14 | 安徽省黔奇电子有限公司 | Anti-condensation semiconductor refrigeration CPU (Central Processing Unit) temperature controller |
| CN105188317A (en) * | 2015-09-07 | 2015-12-23 | 上海交通大学 | Active thermoelectric cooling system for electronic device in severe working conditions |
| CN108807314A (en) * | 2018-07-30 | 2018-11-13 | 紫光股份有限公司 | A kind of semiconductor refrigeration radiating device for central processing unit (CPU) chip |
| CN113467545A (en) * | 2021-07-26 | 2021-10-01 | 联想(北京)有限公司 | Control method and electronic device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115111741A (en) * | 2022-06-02 | 2022-09-27 | 青岛海尔空调器有限总公司 | Storage air conditioner control device and method and storage air conditioner |
| CN115111742A (en) * | 2022-06-02 | 2022-09-27 | 青岛海尔空调器有限总公司 | Storage air conditioner control device and method |
| CN115111742B (en) * | 2022-06-02 | 2023-11-17 | 青岛海尔空调器有限总公司 | Storage air conditioner control device and method |
| WO2023231432A1 (en) * | 2022-06-02 | 2023-12-07 | 青岛海尔空调器有限总公司 | Storage air conditioner control apparatus and control method, and storage air conditioner |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113870906B (en) | 2023-04-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113870906B (en) | Anti-condensation temperature control method, system and circuit control board | |
| US8315746B2 (en) | Thermal management techniques in an electronic device | |
| EP2445327A2 (en) | Air conditioner and air conditioning system | |
| US20130027068A1 (en) | Apparatus and method for testing operation performance of an electronic module under specified temperature | |
| CN113300023B (en) | Energy storage system and condensation prevention control method thereof | |
| CN111562803A (en) | Electronic device, temperature controller, temperature control method, device, and storage medium | |
| CN109343605A (en) | A kind of temperature control equipment and control method | |
| US20060100798A1 (en) | Method to increase the maximum allowable ambient temperature rating of an electronic device | |
| JP4200885B2 (en) | Motor drive device for electric compressor | |
| CN109668273B (en) | Refrigeration device control method, refrigeration device, and storage medium | |
| CN117715366A (en) | Method and device for controlling temperature of cooling liquid, liquid-cooled electronic equipment and medium | |
| CN110972342B (en) | Sensor high-temperature alarm threshold compensation method and electromagnetic heating equipment | |
| CN112965586A (en) | Temperature control method, system and device of edge server and edge server | |
| CN105913867B (en) | A kind of adjustment device and electronic equipment | |
| CN115915725A (en) | Heat dissipation control method and device and electrical equipment | |
| CN113467545A (en) | Control method and electronic device | |
| CN111103911B (en) | Heat dissipation device for mobile equipment and control method thereof | |
| CN109520188B (en) | Refrigeration device control method, refrigeration device, and storage medium | |
| CN111930210A (en) | Temperature control method of desktop computer case based on compressor cooling | |
| Chowdhury et al. | Raising Inlet air temperature for a hybrid-cooled server retrofitted with liquid cooled cold plates | |
| CN108260332B (en) | Thermal management control device and method | |
| KR20110091660A (en) | Climate control in a radio network node | |
| CN216014246U (en) | Automatic computer thermostat | |
| US12085966B2 (en) | Predictive open loop pre-heating of electronic devices in cold environments | |
| CN114739078B (en) | Semiconductor refrigeration equipment and control method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |