CN101320287A - Radiating plate, interspace adjustable cooling clamper and mainboard - Google Patents
Radiating plate, interspace adjustable cooling clamper and mainboard Download PDFInfo
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- CN101320287A CN101320287A CNA2007101059746A CN200710105974A CN101320287A CN 101320287 A CN101320287 A CN 101320287A CN A2007101059746 A CNA2007101059746 A CN A2007101059746A CN 200710105974 A CN200710105974 A CN 200710105974A CN 101320287 A CN101320287 A CN 101320287A
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- heat radiator
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Abstract
The present invention discloses a cooling plate, a gap-adjustable cooling clamp and a mainboard. The gap-adjustable cooling clamp is used to clamp at least one heat source of a tabular module. The gap-adjustable cooling clamp comprises a first cooling fin, a second cooling fin and at least one gap-adjusting part. A gap exists between the first cooling fin and the second cooling fin, and the heat source is suitably arranged in the gap and abuts against the first cooling fin and the second cooling fin. The gap-adjusting part, which is connected between the first cooling fin and the second cooling fin, is used to adjust the gap between the first cooling fin and the second cooling fin, so that the first cooling fin and the second cooling fin can clamp the heat source.
Description
Technical field
The present invention relates to a kind of mainboard, and be particularly related to the anchor clamps of the auxiliary mainboard heat radiation of a kind of energy.
Background technology
Fig. 1 is the synoptic diagram of known main frame.Please refer to Fig. 1, dispose mainboard 110, power supply unit 120, CD-ROM drive 130, floppy disk 140 and main frame fan 150 in the main frame 100.Mainboard 110 is positioned at a side of main frame 100, and central processing unit (Central Process Unit) is wherein arranged on the mainboard 110, and be plugged with many integrated circuit boards such as display card, sound card or RAM (random access memory) card, and other electronic component.Power supply unit 120 is positioned at the below of main frame 100 inside, and power supply unit 120 is suitable for being connected with external power source.Power supply unit 120 also utilizes electric wire to be electrically connected with mainboard 110, so that mainboard 110 has enough power supplys to operate.
Both are disposed at the place ahead of main frame 100 side by side CD-ROM drive 130 and floppy disk 140, and respectively by winding displacement to be connected with mainboard 110 electricity.CD-ROM drive 130 and floppy disk 140 be respectively in order to carrying disc sheet and disk sheet, reading the data of discs and disk sheet, or with data storing in discs and disk sheet.
Central processing unit on the mainboard 110, display card, sound card, RAM (random access memory) card or other electronic component can produce heat when running.In addition, power supply unit 120, CD-ROM drive 130 and floppy disk 140 also can produce heat when running.A large amount of when hot when savings in the main frame 100, can have influence on the running of mainboard 110, power supply unit 120, CD-ROM drive 130 and floppy disk 140.Severe patient also can shorten serviceable life of these electronic installations.
Therefore, also need configure host fan 150 in the main frame 100.The main frame fan 150 that is disposed at main frame 100 rears is in order to the heat with main frame 100 inside, utilizes the mode of forced convertion to be output in outside the main frame 100.
Yet,,, make that near the temperature these thermals source is still higher because electronic component constantly operates and send heat though fan 150 can reduce main frame 100 temperature inside.So, can influence the running of electronic component.Therefore, how to make electronic component more apace heat extraction be present problem demanding prompt solution.
Summary of the invention
The invention provides a kind of interspace adjustable cooling clamper, it can promote the radiating effect of mainboard.
The invention provides a kind of mainboard with great heat radiation effect.
The invention provides a kind of heat radiator of promoting tabular module heat dissipating effect on the mainboard.
The present invention proposes a kind of interspace adjustable cooling clamper, and it is suitable at least one thermal source of the tabular module of clamping.This spacing adjustable cooling clamper comprises first heat radiator, second heat radiator and at least one spacing adjustment part.One spacing (gap) is arranged between first, second heat radiator, and thermal source is suitable for being disposed in the spacing and first, second heat radiator of breasting.Spacing adjustment part (Gap Adjusting Element) is connected between first, second heat radiator, and it is suitable for adjusting the spacing between first, second heat radiator, so that first, second heat radiator clamping (hold) thermal source.
