CN115915725A - A heat dissipation control method, device and electrical equipment - Google Patents

Abstract

The invention relates to the technical field of intelligent control, in particular to a heat dissipation control method, a heat dissipation control device and electrical equipment.

Description

A heat dissipation control method, device and electrical equipment

technical field

The invention relates to the technical field of intelligent control, in particular to a heat dissipation control method, device and electrical equipment.

Background technique

The frequency conversion controller can adjust the power of the motor and realize the variable speed operation of the motor to achieve the purpose of saving electricity, so it is widely used in electrical equipment such as air conditioners and fans. At present, the common high-voltage topology of frequency conversion controllers includes rectification and inverter circuits. Since frequency conversion controllers are usually in high-voltage and high-current operating conditions, the heat generation of the controller board is relatively large. Because the components also have requirements on their own working temperature, exceeding the temperature will cause damage to the components or shorten the service life, so controlling the temperature rise of the components is one of the important tasks of the frequency conversion design.

For the controller motherboard, the existing traditional heat dissipation methods mainly include natural heat dissipation, air cooling, refrigerant heat dissipation, water cooling and oil cooling. For these heat dissipation methods, although certain modifications are also made during application, in order to achieve better heat dissipation effects. However, the existing traditional heat dissipation method is usually passive heat dissipation, but does not realize active heat dissipation, and cannot realize precise control of heat dissipation of the frequency conversion controller, resulting in poor heat dissipation effect.

Contents of the invention

In view of this, the purpose of the present invention is to provide a heat dissipation control method, device and electrical equipment for electrical equipment, so as to solve the problem in the prior art that the heat dissipation effect of the controller board cannot be precisely controlled, resulting in poor heat dissipation. .

According to a first aspect of an embodiment of the present invention, a heat dissipation control method is provided, including:

Detect the current motherboard temperature, working current and working voltage of the electrical equipment;

Determine the current operating power of the electrical equipment according to the operating current and operating voltage;

According to the temperature and operating power of the main board, it is judged whether the main board of the electrical equipment and the positions within the preset range around the main board have good heat dissipation;

According to the judgment result, the working state of the heat dissipation device, and/or, the working state of the electric device is controlled.

Preferably, according to the temperature and operating power of the main board, judging whether the main board of the electrical equipment and the positions within the preset range around the main board are good for heat dissipation, including:

Get the current ambient temperature;

According to the ambient temperature, the temperature of the main board, and the operating power, it is judged whether the main board of the electrical equipment has good heat dissipation;

When it is determined that the main board of the electrical equipment has good heat dissipation, according to the ambient temperature and operating power, determine the estimated temperature of the position points within the preset range around the main board;

According to the estimated temperature, it is judged whether the points within the preset range around the motherboard have good heat dissipation.

Preferably, according to the ambient temperature, main board temperature, and operating power, judging whether the main board of the electric device has good heat dissipation includes:

Judging the temperature condition to which the current ambient temperature belongs, and the power condition to which the operating power belongs;

Determine the limit temperature of the motherboard when the electrical equipment can still operate normally under the current temperature and power conditions;

It is judged whether the temperature of the main board is less than or equal to the limit temperature, if yes, it is determined that the main board of the electrical equipment has good heat dissipation, otherwise, it is determined that the main board of the electrical equipment has poor heat dissipation.

Preferably, the temperature conditions include: low temperature, normal temperature and high temperature, the power conditions include: low power, rated power and high power, and the method further includes:

Pre-store the limit temperature of the main board when the electrical equipment can still operate normally under different temperature conditions and power conditions;

The determination of the limit temperature of the motherboard when the electrical equipment can still operate normally under the current temperature and power conditions is specifically:

Query the pre-stored limit temperature under different temperature conditions and power conditions, and determine the limit temperature of the motherboard when the electrical equipment can still operate normally under the current temperature and power conditions.

