CN105913867B - A kind of adjustment device and electronic equipment - Google Patents
A kind of adjustment device and electronic equipment Download PDFInfo
- Publication number
- CN105913867B CN105913867B CN201610202556.8A CN201610202556A CN105913867B CN 105913867 B CN105913867 B CN 105913867B CN 201610202556 A CN201610202556 A CN 201610202556A CN 105913867 B CN105913867 B CN 105913867B
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- ssd
- temperature
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- chilling plate
- semiconductor chilling
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1426—Reducing the influence of the temperature by cooling plates, e.g. fins
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/144—Reducing the influence of the temperature by detection, control, regulation of the temperature
Abstract
The embodiment of the present invention provides a kind of adjustment device and electronic equipment, for solving technical problem poor to the temperature regulation effect of SSD in electronic equipment.The adjustment device includes: solid-state hard disk SSD；Shell, for accommodating the SSD；Semiconductor chilling plate is connected with the SSD, between the SSD and the shell, for adjusting the temperature of the SSD.
Description
Technical field
The present invention relates to electronic technology field, in particular to a kind of adjustment device and electronic equipment.
Background technique
Solid state hard disk (Solid State Drives, SSD) also referred to as consolidates disk, for using solid-state electronic storage chip battle array
The hard disk of column and system, is made of control unit and storage unit (such as FLASH chip, dram chip), with read or write speed
Fastly, shockproof crash resistance, feature noiseless, operating temperature range is big.
There are many producers to start or the issued SSD based on NVMe interface standard, NVMe SSD at present
The storage medium access speed of system is greatly improved as a kind of new high-performance Sasobit and SBR D.For example, the SSD 750 of Intel,
The lasting read-write of its 400GB reaches as high as 2.2GB/s, 900MB/s, and random read-write reaches as high as 430000 IOPS, 230000
IOPS。
But NVMe SSD also increases the difficulty of system radiating while lifting system performance, especially U.2 front inserting
NVMe SSD, single-deck maximum power dissipation up to 25w, if in the electronic device place 8 NVMe SSD if, hard disk devices
The power consumption of middle NVMe SSD will reach 200w or more, cause the power consumption of system larger, simultaneously as in HDD (hard drive
Device) spacing between the NVMe SSD that is inserted into slot is smaller, heat dissipation difficulty also will be further increased.Also, NVMe SSD
Need certain temperature in normal work, however for some work on special extremely cold ground, it, can be with such as arctic scientific investigation
It is not to be available NVMe SSD, therefore, even if system supports cold-starting, if SSD itself does not support cold-starting that will become yet
Bottleneck in use process.
In summary, poor to the temperature regulation effect of the SSD of electronic equipment in the prior art.
Summary of the invention
The embodiment of the present invention provides a kind of adjustment device and electronic equipment, for solving the temperature in electronic equipment to SSD
The poor technical problem of regulating effect.
A kind of adjustment device, comprising:
Solid-state hard disk SSD；
Shell, for accommodating the SSD；
Semiconductor chilling plate is connected with the SSD, between the SSD and the shell, for adjusting the SSD
Temperature.
Optionally, the semiconductor chilling plate includes first surface and second surface, the first surface and the SSD phase
Contact, the second surface are in contact with the shell.
Optionally, the semiconductor chilling plate includes first electrode and second electrode；Wherein, when the first electrode and electricity
When the anode in source is connected and the second electrode is connected with the cathode of the power supply, the semiconductor chilling plate is in refrigeration mould
Formula, under the refrigeration mode, the temperature of the first surface is lower than the temperature of the second surface.
Optionally, when the first electrode is connected with the cathode of the power supply and the second electrode and the power supply just
When being extremely connected, the semiconductor chilling plate is in heating mode, and under the heating mode, the temperature of the first surface is higher than
The temperature of the second surface.
Optionally, the temperature difference between the temperature of the first surface and the temperature of the second surface is in preset temperature
In poor range.
Optionally, the adjustment device further include:
Thermally conductive sheet is attached on the SSD, for carrying out heat biography between the SSD and the semiconductor chilling plate
It passs.
Optionally, the shell includes the groove for accommodating the semiconductor chilling plate.
Optionally, at least one surface of the shell is provided at least two thermal troughs, for increase the shell with
The contact area of air.