In one embodiment of this invention, above-mentioned tabular module is a RAM (random access memory) card, and thermal source is a memory chip.
In one embodiment of this invention, above-mentioned RAM (random access memory) card also comprises the 3rd heat radiator of breasting memory chip.
In one embodiment of this invention, the material of first, second above-mentioned heat radiator comprises metal.
In one embodiment of this invention, the second above-mentioned heat radiator comprises body and fixing seat.Body has towards the surface of first heat radiator, and the fixing seat is disposed at the surface, and is suitable for contacting thermal source.
In one embodiment of this invention, above-mentioned body and fixing seat are formed in one.
In one embodiment of this invention, above-mentioned interspace adjustable cooling clamper also comprises heat pipe, and some of heat pipes embed in the fixing seat.
In one embodiment of this invention, above-mentioned spacing adjustment part comprises double-screw bolt and nut.Double-screw bolt is connected in first heat radiator and second heat radiator, and nut is connected in double-screw bolt.
In one embodiment of this invention, the first above-mentioned heat radiator and second heat radiator also comprise at least one opening respectively, and opening sets in correspondence with each other, and the double-screw bolt correspondence is arranged in the opening.
In one embodiment of this invention, above-mentioned spacing adjustment part comprises spring.
The present invention proposes a kind of mainboard in addition, and it comprises substrate, heating radiator and interspace adjustable cooling clamper.Substrate has at least one slot and at least one first thermal source.Heat sink arrangements and couples with first thermal source on substrate.Interspace adjustable cooling clamper removably is disposed on the slot, and it comprises first heat radiator, second heat radiator and at least one spacing adjustment part, and a spacing is wherein arranged between first, second heat radiator.The spacing adjustment part is connected between first heat radiator and second heat radiator, and it is suitable for adjusting the spacing between first heat radiator and second heat radiator.
In one embodiment of this invention, the first above-mentioned thermal source is a South Bridge chip.
In one embodiment of this invention, above-mentioned first heat radiator and the material of second heat radiator comprise metal.
In one embodiment of this invention, above-mentioned heating radiator by first heat pipe to couple with first thermal source.
In one embodiment of this invention, above-mentioned mainboard also comprises the heat-conducting seat that is disposed on the substrate, and wherein part first heat pipe wears in the heat-conducting seat.
In one embodiment of this invention, above-mentioned mainboard also comprises second heat pipe, and an end of second heat pipe is connected in interspace adjustable cooling clamper, and the other end of second heat pipe is arranged in the heat-conducting seat movably.
In one embodiment of this invention, the second above-mentioned heat radiator comprises body and fixing seat.Body has towards the surface of first heat radiator, and the fixing seat is disposed at the surface.
In one embodiment of this invention, above-mentioned body and fixing seat are formed in one.
In one embodiment of this invention, above-mentioned mainboard also comprises second heat pipe, and wherein an end and the heating radiator of second heat pipe couple, and the other end of second heat pipe embeds in the fixing seat.
In one embodiment of this invention, above-mentioned spacing adjustment part comprises double-screw bolt and nut.Double-screw bolt connects first heat radiator and second heat radiator, and nut is connected in double-screw bolt.
In one embodiment of this invention, first, second above-mentioned heat radiator also comprises at least one opening respectively, and opening sets in correspondence with each other, and the double-screw bolt correspondence is arranged in opening.
In one embodiment of this invention, above-mentioned spacing adjustment part comprises spring.
In one embodiment of this invention, above-mentioned mainboard also comprises the tabular module that is disposed in the slot, and tabular module has second thermal source, and wherein interspace adjustable cooling clamper contacts second thermal source.
In one embodiment of this invention, above-mentioned tabular module is a RAM (random access memory) card, and second thermal source is a memory chip.