Preferably, the method also includes:

Under different temperature conditions and power conditions, the estimated temperature of each position point within the preset range around the main board is stored when the electrical equipment can still operate normally;

According to the ambient temperature and operating power, the estimated temperature of the position points within the preset range around the main board is determined, specifically:

For each location point, query the pre-stored estimated temperature of the location point under different temperature conditions and power conditions, and determine it as the estimated temperature of the location point.

Preferably, according to the estimated temperature, judging whether the position points within the preset range around the motherboard have good heat dissipation includes:

For each location point, if the estimated temperature is less than or equal to the threshold, it is determined that the location point has good heat dissipation; otherwise, it is determined that the location point has poor heat dissipation.

Preferably, the controlling the working state of the heat dissipation device according to the judgment result, and/or, the working state of the electric device includes:

When it is determined that all positions within the preset range around the main board have good heat dissipation, the working state of the heat dissipation device is controlled according to the difference between the limit temperature and the temperature of the main board; and/or,

When it is determined that any point within the preset range around the main board has poor heat dissipation, it is judged whether the estimated temperature of the point exceeds the threshold preset range, and if so, the electrical equipment is controlled to shut down and a fault prompt message is output; otherwise, Reduce the output capability of the electrical equipment, and output fault prompt information.

Preferably, the method also includes:

When it is determined that the heat dissipation of the main board of the electrical equipment is poor, it is determined whether the temperature of the main board exceeds the limit temperature preset range, and if so, the electrical equipment is controlled to shut down and a fault prompt message is output; otherwise, the temperature of the electrical equipment is reduced. Output capability, and output fault prompt information.

Preferably, the controlling the working state of the cooling device according to the difference between the limit temperature and the temperature of the main board includes:

If the difference is greater than a preset value, then turn off the cooling device;

If the difference is less than or equal to the preset value, the cooling device is turned on.

According to a second aspect of an embodiment of the present invention, there is provided a heat dissipation control device, comprising:

The detection module is used to detect the current motherboard temperature, working current and working voltage of the electrical equipment;

A determination module, configured to determine the current operating power of the electrical equipment according to the operating current and operating voltage;

The judging module is used to judge whether the main board of the electrical equipment and the positions within the preset range around the main board of the electrical equipment have good heat dissipation according to the temperature and operating power of the main board;

The control module is used to control the working state of the heat dissipation device and/or the working state of the electric device according to the judgment result.

According to a third aspect of the embodiments of the present invention, there is provided an electrical device, including:

The heat dissipation control device described above.

Preferably, the electrical equipment includes at least one of the following items, including:

Air conditioning units, fresh air units, air coolers, inverter refrigerators.

The technical solutions provided by the embodiments of the present invention may include the following beneficial effects:

By detecting the current mainboard temperature, operating current and operating voltage of the electrical equipment, it is judged whether the mainboard of the electrical equipment and the positions within the preset range around the mainboard have good heat dissipation, and according to the judgment result, the working state and/or of the cooling equipment are controlled. The working state of the electrical equipment, so as to realize the fine control of the heat dissipation of the motherboard according to the current working parameters of the electrical equipment, optimize the heat dissipation of the electrical equipment, make the temperature inside the electrical equipment more controllable, and solve the current problem In some technologies, the precise control of the heat dissipation of the controller board cannot be realized, resulting in a problem of poor heat dissipation.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description serve to explain the principles of the invention.

Fig. 1 is a flowchart of a heat dissipation control method according to an exemplary embodiment;

Fig. 2 is a flow chart of a heat dissipation control method according to another exemplary embodiment;

Fig. 3 is a schematic block diagram of a heat dissipation control device according to an exemplary embodiment.

Detailed ways

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with aspects of the invention as recited in the appended claims.

Fig. 1 is a flowchart of a heat dissipation control method according to an exemplary embodiment. As shown in Fig. 1, the heat dissipation control method includes:

Step S11, detecting the current main board temperature, working current and working voltage of the electrical equipment;

Step S12. Determine the current operating power of the electrical equipment according to the operating current and operating voltage;

Step S13, according to the temperature of the main board and the operating power, it is judged whether the main board of the electrical equipment and the positions within the preset range around the main board have good heat dissipation;

Step S14 , according to the judgment result, control the working state of the cooling device, and/or, the working state of the electric device.