A kind of electronic equipment, including；
Shell；
The adjustment device, for adjusting the temperature of SSD in the electronic equipment.
In the application, due to including SSD, shell and semiconductor chilling plate in adjustment device, semiconductor chilling plate is located at SSD
Between shell, since semiconductor chilling plate generally includes heat-absorbent surface and radiating surface, therefore by the way that half is arranged between SSD and shell
Conductor cooling piece can carry out temperature adjustment to SSD as needed, such as be radiated or heated to SSD, to improve to SSD
Temperature regulation effect.
Simultaneously as introducing semiconductor chilling plate on the basis of existing SSD, the temperature control to SSD can be realized, and partly lead
The price of body cooling piece is lower, without increasing other excessive hardware, so that cost is relatively low for electronic equipment.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Apply embodiment, for those of ordinary skill in the art, without creative efforts, can also basis mention
The attached drawing of confession obtains other attached drawings.
Fig. 1 is the schematic diagram of middle regulator of the embodiment of the present invention；
Fig. 2 is the schematic diagram of shell further groove in the embodiment of the present invention；
Fig. 3 is the schematic diagram of thermally conductive sheet in the embodiment of the present invention；
Fig. 4 is that the adjustment device of electronic equipment in the embodiment of the present invention carries out the schematic diagram of temperature control to SSD.
Specific embodiment
The embodiment of the present invention provides a kind of adjustment device and electronic equipment, for solving the temperature in electronic equipment to SSD
The poor technical problem of regulating effect.
In order to solve the above-mentioned technical problem, technical solution general thought provided in an embodiment of the present invention is as follows:
In the application, due to including SSD, shell and semiconductor chilling plate in adjustment device, semiconductor chilling plate is located at SSD
Between shell, since semiconductor chilling plate generally includes heat-absorbent surface and radiating surface, therefore by the way that half is arranged between SSD and shell
Conductor cooling piece can carry out temperature adjustment to SSD as needed, such as be radiated or heated to SSD, to improve to SSD
Temperature regulation effect.
Simultaneously as introducing semiconductor chilling plate on the basis of existing SSD, the temperature control to SSD can be realized, and partly lead
The price of body cooling piece is lower, without increasing other excessive hardware, so that cost is relatively low for electronic equipment.To make implementation of the present invention
The purposes, technical schemes and advantages of example are clearer, and following will be combined with the drawings in the embodiments of the present invention, to the embodiment of the present invention
In technical solution be clearly and completely described, it is clear that described embodiments are some of the embodiments of the present invention, without
It is whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not before making creative work
Every other embodiment obtained is put, shall fall within the protection scope of the present invention.
In practical applications, one or more fans can be set in electronic equipment, such as CPU (Central
Processing Unit, central processing unit) fan, graphics card fan etc., when electronic equipment needs to radiate, it can control wind
The rotation of fan radiates to corresponding component.
In addition, the terms "and/or", only a kind of incidence relation for describing affiliated partner, indicates may exist
Three kinds of relationships, for example, A and/or B, can indicate: individualism A exists simultaneously A and B, these three situations of individualism B.Separately
Outside, character "/" herein typicallys represent the relationship that forward-backward correlation object is a kind of "or".
The preferred embodiment of the present invention is described in detail with reference to the accompanying drawing.
As shown in Figure 1, a kind of adjustment device of the embodiment of the present invention, which includes solid-state hard disk SSD, shell and half
Conductor cooling piece, certainly, the adjustment device can also be corresponding with relevant heat generating components.
It may include multiple SSD in the embodiment of the present invention, in electronic equipment, SSD can be with solid-state electronic storage chip
Array and manufactured hard disk, the operating temperature range of chip are very wide, for example, quotient advise product operating temperature range can be
[0,70 DEG C], work advise the operating temperature range of product up to [- 40,85 DEG C].
Usually, the thickness of NVMe SSD can be 15mm, and in the electronic device, the hard disk that standard can be inserted drives
Dynamic device (Hard Disk Drive, HDD) slot, when being inserted into NVMe SSD, the spacing between NVMe SSD is smaller,
Radiate difficulty.
In the embodiment of the present invention, semiconductor chilling plate includes first surface and second surface, and first surface is (as shown in figure 1 partly
Shade institute presentation surface in conductor cooling piece) it is in contact with SSD, second surface is the opposite face of first surface, can be with shell
It is in contact.