In one embodiment of this invention, above-mentioned RAM (random access memory) card also comprises the 3rd heat radiator that is bearing on memory chip.
In one embodiment of this invention, above-mentioned mainboard also comprises the fan that is disposed on the substrate, wherein fan and between heating radiator and slot.
The present invention proposes a kind of heat sink again, and it is suitable for contacting at least one thermal source of the tabular module on the mainboard, and wherein mainboard has heat-conducting seat.This heat radiator comprises body, fixing seat and heat pipe.Body has the surface towards thermal source.The fixing seat is disposed at the surface, and is suitable for contacting thermal source.One end of heat pipe embeds in the fixing seat, and the other end is suitable for embedding in the heat-conducting seat.
In one embodiment of this invention, above-mentioned tabular module is a RAM (random access memory) card, and thermal source is a memory chip.
In one embodiment of this invention, above-mentioned RAM (random access memory) card also comprises the 3rd heat radiator of breasting memory chip.
In one embodiment of this invention, the material of above-mentioned heat sink comprises metal.
In one embodiment of this invention, above-mentioned body and fixing seat are formed in one.
Utilize interspace adjustable cooling clamper of the present invention and/or heat sink, can increase the area of dissipation of the thermal source of tabular module, to promote radiating effect.In addition, the spacing adjustment part can positively be seized thermal source on both sides by the arms, and heat sink can contact thermal source definitely.Therefore, this heat sink or interspace adjustable cooling clamper are applied to the thermal source of tabular module on the mainboard, can effectively promote radiating effect.
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the synoptic diagram of known main frame.
Fig. 2 is the synoptic diagram of the mainboard of first embodiment of the invention.
Fig. 3 is the synoptic diagram of the interspace adjustable cooling clamper of Fig. 2.
Fig. 4 is the synoptic diagram of RAM (random access memory) card.
Fig. 5 is the RAM (random access memory) card synoptic diagram that is provided with the 3rd heat radiator.
Fig. 6 is that the heat radiator of second embodiment of the invention places the synoptic diagram on the mainboard.
Embodiment
[first embodiment]
Fig. 2 is the synoptic diagram of the mainboard of first embodiment of the invention, and Fig. 3 is the synoptic diagram of the interspace adjustable cooling clamper of Fig. 2.Please also refer to Fig. 2 and Fig. 3, mainboard 2000 comprises substrate 2100, heating radiator 2200 and interspace adjustable cooling clamper 2300.
Fig. 4 is the synoptic diagram of RAM (random access memory) card.Please refer to Fig. 4, tabular module is an example with RAM (random access memory) card 2500, and the thermal source of RAM (random access memory) card 2500 promptly is a memory chip 2520.When memory chip 2520 calculates running, just can send heat.Fig. 5 is the RAM (random access memory) card synoptic diagram that is provided with the 3rd heat radiator.Usually, in order to get rid of the heat that memory chip 2520 produces because of computing fast, we also can install the 3rd heat radiator 2540 on RAM (random access memory) card 2500.These the 3rd heat radiator 2540 breasting memory chips 2520 are to increase the area of dissipation of memory chip 2520, the heat extraction of rapid memory chip 2520.What merit attention is, the RAM (random access memory) card 2500 of circulation on the market at present, and its thickness is different according to the specification of each tame manufacturer.Usually the user can choose use according to its hobby.
Please continue with reference to figure 2, for north bridge chips (not icon) can be dispelled the heat apace, heating radiator 2200 is disposed on the north bridge chips of substrate 2100, and couples with South Bridge chip 2120.In the present embodiment, heating radiator 2200 by first heat pipe 2400 to couple with South Bridge chip 2120.By heating radiator 2200, can make the fast dissipation of heat of South Bridge chip 2120, keeping the running of South Bridge chip 2120, and prolong the serviceable life of South Bridge chip 2120.In addition, for fixing first heat pipe 2400, avoid first heat pipe 2400 to contact with other electronic component on the substrate 2100 simultaneously and influence the running of mainboard 2000, mainboard 2000 also comprises heat-conducting seat 2600.Heat-conducting seat 2600 is disposed on the substrate 2100, and between South Bridge chip 2120 and heating radiator 2200.First heat pipe 2400 is arranged in heat-conducting seat 2600, and the two ends of first heat pipe 2400 connect South Bridge chip 2120 and heating radiator 2200 respectively.