It should be noted that this embodiment provides a technical solution, which is suitable for dissipating heat from a mainboard of an electrical device, especially suitable for dissipating heat from a mainboard with a variable frequency controller. In specific practice, the heat dissipation control method provided by this embodiment needs to be loaded and run in the controller of the electric device, or loaded and run in the electronic device connected to the electric device.

The electrical equipment includes, but is not limited to: air conditioner units, fresh air units, air coolers, inverter refrigerators, etc. In specific practice, the electrical equipment is preferably an air conditioner unit.

It can be understood that, in the technical solution provided by this embodiment, by detecting the current mainboard temperature, operating current and operating voltage of the electric equipment, it is judged whether the mainboard of the electric equipment and the positions within the preset range around the mainboard have good heat dissipation, and According to the judgment result, the working state of the heat dissipation device and/or the working state of the electric device is controlled, so as to realize the fine control of the heat dissipation condition of the motherboard according to the current working parameters of the electric device, and optimize the heat dissipation of the electric device, It makes the temperature inside the electrical equipment more controllable, and solves the problem of poor cooling effect in the prior art due to the inability to realize the precise control of the heat dissipation of the controller board.

In practice, the "current main board temperature of the electric device" mentioned in step S11 can be detected and obtained by setting a temperature detection circuit on the main board of the controller. There are many ways to implement the specific circuit structure of the temperature detection circuit, for example, through sequentially connected temperature sensors, RC low-frequency filter circuits, temperature signal receiving ports, and signal processing chips including analog-to-digital conversion circuits and storage units. It can be understood that the temperature sensor detects the real-time temperature of a certain position on the main board of the controller, and transmits the temperature signal to the signal processing chip through the RC low-frequency filter circuit and the temperature receiving port, and converts the temperature signal into The digital temperature signal is then stored in the memory unit.

Similarly, the "current working current and working voltage of the electrical equipment" mentioned in step S11 can be set on the controller board by setting a voltage detection circuit (for example, through voltage dividing resistor detection) or a current detection circuit (for example, through Current sensor or sampling resistance detection) detection and acquisition.

In step S12, "determine the current operating power of the electrical equipment according to the operating current and operating voltage" is specifically:

Calculated according to the formula: operating power = operating voltage × operating current.

The "position point within the preset range around the main board" mentioned in step S13 is the position point where the internal temperature rise of the main board and the electrical box of the electric device is relatively high under the same ambient temperature and operating power. In practice, multiple different location points may be selected according to actual conditions.

In step S13, "according to the temperature and operating power of the main board, determine whether the main board of the electrical equipment and the positions within the preset range around the main board have good heat dissipation", including:

1. Obtain the current ambient temperature.

Taking the electrical equipment as an air-conditioning unit as an example, the current ambient temperature can be obtained through a temperature sensor installed in the outdoor unit.

2. According to the ambient temperature, motherboard temperature, and operating power, determine whether the motherboard of the electrical equipment has good heat dissipation, including:

Judging the temperature condition to which the current ambient temperature belongs, and the power condition to which the operating power belongs;

Determine the limit temperature of the motherboard when the electrical equipment can still operate normally under the current temperature and power conditions;

It is judged whether the temperature of the main board is less than or equal to the limit temperature, if yes, it is determined that the main board of the electrical equipment has good heat dissipation, otherwise, it is determined that the main board of the electrical equipment has poor heat dissipation.

In practice, the temperature conditions that can be set include: low temperature (set the temperature range below 0°C as low temperature), normal temperature (set the temperature range from 0°C to 30°C as normal temperature) and high temperature (set the temperature range above 30°C as high temperature ), the power conditions that can be set include: low power (set the power range less than 50% as low power), rated power (set the power range 50%~80% as rated power) and high power (set the power range 80%~100% % set to high power).