It may include first surface and second surface, first surface and SSD in semiconductor chilling plate in the embodiment of the present invention
It is in contact, second surface is in contact with shell.Usually, first surface and second surface can be respectively as the suction of cooling piece
Hot face and radiating surface.For example, second surface can be radiating surface if first surface is heat-absorbent surface in semiconductor chilling plate, or
Person, if first surface is radiating surface, second surface is heat-absorbent surface.
In the embodiment of the present invention, shell can be used for accommodating SSD or SSD controller, and the material of shell, which can be, to be had
The material of certain degree of hardness, such as may include alloy material, metal material etc., the embodiment of the present invention is not specifically limited this.
Usually, shell can have biggish thickness, at least one surface outer surface of shell can be set to
Few two thermal troughs, for increasing the contact area of shell and air, thus can be by shell when surface of shell has distinguished and admirable flow through
The heat on surface is taken away, and the radiating efficiency of SSD is improved.
It may include the groove for accommodating semiconductor chilling plate in the embodiment of the present invention, in shell, groove may be at
Position corresponding with SSD in shell, i.e., the band of position that groove is arranged in shell can be area corresponding with the present position SSD
Domain, to carry out relatively straightforward temperature control effect to SSD.As shown in Fig. 2, it is the schematic diagram of shell further groove, the depth of groove
Degree might be less that the thickness of shell.
Optionally, adjustment device can also include thermally conductive sheet, and thermally conductive sheet can be attached on SSD, thermally conductive sheet have it is thermally conductive,
The effect of insulation can be used for carrying out heat transfer between SSD and semiconductor chilling plate.As shown in figure 3, it is self-contained for tune
Set the schematic diagram of middle thermally conductive sheet, wherein thermally conductive sheet can also be attached to the heat generating components adjusted in device in addition to being attached to SSD
On (including SSD), it can be used for for the heat adjusted inside device being transmitted on cooling piece and/or shell.
In practical applications, the thermally conductive sheet of use can be heat-conducting silica gel sheet, thermally conductive silica gel piece, heat conductive graphite piece etc..Its
In, heat-conducting silica gel sheet is using silica gel as substrate, and the various auxiliary materials such as addition metal oxide are led by one kind that special process synthesizes
Thermal medium material, thermal coefficient is up to [0.8w/m-k, 3w/m-k].
Usually, thermally conductive sheet can be used for increasing the contact area between chip and shell, can be by SSD by thermally conductive sheet
The heat of controller is transmitted on shell on (such as aluminum alloy casing), to promote heat-conducting effect.
Optionally, semiconductor chilling plate includes first electrode and second electrode, by can to first motor and the second motor
Semiconductor chilling plate and power supply are attached.
In practical applications, semiconductor chilling plate can have Peltier effect (i.e. Peltier effect), Peltier effect
Refer to that two different metals constitute closed circuits, when in circuit, there are when DC current, the temperature difference will be generated between two connectors.
For example, heat can be absorbed respectively at the both ends of electrode when the electrode that direct current is connected by two kinds of different semiconductor materials
Amount and releasing heat, so as to realize the purpose of refrigeration.
It is relatively simple to semiconductor chilling plate control mode during the present invention is implemented, in practical applications, direct current can be used
As power supply, connect its two electrodes can be realized the energy transfer of a surface (such as face A) in semiconductor chilling plate 12V
To another surface (such as face B), the temperature difference in two faces AB can be realized from 1 DEG C to 100 DEG C or more by controlling size of current, certainly
In the embodiment of the present invention, the temperature difference in two faces only need to be reached to [30 DEG C, 40 DEG C].
Meanwhile there are also another characteristics for semiconductor chilling plate, that is, if by the electricity of two electrodes above-mentioned
Source reversion, then by the energy transfer in the realization face B to the face A.That is refrigeration can be thus achieved for the face A to be used for pair
The function of controller chip heat dissipation, while can also be used to heating to realize the heating function to controller chip, realize low temperature
Start the function of work.
Therefore, in the embodiment of the present invention, by controlling the connection type to first electrode and second electrode and power supply, to control
The operating mode of semiconductor chilling plate processed.
Mode one: first electrode is connected with the anode of power supply, and second electrode is connected with the cathode of power supply (refers to figure
1), at this point, then semiconductor chilling plate is in refrigeration mode, in cooling mode, the temperature of first surface can be lower than the second table
The temperature in face.