Please continue simultaneously with reference to figure 2 and Fig. 3, interspace adjustable cooling clamper 2300 removably is disposed on the slot 2110, and it is suitable for clamping and is inserted in RAM (random access memory) card 2500 in the slot 2110, with the heat radiation of rapid memory card 2500.At length, interspace adjustable cooling clamper 2300 comprises first heat radiator 2310, second heat radiator 2320 and at least one spacing adjustment part 2330.
Between first heat radiator 2310 and second heat radiator 2320 spacing is arranged.RAM (random access memory) card 2500 promptly is between first heat radiator 2310 and second heat radiator 2320, and first heat radiator 2310 and second heat radiator 2320 are suitable for contacting the memory chip 2520 of RAM (random access memory) card 2500.By first heat radiator 2310 and second heat radiator 2320, can make the area of dissipation of memory chip 2520 become big, so that memory chip 2520 heat extraction fast.In addition, the material of first heat radiator 2310 and second heat radiator 2320 is the good conductor of heat, as metal.Therefore heat radiation that can rapid memory card 2500 makes RAM (random access memory) card 2500 keep good running.
In addition, spacing adjustment part 2330 is connected between first heat radiator 2310 and second heat radiator 2320, and can adjust the relative position of first heat radiator 2310 and second heat radiator 2320 by spacing adjustment part 2330, to adjust the size of spacing, make first heat radiator 2310 and second heat radiator, 2320 clamping RAM (random access memory) card positively 2500.With present embodiment, spacing adjustment part 2330 comprises double-screw bolt 2332 and nut 2334.Double-screw bolt 2332 connects first heat radiator 2310 and second heat radiator 2320, and nut 2334 connects double-screw bolt 2332.At length, first heat radiator 2310 and second heat radiator 2320 have the mutual corresponding opening 2312,2321 in position respectively, and double-screw bolt 2332 promptly is to be arranged in the corresponding opening 2312,2321.The user can adjust the spacing size by adjusting the position of nut 2334 on double-screw bolt 2332.
For the heat extraction of rapid memory card 2500, mainboard 2000 also comprises second heat pipe 2700, and second heat pipe 2700 is coupled between heating radiator 2200 and the interspace adjustable cooling clamper 2300.For fixing second heat pipe 2700, the second heat radiator 2320 comprise body 2322 and fixing seat 2324.Body 2322 has the surperficial 2322a towards first heat radiator 2310, and fixing seat 2324 is disposed at surperficial 2322a.Body 2322 can be one-body molded with fixing seat 2324.One end of second heat pipe 2700 embeds in the fixing seat 2324, and the other end of second heat pipe 2700 then is to be arranged in movably in the heat-conducting seat 2600.
In addition, mainboard 2000 also comprises the radiating seat 2800 that is disposed on the substrate 2100.Radiating seat 2800 is disposed on the central processing unit (not shown), and it is other to be positioned at heating radiator 2200.Radiating seat 2800 is in order to discharge the heat of central processing unit apace.For the heat of dissipation central processing unit more apace, usually can the additional configuration fan on the radiating seat 2800.
Please continue the while with reference to figure 2, Fig. 3 and Fig. 4, when RAM (random access memory) card 2500 was inserted in slot 2110, in order to increase the radiating effect of RAM (random access memory) card 2500, the user can place interspace adjustable cooling clamper 2300 on the slot 2110.Then, the user screws in the middle body of nut 2334 toward double-screw bolt 2332 again.At this moment, first heat radiator 2310 and second heat radiator, 2320 clamping RAM (random access memory) card 2500, and contact memory chip 2520.By first heat radiator 2310 and second heat radiator 2320, the area of dissipation of memory chip 2520 increases, so the heat extraction effect is good.