In practice, the limit temperature of the motherboard can be pre-stored under different temperature and power conditions, when the electrical equipment can still operate normally, as shown in Table 1 below:

Table I

In Table 1, A1 represents when the current ambient temperature is low temperature and the electrical equipment is running at low power, and the electrical equipment can still operate normally (the electrical equipment can still operate normally when the electrical equipment is in normal operation at the initial stage of development. , there is a corresponding logical relationship between the detected motherboard temperature and the operation of the cooling fan. If the logical relationship conforms to the original setting in actual operation, it is considered that the electrical equipment is operating normally), the limit temperature of the motherboard; that is, low temperature and low temperature Under power conditions, when the real-time detected motherboard temperature is ≤ A1, the electrical equipment can work normally; A2 means that the current ambient temperature is normal temperature, and when the electrical equipment is running at low power, the electrical equipment can still operate normally. The limit temperature; that is, under normal temperature and low power conditions, when the real-time detected motherboard temperature is ≤ A2, the electrical equipment can work normally. By analogy, the specific meanings of the limit temperatures A3, B1-B3, and C1-C3 in Table 1 can be obtained, which will not be repeated here.

It can be understood that by querying the limit temperature under different temperature conditions and power conditions pre-stored in Table 1, the limit temperature of the motherboard can be determined when the electrical equipment can still operate normally under the current temperature condition and power condition.

In practice, it is also possible to pre-store the estimated temperature of each point within the preset range around the motherboard when the electrical equipment is still operating normally under different temperature and power conditions, as shown in Tables 2 and 3 below:

Table II

Table three

Table 2 is an example of the estimated temperature stored at the point A within the preset range around the motherboard as an example. In Table 2, D1 represents the estimated temperature of point A when the current ambient temperature is low temperature and the electrical equipment operates at low power; D2 represents the estimated temperature of point A when the current ambient temperature is normal temperature and the electrical equipment operates at low power temperature. By analogy, the specific meanings of the estimated temperatures D3, E1-E3, and F1-F3 at point A in Table 2 can be obtained, which will not be repeated here.

Table 3 takes point B within a preset range around the motherboard as an example, and an example of the estimated temperature stored. In Table 3, D4 represents the estimated temperature of point B when the current ambient temperature is low temperature and the electrical equipment operates at low power; D5 represents the estimated temperature of point B when the current ambient temperature is normal temperature and the electrical equipment operates at low power temperature. By analogy, the specific meanings of the estimated temperatures D6, E4-E6, and F4-F6 at point B in Table 3 can be obtained, which will not be repeated here.

It should be noted that the above-mentioned temperature values in Table 2 and Table 3 are called speculative temperatures because the position points within the preset range around the motherboard (such as the above-mentioned position point A and position point B) are not set additional temperature sensor for temperature detection, the temperature data in Table 2 and Table 3 is the temperature data of the position point under different temperature conditions and power conditions recorded through experiments in the early stage of development, the temperature data is stored in the database, and the corresponding position of supply and demand Called when the point's temperature data. For example, for point A, assuming that the current ambient temperature is low temperature and the current operating power is low power operation, it is inferred that the current temperature of point A is D1.

3. When it is determined that the main board of the electrical equipment has good heat dissipation, according to the ambient temperature and operating power, determine the estimated temperature of the position points within the preset range around the main board, specifically:

For each location point, query the pre-stored estimated temperature of the location point under different temperature conditions and power conditions, and determine it as the estimated temperature of the location point.

For example, for location point A, if the current ambient temperature is 15°C, according to the pre-set temperature conditions, the current ambient temperature is a low-temperature condition; if the current operating power of the electrical equipment is 20%, according to the pre-set power conditions, The current operating power is a low power condition; by looking up Table 2, it can be known that the estimated temperature under low temperature and low power operating conditions is D1, then determine the estimated temperature of the current location point A as D1.