In cooling mode, since the temperature of first surface is lower than the temperature of second surface, and first surface connects with SSD
Touching, therefore when SSD generates heat, by the conductive force of semiconductor chilling plate, the SSD heat generated can be transmitted to shell
On outer surface, to radiate.
Since SSD may continue to generate during the work time heat, for example, it is longer using duration when, therefore SSD and its institute
The temperature for locating environment may be higher, causes power consumption larger, heating problem is more serious, or even can be more than the normal work temperature of SSD
Range is spent, therefore, in actual operation, when the temperature for detecting SSD is higher than certain temperature value, semiconductor refrigerating can be connected
The heat dissipation to SSD is realized in the connection of the first motor of piece and the second motor and power supply.
In the embodiment of the present invention, the baseboard management controller (Base-board in electronic equipment can be passed through
Management Contrlle, BMC) complete machine temperature (can be mainly the corresponding temperature of SSD in the present invention) be carried out to server
Detection, when BMC judges that current detection temperature is higher than preset temperature, wherein preset temperature can be less than or equal to the normal work of SSD
Make the peak of temperature range, such as preset temperature can be 45 DEG C, then when determining that Current Temperatures are higher than 45 DEG C, can determine
It needs to radiate to SSD, the first electrode of semiconductor chilling plate can be connected with the anode of power supply at this time, and second electrode
It is connected with the cathode of power supply, so that semiconductor chilling plate enters refrigeration mode, first surface is heat-absorbent surface at this time, at a temperature below
Second surface can rapidly absorb the heat of SSD by first surface, and by the conduction of thermally conductive sheet, conduct heat to
It on shell, such as is radiated by the thermal trough of shell, realizes the heat dissipation to SSD.
Wherein, fully achieved in BMC IPMI function need a 16 powerful bits or 32 bit microcontrollers with
And for data storage RAM, for non-volatile data storage flash memory and firmware.
In practical applications, if being pasted with thermally conductive sheet on SSD, when the heat of SSD generation is more, temperature is higher, thus it is logical
It crosses the thermally conductive sheet with larger heat-conducting area being in contact with SSD and is transmitted to semiconductor chilling plate, and then pass through control half
Conductor cooling piece enters refrigeration mode, and the heat dissipation to SSD can be realized.Since the area of thermally conductive sheet is usually larger, therefore it can be with
More comprehensively, rapidly the heat of SSD is adsorbed, and then is transmitted to semiconductor chilling plate, and then pass through semiconductor
Cooling piece it is thermally conductive, to conduct heat to outside shell.
In the embodiment of the present invention, if detecting, the Current Temperatures of SSD are lower than the second preset temperature, which can
With the minimum temperature of the normal working temperature range greater than SSD, if the normal working temperature range of SSD is [- 30 DEG C, 70 DEG C],
Second preset temperature can be -5 DEG C, then when the Current Temperatures for detecting SSD are lower than the second preset temperature, can pass through control
Semiconductor chilling plate is in heating mode to realize the heating function to controller chip in SSD.
Realize that the process promoted to the temperature of SSD may is that the first of semiconductor chilling plate by semiconductor chilling plate
Electrode is connected with the cathode of power supply, meanwhile, second electrode is connected with the anode of power supply, at this point, can will be in semiconductor chilling plate
Second surface energy transfer to first surface, improve the temperature of first surface, the temperature of first surface can be higher than at this time
The temperature of second surface, and first surface is adjacent with SSD, therefore enable to the temperature of SSD local environment higher, to guarantee
Normal starting or work of SSD etc..
In practical applications, when semiconductor chilling plate is in heating mode, the temperature of first surface is higher than second surface
Temperature, if there are thermally conductive sheet between SSD and semiconductor chilling plate, thermally conductive sheet can pass the heat of the higher first surface of temperature
The face being in contact with SSD is led, to improve the temperature of the SSD contacted with thermally conductive sheet.
Optionally, during being heated by semiconductor chilling plate, since SSD can also be generated during the work time
Corresponding heat, therefore can also implement to detect the temperature of SSD, however, it is determined that the temperature of SSD reaches certain temperature range,
It can stop the heating operating mode of semiconductor chilling plate.For example, when the temperature for determining SSD is restored to normal temperature, it is such as current
Temperature is in [6 DEG C, 15 DEG C], then can control the connection of first electrode and second electrode and power supply in semiconductor chilling plate, stop
Only heating mode.