In addition, be connected with second heat radiator 2320 and heating radiator 2200, can make second heat radiator 2320 heat extraction more apace, and then the heat energy of memory chip 2520 is removed apace by second heat pipe 2700.
What merit attention is that each user-selected thickness of purchasing the RAM (random access memory) card 2500 of use is not quite similar.Use the benefit of the interspace adjustable cooling clamper 2300 of present embodiment to be: the user can be in response to the thickness of the RAM (random access memory) card 2500 of each tame label, adjust the degree that nut 2334 screws in double-screw bolt 2332, allow interspace adjustable cooling clamper 2300 clamping RAM (random access memory) card definitely 2500, to increase RAM (random access memory) card 2500 heat conducting effects.
Please also refer to Fig. 4 and Fig. 5, at length, RAM (random access memory) card 2500 has installing the 3rd heat radiator 2540 and does not have the thickness of installing the 3rd heat radiator 2540 just different.Yet, by spacing adjustment part 2330, can adjust the spacing between first heat radiator 2310 and second heat radiator 2320, allow interspace adjustable cooling clamper 2300 clamping RAM (random access memory) card definitely 2500.The memory chip 2520 of RAM (random access memory) card 2500 is the effect of heat extraction fast just.
In addition, though spacing adjustment part 2330 shown in Figure 3 is double-screw bolt 2332 and nut 2334.In the embodiment that another does not illustrate, spacing adjustment part 2330 also can be a spring.The user can the first application of force pull open first heat radiator 2310 and second heat radiator 2320 toward two opposite directions, and is sheathed on RAM (random access memory) card 2500.After the user stopped the application of force, the restoring force of spring just can allow first heat radiator 2310 and second heat radiator, 2320 clamping RAM (random access memory) card 2500.
Specifically, because spacing adjustment part 2330 can make the relative position between first heat radiator 2310 and second heat radiator 2320 change, therefore be arranged in second heat pipe 2700 in the heat-conducting seat 2600, also can in heat-conducting seat 2600, move along with second heat radiator 2320.Yet the heat of second heat pipe 2700 also can be passed to heating radiator 2200 by heat-conducting seat 2600.
At length, memory chip 2520 adstante febres, heat can reach first heat radiator 2310 and second heat radiator 2320.Reach the heat of first heat radiator 2310, can be emitted in the colder on every side environment.Reach the heat of second heat radiator 2320, can more reach heat-conducting seat 2600 earlier, reach heating radiator 2200 backs by first heat pipe 2400 again and get rid of by second heat pipe 2700.So, just, can reach the purpose of memory chip 2520 quick heat radiatings that utilize interspace adjustable cooling clamper 2300 to make RAM (random access memory) card 2500.
[second embodiment]
The present embodiment and first embodiment are roughly the same, and same or analogous assembly label is represented same or analogous assembly.Fig. 6 is that the heat radiator of second embodiment of the invention places the synoptic diagram on the mainboard.Please also refer to Fig. 2 and Fig. 6, heat sink 200 places on the memory card slot (not indicating), with the memory chip 2520 of the RAM (random access memory) card 2500 on the contact mainboard 2000, and 2500 heat radiations of auxiliary memory card.
Different with first embodiment is, heat sink 200 can utilize close-fitting, screw locking, the buckle utensil of structure or mode such as slide rail is set to form constructive interference with memory card slot.Perhaps, also can utilize the cooperation between the shape, so that heat sink 200 directly places on the memory card slot.Therefore, the user can mobile easily heat sink 200, so that fixing seat 220 corresponding contact memory chips 2520.Heat pipe 230 embeds that end in the heat-conducting seats 2600, also can be along with the moving of heat sink 200, and in heat-conducting seat 2600, move.
Similarly, by heat sink 200, can make RAM (random access memory) card 2500 quick heat radiatings.So, can make RAM (random access memory) card 2500 keep normal operation, and prolong the serviceable life of RAM (random access memory) card 2500.