For another example, for location point B, if the current ambient temperature is 15°C, according to the pre-set temperature conditions, the current ambient temperature is a low-temperature condition; if the current operating power of the electrical equipment is 20%, according to the pre-set power conditions , the current operating power is a low power condition; through the query table 2, it can be known that the estimated temperature under low temperature and low power operating conditions is D4, and then the estimated temperature of the current position point B is determined to be D4.

4. According to the estimated temperature, judge whether the points within the preset range around the motherboard have good heat dissipation, specifically:

For each location point, if the estimated temperature is less than or equal to the threshold value (threshold value is set according to user needs, or set according to historical experience value, or set according to experimental data), then it is determined that the heat dissipation of the point point is good, otherwise, It is determined that the heat dissipation at this point is poor.

For example, for point A, if the threshold value under low temperature and low power operating conditions is 0°C, and the current estimated temperature is 3°C, the estimated temperature at this time is greater than the threshold value, so it is determined that the heat dissipation at point A is poor at this time.

For another example, for point B, if the threshold value under normal temperature and low power operating conditions is 30°C, and the current estimated temperature is 23°C, the estimated temperature at this time is lower than the threshold value, so it is determined that the heat dissipation at point B is good at this time.

The "radiation equipment" mentioned in step S14 includes, but is not limited to: cooling fans, refrigerants, water, and the like. These heat dissipation devices may be heat dissipation devices that come with the electrical equipment before leaving the factory, or heat dissipation equipment that are not provided with the factory but are added to the electrical equipment.

In step S14, "according to the judgment result, control the working state of the heat dissipation device, and/or, the working state of the electric device" includes:

When it is determined that all positions within the preset range around the motherboard have good heat dissipation, the working state of the cooling device is controlled according to the difference between the limit temperature and the temperature of the motherboard (for example, if the difference is greater than the preset value, then Turn off the heat dissipation device; if the difference is less than or equal to the preset value, turn on the heat dissipation device; for another example, when the temperature of the surrounding location is high, turn on the heat dissipation device such as the heat dissipation fan, refrigerant flow rate or water flow rate to speed up heat dissipation, Improve the heat dissipation effect, thereby reducing the temperature of the motherboard controller components, and then reduce the opening of the heat dissipation device when the temperature of the components is lowered); the preset value is set according to historical experience or experimental data, for example, set to 40°C .

and / or,

When it is determined that any position point within the preset range around the motherboard has poor heat dissipation, it is judged whether the estimated temperature of the position point exceeds the threshold preset range (the preset range is set according to user needs or historical experience values, for example, can be Set the preset range to 20% of the threshold), if so, control the electrical equipment to shut down and output fault prompt information; otherwise, reduce the output capability of the electrical equipment, and output fault prompt information.

When it is determined that the heat dissipation of the motherboard of the electrical equipment is poor, it is judged whether the temperature of the motherboard exceeds the preset range of the limit temperature (the preset range is set according to user needs or historical experience values, for example, the preset range can be set to be 20% of the limit temperature), if so, control the electrical equipment to shut down and output fault prompt information; otherwise, reduce the output capacity of the electrical equipment, and output fault prompt information.

It should be noted that the "reducing the output capability of the electric device" mentioned in this embodiment mainly refers to reducing the operating power of the electric device. It can be understood that the higher the operating power, the greater the operating current and voltage of the electrical equipment, the higher the temperature of the motherboard, and the reduction of the output capacity of the electrical equipment can alleviate the problem of poor heat dissipation of the electrical equipment to a certain extent. .

It can be understood that the technical solution provided by this embodiment can output fault prompt information when the heat dissipation of the main board of the electrical equipment is poor, and can also be used when heat dissipation is poor at any point within the preset range around the main board. Outputting fault prompt information, compared with the existing technology, can remind users to solve heat dissipation faults in time, change passive heat dissipation into active heat dissipation, and improve user experience. Fig. 2 is a schematic flowchart of a heat dissipation control method according to another exemplary embodiment. As shown in Fig. 2, the heat dissipation control method includes:

Step S21, detecting the current main board temperature, working current and working voltage of the electrical equipment;