In practical application, the process of structure function for realizing the adjustment device can be as follows.
Firstly, the heat of SSD controller is transmitted on aluminum alloy casing by heat-conducting silica gel sheet, heat-conducting silica gel sheet can be with
It is intended merely to increase the contact area in SSD between chip and shell, to promote heat-conducting effect.Wherein where SSD controller
The shell (such as aluminium) of side is usually thicker, meanwhile, multiple thermal troughs can be set on shell to increase heat dissipation area.
It is then possible to determine the band of position corresponding with SSD in shell, which can be SSD when being accommodated in shell,
Corresponding region, the region can be set to for placing the position of semiconductor chilling plate in shell SSD in the housing, therefore in shell
A groove is arranged in the corresponding band of position SSD in body, which can have the shape to match with semiconductor chilling plate, with
It will be at least part insertion groove of semiconductor chilling plate.
Further, increase the control circuit of semiconductor chilling plate on SSD, and increase relevant control logic, logic
Control process can be as shown in Figure 4.I.e. by BMC can to electronic equipment carry out complete machine temperature acquisition, and then to temperature into
Row judgement, and corresponding judging result is obtained, deterministic process may include following several middle situations:
Situation one: determine that Current Temperatures are higher than the first preset temperature, when such as 45 DEG C.At this point, system can control half in SSD
Conductor cooling piece enters refrigeration mode, realizes the heat dissipation to SSD.
Certainly, it may determine that whether the Current Temperatures of SSD have been within the scope of normal working temperature in process of refrigerastion, if
It has been in normal operating conditions, then can activate SSD by system, has such as started SSD and enters operating mode.Alternatively, if detection
Current Temperatures are still higher, such as higher than 30 DEG C, then it is in refrigeration mode to continue to control semiconductor chilling plate, i.e. first electrode
It is connected with the anode of power supply, the cathode connection of the second motor and power supply, until the temperature of SSD is restored to room temperature.
Situation two: if it is determined that Current Temperatures are lower than the second preset temperature, such as the second preset temperature can be -5 DEG C, at this point,
System can control semiconductor chilling plate in SSD and enter refrigeration mode, realize the heating to SSD, can be started with to reach SSD
Normal temperature range.
Situation three: if it is determined that Current Temperatures are in normal range of operation, then system can activate SSD to be started, from
And enter operating mode.
In the embodiment of the present invention, due to when semiconductor chilling plate is applied in SSD, it is only necessary to increase simple circuit
The intelligent temperature control effect of SSD can be realized with logic, therefore implementation is relatively simple, by adjusting in semiconductor chilling plate first
The operating mode of semiconductor chilling plate can be adjusted in the connection type of electrode and second electrode and power supply, so that passive heat be passed
The heat dissipation for leading mode becomes active heat transfer, enhances the adaptive capacity to environment of SSD itself.
Based on the same inventive concept, a kind of electronic equipment is also disclosed in the embodiment of the present invention, the electronic equipment include shell and
Adjust device.
Wherein, the structure and function for adjusting device please refer to preceding sections, and details are not described herein again.
Certainly, can also be including other workpieces, such as CPU, video card in electronic equipment, it can be with adjustment device phase
Even, to access SSD.
In practical applications, when such as system starts SSD, it can detecte whether Current Temperatures meet by adjusting device
The start-up temperature requirement of SSD, if not satisfied, then can radiate or heat to SSD by the operating mode of control adjustment device,
Within the temperature range of being at and can start, allow it to start in extreme weather, certainly, in the SSD course of work
In, the temperature of SSD (or SSD local environment) can also be adjusted by adjusting the automatic temperature-controlled effect of device, be made at its
In the temperature control effect to SSD within the scope of certain temperature, improving electronic equipment.
It should be understood by those skilled in the art that, the embodiment of the present invention can provide as method, system or computer program
Product.Therefore, complete hardware embodiment, complete software embodiment or reality combining software and hardware aspects can be used in the present invention
Apply the form of example.Moreover, it wherein includes the computer of computer usable program code that the present invention, which can be used in one or more,
The computer program implemented in usable storage medium (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.) produces
The form of product.