Please also refer to Fig. 5 and Fig. 6, if installing the 3rd heat radiator 2540 is arranged on the RAM (random access memory) card 2500, this moment, the user can mobile easily heat sink 200, made heat sink 200 can contact the 3rd heat radiator 2540 definitely.So, RAM (random access memory) card 2500 just can be dispelled the heat apace.Hence one can see that, and the use of heat sink 200 can't be limited because of the thickness of RAM (random access memory) card 2500 and the 3rd heat radiator 2540.
In sum,, or utilize tabular module on the heat radiator contact mainboard, all can increase the area of dissipation of the thermal source of tabular module, promote radiating effect the tabular module on the above-mentioned interspace adjustable cooling clamper clamping mainboard.The radiating efficiency of tabular module is good, and itself and mainboard just can be kept good running, and can and then prolong the serviceable life of tabular module and mainboard.
In addition, this spacing adjustable cooling clamper can be adjusted the spacing between first, second heat radiator according to the thickness difference of tabular module, makes first, second heat radiator tabular module of clamping definitely.In addition, the use of heat radiator can be not limited because of the thickness of tabular module yet.Therefore, the use that the user can select interspace adjustable cooling clamper and/or heat radiator voluntarily whether, tool is selected elasticity and ease of use for use.Also can select tabular module voluntarily for use, also have the elasticity of selecting for use of tabular module.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; those skilled in the art without departing from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is when looking being as the criterion that claims define.
Claims (18)
1. interspace adjustable cooling clamper is suitable at least one thermal source of the tabular module of clamping, it is characterized in that, comprising:
First heat radiator and second heat radiator have a spacing between wherein said first heat radiator and described second heat radiator, and described thermal source is suitable for being positioned at described spacing and described first heat radiator of breasting and described second heat radiator; And
At least one spacing adjustment part is connected between described first heat radiator and described second heat radiator, is suitable for adjusting the described spacing between described first heat radiator and described second heat radiator, so that described first heat radiator and the described thermal source of the described second heat radiator clamping.
2. interspace adjustable cooling clamper according to claim 1 is characterized in that, wherein said tabular module is a RAM (random access memory) card, and described thermal source is a memory chip.
3. interspace adjustable cooling clamper according to claim 2 is characterized in that wherein said RAM (random access memory) card also comprises the 3rd heat radiator, the described memory chip of breasting.
4. interspace adjustable cooling clamper according to claim 1 is characterized in that, the material of wherein said first heat radiator and described second heat radiator comprises metal.
5. interspace adjustable cooling clamper according to claim 1 is characterized in that, described second heat radiator comprises:
Body has the surface towards described first heat radiator; And
The fixing seat is disposed at described surface, and is suitable for contacting described thermal source.
6. interspace adjustable cooling clamper according to claim 5 is characterized in that, described body and described fixing seat are formed in one.
7. interspace adjustable cooling clamper according to claim 5 is characterized in that, also comprises heat pipe, and wherein the described heat pipe of part embeds in the described fixing seat.
8. interspace adjustable cooling clamper according to claim 1 is characterized in that, wherein said spacing adjustment part comprises:
Double-screw bolt connects described first heat radiator and described second heat radiator; And
Nut is connected in described double-screw bolt.
9. a mainboard is characterized in that, comprising:
Substrate has at least one slot and at least one first thermal source;
Heating radiator is disposed on the described substrate, and couples with described first thermal source;
Interspace adjustable cooling clamper removably is disposed on the described slot, comprising:
First heat radiator and second heat radiator have a spacing between wherein said first, second heat radiator; And
At least one spacing adjustment part is connected between described first heat radiator and described second heat radiator, is suitable for adjusting the described spacing between described first heat radiator and described second heat radiator.
10. mainboard according to claim 9 is characterized in that, wherein said first thermal source is a South Bridge chip.
11. mainboard according to claim 9 is characterized in that, wherein said heating radiator by first heat pipe to couple with described first thermal source.