Step S22, judging whether the main board of the electrical equipment has good heat dissipation;

Step S23, if it is determined that the main board of the electrical equipment has good heat dissipation, determine the estimated temperature of the points within the preset range around the main board, and jump to step S25;

Step S24, if it is determined that the heat dissipation of the motherboard of the electrical equipment is poor, jump to step S28;

Step S25. According to the estimated temperature, it is judged whether the points within the preset range around the main board have good heat dissipation;

Step S26, when it is determined that all points within the preset range around the main board have good heat dissipation, control the working state of the heat dissipation device according to the difference between the limit temperature and the temperature of the main board;

Step S27, jump to step S28 when it is determined that any point within the preset range around the main board has poor heat dissipation;

Step S28, judging whether the temperature of the main board exceeds the limit temperature preset range, if so, controlling the shutdown of the electrical equipment and outputting a fault prompt message; otherwise, reducing the output capability of the electrical equipment, and outputting a fault prompt message; or, Judging whether the estimated temperature at the location exceeds the preset threshold range, if so, controlling the electrical equipment to shut down and outputting fault prompt information; otherwise, reducing the output capability of the electrical equipment and outputting fault prompt information.

It should be noted that this embodiment provides a technical solution, which is suitable for dissipating heat from a mainboard of an electrical device, especially suitable for dissipating heat from a mainboard with a variable frequency controller. In specific practice, the heat dissipation control method provided by this embodiment needs to be loaded and run in the controller of the electric device, or loaded and run in the electronic device connected to the electric device.

The electrical equipment includes, but is not limited to: air conditioner units, fresh air units, air coolers, inverter refrigerators, etc. In specific practice, the electrical equipment is preferably an air conditioner unit.

It can be understood that, in the technical solution provided by this embodiment, by detecting the current mainboard temperature, operating current and operating voltage of the electric equipment, it is judged whether the mainboard of the electric equipment and the positions within the preset range around the mainboard have good heat dissipation, and According to the judgment result, the working state of the heat dissipation device and/or the working state of the electric device is controlled, so as to realize the fine control of the heat dissipation condition of the motherboard according to the current working parameters of the electric device, and optimize the heat dissipation of the electric device, It makes the temperature inside the electrical equipment more controllable, and solves the problem of poor cooling effect in the prior art due to the inability to realize the precise control of the heat dissipation of the controller board.

Furthermore, the technical solution provided by this embodiment can output fault prompt information when the heat dissipation of the motherboard of the electrical equipment is poor, and can also output fault information when the heat dissipation of any point within the preset range around the motherboard is poor. The prompt information, compared with the existing technology, can remind the user to solve the heat dissipation failure in time, change the passive heat dissipation into active heat dissipation, and improve the user experience.

Fig. 3 is a schematic block diagram of a heat dissipation control device according to an exemplary embodiment. As shown in Fig. 3, the heat dissipation control device 100 includes:

The detection module 101 is used to detect the current motherboard temperature, working current and working voltage of the electrical equipment;

A determination module 102, configured to determine the current operating power of the electrical equipment according to the operating current and operating voltage;

A judging module 103, configured to judge whether the main board of the electrical equipment and the positions within the preset range around the main board of the electrical equipment have good heat dissipation according to the main board temperature and operating power;

The control module 104 is configured to control the working state of the cooling device and/or the working state of the electric device according to the judgment result.

It should be noted that this embodiment provides a technical solution, which is suitable for dissipating heat from a mainboard of an electrical device, especially suitable for dissipating heat from a mainboard with a variable frequency controller. In a specific practice, the heat dissipation control device provided in this embodiment is set in an electric device.

The electrical equipment includes, but is not limited to: air conditioner units, fresh air units, air coolers, inverter refrigerators, etc. In specific practice, the electrical equipment is preferably an air conditioner unit.

For the implementation manner and beneficial effect of each module in this embodiment, refer to the introduction of the corresponding steps in the foregoing embodiments, and details will not be repeated in this embodiment.