The present invention be referring to according to the method for the embodiment of the present invention, the process of equipment (system) and computer program product
Figure and/or block diagram describe.It should be understood that every one stream in flowchart and/or the block diagram can be realized by computer program instructions
The combination of process and/or box in journey and/or box and flowchart and/or the block diagram.It can provide these computer programs
Instruct the processor of general purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices to produce
A raw machine, so that being generated by the instruction that computer or the processor of other programmable data processing devices execute for real
The device for the function of being specified in present one or more flows of the flowchart and/or one or more blocks of the block diagram.
These computer program instructions, which may also be stored in, is able to guide computer or other programmable data processing devices with spy
Determine in the computer-readable memory that mode works, so that it includes referring to that instruction stored in the computer readable memory, which generates,
Enable the manufacture of device, the command device realize in one box of one or more flows of the flowchart and/or block diagram or
The function of being specified in multiple boxes.
These computer program instructions also can be loaded onto a computer or other programmable data processing device, so that counting
Series of operation steps are executed on calculation machine or other programmable devices to generate computer implemented processing, thus in computer or
The instruction executed on other programmable devices is provided for realizing in one or more flows of the flowchart and/or block diagram one
The step of function of being specified in a box or multiple boxes.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (8)
1. a kind of adjustment device, comprising:
Solid state hard disk；
Shell, for accommodating the solid state hard disk；
Semiconductor chilling plate is connected with the solid state hard disk, between the solid state hard disk and the shell, for adjusting
The temperature of solid state hard disk is stated,
The semiconductor chilling plate includes first surface and second surface, and the first surface is in contact with the solid state hard disk,
The second surface is in contact with the shell.
2. adjustment device as described in claim 1, which is characterized in that the semiconductor chilling plate includes first electrode and second
Electrode；Wherein, when the first electrode is connected with the anode of power supply and the second electrode is connected with the cathode of the power supply,
The semiconductor chilling plate is in refrigeration mode, and under the refrigeration mode, the temperature of the first surface is lower than described second
The temperature on surface.
3. adjustment device as claimed in claim 2, which is characterized in that when the first electrode is connected with the cathode of the power supply
And the second electrode, when being connected with the anode of the power supply, the semiconductor chilling plate is in heating mode, in the heating
Under mode, the temperature of the first surface is higher than the temperature of the second surface.
4. adjustment device as claimed in claim 3, which is characterized in that the temperature of the first surface and the second surface
Temperature difference between temperature is within the scope of preset temperature difference.
5. adjustment device as described in claim 1, which is characterized in that the adjustment device further include:
Thermally conductive sheet is attached in the solid state hard disk, for carrying out between the solid state hard disk and the semiconductor chilling plate
Heat transfer.
6. adjustment device as described in claim 1, which is characterized in that the shell includes for accommodating the semiconductor refrigerating
The groove of piece.
7. adjustment device as described in claim 1, which is characterized in that at least one surface of the shell is provided at least two
A thermal trough, for increasing the contact area of the shell and air.
8. a kind of electronic equipment, comprising:
Shell；
Device is adjusted as described in any claim of claim 1-7.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610202556.8A CN105913867B (en) | 2016-03-31 | 2016-03-31 | A kind of adjustment device and electronic equipment |
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| CN201610202556.8A CN105913867B (en) | 2016-03-31 | 2016-03-31 | A kind of adjustment device and electronic equipment |
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| CN105913867B true CN105913867B (en) | 2019-06-25 |
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| CN110837284A (en) * | 2019-10-25 | 2020-02-25 | 华为技术有限公司 | Thermoelectric module, hard disk device and electronic equipment |
| CN111988467B (en) * | 2020-08-17 | 2021-09-14 | 深圳小辣椒科技有限责任公司 | Method, device and system for self-defining control of temperature of mobile phone and storage medium |
| CN113096696B (en) * | 2021-03-02 | 2022-11-29 | 北京傲星科技有限公司 | External memory for computer |
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| CN203759637U (en) * | 2014-02-18 | 2014-08-06 | 赛伦（厦门）新材料科技有限公司 | Computer hard disk drive semiconductor cooling heating device |
| JP2016053757A (en) * | 2014-09-02 | 2016-04-14 | 株式会社東芝 | Memory system |
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