12. mainboard according to claim 11 is characterized in that, also comprises heat-conducting seat, is disposed on the described substrate, wherein described first heat pipe of part wears in the described heat-conducting seat.
13. mainboard according to claim 12 is characterized in that, also comprises second heat pipe, an end of described second heat pipe is connected in described interspace adjustable cooling clamper, and the other end of described second heat pipe is arranged in the described heat-conducting seat movably.
14. mainboard according to claim 9 is characterized in that, described second heat radiator comprises:
Body has the surface towards described first heat radiator; And
The fixing seat is disposed at described surface.
15. mainboard according to claim 9, it is characterized in that, also comprise tabular module, be disposed at described slot, and described tabular module has second thermal source, wherein said interspace adjustable cooling clamper contacts described second thermal source, and wherein said tabular module is a RAM (random access memory) card, and described second thermal source is a memory chip.
16. a heat sink is suitable for contacting at least one thermal source of the tabular module on the mainboard, it is characterized in that wherein said mainboard has heat-conducting seat, comprising:
Body has the surface towards described thermal source;
The fixing seat is disposed at described surface, and is suitable for contacting described thermal source; And
Heat pipe, an end of wherein said heat pipe embeds in the described fixing seat, and the other end is suitable for embedding in the described heat-conducting seat.
17. heat sink according to claim 16 is characterized in that, wherein said tabular module is a RAM (random access memory) card, and described thermal source is a memory chip.
18. heat sink according to claim 16 is characterized in that, the material of wherein said heat sink comprises metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101059746A CN101320287A (en) | 2007-06-04 | 2007-06-04 | Radiating plate, interspace adjustable cooling clamper and mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101059746A CN101320287A (en) | 2007-06-04 | 2007-06-04 | Radiating plate, interspace adjustable cooling clamper and mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101320287A true CN101320287A (en) | 2008-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101059746A Pending CN101320287A (en) | 2007-06-04 | 2007-06-04 | Radiating plate, interspace adjustable cooling clamper and mainboard |
Country Status (1)
| Country | Link |
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| CN (1) | CN101320287A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332437A (en) * | 2011-10-25 | 2012-01-25 | 四川长虹电器股份有限公司 | Heat pipe radiating device and installation method thereof |
| CN101990385B (en) * | 2009-08-04 | 2012-07-04 | 华为技术有限公司 | Box-type equipment and slipway thereof |
| CN108845645A (en) * | 2018-05-30 | 2018-11-20 | 郑州云海信息技术有限公司 | One kind being applied to area of computer aided radiating fin fixing device |
| CN109002127A (en) * | 2017-06-06 | 2018-12-14 | 讯凯国际股份有限公司 | Radiator |
| CN108693930B (en) * | 2017-04-11 | 2021-10-08 | 技嘉科技股份有限公司 | Radiator upspring structure and connector module |
-
2007
- 2007-06-04 CN CNA2007101059746A patent/CN101320287A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101990385B (en) * | 2009-08-04 | 2012-07-04 | 华为技术有限公司 | Box-type equipment and slipway thereof |
| CN102332437A (en) * | 2011-10-25 | 2012-01-25 | 四川长虹电器股份有限公司 | Heat pipe radiating device and installation method thereof |
| CN102332437B (en) * | 2011-10-25 | 2013-08-07 | 四川长虹电器股份有限公司 | Heat pipe radiating device and installation method thereof |
| CN108693930B (en) * | 2017-04-11 | 2021-10-08 | 技嘉科技股份有限公司 | Radiator upspring structure and connector module |
| CN109002127A (en) * | 2017-06-06 | 2018-12-14 | 讯凯国际股份有限公司 | Radiator |
| CN108845645A (en) * | 2018-05-30 | 2018-11-20 | 郑州云海信息技术有限公司 | One kind being applied to area of computer aided radiating fin fixing device |
| CN108845645B (en) * | 2018-05-30 | 2020-03-06 | 郑州云海信息技术有限公司 | Be applied to computer-aided fin fixing device |
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