It can be understood that, in the technical solution provided by this embodiment, by detecting the current mainboard temperature, operating current and operating voltage of the electric equipment, it is judged whether the mainboard of the electric equipment and the positions within the preset range around the mainboard have good heat dissipation, and According to the judgment result, the working state of the heat dissipation device and/or the working state of the electric device is controlled, so as to realize the refined control of the heat dissipation condition of the motherboard according to the current working parameters of the electric device, and optimize the heat dissipation of the electric device, It makes the temperature inside the electrical equipment more controllable, and solves the problem of poor cooling effect in the prior art due to the inability to realize precise control of the heat dissipation of the controller board.

An electrical device according to an exemplary embodiment includes: the heat dissipation control device described above.

Preferably, the electrical equipment includes at least one of the following items, including:

Air conditioning units, fresh air units, air coolers, inverter refrigerators.

It can be understood that the technical solution provided by this embodiment includes the above-mentioned heat dissipation control device, and the above-mentioned heat dissipation control device judges the main board and operating voltage of the electric equipment by detecting the current main board temperature, operating current and operating voltage of the electric equipment. Whether the position points within the preset range around the motherboard have good heat dissipation, and according to the judgment result, control the working state of the heat dissipation device and/or the working state of the electrical equipment, so as to realize the cooling of the motherboard according to the current operating parameters of the electrical equipment The refined control of the status optimizes the heat dissipation of the electrical equipment, making the temperature inside the electrical equipment more controllable, and solves the problem of poor heat dissipation in the prior art due to the inability to achieve precise control of the heat dissipation of the controller board.

It can be understood that, the same or similar parts in the above embodiments can be referred to each other, and the content that is not described in detail in some embodiments can be referred to the same or similar content in other embodiments.

It should be noted that, in the description of the present invention, the terms "first", "second" and so on are only used for description purposes, and should not be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plurality" means at least two.

Any process or method descriptions in flowcharts or otherwise described herein may be understood to represent modules, segments or portions of code comprising one or more executable instructions for implementing specific logical functions or steps of the process , and the scope of preferred embodiments of the invention includes alternative implementations in which functions may be performed out of the order shown or discussed, including substantially concurrently or in reverse order depending on the functions involved, which shall It is understood by those skilled in the art to which the embodiments of the present invention pertain.

It should be understood that various parts of the present invention can be realized by hardware, software, firmware or their combination. In the embodiments described above, various steps or methods may be implemented by software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented by any one or combination of the following techniques known in the art: Discrete logic circuits, ASICs with suitable combinational logic gates, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.

Those of ordinary skill in the art can understand that all or part of the steps carried by the methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium. During execution, one or a combination of the steps of the method embodiments is included.

In addition, each functional unit in each embodiment of the present invention may be integrated into one processing module, each unit may exist separately physically, or two or more units may be integrated into one module. The above-mentioned integrated modules can be implemented in the form of hardware or in the form of software function modules. If the integrated modules are realized in the form of software function modules and sold or used as independent products, they can also be stored in a computer-readable storage medium.

The storage medium mentioned above may be a read-only memory, a magnetic disk or an optical disk, and the like.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.

Claims (12)

1. A heat dissipation control method, characterized in that, comprising: Detect the current motherboard temperature, working current and working voltage of the electrical equipment; Determine the current operating power of the electrical equipment according to the operating current and operating voltage; According to the temperature and operating power of the main board, it is judged whether the main board of the electrical equipment and the positions within the preset range around the main board have good heat dissipation; According to the judgment result, the working state of the heat dissipation device, and/or, the working state of the electric device is controlled. 2. The method according to claim 1, wherein, according to the temperature of the main board and the operating power, judging whether the main board of the electrical equipment and the positions within the preset range around the main board are good at dissipating heat, comprising: Get the current ambient temperature; According to the ambient temperature, the temperature of the main board, and the operating power, it is judged whether the main board of the electrical equipment has good heat dissipation; When it is determined that the main board of the electrical equipment has good heat dissipation, according to the ambient temperature and operating power, determine the estimated temperature of the position points within the preset range around the main board; According to the estimated temperature, it is judged whether the points within the preset range around the motherboard have good heat dissipation. 3. The method according to claim 2, characterized in that, according to the ambient temperature, main board temperature, and operating power, judging whether the main board of the electric device has good heat dissipation comprises: Judging the temperature condition to which the current ambient temperature belongs, and the power condition to which the operating power belongs; Determine the limit temperature of the motherboard when the electrical equipment can still operate normally under the current temperature and power conditions; It is judged whether the temperature of the main board is less than or equal to the limit temperature, if yes, it is determined that the main board of the electrical equipment has good heat dissipation, otherwise, it is determined that the main board of the electrical equipment has poor heat dissipation. 4. The method according to claim 3, wherein the temperature conditions include: low temperature, normal temperature and high temperature, and the power conditions include: low power, rated power and high power, and the method also includes: Pre-store the limit temperature of the main board when the electrical equipment can still operate normally under different temperature conditions and power conditions; The determination of the limit temperature of the motherboard when the electrical equipment can still operate normally under the current temperature and power conditions is specifically: Query the pre-stored limit temperature under different temperature conditions and power conditions, and determine the limit temperature of the motherboard when the electrical equipment can still operate normally under the current temperature and power conditions. 5. The method according to claim 4, further comprising: Under different temperature conditions and power conditions, the estimated temperature of each position point within the preset range around the main board is stored when the electrical equipment can still operate normally; According to the ambient temperature and operating power, the estimated temperature of the position points within the preset range around the main board is determined, specifically: For each location point, query the pre-stored estimated temperature of the location point under different temperature conditions and power conditions, and determine it as the estimated temperature of the location point. 6. The method according to claim 5, wherein, according to the estimated temperature, judging whether the heat dissipation is good at the position points within the preset range around the main board comprises: For each location point, if the estimated temperature is less than or equal to the threshold, it is determined that the location point has good heat dissipation; otherwise, it is determined that the location point has poor heat dissipation. 7. The method according to claim 6, wherein the controlling the working state of the heat dissipation device according to the judgment result, and/or, the working state of the electric device comprises: When it is determined that all positions within the preset range around the main board have good heat dissipation, the working state of the heat dissipation device is controlled according to the difference between the limit temperature and the temperature of the main board; and/or, When it is determined that any point within the preset range around the main board has poor heat dissipation, it is judged whether the estimated temperature of the point exceeds the threshold preset range, and if so, the electrical equipment is controlled to shut down and a fault prompt message is output; otherwise, Reduce the output capability of the electrical equipment, and output fault prompt information. 8. The method according to claim 3 or 7, further comprising: When it is determined that the heat dissipation of the main board of the electrical equipment is poor, it is determined whether the temperature of the main board exceeds the limit temperature preset range, and if so, the electrical equipment is controlled to shut down and a fault prompt message is output; otherwise, the temperature of the electrical equipment is reduced. Output capability, and output fault prompt information. 9. The method according to claim 7, wherein the controlling the working state of the cooling device according to the difference between the limit temperature and the temperature of the main board comprises: If the difference is greater than a preset value, then turn off the cooling device; If the difference is less than or equal to the preset value, the cooling device is turned on. 10. A heat dissipation control device, comprising: The detection module is used to detect the current motherboard temperature, working current and working voltage of the electrical equipment; A determination module, configured to determine the current operating power of the electrical equipment according to the operating current and operating voltage; The judging module is used to judge whether the main board of the electrical equipment and the positions within the preset range around the main board of the electrical equipment have good heat dissipation according to the temperature and operating power of the main board; The control module is used to control the working state of the heat dissipation device and/or the working state of the electric device according to the judgment result. 11. An electrical device, characterized in that it comprises: The heat dissipation control device according to claim 10. 12. The electric device according to claim 11, characterized in that it comprises at least one of the following items, including: Air conditioning units, fresh air units, air coolers, inverter refrigerators.

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